如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自 eenewseurope ，谢谢 。 专 业 代 工 厂 Tower Semiconductor Ltd. （ 位 于 以 色 列 米 格 达 勒 埃 梅 克 ） 首 席 执 行 官 Russell Ellwanger 表示，"五六个月前"放弃了在印度建设晶圆厂的计划。 参考链接 https://www.eenewseurope.com/en/tower-dropped-india-wafer-fab-project-in-2024-says-ceo/ 点这里加关注，锁定更多原创内容 在分析师电话会议上讨论 Tower 公司 2025 年第一季度稳定的财务业绩时，埃尔旺格表示，最近 有关阿达尼集团暂停这项 100 亿美元项目的报道并不属实。 "这（新闻报道）令人意外，因为我们停止了这个项目，而且大约五六个月前，我们根据自己的要 求退出了这个项目，"埃尔旺格说。"我们退出的理由非常充分，但出于保密考虑，我不便透露这些 理由，"他补充道。 埃尔旺格表示，Tower 公司在参与该项目期间从未向媒体发布过有关该项目的任何信息，因为从 未达成任何正式的继续推进协 ...

Core Viewpoint - The UCIe 2.0 standard for die-to-die interconnects in advanced packaging has raised concerns about its complexity, but many of its new features are optional, allowing for customization based on specific needs [1][2][3] Group 1: UCIe 2.0 Features and Flexibility - UCIe 2.0 introduces optional features that are not necessary for internal designs, which dominate the current chiplet market [2][6] - The standard provides flexibility similar to PCIe and CXL, allowing companies to implement only the features they require [2][5] - Most of the new features in UCIe 2.0 are management-related, aimed at ensuring startup and composability, but they are not mandatory [7][9] Group 2: Market Dynamics and Competition - The current advanced packaging products are primarily developed by well-funded companies that control all components, limiting the need for interoperability with externally sourced chiplets [3][17] - There is ongoing competition between UCIe and Bunch of Wires (BoW), with both standards having their proponents and potential applications [15][17] - The UCIe Consortium is working towards establishing a universal market for chiplets, similar to the existing soft design IP market [4][5] Group 3: Implementation and Adoption Challenges - The implementation of UCIe features may face challenges due to the need for consensus among various stakeholders, which can slow down the adoption of new functionalities [17][18] - Companies may choose to use proprietary interfaces for chiplets that are not intended for sale, while others will look to adopt industry standards for commercial products [18][19] - The complexity of UCIe features may deter some companies from fully utilizing the standard, as many prefer simpler, more lightweight solutions [15][16]

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自环球网 ，谢谢 。 美方滥用出口管制限制使用华为"昇腾"芯片，外交部：坚决反对，绝不接受 外交部发言人林剑主持5月16日例行记者会。会上环球时报-环球网记者提问称：据报道，美国商务 部工业与安全局发布公告，视使用华为"昇腾"芯片为违反美国出口管制行为，警告公众允许使用美 人工智能芯片训练中国人工智能模型的潜在后果。中方对此有何评论？ 视频制作：环视频 / 徐童 推荐阅读 10万亿，投向半导体 芯片巨头，市值大跌 黄仁勋：HBM是个技术奇迹 Jim Keller：RISC-V一定会胜出 全球市值最高的10家芯片公司 关 注 我 们 设 为 星 标 扫码立即关注 in 公众号ID: MooreNEWS Ø 9 喜欢我们的内容就点 "在看 " 分享给小伙伴哦~ 美方滥用出口管制限制使用华为"昇腾"芯片，外交部：坚决反对，绝不接受 外交部发言人林剑主持5月16日例行记者会。会上环球时报-环球网记者提问称：据报道，美国商务 部工业与安全局发布公告，视使用华为"昇腾"芯片为违反美国出口管制行为，警告公众允许使用美 人工智能芯片训练中国人工智能模型的潜在后果。中方对此 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自 wccftech ，谢谢 。 小米定制SoC"Xring"的名称 在一个月前就被曝光，而该公司很快便正式发布了这款名为XRING 01的新芯片组。小米 首席执行官雷军在微博社交网络上发布了这一消息，但一如既往地没有透露规格等重要细节。值得庆幸的是，我们之 前已经深入报道过这些信息，现在我们将再次回顾，以便您了解未来小米智能手机将采用何种芯片。 此前有报道称，XRING 01 将采用台积电的 4nm 技术，但有传言称小米将推出 3nm 版本，并可能在未来实现量产 除了提到XRING 01将于本月晚些时候发布外，该微博帖子未分享其他任何有价值的信息。目前尚不清楚小米CEO是 想让观众保持悬念，还是另有其他原因。此前，我们曾报道XRING 01将采用台积电较老的4nm工艺进行量产，但与 骁龙8 Elite不同的是，这款自主研发的解决方案将基于ARM的当前一代CPU设计，其中最快的是主频为3.20GHz的 Cortex-X925。 采用上一代制造工艺可能意味着小米希望避免成本上涨，但我们去年提到，这家中国科技巨星已成功实现 3nm 芯片组 的流片，暗示可能会在 ...

Core Insights - The 2025 COMPUTEX will take place on May 20, featuring keynote speeches from industry leaders such as NVIDIA's CEO Jensen Huang and Hon Hai's Chairman Liu Yangwei, focusing on the latest trends in the technology industry and talent [1] - According to the 104 Job Bank's "2025 Technology Industry Talent Report," the median annual salary for analog IC design engineers is NT$1.55 million, the highest among technology professionals, with semiconductor salaries being 15-30% higher than other tech sectors [1] - The report indicates that software engineers have the most job openings in the tech industry, with a significant demand for various engineering roles [1] Salary Insights - The median annual salary for non-managerial positions in 2024 ranks the top five high-paying roles as follows: Analog IC Design Engineer NT$1.55 million, Digital IC Design Engineer NT$1.34 million, Micro-Electro-Mechanical Systems Engineer NT$1.084 million, Semiconductor Engineer NT$1.081 million, and Firmware Engineer NT$1.077 million [1] - The theme of COMPUTEX is "AI Next," highlighting the ongoing impact of AI on the industry, with median salaries for algorithm development engineers at NT$1.0765 million and data scientists at NT$1.01 million, both ranking in the top ten highest salaries [2] - The top ten AI job roles with the highest salary growth include Digital IC Design Engineer with a 32% salary increase, Analog IC Design Engineer with a 27% increase, Algorithm Development Engineer with a 17% increase, and Software Engineer with a 15% increase [2] Talent Demand Insights - An overview of six major technology sectors reveals the largest talent gaps and job opportunities in the following roles: Software/Engineering, Engineering/R&D, Sales, Operations/Technical, Process Planning, Quality Assurance/Control, Maintenance/Technical Services, Project/Product Management, MIS/Network Management, and Retail Sales [2] - The three roles with the largest talent shortages across the six technology sectors are Software/Engineering, Engineering R&D, and Sales, with semiconductor salaries being the most competitive [2] - The median annual salary for Software/Engineering roles can reach NT$1.11 million, which is 15-30% higher than other tech sectors, while Engineering R&D roles have a median salary of NT$1 million, 2-24% higher than other tech sectors [2]

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自 无忧资讯 ，谢谢 。 目前，美中两国在AI运算能力上领先全球，若阿联与其他波湾国家的相关交易顺利推动，该地区 有望成为全球AI产业的第三势力。 UAE本土科技公司G42背后股东实力雄厚，包括阿布达比主权财富基金穆巴达拉（Mubadala）、 阿联王室及美国私募基金银湖资本（Silver Lake），董事长阿勒纳哈扬（Sheikh Tahnoon bin Zayed Al Nahyan）同时也是阿联国家安全顾问兼总统胞弟。 此外，协议也要求G42在阿联每建一座资料中心，就必须在美国兴建规模相同的设施，以促进双边 科技合作。芯片型号则锁定英伟达顶级图形处理器（GPU），可能涵盖Blackwell或即将推出的 Rubin新一代芯片。 美国商务部、白宫、G42与阿联政府对此皆未回应，英伟达则拒绝评论。 根据《路透社》报导，初步草案显示，阿联（UAE）取得的这批AI芯片有20％（即每年10万颗） 将 分 配 给 UAE 本 土 科 技 公 司 G42 ， 其 余 则 由 美 国 科 技 巨 头 ， 包 括 微 软 （ Microsoft ） 、 甲 骨 文 （O ...

Core Viewpoint - The article emphasizes the hidden challenges in AI infrastructure, particularly in data center operations, where inefficiencies lead to significant asset waste and operational issues. The need for improved testing, validation, and optimization processes is highlighted as essential for the advancement of AI capabilities [1][10][22]. Group 1: Company Evolution - Keysight Technologies has transformed from a hardware-centric company to a software-focused entity, spanning multiple sectors including communication, semiconductors, automotive electronics, and AI over the past decade [3][6]. - The company has completed over 20 acquisitions, enhancing its capabilities from the physical layer to application layer testing, reflecting its proactive adaptation to industry changes [6][7]. Group 2: AI Market Insights - The AI market is projected to reach $1.3 trillion by 2030, with current investments primarily focused on computational infrastructure. However, future value will increasingly derive from applications and services [13]. - The rapid evolution of AI technology necessitates advancements in underlying network bandwidth, storage, and interconnect technologies, with Ethernet and PCIe standards evolving at unprecedented rates [13][14]. Group 3: Infrastructure Challenges - Current AI data centers often operate under suboptimal conditions, with GPU utilization rates below 40%, leading to significant idle time and wasted resources [15][18]. - The complexity of AI model training requires robust network communication, where any single point of failure can lead to substantial efficiency losses [18][20]. Group 4: KAI Solution - Keysight's KAI (Keysight AI) solution aims to address the hidden inefficiencies in AI computational infrastructure by providing a comprehensive diagnostic platform that identifies performance bottlenecks and predicts potential failures [22][26]. - The KAI product matrix targets critical issues in AI data centers, including bandwidth limitations, energy inefficiencies, and low GPU utilization, transforming high-risk assets into more reliable investments [26][29]. Group 5: Industry Positioning - Keysight is evolving from a traditional testing equipment supplier to a comprehensive solution provider for AI infrastructure, integrating various aspects of performance management and operational efficiency [30][34]. - The company actively participates in industry standards organizations, positioning itself as a leader in establishing reliability and stability in AI networks, which are increasingly recognized as critical competitive factors [34].

Group 1 - Vivo has launched a talent recruitment program named "Blue Polaris Plan," targeting top talents in core technology fields such as chips, AI large models, and XR [1] - The program is designed as Vivo's core talent strategy, aimed at attracting top technical talents from global universities, with high salary potential and exclusive mentorship [1] - The recruitment is limited to PhD candidates, with a total scale of around 100 positions, primarily in imaging technology, and job locations include major cities like Shanghai, Dongguan, Xi'an, Shenzhen, and Hangzhou [1] Group 2 - Major tech companies are intensifying their competition for top technical talents to drive technological breakthroughs and business growth, as seen with Huawei's "Genius Youth" recruitment plan and JD's "TGT—Top Young Technical Talent Plan" [1]

据世界半导体市场统计组织（WSTS）统计，2025年1-3月全球半导体市场规模较去年同期增长 18.8%，表现强劲。从个别产品来看，内存销售额增长24.7%，逻辑销售额增长36.9%，表现强 劲。 在此形势下，各大半导体厂商的业绩进展如何？如今，2025年1月至3月的财务业绩已经出炉，对 比各家公司的业绩，好坏参半。这种明显的起伏趋势从2024年至今一直延续，各大公司之间可以 说"赢家"和"输家"并存。 台积电2025年1-3月营收预计较去年同期增长41.6%。台积电的销售额主要由逻辑产品组成，其增 长率远远超过WSTS统计的逻辑市场增长率。该公司无疑是赢家之一。 从图中可以看出，7nm、5nm、3nm等尖端工艺的销售额都在增长，而该公司的优势在于其在这些 领域的市场近乎垄断。 如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 eetjp ，谢谢 。 选定的比较对象是调查公司Omdia公布的2024年半导体销售额排名前10位的公司（NVIDIA、三星 电子、英特尔、SK海力士、高通、博通、美光科技、AMD、苹果、联发科），其中不包括并非半 导体制造商的苹果，而是包括专门从事半导体代工（晶圆代工）的 ...

Core Viewpoint - AMD's Instinct MI325X accelerator faces significant commercial challenges due to limited scalability and shipment delays, especially in comparison to Nvidia's offerings [1][2]. Group 1: Scalability and Performance - The maximum scalable configuration for AMD's Instinct MI325X and MI355X is limited to 8 GPUs, while Nvidia's B200 can scale up to 72 GPUs using NVLink interconnect [2]. - To build a cluster with more than 8 GPUs based on AMD, a shift to a different architecture is required, which reduces scalability [2]. - The MI325X has high power consumption (1000W) and does not show significant performance improvements over the MI300, complicating upgrades from existing platforms [2]. Group 2: Market Reception and Future Prospects - Microsoft expressed disappointment with AMD's GPUs as early as 2024, leading to a lack of follow-up orders, although Oracle and other companies have shown renewed interest due to AMD's price reductions [3]. - If the MI355X is competitively priced and supported by robust software, it may gain some traction, but it will still struggle to compete with Nvidia's rack-scale GB200 NVL72 [3]. - SemiAnalysis suggests that the MI355X could succeed in non-rack scale deployments if it has a competitive total cost of ownership (TCO) and improved software [3].