证券研究报告/宏观利率研究 2026 年 02 月 25 日 节前资金面宽松 十债利率站稳 1.8%下方 宏观利率周报（20260209-20260213） 研报摘要 ⚫ 核心观点：本周资金面平稳，A 股震荡、海外权益调整，不构成债市压制，市场震 荡偏强。1 月 PPI 同比稳步回升，但债市对"反内卷"计价已相对充分，降息降准靴子 落地前实际影响仍偏边际。社融数据同比多增幅度不大，开门后力度弱于去年同期，债 市多头思维或阶段延续。政策方面，四季度货币政策执行报告中有关货币财政协同、 "存款搬家"、国债买卖操作等阐述，均有利于利率筑顶。年初以来，债市呈现的"小 阳春"行情，主要由配置型资金主导推动，叠加交易盘对降准降息政策的乐观预期形成 接力效应，节后持续性仍有待观察。2 月份属于政策、经济数据空窗期，时处生产淡季， 且年初配置力量偏强、资金面宽松，整体对债市有利。在"降准降息"靴子落地前，配 置盘主导的行情或仍将延续，但空间或受限，提示 10 年国债活跃券收益率（1.78%） 向下赔率不高，建议适当把握节奏。 ⚫ 行情回顾：（1）资金面：本周临近春节长假，央行操作"呵护"意图较强，公开 市场操作净投放过万亿。 ...

韩国 SK 海力士周三宣布，计划投资 21.6 万亿韩元（约合 150.7 亿美元），于 2030 年前在韩国龙仁市 新建芯片生产线，以满足不断增长的半导体需求。 责任编辑：郭明煜 责任编辑：郭明煜 韩国 SK 海力士周三宣布，计划投资 21.6 万亿韩元（约合 150.7 亿美元），于 2030 年前在韩国龙仁市 新建芯片生产线，以满足不断增长的半导体需求。 ...

Group 1 - The core point of the news is that southbound funds recorded a net sell of HKD 40.57 billion in Hong Kong stocks, with significant buying in Tencent, Meituan, Alibaba, Xiaomi, and others [1] - Tencent Holdings saw a net buy of HKD 8.18 billion, while Meituan-W, Alibaba-W, and Xiaomi Group-W also experienced substantial net inflows [1] - The net sell was primarily driven by the Yingfu Fund, which had a net sell of HKD 44.1 billion, followed by significant sells in Hang Seng China Enterprises and COSCO Shipping Energy [1] Group 2 - Southbound funds have consistently net bought Meituan for six consecutive days, totaling HKD 33.014 billion, and have also net bought SMIC and Xiaomi for four consecutive days [1] - The recent trading data shows Tencent Holdings with a slight increase of 0.5% and a net buy of HKD 5.46 billion, while Alibaba-W experienced a minor increase of 0.2% but had a net sell of HKD 1.70 billion [5] - Longi Green Energy and other companies like China National Offshore Oil Corporation also showed varied performance, with some experiencing net sells despite slight price changes [5]

海光信息公告，公司2025年实现营业收入1,437,589.94万元，比上年同期增加56.91%；实现归属于母公 司所有者的净利润254,226.41万元，比上年同期增加31.66%。预计2026年第一季度实现归属于母公司所 有者的净利润与上年同期（法定披露数据）相比，将增加1.14亿元到2.14亿元，同比增长22.56%到 42.32%。 风险提示及免责条款 市场有风险，投资需谨慎。本文不构成个人投资建议，也未考虑到个别用户特殊的投资目标、财务状况或需要。用户应考虑本文中的任何 意见、观点或结论是否符合其特定状况。据此投资，责任自负。 ...

美国还能靠关税吓住全世界吗？2026年2月20日，这个问题有了答案。 当天，美国最高法院一纸判决，直接宣布特朗普政府过去一年多加征的"对等关税"违法。 理由很硬：总统无权绕过国会，用《国际紧急经济权力法》当借口，对全球商品随意加税。 这不是程序瑕疵，是釜底抽薪。 特朗普赖以施压各国的核心工具，说加就加、动辄50%的关税大棒一夜之间失去了法律支撑。 最高法院一锤子砸懵白宫 2026年2月20日，美国最高法院给了白宫当头一棒。 几名大法官判定，特朗普政府这两年一直拿来吓唬全世界的"关税大棒"，根本就没法律根基，以《国际 紧急经济权力法》（IEEPA）为依据，对各国商品随意加征所谓"对等关税"，属于总统越权。 这场官司的原告，看着不起眼，五家美国中小企业加上12个州联手起诉。 但裁决一落地，等于直接把特朗普用来对外施压的"万能钥匙"从法律上折断了。 过去一年，他靠"关税威胁"逼着盟友签各种协议、砍价、让步，现在突然被告知，这一套从源头上违 法，后续一大堆行政命令都站不住脚。 按理说，遇到这事，任何总统都得停下来重新评估对外经济政策。 但特朗普的脾气大家都清楚：不信邪、要硬撑。 在裁决生效不到24小时内，白宫迅速翻出 ...

1. Report Industry Investment Rating - The document doesn't provide the industry investment rating. 2. Core Viewpoints of the Report - The semiconductor industry is of strategic importance, but its financing system faces challenges. The report analyzes the bond financing strategies of three overseas semiconductor companies to provide reference for Chinese semiconductor companies and the domestic bond market [9][10][11]. 3. Summary According to the Directory 3.1 Asia: SK Hynix Inc - **Company Overview**: A global leading semiconductor storage solutions provider, focusing on memory chips with products like DRAM, NAND flash, and CIS. In 2025, it became the world's largest DRAM manufacturer and had a strong position in other markets [12][14][15]. - **Development Path**: It went through four stages: "start - up and foundation - building (1983 - 1998)", "scale expansion (1999 - 2011)", "strategic transformation (2012 - 2020)", and "AI - enabled (2021 - 2025)". It achieved strategic upgrades through technology iteration and capacity expansion [16][17][20]. - **Bond Issuance History and Changes**: The bond - issuing mode evolved from "point - like exploratory financing" to "normalized, large - scale, diversified strategic financing". The financing strategy changed in different stages, with the bond financing frequency, term, and coupon rate showing corresponding characteristics [24][31][34]. 3.2 Europe: ASML Holding NV - **Company Overview**: The global leader in semiconductor lithography equipment, with a monopoly in the EUV market. Its products include EUV, DUV lithography equipment, and related services. In 2025, it further consolidated its monopoly position [46][47][48]. - **Development Path**: It went through three stages: "breaking through difficulties (1984 - 2007)", "technological monopoly (2007 - 2013)", and "ecosystem binding (2013 - present)". It achieved a leading position through technological focus and strategic choices [49][50][54]. - **Bond Issuance History and Changes**: The bond - issuing mode evolved from "supplementary financing" to "strategic supporting financing". The financing strategy was adjusted according to different development stages, with the bond financing frequency, term, and coupon rate changing accordingly [57][62][65]. 3.3 United States: Broadcom Inc - **Company Overview**: A global leading provider of semiconductor chips and infrastructure software solutions, with a dual - business pattern of "semiconductor chips + infrastructure software". It ranked 7th in the global semiconductor companies in 2025 [77][79]. - **Development Path**: It went through three stages: "merger and acquisition expansion (1991 - 2013)", "technology integration (2013 - 2018)", and "chip + software ecosystem closed - loop (2018 - present)". It reshaped its business through mergers and acquisitions [81][82][85]. - **Bond Issuance History and Changes**: The bond - issuing mode evolved from "supplementary R & D financing" to "merger - driven large - scale financing". The financing strategy was closely related to the merger and acquisition process, with the bond financing frequency, term, and coupon rate showing different characteristics in different stages [86][93][94].

（文章来源：证券日报） 证券日报网讯 2月25日，神工股份发布2025年度业绩快报公告称，公司2025年实现营业总收入44277.20 万元，同比增长46.26%；归属于上市公司股东的净利润10145.47万元，同比增长146.54%。 ...

Core Viewpoint - The A-share HBM (High Bandwidth Memory) industry chain is experiencing a collective surge due to the explosive demand for AI computing power and accelerated iteration of HBM technology, with increased capital attention across various segments from upstream materials and equipment to packaging and testing. Company Summaries - **拓荆科技 (Tuojing Technology)**: Latest stock price is 360.00 CNY with a daily increase of +9.98%. The company plans to reduce holdings and is a major supplier of ALD equipment, essential for HBM manufacturing processes [1]. - **宏昌电子 (Hongchang Electronics)**: Latest stock price is 11.54 CNY with a daily increase of +8.97%. It is a leading domestic supplier of electronic-grade epoxy resin, a key material for HBM packaging [2]. - **精智达 (Jingzhida)**: Latest stock price is 313.00 CNY with a daily increase of +7.28%. The company develops testing technologies and equipment for new generation semiconductor memory, including HBM [3]. - **联瑞新材 (Lianrui New Materials)**: Latest stock price is 68.50 CNY with a daily increase of +6.83%. It supplies core materials for HBM packaging, including ball silicon and Low α ball aluminum [4]. - **芯碁微装 (Xinqi Microelectronics)**: Latest stock price is 186.37 CNY with a daily increase of +5.82%. The company plans to reduce holdings and provides advanced packaging equipment that supports HBM applications [5]. - **兴森科技 (Xingsen Technology)**: Latest stock price is 26.30 CNY with a daily increase of +5.41%. The company produces FCBGA packaging substrates, crucial for HBM storage packaging [6][7]. - **飞凯材料 (Feikai Materials)**: Latest stock price is 31.98 CNY with a daily increase of +5.02%. It produces EMC epoxy resin, a core material for HBM storage chip manufacturing [8]. - **芯源微 (Xinyuan Micro)**: Latest stock price is 212.20 CNY with a daily increase of +4.88%. The company has gained recognition in HBM and 2.5D/3D packaging fields, with increasing sales of multiple products [9]. - **圣泉集团 (Shengquan Group)**: Latest stock price is 34.21 CNY with a daily increase of +4.65%. The company provides various materials, including special phenolic resin and epoxy resin, for the HBM industry [10]. - **壹石通 (Yishitong)**: Latest stock price is 31.40 CNY with a daily increase of +4.32%. The company supplies chip packaging materials for HBM and is an important part of the HBM packaging supply chain [11]. - **华海诚科 (Huahai Chengke)**: Latest stock price is 132.54 CNY with a daily increase of +4.21%. The company plans to reduce holdings and has materials for HBM packaging that have passed customer certification [12]. - **赛腾股份 (Saiteng Co., Ltd.)**: Latest stock price is 50.53 CNY with a daily increase of +4.21%. The company has entered the wafer inspection and measurement equipment field and is expanding applications in HBM [13][14]. - **ST华鹏 (ST Huapeng)**: Latest stock price is 7.00 CNY with a daily increase of +3.86%. It is an upstream supplier of epoxy resin for HBM construction materials [15]. - **强力新材 (Qiangli New Materials)**: Latest stock price is 16.21 CNY with a daily increase of +3.71%. The company is in the customer certification phase for advanced packaging materials and aims to enter the HBM advanced packaging market [16]. - **国芯科技 (Guoxin Technology)**: Latest stock price is 41.38 CNY with a daily increase of +3.71%. The company is involved in HBM interface technology development and validation [17].

① 【三大期指齐涨】道指期货涨0.11%、标普500指数期货涨0.14%、纳指期货涨0.20%。 ② 【英伟达Q4财报公布在即，盘前微涨】英伟达盘前微涨0.34%。消息面上，该公司将于2月25日盘后 发布2025财年第四财季财报，财报电话会议定于北京时间2月26日早上6:00举行。 英伟达此前第三财季营收超出分析师预期，达到570.1亿美元，同比增长62.5%，当时其给出的第四财季 营收预期为650亿美元，上下浮动2%；GAAP毛利率预计为74.8%，上下浮动0.5%。过去30天里，追踪 英伟达业绩的分析师均重申了对其保持强劲业务增长的预期。 ⑤ 【台积电涨超1%】台积电盘前涨超1%。消息面上，报道称苹果2026年将采购超1亿片台积电生产的 先进芯片。 ⑥ 【日本反垄断机构"突袭"微软办公室】北京时间2月25日，据媒体报道，知情人士透露称，日本反垄 断监管机构突击搜查了微软日本公司的办公室，此举是为了调查这家美国软件巨头是否不当阻碍其 Azure云平台客户使用其他云服务。日本公平贸易委员会正在调查微软涉嫌违反《反垄断法》的不公平 贸易行为，还将要求微软美国母公司作出澄清。 ⑦ 【苹果触屏版MacBook Pr ...

有投资者在互动平台向 长光华芯提问：请问公司400GEML研发进展如何？200GEML验证预计什么时候 结束？什么时候能取得小批量订单？100GEML去年是一季度末首次签单，公司说客户十分满意，请问 今年合同完成后是否取得更大新订单？订单累计金额是否超过5个亿？ 长光华芯回复称，公司200G EML芯片目前处于客户验证阶段，验证通过后将及时披露。更高速率产品在研发阶段。100G EML芯片 订单签订及交付工作正常开展，相关订单金额未达到披露标准，公司将在定期报告中披露经营进展。 ...