Group 1: SiC Substrate Market - The global N-type SiC substrate market is projected to experience a revenue decline of 9% in 2024, amounting to $1.04 billion, due to weakened demand in the automotive and industrial sectors, alongside intensified market competition and significant price drops [1] Group 2: Semiconductor Packaging and Testing Market - The combined revenue of the top ten semiconductor packaging and testing companies is expected to reach $41.56 billion in 2024, reflecting a year-on-year growth of 3% [4] - ASE Holdings and Amkor maintain their leading positions, while companies like JCET and Tianshui Huatian are experiencing double-digit growth, posing strong challenges to the existing market structure [4][5] Group 3: AI Chip Development - The demand for AI servers is accelerating the self-research of ASIC chips among major North American cloud service providers, with new versions expected to be released every 1-2 years [6] - The proportion of AI chips sourced from foreign suppliers like NVIDIA and AMD in the Chinese market is anticipated to decrease from approximately 63% in 2024 to about 42% in 2025, while local suppliers are expected to increase their share to 40% under government policy support [6]

Core Insights - The article discusses the accelerating trend of AI server demand driving major North American Cloud Service Providers (CSPs) to develop their own Application-Specific Integrated Circuits (ASICs) to reduce reliance on external suppliers like NVIDIA and AMD [1][2][3][4][5]. Group 1: North American CSP Developments - Google has launched the TPU v6 Trillium, focusing on energy efficiency and optimization for large AI models, with plans to significantly replace the TPU v5 by 2025 [2]. - AWS is collaborating with Marvell on the Trainium v2, which supports generative AI and large language model training, and is expected to see substantial growth in ASIC shipments by 2025 [2]. - Meta is developing the next-generation MTIA v2 in partnership with Broadcom, emphasizing energy efficiency and low-latency architecture for AI inference workloads [3]. - Microsoft is accelerating its ASIC development with the Maia series chips, optimizing for Azure cloud services, and is collaborating with Marvell for the Maia v2 design [3]. Group 2: Chinese AI Supply Chain Autonomy - Huawei is actively developing the Ascend chip series for domestic markets, targeting applications in LLM training and smart city infrastructure, which may challenge NVIDIA's market position in China [4]. - Cambricon's MLU AI chip series is aimed at cloud service providers for AI training and inference, with plans to advance its solutions to the cloud AI market by 2025 [4]. - Chinese CSPs like Alibaba, Baidu, and Tencent are rapidly developing their own AI ASICs, with Alibaba's T-head launching the Hanguang 800 AI inference chip and Baidu working on the Kunlun III chip [5].

周价格表 | | | | | 更新日期:2025/5/14 | | --- | --- | --- | --- | --- | | 多晶硅 (Per KG) | 高点 | 低点 | 均价 | 涨跌幅 | | N型复投料(RMB) | 41.000 | 36.000 | 38.000 | -2.56% | | N型致密料(RMB) | 38.000 | 35.000 | 36.000 | -2.70% | | N型颗粒硅(RMB) | 36.000 | 33.000 | 34.500 | -2.82% | | 非中国区多晶硅(USD) | 22.000 | 13.100 | 18.200 | 0.00% | | 硅片 (Per pc) | 高点 | 低点 | 均价 | 涨跌幅 | | N型183車晶硅片-183mm/130μm (RMB) | 0.950 | 0.900 | 0.950 | -6.86% | | N型210单晶硅片-210mm/130um (RMB) | 1.300 | 1.250 | 1.300 | -1.52% | | N型210R单晶硅片-210*182mm/130um (RMB) | 1 ...

Industry Insights - The global OSAT market is facing dual challenges of technological upgrades and industry restructuring in 2024 [1] - The top ten OSAT companies are projected to generate a combined revenue of $41.56 billion in 2024, reflecting a year-on-year growth of 3% [2][3] Company Performance - ASE Holdings (日月光控股) remains the leader with a revenue of $18.54 billion in 2024, a slight decrease of 0.7% from 2023, holding a market share of 44.6% [3][5] - Amkor (安靠) ranks second with a revenue of $6.32 billion, down 2.8% year-on-year, primarily due to weak demand in automotive electronics [3][6] - JCET (长电科技) is third with a revenue of $5 billion, showing a significant growth of 19.3%, driven by improving demand in consumer electronics and AI PC markets [3][7] - TFME (通富微电) ranks fourth with a revenue of $3.32 billion, up 5.6%, benefiting from recovering demand in communications and consumer electronics [3][8] - PTI (力成科技) is fifth with a revenue of $2.28 billion, reflecting a modest growth of 1% due to transitional challenges in advanced packaging [3][9] - TSHT (天水华天) ranks sixth with a revenue of $2.01 billion, achieving the highest growth rate of 26% among the top ten OSAT companies, supported by advancements in packaging technology [3][10] - WiseRoad (智路封测) is seventh with a revenue of $1.56 billion, up 5%, driven by semiconductor demand recovery [3][11] - Hana Micron (韩亚微) ranks eighth with a revenue of $0.92 billion, growing 23.7% due to strong performance from memory clients [3][12] - KYEC (京元电子) is ninth with a revenue of $0.91 billion, down 14.5%, impacted by the sale of a subsidiary but benefiting from growth in AI server and HPC chip markets [3][13] - ChipMOS (南茂科技) rounds out the top ten with a revenue of $0.71 billion, up 3.1%, driven by stable demand in automotive and OLED sectors [3][14] Market Trends - The 2024 OSAT market indicates a restructuring of the value chain, with increasing demands for advanced packaging technologies driven by AI and edge computing [14] - The market is characterized by a dual-axis trend of "mature leaders' stability and the rise of regional new forces," setting the stage for future competition in advanced packaging and heterogeneous integration technologies [14]

May.12, 2025 产业洞察 根据TrendForce集邦咨询最新研究，受2024年汽车和工业需求走弱，SiC衬底出货量成长放缓，与此同 时，市场竞争加剧，产品价格大幅下跌，导致 2024年全球N-type（导电型）SiC衬底产业营收年减9%， 为10.4亿美元 。 进入2025年，即便SiC衬底市场持续面临需求疲软和供给过剩的双重压力，但长期成长趋势依旧不变，随 着成本逐渐下降和半导体元件技术不断提升，未来SiC的应用将更为广泛，特别是在工业领域的多样化。同 时，激烈的市场竞争将加速企业整合的力道，重新塑造产业发展格局。 先进则在8英寸晶圆市场中占据领先地位。Coherent则下滑至第四名，市占率约13.9%。 从衬底尺寸观察，由于现行主流的6英寸SiC衬底价格快速下降，以及8英寸SiC前段制程的技术难度较高， 加上市场环境剧烈变化，预计6英寸衬底将持续占据SiC衬底市场的主导地位。但8英寸衬底是进一步降低 SiC成本的必然选择，且有助SiC芯片技术升级，吸引各大厂商积极投入。 在此情况下，TrendForce集邦 咨询预估8英寸SiC衬底的出货份额将于2030年突破20% 。 如果你觉得这篇文章有价 ...

Group 1: MLCC Market Insights - The MLCC market faces increased uncertainty for the second half of 2025, with a growing risk of a "not-so-busy" peak season due to companies and end markets adopting a cautious and wait-and-see attitude [1] Group 2: OLED Display Growth - The OLED display market is experiencing rapid growth, with shipments expected to reach approximately 507,000 units in Q1 2025, representing a year-on-year increase of 175% [3] - In Q2 2025, shipments are projected to benefit from a significant increase in 27-inch UHD models, potentially reaching 650,000 units [3] - The total shipment for 2025 is forecasted to reach 2.58 million units, with an annual growth rate of 81%, and the overall penetration rate of displays is expected to grow to 2% [3] Group 3: Company Collaborations - Mitsubishi Motors has signed a memorandum of understanding with Hon Hai's subsidiary, Honhua Advanced Technology, to supply electric vehicles to the Australian and New Zealand markets starting in 2026 [7] - This collaboration is a strategic move for Mitsubishi to implement its electrification blueprint and adapt to rapid market changes, while Hon Hai's CDMS model gains recognition from international automakers, which is crucial for future business expansion [7]

TrendForce集邦咨询 TrendForce 汽车产业 May. 9, 2025 产业洞察 三菱汽车(Mitsubish Motors)近日宣布与鸿海子公司鸿华先进科技签订电动车供应备忘录，计划于2026年 向澳洲与新西兰市场销售电动车。TrendForce集邦咨询表示，此举不仅是三菱实现其电动化蓝图的具体行 动，也是面对市场快速变化所做的策略性布局。对鸿海而言，其建立的CDMS (contract design and manufacturing service)模式获得国际级车厂认可至关重要，对未来业务拓展具有指导性意义。 这款电动车将由鸿华先进开发，裕隆生产，挂三菱品牌销售。TrendForce集邦咨询分析，此合作案突显目 前汽车产业的两大趋势：首先，传统车厂在电动化浪潮与市场不确定性下，正积极寻求外部资源以加速转 型；其次，不同背景的制造服务商皆可能在未来的汽车产业链中扮演重要角色，展现出产业竞争与合作的 多元可能性。 根据三菱的电动化目标，公司计划推动油电混合车(HEV)、插电式混合动力车(PHEV)及纯电动车(BEV)在 2030年前成为主要销售车型，并于2035年达成以纯电动车为销售主力的 ...

| 多晶硅 (Per KG) | 高点 | 低点 | 均价 | 涨跌幅 | | --- | --- | --- | --- | --- | | N型复投料(RMB) | 42.000 | 37.000 | 39.000 | -1.27% | | N型致密料(RMB) | 39.000 | 36.000 | 37.000 | -1.33% | | N型颗粒硅(RMB) | 36.000 | 35.000 | 35.500 | -1.39% | | 非中国区多晶硅(USD) | 22.000 | 13.100 | 18.200 | -1.62% | | 硅片 (Per pc) | 高点 | 低点 | 均价 | 涨跌幅 | | N型183单晶硅片-183mm/130pm (RMB) | 1.050 | 0.980 | 1.020 | -2.86% | | N型210单晶硅片-210mm/130µm (RMB) | 1.350 | 1.280 | 1.320 | -5.71% | | N型210R单晶硅片-210*182mm/130pm (RMB) | 1.180 | 1.100 | 1.150 | 0.00% | ...

Core Viewpoint - The OLED monitor market is experiencing rapid growth, with significant increases in shipment volumes expected through 2025, driven by new product launches and market demand [1]. Group 1: Market Overview - OLED monitor shipments are projected to reach approximately 507,000 units in Q1 2025, representing a year-on-year increase of 175% [1]. - By the end of 2025, total shipments are expected to hit 2.58 million units, with an annual growth rate of 81%, and overall penetration in the display market will rise to 2% [1]. Group 2: Brand Performance - Samsung leads the OLED monitor market with over 22% market share in Q1 2025, with its 49-inch product accounting for 40% of its shipments [2]. - ASUS has climbed to the second position in market share, closely trailing Samsung by less than one percentage point, and achieved the highest monthly shipment volume in February and March [3]. - MSI holds the third position with a 14% market share, benefiting from a 63% year-on-year growth in overall monitor shipments and a staggering 36-fold increase in OLED shipments [4]. - LG Electronics (LGE) ranks fourth with a 13% market share, but is expected to fall behind due to a lack of strong product offerings in the 27-inch UHD segment [5]. - Dell is currently in fifth place with an 11% market share, anticipating an increase in its ranking due to new product launches aimed at the business market [6].

May. 7, 2025 Tr e n dFo r c e集邦咨询表示，终端市场需求下滑与销售成本暴增，MLCC供应商面临OEM下修订单风 险，可能被要求降价等两大主要挑战。此外，国际货币市场日元再度成为市场青睐的避险货币，近 期持续升值，四月起美元兑日元已从1 5 0下跌至1 4 1日元。在此背景下，观察目前MLCC商规中低容 值和车规产品报价，皆低于疫情前2 0 1 9年第四季水平。至于AI Se r v e r常用的高阶标准品，历经 2 0 2 4年的竞价抢单，销售利润大幅下滑，终端订单需求能见度低，加上潜在货币升值风险，MLCC 供应商运营挑战加剧，势必将压缩定价与让利空间。 产业洞察 根据Tr e n dFo r c e集邦咨询最新MLCC研究报告，因企业及终端市场的避险与观望心态与日俱增， 2 0 2 5年上半年MLCC供需节奏被打乱，下半年"旺季不旺"的风险也随之上升。 据Tr e n dFo r c e集邦咨询调查，OEM、ODM接连将北美Ch r ome b o o k与部分消费性笔电订单提前至第 一季出货，导致四月开始的传统教育笔电旺季备货动能意外平淡。以MLCC供应商取得第二季De ll ...