这股存储芯片热潮对Kioxia股价构成利好，因投资者预期强劲需求和价格上涨将提振其收入。 Asymmetric Advisors 公 司 日 本 股 票 策 略 师 Amir Anvarzadeh 表 示 ： " 在 科 技 领 域 ， 我 们 进 入 2026年的配置重点主要是存储芯片，无论是直接投资Kioxia，还是相关的二次衍生产品。"他表 示，像Sumco Corp.这样的芯片晶圆制造商也有望从明年强劲的存储需求中受益。 如果您希望可以时常见面，欢迎标星收藏哦~ 人工智能对数据存储的贪婪需求，已使日本内存芯片制造商Kioxia控股公司成为今年全球涨幅最 大的股票，这表明尽管近期市场出现波动，但AI热潮依然强劲。 Kioxia股价年内上涨约540%，表现优于MSCI全球指数所有其他成分股，并成为2025年日本东证 股价指数中表现最佳的股票。这家NAND闪存制造商于去年12月才在东京证券交易所上市，其客 户包括苹果公司和微软公司，目前市值约5.7万亿日元(合360亿美元)。 Kioxia股价的惊人攀升，凸显了科技行业对存储芯片的旺盛需求，因超大规模服务商正竞相建设 AI基础设施。像Kioxia生产的这类芯 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 点这里加关注，锁定更多原创内容 喜欢我们的内容就点 "在看 " 分享给小伙伴哦~ 而这项美国政府的批准，对韩国企业而言只是暂时的缓解，因为之前美国已于2025 年初决定撤销 先前给予部分科技公司的许可证豁免，原因是为了限制中国取得美国先进技术，美国总统川普的政 府一直在重新审视，其认为拜登政府时期过于宽松的出口管制措施。 而根据消息人士的说法，美国政府方面对向中国出口芯片制造工具实行了年度许可制度。基于这样 的情况下，美国政府已向三星电子和SK 海力士发送年度许可证，允许其在2026 年将芯片制造设 备导入其位于中国的工厂中。 报导强调，包括三星、SK 海力士和台积电先前都受会于美国对中国芯片相关产品出口的全面限制 豁免。但这项被称为「最终用户认证」 的特权将于12 月31 日到期，这意味着此后美国芯片制造 设备运往这些公司在中国的工厂之际，将需要获得美国出口许可证。而对此，三星和SK 海力士拒 绝评论，而台积电则还未回应相关报导。至于，美国商务部则是在非办公时间，暂未对此事发表评 论。。 （来源 ：编译自路透社 ） *免责声明：文章内容系作者个人观点，半导体芯闻转载 ...

Core Viewpoint - The article highlights the resurgence of Samsung Electronics in the high-bandwidth memory (HBM) market, driven by the increasing demand for AI accelerators, which is expected to lead to record-high performance for the company in the semiconductor sector [1]. Group 1: HBM Market Dynamics - Samsung's HBM competitiveness has rebounded faster than expected, with its market share increasing from 15% in Q2 to 22% in Q3, surpassing Micron by 1 percentage point [2]. - The company has regained its position as the second-largest player in the DRAM market, narrowing the gap with SK Hynix to just 1 percentage point [2]. - Samsung's HBM4 memory has received high praise for its performance, and the company is expected to complete product certifications for two major clients soon, projecting a 140% increase in HBM shipments next year [3]. Group 2: Diversified Memory Solutions - Samsung is set to strengthen its market position with customized memory solutions for AI data centers and low-power mobile devices, exemplified by the SOCAMM2 product, which is expected to meet significant demand from NVIDIA [4]. - The anticipated supply of SOCAMM2 to NVIDIA is projected to reach 10 billion GB, accounting for 50% of NVIDIA's total demand for this product [4]. Group 3: Sales Success and Market Conditions - Samsung's low-power, high-performance mobile DRAM, LPDDR, has seen significant sales success, with 70% of the LPDDR5X memory used in Apple's iPhone 17 sourced from Samsung [5]. - The ongoing global semiconductor supply shortage has favored Samsung, allowing it to increase DRAM prices by approximately 40% in Q4 [6]. - Samsung's semiconductor business is expected to generate nearly 15 trillion KRW in operating profit in Q4, constituting 75% of the company's total quarterly operating profit [6].

Core Viewpoint - The RISC-V×AI Ecological Conference and ArchitStudio User Conference highlighted the collaboration between Shanghai Pudong Software Park and Sunzhan Technology to establish a DSA computing laboratory, aiming to drive innovation and technology transfer in the industry [1][10]. Group 1: Conference Highlights - The DSA computing laboratory was officially inaugurated, focusing on promoting RISC-V and AI integration to accelerate the development of specialized processors [10]. - The conference attracted over a hundred industry guests, discussing new opportunities for industrial development [1]. - Keynote speeches emphasized the importance of RISC-V's open and flexible characteristics in supporting AI and specialized computing [6][18]. Group 2: Key Presentations - Sunzhan Technology's CEO highlighted DSA as a critical direction for overcoming processor design bottlenecks and achieving performance improvements [8]. - The ArchitStudio platform was presented as a revolutionary solution for processor design, offering full-process automation and enhancing collaboration among its core modules [13]. - The platform's adaptability in industrial control scenarios was showcased, demonstrating its ability to meet stringent requirements for real-time performance and stability [15]. Group 3: Industry Applications - RISC-V's integration with AI is seen as a solution to challenges in edge AI deployment, such as precise power adaptation and cost control [18]. - The XVA architecture was introduced as a means to support intelligent transformation in communications, showcasing its low power consumption and high computational density [19]. - RISC-V's potential in machine vision was discussed, emphasizing its ability to enhance scene recognition and parallel computing capabilities [22]. Group 4: Future Directions - The conference concluded with a roundtable discussion on the opportunities and challenges presented by the integration of RISC-V and AI technologies, with a consensus on the need for continued innovation and collaboration [25]. - Sunzhan Technology plans to deepen its collaboration with industry partners and enhance the capabilities of the ArchitStudio platform, focusing on addressing industry pain points and promoting large-scale implementation of innovative solutions [29].

Core Insights - The OECD report highlights the geographical distribution of wafer fabrication capacity, indicating that the top five economies (China, Taiwan, South Korea, Japan, and the USA) account for 87% of global wafer production capacity by September 2025 [2][5]. Geographical Distribution of Production Capacity - The report illustrates that South Korea's wafer production capacity is highly concentrated, with nearly 80% coming from nodes between 6nm and less than 22nm, primarily due to investments from major suppliers like SK Hynix and Samsung [5]. - In contrast, the USA's wafer production capacity is more diversified across various process nodes [5]. Concentration of Production Capacity Among Companies - The top ten semiconductor companies hold approximately 50% of the global wafer production capacity [6]. - In Japan, 73 companies operate wafer fabs with a total capacity exceeding 5 million wafers, with the top five companies accounting for 58% of Japan's total capacity [6]. Planned and Under Construction Capacity Growth - The majority of capacity investments are concentrated in the largest semiconductor-producing economies, driven by major companies operating in those regions [9]. - The USA, China, South Korea, Taiwan, Japan, Germany, and Singapore are identified as the countries with the largest growth in wafer production capacity [9]. Wafer Capacity by Chip Type - The report emphasizes that assessing wafer capacity distribution solely by node density is insufficient; chip type and business model must also be considered [11]. - China and Taiwan are the only two economies ranked among the top five producers for all six chip types analyzed [16]. Potential for Capacity Expansion by Chip Type - Capacity expansion potential varies significantly across chip types and economies, with notable growth in power chips and analog chips primarily occurring in China [18]. - The USA leads in upcoming capacity for analog chips, while China is set to dominate in mature logic chip production [19]. Mixed Manufacturing Capabilities of Fabs - Many fabs can produce multiple chip types, complicating the analysis of wafer capacity distribution [24]. - The presence of mixed-capacity fabs is particularly common in the production of analog and mature logic chips, while dedicated fabs are more prevalent for power semiconductors and advanced logic chips [26]. Average Wafer Fab Size by Chip Type - The average size of wafer fabs varies by chip type, with power, analog, and mature logic chips averaging between 30,000 to 50,000 WSPM, while advanced logic and general memory fabs are significantly larger [28]. Ownership and Wafer Capacity - Most wafer production capacity in the top five economies is owned by domestic companies, although foreign investment is increasing in some regions [32]. - The report notes that the ownership structure in the semiconductor industry can be complex, with many companies operating in multiple countries [33]. Wafer Capacity by Business Model - The report categorizes wafer capacity into three business models: IDM, pure foundry, and IDM-foundry, highlighting the evolving nature of semiconductor manufacturing [36]. - China and Taiwan are noted for having over 50% of their domestic wafer capacity coming from foundries rather than IDMs [38].

Core Viewpoint - TSMC has quietly announced the commencement of volume production of its N2 (2nm) process chips, achieving its previously stated goal for production in Q4 2025 [1][5]. Group 1: N2 Technology Overview - TSMC's N2 technology utilizes the first-generation nanosheet transistor technology, enhancing performance and power efficiency across all nodes [1]. - The N2 process aims for a 10%-15% performance improvement at the same power consumption and a 25%-30% reduction in power consumption at the same performance level [3][4]. - For mixed designs including logic, analog, and SRAM, transistor density is expected to increase by 15% compared to N3E, while pure logic designs will see a 20% increase [3]. Group 2: Production and Capacity - TSMC has begun production at its Fab 22 facility near Kaohsiung, Taiwan, with expectations for ramping capacity in 2026 driven by demand from smartphones and high-performance computing AI applications [5]. - The company is also constructing two new fabs capable of N2 process technology to meet the strong interest from partners, with plans to produce N2P and A16 chips starting in the second half of 2026 [7]. Group 3: Performance Enhancements - The N2P process, an enhanced version of N2, is set to further improve performance and power efficiency, while the A16 variant will utilize a Super Power Rail design tailored for complex AI and HPC processors [7].

追风赶月莫停留，平芜尽处是春山 ——2026年新年致辞 轮值董事长 孟晚舟 时光的潮水正漫过2025的岸线，回望这一年的忙碌与奔赴，那些深浅不一的足迹，正是我们奋力 向前的最好见证： 在撒哈拉沙漠南缘，网优工程师穿梭在44℃高温、红土飞扬的街头，厘清网络症结； 在大西洋的七级风浪中，光网专家克服严重晕船，和客户一起定位故障、恢复通信； 在海拔4300米的雪域高原，服务团队缺氧不缺精神，冒着零下15℃的严寒调试光储系统，把绿色 电源送入千家万户； 在凌晨4:30的客户机房，抓住业务流量最小的间隙，研发团队奋战30天的技术方案紧急切换上 线； 鸿蒙生态工程师与伙伴一起披星戴月，从第一单外卖、第一条笔记、第一次出行开始，持续提升用 户体验； 手语工程师克服专业术语挑战，解决听障用户的售后难题，为他们架起无声的桥梁； 制造工匠深入钻研打螺钉，从小鸡喂食器得到启发，解决了手机微短螺钉供钉器随动打钉技术难 题，大幅提升打钉效率； 支付会计严格遵照公司流程，查授权验文档，以始终如一的匠心，守万亿支付零损失； …… 过去这一年，每一滴汗水都值得称颂！ 我们助力运营商建设5G-A网络，为6000万用户提供极速网络联接体验； 在 ...

Core Viewpoint - The primary task for 2026 is to "consolidate the stable and positive trend of the industrial economy," reflecting a shift in policy focus from short-term growth to long-term quality improvement [3][4][5]. Group 1: Industrial Economy - The meeting emphasizes the need to support industrial provinces and stabilize effective investment in manufacturing [4]. - The industrial economy is expected to show resilience and vitality, with telecommunications and software business revenues projected to grow by approximately 9% and 12% respectively [3]. - The shift from "promoting stable growth" to "consolidating a stable and positive trend" indicates a deeper understanding of the current industrial economic situation [4]. Group 2: Supply and Demand - The focus on increasing the supply of green products, trendy products, and products for the elderly aligns with market demand trends [4]. - The emphasis on domestic demand as a primary driver of economic growth reflects a strategic shift towards building a strong domestic market [5]. Group 3: Technological Integration - The meeting highlights the importance of "AI + manufacturing" initiatives, aiming to cultivate key industry intelligent entities and original intelligent enterprises [7][10]. - The transition from "digital empowerment" to "intelligent empowerment" signifies a deeper integration of intelligent technologies into traditional industries [8]. Group 4: Emerging Industries - The conference outlines plans to develop emerging pillar industries such as integrated circuits, new displays, new materials, aerospace, low-altitude economy, and biomedicine [10][11]. - These industries are seen as crucial for addressing "bottleneck" issues and fostering new productive forces, with a focus on high value-added and high-tech characteristics [12]. Group 5: Quality Enterprises - The meeting stresses the need to cultivate high-quality enterprises, including "little giant" companies and manufacturing champions, while addressing issues of overdue payments to businesses [15][17]. - The goal is to enhance the service capabilities of the information and communication industry, with significant growth in 5G infrastructure [15]. Group 6: Governance and Competition - The meeting calls for improved governance efficiency in the industrial and information sectors, aiming to curb "involution" competition and promote high-quality standards [17]. - Strengthening policy coordination across industries, finance, and taxation is essential for fostering productive cooperation [17].

一位业内人士表示："由于人形机器人的商业化仍需时日，LG电子从研发阶段就开始使用自主研发 的芯片。"他还补充道："这款新开发的芯片在设计之初就考虑到了未来在LG人形机器人上的应 用，并有望发展成为专用的人形机器人半导体。" 如果您希望可以时常见面，欢迎标星收藏哦~ 时隔两年，LG电子将推出一款全新自主研发的半导体芯片。据业内人士12月28日透露，该公司已 完成其自主研发的家用电器芯片DQ-C2的设计，并正在准备量产。DQ-C2是LG电子自主研发的第 三款半导体芯片。该芯片将由全球最大的半导体代工厂台积电负责生产。 自2022年以来，LG电子一直在自主研发半导体，以最大限度地提升其家用电器的性能。2022年发 布的DQ-1芯片应用于LG的"可升级家电"产品，使消费者即使在购买后也能通过网络连接持续升级 产品功能。去年发布的DQ-C芯片旨在增强家用电器的AI能力，以应对AI家电的蓬勃发展。与前代 产品相比，新款DQ-C2芯片增强了内存功能和AI运算能力，并提升了中央处理器（CPU）性能， 从而支持扫地机器人等产品的复杂AI计算，显著提升了AI性能。 随着人工智能家用电器技术的飞速发展，LG电子研发出这款新型芯片。 ...

Group 1 - The core point of the article is that Tongye Technology (300960) announced a cash acquisition of 91.69% of Beijing Silingke Semiconductor Technology Co., Ltd. for 561 million yuan, adjusting from an initial plan to acquire 100% [1] - The acquisition will make Silingke Semiconductor a subsidiary of Tongye Technology, and the transaction is classified as a major asset restructuring [1] - Silingke Semiconductor, established in March 2016, operates in various technology services, integrated circuit design, and software development [1] Group 2 - Projected revenues for Silingke Semiconductor are 290 million yuan and 310 million yuan for 2023 and 2024, respectively, with net profits of 29.5 million yuan and 30.89 million yuan for the same years [1] - The transaction includes performance commitments, with the related parties promising that Silingke Semiconductor will achieve a cumulative net profit of no less than 160 million yuan from 2026 to 2028 [1]