来源：21世纪经济报道 南方财经记者 庞成 广州报道 在"并购六条"等政策驱动下，并购重组市场持续活跃。2025年，广东累计新增并购重组909单，同比增加10.60%，占全国比重达 15.85%，稳稳占据全国并购重组"第一省"地位。 2月24日，广东省高质量发展大会在广州举行。在"科技与金融创新赋能产业融合"分会场上，中信证券股份有限公司总监张秀杰 分享了并购重组赋能广东企业高质量发展的实践经验。 2024年9月以来，广东先后出台了《广东省金融支持企业开展产业链整合兼并行动方案》等政策文件，从推动产业升级、促进新 质生产力发展等方面鼓励上市公司与大型金融机构合作，积极开展并购重组。 张秀杰表示，中信证券密切跟进政策导向，积极支持广东省企业开展并购重组，助力广东省企业高质量发展。2023至2025年， 中信证券累计服务广东省企业完成并购重组54单，交易规模达2336亿元，其中，2025年参与交易21单，规模达715亿元。 期间，中信证券还参与完成了多个具有代表性的案例，例如，服务格力地产完成重大资产置换，树立国企改革新标杆；协助中 国华润收购长电科技控制权，完善半导体产业链布局，这些交易都紧扣广东省产业升级方向 ...

Group 1 - The semiconductor ETF (159813) opened with a gain of 1.53%, priced at 1.260 yuan [1] - Key holdings in the semiconductor ETF include: - SMIC up 0.94% - Haiguang Information up 3.00% - Cambricon up 1.39% - Northern Huachuang up 1.17% - Zhaoyi Innovation up 2.85% - Zhongwei Company up 1.26% - Lanke Technology up 3.27% - OmniVision up 1.02% - Tuojing Technology up 0.92% - Changdian Technology up 1.67% [1] - The performance benchmark for the semiconductor ETF is the National Securities Semiconductor Chip Index return rate [1] Group 2 - The ETF is managed by Penghua Fund Management Co., Ltd., with the fund manager being Luo Yingyu [1] - Since its establishment on April 17, 2020, the ETF has achieved a return of 86.00%, with a return of 3.62% over the past month [1]

【环球网财经综合报道】2020年以来，以国家大基金、税收优惠等政策为支撑，叠加外部技术封锁与国 内晶圆厂扩产需求拉动，我国半导体行业国产化进度逐步从单点突破迈向全链协同。 综合中国半导体行业协会 (CSIA)、赛迪顾问 2025 年半导体产业发展报告数据，28nm及以上成熟制程率 先实现国产化，自给率达60%；刻蚀、清洗、薄膜沉积等设备及8英寸硅片等材料国产化率突破50%， 先进封装在Chiplet等领域达国际先进水平，长江存储、长电科技（600584.SH）等龙头企业崛起。上述 各环节取得的成果使得整体国产化率从2020年不足20%提升至2025年45%左右，芯片出口于2024年成为 我国第一大出口商品，自主可控能力显著增强。 在此背景下，未来几年伴随我国半导体产业向5nm/3nm等先进制程加速突破的确定性趋势，受益于在产 能、效率及良率几个关键指标方面均可以发挥关键作用，AMHS（自动物料搬运系统）已从历史阶段的 辅助工具升级为决定先进制程可行性的核心基础设施。 AMHS 应用贯穿从硅片投入到出厂制造全流程 根据公开资料，AMHS即自动物料搬送系统，一般特指在洁净室环境下，通过软件系统的控制和调度， 按照 ...

Group 1 - The chip ETF (159995) opened with a gain of 1.86%, priced at 1.972 yuan [1] - Major holdings in the chip ETF include: - SMIC up 0.94% - Haiguang Information up 3.00% - Cambricon up 1.39% - Northern Huachuang up 1.17% - GigaDevice up 2.85% - Zhongwei Company up 1.26% - Lattice Technology up 3.27% - OmniVision up 1.02% - Tuojing Technology up 0.92% - Changdian Technology up 1.67% [1] - The performance benchmark for the chip ETF is the National Securities Semiconductor Chip Index return, managed by Huaxia Fund Management Co., Ltd. [1] Group 2 - Since its establishment on January 20, 2020, the chip ETF has achieved a return of 93.54% [1] - The return over the past month for the chip ETF is 3.60% [1]

人的情绪是波动的，往往一碰到亏损，一个缓神下来，再痛定思痛出局，就发现，三次的盈利往往敌不 过一次的陷阱损失。所以，做投资，不能过于求快，讲究效率，试图一年下来，下半辈子都有了，不现 实。 以价值为基础，无论是价值投资，还是投机，失去了价值这个厚实之地为依靠，可胜一城一池，不可胜 久远。试图认为自己比别人聪明一点，跑得更快，总有更愚蠢的人接盘，可胜在敌，不可胜在己了！ 以往每每看到高手下棋，发现高手喜欢补棋，放着明明的大场而不抢，非要走那缓重之棋，岂不是浪费 效率？ 时间长了，则悟到，原来是自己大谬。补棋事关全局厚薄之着，棋厚则根牢，徐图下来，往往后发先 至。而轻兵疾进，处处落子，看似满盘皆是自己的势力范围，心中大喜。 实则不然。薄棋碰到厚味，厚实一方或分而断之，缠绕攻击，处处落在棋形要害处，薄主无奈左支右 撑，痛不欲生；或搜根带刮，几着下来，原来茫茫的势力眨眼之间成了别人的实地，只落下长吁短叹， 还没明白究竟是个为什么？ 棋经《度情篇第八》云："夫持重而廉者，多得；轻易而贪者，多丧。"持重即不轻易，不轻易则谋定而 后动，要打有把握之仗。 投资之道，低者重价差，中者重趋势，高者重复利。 处处落子，频繁交易，这 ...

Core Insights - The integrated circuit packaging and testing (ICPT) industry is a crucial part of the semiconductor supply chain, ensuring chip usability and quality certainty, and is supported by various national policies in China [1][4] - The global ICPT market is experiencing fluctuating growth, with a significant shift of capacity towards emerging Asian markets, particularly Taiwan, mainland China, and the USA [1][4] - Advanced packaging is becoming the main growth driver in the post-Moore's Law era, with the largest market segment being flip-chip packaging and the fastest growth in multi-chip integration packaging [1][5] Industry Overview - ICPT encompasses both packaging and testing, connecting wafer manufacturing with end applications, providing physical protection and performance validation [2][3] - The industry is supported by national policies aimed at technological breakthroughs and market expansion, with recent initiatives focusing on energy electronics and AI [4] Global Market Analysis - The global ICPT market is projected to reach $117.85 billion by 2026, with advanced packaging expected to grow at a compound annual growth rate (CAGR) of 13.2% from 2024 to 2026, significantly outpacing traditional packaging's 3.9% CAGR [4][5] - The market is currently in a downturn due to weak demand in consumer electronics and global economic uncertainties, but is expected to recover in 2024 as demand stabilizes [4] China Market Analysis - The mainland China ICPT market is expected to grow from 250.95 billion yuan in 2020 to 353.39 billion yuan by 2025, with a CAGR of 7.09% [6][7] - Advanced packaging is gaining traction, with its market share projected to reach 20.86% by 2025, driven by domestic demand and technological advancements [7] Competitive Landscape - The global ICPT industry is dominated by a few key players, with the top three companies holding approximately 50% of the market share by 2024 [12] - Mainland China has four companies in the global top ten, showcasing its competitive strength in the ICPT sector [12] Future Development Trends - The industry is expected to shift towards high-end, collaborative, and differentiated development, focusing on advanced packaging technologies and enhancing domestic supply chains [13][14] - There will be a continued emphasis on optimizing demand structures, with a shift from traditional consumer electronics to high-end applications like automotive electronics and AI [15]

Core Viewpoint - The 2026 Future Industries New Materials Expo (FINE 2026) aims to lead global innovation in new materials, emphasizing their critical role in the transformation of high-tech industries and future economic development [1][2]. Group 1: Event Overview - FINE 2026 will take place from June 10 to June 12, 2026, at the Shanghai New International Expo Center, featuring a total exhibition area of 50,000 square meters and over 300 strategic and cutting-edge technology reports [2][18]. - The expo will focus on popular innovations applicable to various industries, including artificial intelligence, aerospace, smart vehicles, and renewable energy, while addressing five common needs in future industries: advanced semiconductors, advanced batteries, lightweight functionalization, low-carbon sustainability, and thermal management [2][10]. Group 2: Historical Context and Participation - The previous editions of the expo, including the 2025 International Carbon Materials Expo and the 2025 Thermal Management Expo, achieved record attendance with over 35,000 professional visitors from 27 countries and regions, showcasing more than 500 exhibitors [7][36]. - The event is expected to attract over 100,000 professional visitors, including representatives from major companies such as BYD, Huawei, and Xiaomi, as well as over 5,000 industry investors [37][36]. Group 3: Thematic Focus and Special Features - FINE 2026 will feature seven specialized thematic exhibition areas, including advanced semiconductors, AI chips, thermal management, and sustainable materials, aiming to present a comprehensive chain of innovation from components to cutting-edge technologies [13][15]. - The expo will host over 30 forums with more than 300 renowned experts discussing trends in technology, investment strategies, and advanced manufacturing techniques related to new materials [22][24]. Group 4: Strategic Importance - The event is positioned as a critical opportunity for companies to connect with industry funds, government parks, and project resources, facilitating the integration of technological and industrial innovation in the new materials sector [2][10]. - The timing of the expo in June is highlighted as a strategic window for seizing business opportunities in the second half of the year, leveraging Shanghai's advantages as a major international exhibition platform [10].

在 AI 驱动半导体产业打破周期性定律、全球市场规模预计达 9750 亿美元（WSTS 数据）的 关键节点，半导体全产业链协同已成为突破技术瓶颈、把握结构性增长机遇的核心路径。由 半导体行业观察 与 慕尼黑上海光博会 联合主办的 《从器件到网络的协同创新论坛》 ，将于 2026年3月18日 登陆上海新国际博览中心。 论坛紧扣 "光电融合、算力革新、国产攻坚" 三大行业主线，串联 "趋势 — 基础 — 核心 — 器件 — 组件 — 应用 — 协同" 全链路，打造契合产业演进方向的高端交流平台。 Part.01 呼应产业变局，破解协同痛点 当前半导体产业正经历多重结构性变革：AI 算力需求推动硅光技术从 800G 向 1.6T 快速迭代 （2026 年 1.6T 光模块渗透率预计突破 20%）、国产算力芯片进入大规模应用关键期（海光信 息、寒武纪等企业已实现多场景落地）、先进封装成为后摩尔时代性能提升核心路径（CoWoS 产 能持续扩张）。本次论坛精准锚定这些趋势，线下汇聚 200 位运营商、设备商、EDA 企业等核心 从业者，线上通过半导体行业观察视频号同步直播，构建 "线下技术对接 + 线上趋势传播" 的双线 ...

Core Viewpoint - Yongzhi Co., Ltd. is positioned as a national-level "little giant" enterprise and a national high-tech enterprise, focusing on the semiconductor chip packaging materials sector, and aims to support the independent and controllable development of the domestic semiconductor industry chain [2]. Group 1: Company Overview - Yongzhi Co., Ltd. was established on October 15, 2007, with a registered capital of 1.133 billion yuan, and is located in Taixing City, Jiangsu Province [1]. - The company specializes in the research, production, and sales of semiconductor packaging materials, particularly lead frames and packaging substrates [2]. Group 2: Product and Technology - Yongzhi's core products include lead frames and packaging substrates, with lead frames being critical materials in semiconductor packaging that provide electrical connections, mechanical support, and thermal management [2]. - The company utilizes advanced high-precision stamping, etching, and metal surface treatment technologies, offering both stamped and etched lead frames primarily for medium to high-power discrete devices [2]. Group 3: Market Position and Partnerships - Yongzhi has established itself as a key supplier for major chip manufacturers such as Silan Micro, China Resources Micro, and BYD Semiconductor, and has close collaborations with global top ten packaging and testing companies [3]. - The company has been recognized as a qualified supplier by ASE, indicating strong market acceptance [3]. Group 4: Intellectual Property and Future Prospects - Yongzhi has obtained a total of 128 patents, including 47 invention patents, showcasing its strong research and development capabilities [3]. - Market participants are optimistic about Yongzhi's successful completion of the guidance acceptance and its potential listing on the capital market, which would mark the beginning of a new sustainable development journey [3].

Core Viewpoint - Yongzhi Co., Ltd. is positioned as a national-level specialized and innovative "little giant" enterprise in the semiconductor chip packaging materials sector, focusing on providing high-performance and reliable packaging material solutions to support the independent and controllable development of the domestic semiconductor industry [2]. Group 1: Company Overview - Yongzhi Co., Ltd. was established on October 15, 2007, with a registered capital of 113.33 million yuan, and is located in Taixing City, Jiangsu Province [1]. - The company specializes in the research, production, and sales of semiconductor chip packaging materials, with core products including lead frames and packaging substrates [2]. Group 2: Product and Technology - The lead frame, a key material in semiconductor packaging, plays crucial roles in electrical connection, mechanical support, and thermal management, while the packaging substrate serves as the core connection bridge between bare chips and external circuits [2]. - Yongzhi's lead frame products are categorized into stamped lead frames and etched lead frames, primarily used in medium to high-power discrete devices across various critical sectors such as consumer electronics, industrial control, new energy, and automotive [2]. Group 3: Market Position and Partnerships - Yongzhi has established itself as a significant supplier to renowned chip manufacturers such as Silan Micro, China Resources Micro, and BYD Semiconductor, and has formed close collaborations with global top ten packaging and testing companies [3]. - The company has been recognized as a qualified supplier by ASE, indicating strong market acceptance [3]. Group 4: Intellectual Property and Future Prospects - As of now, Yongzhi has obtained a total of 128 patents, including 47 invention patents, showcasing its robust research and development capabilities that support product innovation and technological breakthroughs [3]. - Market participants express anticipation for Yongzhi to successfully complete its guidance acceptance and enter the capital market, marking the beginning of a new sustainable development journey [3].