如果您希望可以时常见面，欢迎标星收藏哦~ 美国方面：为了"就业期待"，说服居民并承诺州政府补贴 来源：内容 编译自 joongang ，谢谢 。 本月6日（当地时间），美国印第安纳州西拉法叶市议会通过了一项决议，同意将49万平方米的住 宅用地变更为SK海力士用于建设高带宽内存（HBM）工厂的用地。这一地块比最初规划的更大， 也更靠近住宅区，是SK海力士更为偏好的位置。市议会经过7小时的通宵会议后进行了投票，9名 市议员中有6人投下赞成票。他们对SK海力士的提案进行了详细审查。 而在上月30日，韩国京畿道安城市议会一致通过了"敦促废除与龙仁半导体集群的共生协议"的决 议案。原因在于SK海力士龙仁产业园内规划建设的液化天然气（LNG）热电联产发电站距离安城 市较近，且输电线路将穿过安城市，可能给当地带来损害。安城市市长金宝罗此前表示将组建居民 对策委员会反对该项目，并称将拨付市预算支持该行动。这项支持依据是2023年12月制定的一项 条例，允许市长为解决与其他地方政府利益冲突的市民团体提供财政支持。 一个企业分别在两个城市建设工厂——这正是为了应对蜂拥而至的订单，SK海力士计划在美国印 第安纳州和韩国龙仁市建设的 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 截至1月26日的财年中，中国市场为英伟达贡献了170亿美元的营收，占其总销售额的13%，而 H20芯片是在美国2023年10月进一步收紧出口管制后推出的。 据路透社今年早些时候报道，随着像DeepSeek这类初创公司对高性价比AI模型的需求不断上升， 中国科技巨头，包括腾讯、阿里巴巴以及字节跳动，也加大了对H20芯片的采购力度。自今年1月 以来，英伟达已经积累了价值达180亿美元的H20订单。 参考链接 来源：内容编译自路透，谢谢 。 英伟达计划在未来两个月内为中国市场推出其H20人工智能芯片的"降级版"，此前该芯片原始型号 因美国出口限制被禁止销售。 消息人士表示，这家美国芯片制造商已通知包括主要云计算服务商在内的中国主要客户，公司计划 于7月发布经过修改的H20芯片。 这款降级版H20代表了英伟达在美国不断加强对华先进半导体技术出口限制背景下，为维持其在这 一关键市场中的存在而做出的最新努力。原本被认为是英伟达在中国可销售的最强AI芯片的H20， 在美国官员上个月通知公司其需申请出口许可证后，实际上已被挡在中国市场之外。 英伟达已经制定出新的技术门槛，用以指导降级 ...

Core Viewpoint - Apple is making significant progress in developing a custom chip for smart glasses, indicating an acceleration in its product development to compete with Meta's offerings [1][2]. Group 1: Smart Glasses Development - Apple is developing smart glasses that will utilize a custom chip based on the technology used in the Apple Watch, designed for low power consumption [1]. - The company plans to start mass production of the smart glasses processor by the end of next year or in 2027, suggesting a potential market launch within the next two years [1]. - Apple is also exploring non-AR smart glasses that will use cameras and AI to assist users, similar to Meta's products [2]. Group 2: Semiconductor Advancements - Apple's silicon team has become a crucial part of its product development, especially since the transition to in-house Mac chips in 2020 [1]. - The company is developing new chips for various devices, including a camera-equipped Apple Watch and AirPods, with plans to have these ready by around 2027 [3]. - Apple is also working on advanced Mac chips, including potential M6 and M7 processors, with the M5 processor expected to be applied to iPad Pro and MacBook Pro by the end of this year [3]. Group 3: AI Server Chips - Apple is developing its first dedicated AI server chips, named "Baltra," which are expected to enhance the speed and functionality of its AI services by 2027 [4][5]. - The AI server project will utilize components co-developed with Broadcom, aiming to significantly increase processing capabilities compared to current models [5]. - The hardware technology team is also working on future components, including sensors for non-invasive blood glucose measurement for future Apple Watch versions [5].

Core Viewpoint - Intel's 18A process technology has garnered significant interest from major tech companies, positioning it as a potential competitor to TSMC's N2 process, especially in the context of U.S. manufacturing and supply chain dynamics [1][2]. Group 1: Intel's 18A Process - The 18A process is being discussed with major clients like NVIDIA, Microsoft, and Google, indicating its potential as a viable alternative to TSMC's offerings [1]. - Intel's 18A process is touted as "the most advanced process made in America," showcasing its competitive edge over previous generations and its alignment with customer expectations [1]. - The 18A process is reported to have similar SRAM density and performance/efficiency metrics compared to TSMC's N2 process, suggesting a strong competitive position [1]. Group 2: Leadership and Strategic Shifts - The interest in the 18A process is partly attributed to the leadership changes at Intel, particularly the appointment of new CEO Pat Gelsinger, who is expected to shift focus towards semiconductor design automation, packaging, and foundry services [2]. - There is speculation that Intel may abandon its "IDM 2.0" strategy, which could lead to growth in its consumer business, particularly in CPU products [2]. - The current congestion in TSMC's production lines is driving other companies to seek alternatives, giving Intel a favorable position in the competition against TSMC's 2nm node [2].

Core Viewpoint - The article emphasizes the significance of MIPI A-PHY as a transformative standard in the automotive industry, particularly for smart driving technologies, and highlights Valens as a key player in this evolution [1][5][9]. Group 1: Company Overview - Valens, established in 2006, specializes in long-distance high-speed video and data transmission solutions for the automotive and audiovisual industries [1]. - The company has gained widespread application of its technology across various sectors, including entertainment, digital signage, education, video conferencing, industrial, and medical markets, with a client roster that includes major brands like Sony, Samsung, and Panasonic [1]. Group 2: MIPI A-PHY Standard - MIPI A-PHY is designed specifically for automotive needs, supporting advanced driver-assistance systems (ADAS), automated driving systems, in-vehicle infotainment (IVI) displays, and various sensor applications [1][5]. - The standard addresses the growing bandwidth demands in the automotive sector due to the increasing number of sensors and data processing requirements, necessitating high-speed, low-latency connectivity solutions [5][9]. Group 3: Market Trends and Innovations - The automotive industry is experiencing explosive growth in bandwidth demand, with the need for real-time, uncompressed data transmission now measured in gigabits per second (Gbps) [5][9]. - Valens has introduced the VA7000 series, the first chipsets compliant with the MIPI A-PHY standard, which boasts advantages such as strong electromagnetic compatibility, high bandwidth transmission, sensor integration support, and standardized connectivity capabilities [10][12]. Group 4: Competitive Landscape - Valens aims for MIPI A-PHY to replace traditional proprietary SerDes protocols like FPD-Link and GMSL, emphasizing the standard's superior electromagnetic compatibility and reliability [9]. - The company has successfully completed interoperability tests with several Chinese chip manufacturers, marking a significant milestone in promoting the A-PHY standard in the Chinese market [10][12]. Group 5: Cost Efficiency and Future Developments - Utilizing unshielded twisted pairs (UTP) and multi-pin shared connectors, A-PHY can enhance performance while significantly reducing overall system costs, with potential savings of 15% on wiring harnesses for OEMs [12][13]. - The upcoming MIPI A-PHY 2.0 version will support increased bandwidth from 16 Gbps to 32 Gbps, with Valens planning to introduce chipsets that accommodate even higher speeds in response to market demands [13].

Core Viewpoint - Jiangbolong, established in 1999, is a leading Chinese storage company known for its embedded storage solutions, including UFS, eMMC, ePoP, LPDDR, and SLC NAND Flash, catering to various industries such as consumer electronics, data centers, industrial, communication, and automotive [1][2]. Automotive Storage Market - The automotive storage market is experiencing significant growth due to the rise of smart and electric vehicles, with IDC predicting that revenue from automotive storage chips will exceed $7 billion by 2027 [2]. - Jiangbolong has been proactive in this sector, investing in research and development for automotive storage since 2017 and launching automotive storage products in 2019 [2][4]. Product Development and Capabilities - Jiangbolong offers a range of automotive storage products, including automotive-grade eMMC, UFS, and LPDDR, and has established partnerships with over 20 OEMs and 50 Tier 1 automotive clients [6][8]. - The company has a robust testing and packaging capability, with over 5,000 test cases and a dedicated testing base in Zhongshan, ensuring high reliability for automotive storage products [4][6]. New Product Launches - Jiangbolong recently introduced several new automotive storage products, including a custom automotive-grade eMMC with a maximum capacity of 128GB and a self-developed WM6000 controller, achieving speeds up to 600MB/s [11][12]. - The automotive-grade LPDDR4x storage solution features a data rate of 4266Mbps and supports low power consumption, making it suitable for applications like AI voice assistants in smart cabins [11][13]. Competitive Advantages - Jiangbolong's competitive edge lies in its self-developed core components, which enhance overall performance by over 10%, and its ability to quickly address core issues [12][16]. - The company emphasizes a "full-link reliability" approach, ensuring high-quality and reliable automotive storage solutions [13][16]. Future Outlook - Jiangbolong aims to deepen its "technology self-research + ecosystem co-construction" strategy, collaborating with industry partners to unlock the potential of automotive storage [17].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自 chosun Daily ，谢谢 。 随着越来越多的顶尖理工科学生放弃芯片相关专业，转而投身医学领域，韩国正面临半导体行业年 轻人才的流失。在全球对半导体创新需求不断增长的背景下，这种转变正在重塑韩国的高科技劳动 力队伍。 全国各地的大学都报告称，越来越多的学生退出了半导体项目，其中包括曾经将人才直接输送到三 星电子和 SK 海力士等大公司的精英研究生课程。 教育界人士警告称，政府扩大医学院招生的计划正在加速这一趋势，吸走韩国最关键行业之一的人 才。 其中一个案例涉及一名研究生，仅被确认为 A 先生，他在首尔一所私立大学攻读半导体工程综合 硕士和博士课程仅一年后就离开了。 他从同一所学校的电子工程系毕业后，就读研究生，目标是加入一家大型半导体公司的研发团队。 但去年2月，他提交了退学申请，改变了学习方向。 "我听其他学生说，他现在正在准备读医学院，"他的学术导师说。"即使在半导体这种就业几乎有 保障的领域，年轻人也选择离开，去寻找更有保障的未来。" 据政府运营的高等教育门户网站"Allimi"称，离开半导体工程研究生课程的学生人数从2023年的 17人 ...

Core Viewpoint - Cisco has developed a quantum network entanglement chip in collaboration with the University of California, Santa Barbara, aiming to enhance connectivity in the quantum era and leverage its role in internet infrastructure [2]. Group 1: Chip Features and Advantages - The entanglement chip operates at standard telecom wavelengths, allowing it to utilize existing fiber optic infrastructure for practical deployment [4]. - It functions as a micro-photonic integrated chip (PIC) at room temperature, making it suitable for scalable system deployment [4]. - The chip consumes less than 1mW of power, showcasing energy efficiency [4]. - Each output channel can produce 1 million high-fidelity entangled pairs, with a rate of up to 200 million entangled pairs per second [4]. Group 2: Strategic Directions - Cisco is building infrastructure for large-scale connectivity of quantum processors, enabling distributed quantum computing, quantum sensing, and optimization algorithms that could revolutionize drug development, materials science, and complex logistics [4]. - The principles of quantum networking are already providing direct benefits to classical systems through applications such as secure communication, precise time synchronization, decision signaling, and secure location verification [4].

如果您希望可以时常见面，欢迎标星收藏哦~ 2025年4月15日-17日，慕尼黑上海电子展在上海新国际博览中心盛大开幕，TDK以「为可持续的 未来加速转型」为主题，重磅展示了多项面向智能时代的创新解决方案，不仅涵盖了TDK在汽车 电子、物联网、AR/VR、工业自动化和智慧城市等重点领域的整体布局，还带来了多款代表前沿 趋势的核心产品。 凭借数十年来的技术积累，TDK正通过其前沿的电磁感应、高密度储能与智能传感技术，为未来 出行与互联体验打造更高效、更可靠、更智能的核心部件，成为推动行业不断发展的重要力量。 用于热泵系统的温度与压力传感器解决方案 "随着新能源汽车的快速发展，如何提升车内舒适性而又不牺牲续航，是系统级热管理的核心议 题。"TDK专家如是说。 传统燃油车依靠发动机余热配合空调系统完成车内加热。然而在没有内燃机的电动车中，PTC加热 成为替代方案，却带来续航大幅下降的问题——在严寒条件下，甚至可能减少30%至50%的电池续 航。 热泵系统因此应运而生。这一方案通过压缩机与电磁膨胀阀实现双向热交换，在冬夏皆可提供高效 的热控功能。而精准调控冷媒温度与压力，成为热泵系统性能的关键——这正是TDK传感器的用 ...

然而，Rapidus的处境与如今业界最大的芯片制造商台湾半导体制造股份有限公司 ( TSMC ) 在 20 世纪 90 年代成立时的情况并无二致。早稻田大学商业与金融研究生院的Atsushi Osanai教授指 出，当时与日本一样，台湾政府支持这家初创企业，而私营企业"最初并不热衷"。"同样，日本私 营企业对 Rapidus 也采取了观望态度。关键因素在于政府是否会为 Rapidus 提供足够的支持，以 激励私营部门。" 如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自 IEEE spectrum ，谢谢 。 世界上只有三家公司能够以令人难以置信的精度大规模生产最先进的计算机芯片。上个月，日本的 一家初创公司迈出了成为第四家公司的第一步。4月 1 日， Rapidus达到了一个关键的里程碑，它 使用与IBM 合作开发的配方（基于后者的纳米片晶体管结构）启动并测试了其 2 纳米节点芯片试 验线。Rapidus告诉IEEE Spectrum，其位于千岁的新晶圆厂安装的 200 多台尖端设备现已准备就 绪，可以投入运行，其中包括关键设备——价值3 亿多美元的最先进的极紫外( EUV )光刻系统。 "我们于2 ...