Core Viewpoint - Intel's new CEO, Lip-Bu Tan, is considering significant changes to the company's contract manufacturing business to attract major clients, which may incur high costs compared to previous plans [1][2]. Group 1: Strategic Changes - The new strategy for Intel's contract manufacturing will not include marketing certain long-developed chip manufacturing technologies to external clients [1]. - Intel's 18A process, which has seen substantial investment, is reportedly losing appeal to new customers, prompting the need for potential write-downs [1][2]. - The company is focusing more resources on the 14A process, which is expected to be more competitive than TSMC's N2 technology, aiming to attract major clients like Apple and Nvidia [2]. Group 2: Financial Implications - Intel is projected to incur losses of up to $18.8 billion in 2024, marking its first loss since 1986 [3]. - The potential costs associated with the shift in strategy could lead to losses in the hundreds of millions or even billions of dollars [1][2]. Group 3: Production Plans - Intel plans to achieve mass production of the 18A chips later this year, with internal chips expected to be delivered ahead of external customer orders [4]. - The timely delivery of 14A chips to secure large contracts remains uncertain, and Intel may continue with its existing 18A chip plans [4][5].

如果您希望可以时常见面，欢迎标星收藏哦~ 来 源： 内容来自半导体芯闻综合 。 据财经报道，华为海思原总裁、现任华为半导体业务部总裁何庭波，将兼任华为高级人才定薪科科 长。该任命公告6月27日由华为创始人兼CEO任正非签发，7月1日在华为内部正式公布。 华为官方资料显示，何庭波女士出生于1969年，毕业于北京邮电大学，半导体物理和通信工程专 业双学士、硕士。1996年加入华为，历任芯片业务岗位（开发、研究、架构、供应链）、研发部 长、海思总裁、2012实验室总裁，现任科学家委员会主任、ITMT主任、半导体业务部总裁。 何庭波：半导体正处于变革的十字路口 自2004年海思成立以来，在何庭波带领下，华为半导体业务支撑了华为产品体系连续20多年的发 展和创新。 从起初的固定通信领域，到无线通信，在3G/4G/5G移动通信网络芯片、宽带接入网络芯片、光通 信芯片、数据通信芯片等领域，助力华为从跟随者成长为行业领导者；此外，还先后拓展进入了智 能手机套片、光电芯片、通用CPU、AI处理器等全球巨头同台竞技的高难度前沿领域，且取得了 一系列堪称行业里程碑的成果，如天罡多模多制式基站处理器、麒麟应用处理器、鲲鹏高性能通用 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来 源： 内容来自moneyDJ 。 日本官民合作设立的晶圆代工厂Rapidus目标在2027年量产2纳米(nm)芯片，而为了筹措量产资 金、传出Rapidus已对日本半导体材料厂富士软片(Fujifilm)提出出资要求，且据悉Rapidus将在本 月18日向业务伙伴报告2纳米芯片的试产情况。 共同通信1日报导，Rapidus据悉已对富士软片提出出资要求。富士软片有从事半导体材料事业， 而Rapidus似乎正呼吁包含富士软片在内的半导体相关企业对其出资，目标藉由扩大股东规模、打 造出整体产业界援助量产的体制。 报导指出，Rapidus 2纳米试产产线已在4月启动，且预定会在7月18日在工厂所在地北海道千岁市 举 办 活 动 、 向 业 务 伙 伴 报 告 试 产 情 况 。 试 产 品 的 主 要 性 能 数 据 预 估 在 9 月 左 右 明 朗 ， 有 意 对 Rapidus出资的企业可能会依据数据结果做出最终判断。 Rapidus设立于2022年8月，由丰田汽车、Sony、NTT、NEC、软银、Denso、铠侠、三菱UFJ等8 家日企共同出资设立，其中前7家商业 ...

Core Insights - Navitas Semiconductor has announced a strategic partnership with Powerchip Semiconductor Manufacturing Corporation (PSMC) to produce and develop 200mm silicon-based gallium nitride (GaN) technology after TSMC plans to terminate its GaN foundry business by 2027 [1][2] - The collaboration aims to meet the growing demand for GaN products in 48V infrastructure, including large-scale AI data centers and electric vehicles, with initial devices expected to be certified by Q4 2025 [1][2] Group 1 - Navitas will utilize Powerchip's 200mm wafer production capabilities at its 8B fab in Taiwan, which has been operational since 2019, to support various GaN mass production processes [1] - Powerchip's advanced 180nm CMOS technology will enhance performance, power efficiency, integration, and cost-effectiveness of Navitas's GaN product lineup, which will range from 100V to 650V [1][2] - The first 100V series is expected to enter production in H1 2026, while the 650V devices will transition from TSMC to Powerchip within the next 12-24 months [1] Group 2 - Navitas has made several announcements in the AI data center, electric vehicle, and solar markets, including collaborations with NVIDIA and Enphase, showcasing its GaN and SiC technology [2] - The CEO of Navitas expressed excitement about the partnership with Powerchip, emphasizing the commitment to continuous innovation in product performance and cost efficiency [2] - Powerchip's general manager highlighted the long-standing collaboration with Navitas in GaN-on-Si technology and the nearing completion of product certification, paving the way for mass production [2]

Core Viewpoint - The article emphasizes the rapid transformation of the automotive industry towards smart electric vehicles, highlighting the competitive landscape and the strategic initiatives of Changan Automobile to adapt and thrive in this evolving market [1]. Group 1: Changan Automobile's Strategic Plans - Changan Automobile is accelerating its three major plans: "Shangri-La," "Beidou Tianshu," and "Haina Baichuan," focusing on the development of its three smart electric brands: Changan Qiyuan, Deep Blue Automobile, and Avita [1]. - The company aims for a total sales target of 3 million vehicles by 2025, with 1 million of those being new energy vehicles and another 1 million in overseas markets [1]. - By 2030, Changan targets global sales to exceed 5 million vehicles, with 3 million being new energy vehicles and 1.5 million in overseas markets [1]. Group 2: 2025 Forward-looking Technology and Ecosystem Cooperation Exhibition - The "2025 Forward-looking Technology and Ecosystem Cooperation Exhibition" will take place on July 24-25, aimed at fostering collaboration between Changan Automobile and over 100 industry-leading companies [2][4]. - This event serves as a platform for direct communication and cooperation, enhancing cross-industry connections and joint research efforts [4][10]. - The exhibition will feature various activities, including product displays, technology forums, and supply-demand matching sessions, providing a comprehensive interaction opportunity for participants [11]. Group 3: Industry Collaboration and Ecosystem Development - The initiative aims to integrate industry resources and leverage Changan's position as a "chain master" to drive collaboration among vehicle manufacturers, suppliers, and research institutions [7]. - The focus is on optimizing existing supply chains and identifying potential suppliers to build a new "partner" ecosystem [8]. - The event will create a "one-stop" cooperation platform for stakeholders in the smart electric vehicle sector, facilitating the exchange of new technologies and products [9].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容综合自蓝鲸新闻。 7月2日，蓝鲸科技记者今日走访深圳最大电子交易市场华强北时，被多位华强北商家告知，日前深圳市场监督管理局已向华强北市场部下发通知， 不带3C认证的充电宝严禁在华强北市场销售。记者在华强北多个售卖充电宝柜台也发现，各柜台均明确标注所售充电宝为带3C认证产品。 另据商家透露，"目前华强北已有违规售卖无3C认证充电宝的商家，被市场监督管理部门罚款。当前不少商家正积极清理库存，将无3C认证的充电 宝下架，确保所售产品均符合规定。" 中国民航局回应为何发布有关充电宝的紧急通知 三是电池产品质量参差不齐。近期，国家市场监管总局通报移动电源质量国家监督抽查情况，在抽查的149批次移动电源中发现有65批次产品不合 格，不合格率占比达43.6%。目前，市场上充电宝的生产厂家众多，一些假冒伪劣的充电宝内部电池的电解液质量差、隔膜性能不佳，容易出现漏 液、短路等问题。有的充电宝在设计和制造过程中未充分考虑安全保护措施，缺乏有效的过充、过放、短路保护功能，在使用时存在较大安全隐 患。如果这些质量不过关的充电宝被携带上飞机，将极大增加航空运输安全风险。 据介绍，通知 ...

Core Viewpoint - The article announces the upcoming 7th Pudong New Area Yangtze River Delta Integrated Circuit Skills Competition, inviting participants passionate about integrated circuits to join this event focused on skills and craftsmanship [1] Group 1 - The competition aims to showcase skills in the integrated circuit industry, highlighting the importance of craftsmanship in this field [1] - Participants are encouraged to register quickly, indicating a sense of urgency and excitement surrounding the event [1]

Core Viewpoint - IBM has announced a new quantum computing architecture that significantly reduces the number of qubits required for error correction, supporting its goal to build a large-scale fault-tolerant quantum computer named "Starling" by 2029 [4][6]. Summary by Sections Quantum Error Correction - Quantum computers rely on qubits, which have inherent unreliability, making error correction essential for building reliable large-scale quantum devices. Error correction techniques create "logical qubits" by distributing information across multiple physical qubits for redundancy [4]. - The most common error correction method, "surface code," requires about 1000 physical qubits to form one logical qubit. IBM initially focused on this method but later recognized the engineering challenges involved [4][5]. New Error Correction Scheme - In 2019, IBM began exploring alternatives and introduced a new error correction scheme called quantum low-density parity-check (qLDPC) code, which requires approximately one-tenth the number of qubits compared to surface code [5][6]. Upcoming Developments - IBM plans to launch a processor named "Loon" later this year, which will feature couplers that connect distant qubits on the same chip, crucial for implementing the qLDPC code. This non-local interaction enhances efficiency compared to surface code [7]. - Following "Loon," IBM aims to release a processor called "Kookaburra" in 2026, which will include both logical processing units and quantum memory, marking the first demonstration of the foundational modules needed for subsequent systems [7]. Starling and Future Roadmap - The Starling quantum computer is expected to be built by 2028 and connected to the cloud the following year. It will be located in a new quantum data center in Poughkeepsie, New York, and will serve as a foundation for a future system, codenamed Blue Jay, with 2000 logical qubits [8]. - IBM's new architecture represents a significant breakthrough, with enhanced interconnectivity and support from advancements in 3D manufacturing. Achieving 200 logical qubits could propel quantum computing into practical problem-solving [8]. Engineering Challenges - One of the main challenges is improving the overall fidelity of gate operations, which needs to be reduced by an order of magnitude for the new architecture to succeed. Enhancing the coherence time of qubits is a key path forward [8][10]. - IBM has achieved an average coherence time of 2 milliseconds in isolated test devices, but translating this to large chips remains challenging. Recent progress on the Heron chip has increased coherence time from approximately 150 microseconds to 250 microseconds [9]. Infrastructure and Component Reduction - Significant engineering challenges remain in infrastructure support, including connectors and amplifiers. However, the new architecture's reduced qubit requirements also decrease the number of necessary components, which is a major advantage of the qLDPC codes [10].

Core Viewpoint - Multiple vulnerabilities have been discovered in Bluetooth SoC products from Airoha, a subsidiary of MediaTek, exposing various headphone and earbud vendors to potential exploitation [1][2]. Vulnerabilities Overview - The vulnerabilities are identified as CVE-2025-20700, CVE-2025-20701, and CVE-2025-20702, allowing attackers to gain complete control over headphones via Bluetooth without authentication or pairing [1][2]. - Attackers only need to be within Bluetooth range to exploit these vulnerabilities, potentially allowing them to manipulate RAM and flash memory of the devices [1]. Affected Devices - Numerous devices are at risk, including Bose QuietComfort earbuds, Marshall ACTION III, and Sony Link Buds S, with vulnerabilities present in both entry-level and flagship models [2]. - Confirmed vendors affected include Beyerdynamic, Marshall, and Sony, with indications that more devices using these chips are also vulnerable [2]. Remediation Efforts - Airoha has addressed the vulnerabilities in their SDK and released a new version, but individual vendors must build and distribute firmware updates to end-users [2]. - As of now, no fixed firmware versions have been identified [2].

Core Insights - The article highlights that MediaTek has once again topped the average salary rankings for non-managerial full-time employees in Taiwan for 2024, with an average salary of 4.31 million TWD, marking a 14.8% increase from the previous year [1][2] Salary Rankings - MediaTek leads the salary rankings among all listed companies, being the only company with an average salary exceeding 4 million TWD [1] - Among all listed companies, there are 9 companies with average salaries over 3 million TWD for non-managerial employees, with 8 of them being in the semiconductor industry [1][2] - The top 10 salary list includes companies from various sectors, but the semiconductor industry dominates, with 7 out of 10 being IC design companies [1] Salary Growth - The highest salary growth in the top ten is seen in Ruiding, with a 33.53% increase, followed by Dafa at 27.35% and Realtek at 24.33% [1][2] - TSMC also reported a significant salary increase of 19.32% [1][2] Median Salary Insights - In terms of median salary, MediaTek again ranks first with a median of 3.438 million TWD, followed by Realtek at 3.246 million TWD and Dafa at 3.049 million TWD [4][5] - Only three companies have a median salary exceeding 3 million TWD, indicating a concentration of high salaries within these firms [4] Notable Trends - The only non-semiconductor company in the median salary top 10 is Evergreen Marine, which ranks tenth with a median salary of 2.415 million TWD [5] - Evergreen Marine also recorded the highest growth in median salary at 71.28%, followed by Dafa at 29.91% and Realtek at 25.18% [5]