Core Insights - The article discusses the establishment of the world's first group standard for humanoid robots, titled "Intelligent Classification of Humanoid Robots" (T/CIE 298-2025), which includes a four-dimensional and five-level intelligence capability grading system [1][2]. Group 1: Standardization and Industry Impact - The new standard categorizes humanoid robot intelligence into four core capabilities: Perception and Cognition (P), Decision Making and Learning (D), Execution Performance (E), and Collaboration and Interaction (C) [1]. - The standard provides a grading system from L1 to L5, indicating a progressive increase in intelligence capabilities, along with 22 primary indicators and over 100 technical clauses [1]. - TrendForce indicates that the standardization is crucial for the commercialization of humanoid robots, helping to regulate technical indicators and lower barriers to entry, thus facilitating large-scale production and cost reduction [1][4]. Group 2: Market Dynamics and Player Analysis - As of May 2025, there are 54 companies in China actively engaged in the humanoid robot sector, with startups making up 61% of this market [4]. - Different types of companies are entering the humanoid robot space, including traditional industrial robot firms (11%), automotive companies (13%), large internet firms (9%), and home appliance companies (4%) [4]. - Automotive companies leverage their experience in autonomous driving and established supply chains, while startups excel in innovation and rapid market responsiveness [4][5]. Group 3: Future Prospects - The establishment of national standards is expected to enhance the technical iteration of hardware and software systems among participating teams in upcoming events like the 2025 World Robot Conference and the World Humanoid Robot Games [2]. - Long-term, the standard is anticipated to accelerate the commercial deployment of humanoid robots across various sectors, including industrial manufacturing, healthcare, and home services [2].

May. 26, 2025 产业洞察 | | 2Q25E | 3025F | | --- | --- | --- | | Blended | up 3~8% | up 5~10% | | NAND Flash | | | | Source: TrendForce, May 2025 | | Trend Force | 根据TrendForce集邦咨询最新调查，以北美大厂为主的云端服务业者(CSP)持续加强AI投资，预期将 带动企业级SSD（Enterprise SSD）需求于2025年第三季显著成长。在成品库存水位偏低的背景下， 预期Enterprise SSD市场将转为供应吃紧，这将支撑价格出现上涨，季增幅度有望达到10%。 然而，近期存储需求回暖，这波成长动能一方面来自NVIDIA GB200等高阶AI Server陆续出货；另一 方面，今年初开始HDD订单加量反映企业扩建趋势，预期全年将持续增长。可见在CSP的Server建置 需求维持稳健下，SSD与HDD皆受益于企业资本支出扩张，迎来订单成长。 TrendForce集邦咨询指出，今年初由于供应商执行保守产能策略，NAND Flash市场逐步转向供需平 ...

Group 1: Data Center Interconnection and AI Impact - The global market value for Data Center Interconnection (DCI) is expected to grow at an annual rate of 14.3%, surpassing $40 billion by 2025, driven by the integration of generative AI into everyday applications [1] Group 2: New Energy Vehicle Sales - In the first quarter of 2025, global sales of new energy vehicles (including BEVs, PHEVs, and hydrogen fuel cell vehicles) reached 4.02 million units, marking a 39% year-on-year increase, with new energy vehicles accounting for 18.4% of total global car sales [3] Group 3: HBM4 Technology and Market Trends - The development of HBM (High Bandwidth Memory) technology is being propelled by demand from AI servers, with major manufacturers advancing HBM4 products. The increased complexity and size of HBM4 chips are expected to lead to a premium of over 30%, compared to approximately 20% for HBM3e at launch [7]

Core Insights - The development of HBM technology is driven by the demand for AI servers, with major manufacturers actively advancing HBM4 product timelines [1][5] - HBM4 is expected to have a premium exceeding 30% due to increased manufacturing complexity compared to HBM3e, which had a premium of about 20% at launch [1] Group 1: HBM Technology Overview - HBM4 is set to release in 2026, featuring a core die density of 24Gb, with layers ranging from 12 to 16 and a speed of 8-10 Gbps, doubling the I/O count from 1024 to 2048 compared to previous generations [2][5] - HBM3e, released in 2024, has a core die density of 24Gb and an I/O count of 1024, while HBM3, released in 2022, has a core die density of 16Gb [2] Group 2: Market Projections - TrendForce forecasts that the total shipment volume of the HBM market will exceed 30 billion Gb by 2026, with HBM4 expected to surpass HBM3e in market share by the second half of 2026 [6] - SK hynix is projected to maintain a leading position with over 50% market share in HBM4, while Samsung and Micron need to improve product yield and capacity to catch up [6]

01 周价格表 | 多晶硅 (Per KG) | 高点 | 低点 | 均价 | 涨跌幅 | | --- | --- | --- | --- | --- | | N型复投料(RMB) | 39.000 | 36.000 | 37.500 | -1.32% | | N型致密料(RMB) | 37.000 | 35.000 | 35.000 | -2.78% | | N型颗粒硅(RMB) | 35.000 | 32.000 | 34.000 | -1.45% | | 非中国区多盟娃(USD) | 22.000 | 13.100 | 18.200 | 0.00% | | 硅片 (Per pc) | 高点 | 低点 | मुद्री | 涨跌幅 | | N型183单晶硅片-183mm/130pm (RMB) | 0.950 | 0.920 | 0.930 | -2.11% | | N型210单晶硅片-210mm/130µm (RMB) | 1.300 | 1.250 | 1.300 | 0.00% | | N型210R单晶硅片-210*182mm/130μm (RMB) | 1.100 | 1.050 | 1.080 ...

May. 21, 2025 产业洞察 根 据 TrendForce 集 邦 咨 询 最 新 统计，2025年第一季全球纯电动车 （ BEV ） 、 插 电 混 合 式 电 动 车 （PHEV）和氢燃料电池车等新能源车合计销量达402万辆，年增39%，新能源车占第一季全球汽车销 售比例为18.4%。 | Rank | BEV | Market Share | PHEV | Market Share | | --- | --- | --- | --- | --- | | 1 | 比亚迪 | 15.4% | 比亚迪 | 38.7% | | 网 | Tesla | 12.6% | 理想 | 6.7% | | 3 | 書利 | 6.9% | 吉利 | 5.9% | | 4 | 上汽通用五菱 | 6.6% | 奇瑞 | 3.6% | | 5 | Volkswagen | 4.0% | BMW | 3.5% | | 6 | 小鵬 | 3.5% | Mercedes-Benz | ﻟﻴﻨﻴ 3.4% | | 7 | BMW | 3.3% | 同界 | 3.2% | | B | 小米 | 2.8% | Volvo cars | ...

| 应用别 | R4 | 分辨率 | 出货型态 | | | 液晶显示屏价格 | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | | | | | | TE | 를 | म्येरी | 与前月差异(%) | | | 电视 | ee .. M | 3840x2160 | Open-Cell | 173 | 182 | 177 | 0.0 | 0.0% | | | SE. M | 3840x2160 | Open-Cell | 122 | 130 | 127 | 0.0 | 0.0% | | | 43"W | 1920x1080 | Open-Cell | Ed | 67 | રેર | 0.0 | 0.0% | | | 32"W | 1366x768 | Open-Cell | 35.0 | 37.0 | 36.0 | 0.0 | 0.0% | | 桌上显示器 | 27"W (IPS) | 1920x1080 | LED | 57.6 | 65.8 | 63.0 | 0.1 | 0.2% | | | 23.8"W (IPS) | 1920x1 ...

Core Viewpoint - The panel prices for televisions and laptops remained stable in May 2025, while monitor panel prices experienced a slight increase [1]. Group 1: Television Panels - The average price for a 65-inch television panel was $177, with a minimum of $173 and a maximum of $182 [5]. - The average price for a 55-inch television panel was $127, with a minimum of $122 and a maximum of $130 [6]. - The average price for a 43-inch television panel was $66, with a minimum of $64 and a maximum of $67 [8]. - The average price for a 32-inch television panel was $36, with a minimum of $35 and a maximum of $37 [9]. Group 2: Monitor Panels - The average price for a 27-inch IPS monitor panel was $63, reflecting an increase of $0.1 or 0.2% from the previous month, with a minimum of $57.6 and a maximum of $65.8 [11]. - The average price for a 23.8-inch IPS monitor panel was $49.9, showing an increase of $0.2 or 0.4% from the previous month, with a minimum of $47.1 and a maximum of $51.4 [12]. Group 3: Laptop Panels - The average price for a 17.3-inch TN laptop panel remained stable at $38.3, with a minimum of $37.7 and a maximum of $39.8 [14]. - The average price for a 15.6-inch Value IPS laptop panel was $40.3, unchanged from the previous month, with a minimum of $38.6 and a maximum of $41.9 [14]. - The average price for a 14.0-inch TN laptop panel remained stable at $26.9, with a minimum of $26.4 and a maximum of $28.1 [14]. - The average price for an 11.6-inch TN laptop panel remained stable at $25.1, with a minimum of $24.2 and a maximum of $26.5 [14].

May.19, 2025 产业洞察 根据TrendForce集邦咨询最新研究，2025年随着生成式AI逐步融入人们的生活应用，SK Telecom、Deutche Telekom 等全球主要电信商陆续针对一般用户推出代理式AI (Agentic AI) 服务。在电信商和CSP大厂持续建置数据中心的情况 下， 数据中心互连(Data Center Interconnect, DCI)技术日益受到关注，预估2025年产值将年增14.3%，突破400亿 美元 。 聚焦新趋势，6/10 锁定TrendForce集邦咨询2025半导体产业高层论坛，与讲者共探新机 TrendForce集邦咨询表示，DCI技术可连接两个或多个数据中心，在短、中长距离范围内进行高速数据传输，有助于 降低数据中心庞大的AI数据运算负载。现阶段主要由光通讯设备厂与美国、北欧、东南亚区域电信商合作，共同部署 DCI场景验证。其中以美国的Ciena最为积极提供DCI服务，其合作的电信商Telia、e&和Arelion皆有采用Wavelength Logic6 Extreme方案。 Nokia则拓展其DCI业务至沙特阿拉伯和越南等国家，在越南，Nok ...

6,10 ★ TSS2025 2025年，全球半导体产业在复杂国际形势、终端市场需求波动及颠覆性技术突破的三重变量中深度演 进。AI算力革命与人形机器人产业风口加速形成，晶圆代工市场呈现高端制程与成熟工艺两极化发展， 先进封装产能需求持续攀升，存储芯片周期波动仍存不确定性，第三代半导体产业化进程全面提速。 展望未来，在AI与机器人浪潮驱动下，半导体产业技术变革与产业机遇并存，但也同样面临一系列挑 战。 2025年6月10日（周二） ，TrendForce集邦咨询将在深圳举办" 2025集邦咨询半导体产业高层论坛 （TrendForce Semiconductor Seminar 2025）"。 本次会议为主要面向产业链高层的精品会议，行业精英云集，全程干货分享交流。 目前，演讲嘉宾团队已集结完毕。届时，集邦咨询多位重量级资深分析师将持续聚焦AI人工智能领域， 围绕晶圆代工、IC设计、内闪存、服务器、宽禁带半导体等产业链热门议题，全方位剖析半导体产业现 状与未来，敬请期待！ 演讲阵容 TSS2025 演讲嘉宾： 郭祚荣 集邦咨询资深研究副总经理 分享主题： AI持续升温，全球半导体市场战略布局 ✦ • ✦ 分享 ...