Core Viewpoint - The article highlights the contrasting political responses and business environments in the U.S. and South Korea regarding semiconductor manufacturing, particularly focusing on SK Hynix's new HBM chip factory in Indiana and the challenges faced in its home country [2][3]. Group 1: Indiana Factory Approval - The Lafayette City Council in Indiana approved a zoning change for a 121-acre residential area to allow SK Hynix to build a high-bandwidth memory (HBM) chip factory, with six out of nine council members voting in favor after a lengthy meeting [1][4]. - The Indiana factory is expected to start mass production of HBM chips by the second half of 2028, creating approximately 7,000 direct and indirect jobs, supported by state government subsidies [2][4]. Group 2: Challenges in South Korea - In contrast, SK Hynix's project in Longin faced significant delays and local opposition, with the city council unanimously passing a resolution to terminate a cooperation agreement due to health and environmental concerns related to a planned LNG power plant [1][5]. - The company has invested 122 trillion won (approximately $86.3 billion) in the Longin semiconductor cluster, but the project has been repeatedly postponed, with ground-breaking now expected in February 2025, six years after the initial announcement [2][5]. Group 3: Local Government Dynamics - The article emphasizes the lack of willingness and capability of the South Korean central government to resolve local conflicts, which has exacerbated tensions between local governments and companies like SK Hynix [2][3]. - Local opposition in Longin is mirrored by similar challenges faced by Samsung Electronics in its planned investment of 360 trillion won in the area, highlighting a broader issue of local resistance to industrial projects [6].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：本文 编译自ciiblog ，谢谢。 随着日常生活中对电子设备的需求不断增长，以及各行各业数字化转型的持续推进，半导体已成为 各行各业的关键部件。多年来，印度主要进口智能手机、电脑和机器人设备等成品。然而，印度政 府近期推出的举措/计划，已促使多个终端应用领域建立了OSAT（外包半导体组装和测试）设施。 作为行业发展的下一阶段，印度目前正专注于半导体价值链中间产品的自主制造，尤其是芯片制 造。这一转变将使行业从OSAT运营发展到成熟的制造能力。 过去五年，印度半导体行业的投资复合年增长率为 10.5%，到 2024 年达到 3710 万美元。预计这 一上升趋势将持续下去，到 2030 年投资额将增至 1.096 亿美元。推动这一增长的因素包括汽车电 子、电信基础设施、工业自动化和消费电子产品的国内制造业增长，尤其是 5G 和基于人工智能的 技术的扩张。 2024年，受电动汽车革命的推动，印度对半导体的最大需求来自汽车行业（33%）。受5G网络部 署的推动，印度对半导体的第二大需求来自电信设备行业（24%）。其次是数据中心（14%）和工 业自动化（14%）等领域， ...

Core Viewpoint - The Japanese circuit board industry leader, IBIDEN, predicts significant growth in the AI server circuit board market, with sales expected to increase 2.5 times over the next 5 to 6 years, benefiting domestic companies like Samsung Electronics and LG Innotek [1][2]. Group 1: Market Growth and Projections - IBIDEN forecasts an 11% year-on-year increase in total sales for the fiscal year 2025, with the electronic division's sales, including FC-BGA, projected to reach $24 billion and operating profit to hit $3.3 billion, reflecting growth of 22% and 23% respectively compared to the previous year [1]. - By fiscal year 2030, sales of AI server substrates are expected to grow approximately 2.5 times from 2024, reaching $47.5 billion [2]. - The global FC-BGA market is anticipated to more than double from $8 billion in 2022 to $16.4 billion by 2030 [2]. Group 2: Technological Trends and Innovations - FC-BGA substrates are becoming essential in high-performance electronics due to their ability to provide higher I/O density and improved electrical performance compared to traditional packaging methods [3]. - The demand for miniaturization and enhanced functionality in consumer electronics, particularly in smartphones and IoT devices, is driving the adoption of FC-BGA substrates [3]. - The rise of 5G technology necessitates semiconductors capable of handling high-frequency signals, making FC-BGA substrates ideal for RF and millimeter-wave applications [4][5]. - The growth of automotive electronics, particularly in electric vehicles (EVs), is increasing the demand for efficient packaging solutions like FC-BGA that can manage higher power densities [6]. - High-performance computing (HPC) and AI workloads require low-latency processors, and FC-BGA substrates support heterogeneous integration of multiple chips, crucial for data centers and edge devices [7]. - Sustainability is becoming a key factor in semiconductor manufacturing, with FC-BGA substrates contributing to reduced material usage and improved energy efficiency [8]. Group 3: Challenges and Future Outlook - Despite the advantages of FC-BGA technology, challenges such as higher production costs and complexities in testing and inspection remain [8]. - The future of FC-BGA substrates looks promising, with emerging trends in heterogeneous integration and system-in-package (SiP) solutions expected to enhance performance [8]. - The semiconductor packaging landscape is undergoing a paradigm shift, with FC-BGA technology playing a critical role in meeting the complex demands of modern electronic devices and systems [8][9].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：本文来自雅虎 ，谢谢。 | 起新 | 碩士 | 露十 | 高中以下 | | --- | --- | --- | --- | | 2017 | 46,800 | 31,000 | 26,600 | | 2018 | 46,600 | 32,500 | 鮮 | | 2019 | 48,130 | 32,530 | 30,050 | | 2020 | 48,800 | 33,030 | 31,050 | | 2021 | 58,670 | 39,630 | 35,050 | | 2022 | 62,670 | 42,130 | 35,050 | | 2023 | 63,900 | 42,930 | 37,900 | | 2024 | 65,130 | 43,730 | 38,400 | 累计台积电硕士新鲜人的起薪从有纪录的2017年当时平均月领4万6800元到去年，7年来合计薪水 成长了18330元、幅度为39%。但近二年来成长只有不到4%。 大学生则2017年的平均月薪3万1起跳到去年为止提高到43730元，近七年来调整约1万2730元，增 幅约41%，惟近二年来只 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：本文来自 technews ，谢谢。 全球AI 热潮推动高效能芯片需求激增，根据台湾政府官方资料显示，马来西亚在今年年4 月GPU 进口金额突破27.4 亿美元，不仅打破前月纪录，更写下单月新高。外界高度关注，这是否已成为 Nvidia 芯片绕道出口的新枢纽。 据统计，马来西亚今年前四月共进口价值64.5 亿美元的GPU，远高于2024 年全年48.77 亿美元的 水准。成长幅度惊人，显示该国在全球AI 芯片供应链中的角色正在迅速升温。 若进一步拆解每月数据，可见增幅几乎呈爆炸性成长： 值得注意的是，马来西亚进口的GPU 多来自美系芯片大厂Nvidia。该公司预估2025 会计年度第一 季（2 月至4 月）营收为430 亿美元，而马来西亚单季进口金额就高达53.3 亿美元，等同于Nvidia 营收的13%。 根据台湾国际贸易局的数据，3 月份台湾对马来西亚的计算机系统出口总额为 18.7389 亿美元， 较去年 3 月份的 4.0192 亿美元同比增长 366%，较 2023 年 3 月份的 340 万美元增长55,117 %。 事实上，根据台湾信息技术厅的数据 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：本文来自 manufacturingdive ，谢谢。 英特尔、Global Foundries等行业大厂高管讨论了半导体行业采用人工智能以更快获得成果时所 面临的挑战。 制造商正在将人工智能引入其流程中，以提高效率并获得竞争优势。 本周举行的行业会议上，高管们表示，最终，通过机器人、数据和软件的正确组合，可以实现完 全自主的半导体晶圆厂或流程，从而释放人力来与人工智能一起解决问题。 在纽约奥尔巴尼举行的先进半导体制造大会上，来自英特尔、EMD、格芯和其他计算机芯片公司 的领导人探讨了他们对人工智能的愿景。他们还谈到了随着该技术在整个行业应用的不断增长， 该技术面临的挑战和局限性。 从数据稀缺问题到幻觉问题，以下是行业领导者在人工智能方面面临的一些关键限制。 确定从哪里获取人工智能的价值 目前，ChatGPT 等大型语言模型可以生成类似人类的文本并执行与语言相关的任务。一些工具可 以生成视频、图像甚至代码，而其他形式的人工智能可以创建工厂车间的数字复制品，处理重复 性任务或通过计算机视觉改进质量控制。 人工智能在芯片制造中的应用潜力无限。然而，随着各大公司竞相将 ...

Core Viewpoint - OKI Circuit Technology has achieved a significant milestone by introducing a 124-layer printed circuit board (PCB), surpassing the previous industry limit of 108 layers without increasing the standard thickness of 7.6 mm, which could revolutionize substrate design in fields such as artificial intelligence, defense, aerospace, and advanced communication technologies [1][4][10] Group 1: Technical Advancements - The increase from 108 layers to 124 layers represents a fundamental shift in PCB manufacturing capabilities, achieving a 15% increase in signal layers without compromising the standard thickness [4][10] - Traditional PCB designs face mechanical and thermal performance limits before reaching 100 layers, and exceeding 108 layers typically requires thicker boards or reduced reliability, which OKI has successfully avoided [4][5] - The use of ultra-thin dielectric materials with a thickness of only 25 µm enables strict impedance control and supports high-power AI chips, crucial for next-generation high-bandwidth memory (HBM) [5][6] Group 2: Applications and Benefits - The 124-layer configuration is expected to open new avenues for semiconductor testing in AI, as it enhances wiring capacity and shielding potential, which is vital for maintaining signal integrity [9] - The PCB's design supports integrated grounding layers and microvia arrays, minimizing crosstalk and signal loss while improving thermal performance, making it ideal for aerospace and defense applications [9] - The PCB meets MIL-STD-883G reliability standards after over 1,000 thermal cycles, ensuring electrical integrity in extreme environments [9] Group 3: Cost and Production Challenges - The material cost for the 124-layer PCB can reach up to $4,800 per square meter, with a production time of 16 weeks and a yield rate around 65%, which is lower than the typical yield of 85% for 108-layer PCBs [10] - Mechanical stress from thermal cycling can exceed 80 MPa, potentially leading to issues in fine-pitch BGA packaging, complicating the diagnostic process [10] - While current applications are limited to niche, high-performance areas, underlying innovations may gradually permeate broader markets as advancements in additive manufacturing and AI-driven EDA tools emerge [10]

Core Viewpoint - The article discusses the trend of Chinese manufacturers, particularly Lenovo, moving towards self-developed chips, highlighting the upcoming Yoga Pad Pro with a custom SoC [4][6]. Group 1: Chip Development - The new SoC features a 10-core layout manufactured using TSMC's 5nm process [2][6]. - The SoC architecture is based on Arm64-v8a ISA, with a configuration of 2+2+3+3 cores, and the highest core frequency reaching 3.29 GHz [5][6]. - The GPU used in the SoC is the Arm Immortalis G720, which is also utilized in MediaTek's Dimensity 9300 and 8400 SoCs [6]. Group 2: Market Strategy - Lenovo's Yoga Pad Pro is expected to be targeted primarily at the Chinese market as a 2-in-1 hybrid device [4][6]. - The decision to invest in custom chips for a relatively small market is seen as noteworthy, given Lenovo's primary focus on PCs and laptops [4][6]. - Despite U.S. sanctions, Lenovo and Xiaomi have not faced significant setbacks, allowing them to continue sourcing advanced chips from TSMC [6]. Group 3: Industry Context - The push for self-developed chips aligns with China's goal to reduce reliance on Western technology [6]. - A significant barrier for China's semiconductor industry has been the limitations of SMIC, which has been confined to 7nm technology for years [6].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：本文来自 semiengineering ，谢谢。 吞吐量仍然是一个问题，解决方案需要多种技术的结合。 事实证明，电子束检测对于发现 5 纳米以下尺寸的关键缺陷至关重要。现在的挑战是如何加快这 一流程，使其在经济上符合晶圆厂的接受度。 电子束检测因灵敏度和吞吐量之间的权衡而臭名昭著，这使得在这些先进节点上利用电子束进行 全面缺陷覆盖尤为困难。例如，对于英特尔的18A逻辑节点（约1.8纳米级）和三星数百层的3D NAND存储器，缺陷检测已达到极限。 传统检测方法在 5 纳米以下开始遭遇根本性的物理限制。光学检测系统历来是缺陷检测的主力， 但由于衍射极限、复杂材料堆叠导致的对比度降低以及日益细微的缺陷特征，在先进节点上表现 不佳。 电子束检测提供纳米级分辨率，能够捕捉光学工具可能遗漏的微小致命缺陷，但这些优势也伴随 着显著的代价。吞吐量是主要瓶颈。用单束电子束扫描整个300毫米晶圆可能需要数小时甚至数 天，远远超出了现代晶圆厂严格的时间预算。 PDF Solutions先进解决方案副总裁 Michael Yu 表示："如果想在 7nm 或 5nm 等先进节点的生 产 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：本文综合自网络 ，谢谢。 欧洲面临着艰难的选择——为"主权"而战、与中国亲近，还是与华盛顿合作。 据报道，特朗普政府准备对半导体征收大范围关税。目标不仅限于中国或外国成品芯片。潜在的 所谓"零部件关税"将把设备内部外国制造芯片的价值加总，并对成品设备征收关税。 且不论如此复杂的方案是否切实可行（严肃的分析师对此表示怀疑），关税可能会损害欧洲的利 益，减少其自身尖端芯片的销售，并减缓欧洲大陆的芯片投资。欧洲最好的应对措施并非通过芯 片补贴进行反击，而是与中国合作，并在必要时对一系列美国数字产品征税进行反击。 我们先来看看潜在的直接影响。欧洲对美国的芯片出口几乎不会受到影响。欧洲仅占全球芯片产 量的8%，而且大部分都销往欧洲汽车行业，而不是在亚洲组装的消费电子产品。 欧洲真正的优势——以及其脆弱性——在于生产制造尖端芯片所必需的机器。领先的荷兰光刻设 备制造商ASML将受到影响。尽管该公司计划将"大部分"关税成本转嫁给美国客户，但由于贸易 战影响的不确定性，该公司已经预测订单将放缓。由于非人工智能芯片产能过剩，包括英特尔、 台积电和三星在内的ASML客户正在推迟设备 ...