Core Viewpoint - The article discusses the advancements and importance of 3D integrated circuits (3D IC) and the role of EDA tools like 3Sheng Stratify™ in ensuring the accuracy and integrity of stacked chip designs, which are crucial for high-performance applications in various industries [3][30]. Group 1: 3D IC and Advanced Packaging - 3D IC technology provides significant flexibility and reusability in product design, particularly for AI computing and high-end mixed-signal integration [3]. - Stacked chips utilize advanced packaging techniques that are essential for performance, functionality, cost, and iteration methods [3]. - The demand for high-density interconnect advanced packaging is growing across various applications, including military, aerospace, and consumer electronics [4]. Group 2: EDA Tools and Verification - 3Sheng Stratify™ EDA tool offers rapid and accurate assembly-level verification for interconnections between dies and intermediary layers in stacked chip designs [10]. - The tool supports design rule checks (DRC) and layout versus schematic (LVS) checks to ensure consistency and compliance with design specifications [10][12]. - The verification process includes checks for signal integrity and functionality across complex interconnect structures [9]. Group 3: Key Performance Indicators - The EDA tool provides various functionalities, including high-density interconnect verification, static timing analysis, and design rule compliance checks [12][13]. - It also features automated detection of anomalies and supports multi-file collaborative checks to enhance design efficiency [13][14]. - The tool aims to improve manufacturability and reliability of 2.5D designs by ensuring that physical layouts meet manufacturing process specifications [23]. Group 4: Design Rule Checks and Automation - The 3Sheng DRC tool supports a wide range of design rule checks, including geometric rules and special process checks, to ensure compliance with foundry specifications [25][28]. - The tool incorporates machine learning algorithms for anomaly detection in 2.5D designs, enhancing the accuracy of network connection checks [18][20]. - Automated repair features are included to address design rule violations, thereby reducing manual intervention and speeding up the design iteration process [28][29]. Group 5: Future Directions - The company aims to enhance the automation design capabilities for 2.5D/3D/3.5D systems, providing comprehensive design and verification solutions to the industry [31]. - The integration of various design engines within the 3Sheng Integration Platform facilitates rapid design and verification processes, ensuring a balance between performance, power consumption, area, and cost [30].

Core Viewpoint - Asahi Kasei's supply adjustments of PSPI materials have significant implications for the global semiconductor industry, highlighting the tension between surging AI computing demands and limited production capacity [1][2]. Group 1: PSPI Material Overview - PSPI (Photosensitive Polyimide) is a high-performance polymer material that combines excellent dielectric properties, mechanical strength, and heat resistance with photosensitivity, playing a crucial role in semiconductor packaging and advanced packaging processes [3][5]. - The global market for PSPI materials is projected to reach USD 402 million in 2024 and USD 802 million by 2030, with major suppliers dominating approximately 95% of the market share [5][9]. Group 2: Domestic Market and Companies - The domestic PSPI market in China is expected to reach RMB 820 million in 2024, driven by the increasing demand for AI computing chips and advanced packaging technologies [9]. - Key domestic players in the PSPI market include Bomi Technology, Dinglong Holdings, Aisen Semiconductor, and Shengquan Group, with various companies actively developing and producing PSPI materials [10][11][12][13]. Group 3: Company Highlights - Bomi Technology has achieved mass production of PSPI materials and is involved in a national key research project for 2.5D/3D packaging technology [10]. - Dinglong Holdings has developed multiple semiconductor packaging materials and is set to begin mass production in 2024 [11]. - Aisen Semiconductor is launching its first domestic positive PSPI product in 2024 and is also working on various other PSPI types [12]. - Shengquan Group has established a pilot line for PSPI and plans to expand production significantly by 2025 [12].

Core Viewpoint - The article emphasizes the significance of electronic specialty gases, particularly photolithography gases, in the semiconductor industry, highlighting the potential for domestic companies to fill the gap in a market currently dominated by international players [3][4]. Group 1: Electronic Specialty Gases Overview - Electronic specialty gases, also known as electronic gases, are characterized by their high purity and special applications, making them essential materials in industries such as integrated circuits, display panels, and solar cells [1]. - The article categorizes electronic specialty gases into various types based on their applications, including bulk gases, chemical vapor deposition, etching, cleaning, doping, and others [2]. Group 2: Photolithography Gases - Photolithography gases are crucial for the operation of photolithography machines, which directly influence the resolution of these machines. The composition of photolithography gases typically includes argon, neon, krypton, xenon, and fluorides in specific ratios [3]. - Currently, international companies like Linde, Air Liquide, and Taiyo Nippon Sanso dominate over 80% of the global market share for photolithography gases, indicating significant room for domestic alternatives [3]. Group 3: Domestic Companies in Photolithography Gases - The article lists several domestic companies involved in the production of photolithography gases, including their locations and specific products, such as high-purity krypton-neon mixtures and hydrogen [4][5]. - Notable companies mentioned include Huate Gas, KMT Gas, and Qiaoyuan Co., among others, showcasing a diverse range of products aimed at meeting the high purity requirements of the semiconductor industry [4][5]. Group 4: Upcoming Industry Events - The article announces the 2025 TrendBank (5th) Photolithography Materials Industry Conference scheduled for July 8-10 in Hefei, which aims to facilitate discussions on the supply chain and development trends in the photolithography materials sector [6].

Core Viewpoint - The global photoresist market is expected to exceed $15 billion by 2025, with China's market share increasing to 35%, highlighting significant growth potential in the industry [2]. Industry Overview - The photoresist industry is a critical component of high-tech materials, encompassing the entire chain from research and development to production and sales [2]. - In the high-end semiconductor photoresist sector, Japanese companies like JSR and Tokyo Ohka dominate with over 85% market share, while domestic production rates are below 5%, indicating a significant technological and market monopoly [2]. Market Dynamics - The advancement in the photoresist industry is driven by downstream demand, where manufacturers' process improvements necessitate technological iterations in photoresists and raw materials [2]. - Domestic manufacturers are increasingly replacing foreign suppliers and expanding production, creating opportunities for photoresist companies [2]. Supply Chain Components - The upstream of the photoresist supply chain includes raw materials such as resins, monomers, photosensitizers, and solvents; the midstream involves the production and synthesis of photoresists based on formulations; and the downstream includes applications in printed circuit boards, LCDs, and IC chips across various industries [2]. Key Raw Materials - Solvents constitute 50%-90% of photoresist composition, essential for dissolving resins and photosensitizers to create a uniform photoresist solution [3][5]. - Photosensitizers, making up 1%-6% of the composition, are crucial for initiating chemical reactions under specific wavelengths of light, altering the solubility of resins during the development process [3][8]. - Resins account for 10%-40% of photoresist, serving as the inert polymer matrix that binds materials together and determines the basic performance of the photoresist after exposure [3]. Market Players - Domestic companies like Yida Co. hold over 40% market share in electronic-grade PM solvents, while other firms like Xilong Science and Jingrui Electric Materials are also making strides in the solvent sector [7]. - The photosensitizer market is dominated by international players such as BASF and IGM Resins, with a trend of production capacity shifting towards China due to patent expirations and increased domestic demand [10]. Product Types and Applications - Different types of photoresists are used for various exposure wavelengths, with global resin supply primarily monopolized by companies like Sumitomo Chemical and Dow Chemical [11]. - Domestic enterprises such as Shengquan Group and Tongcheng New Materials are making significant advancements in photoresist resin production, with some achieving production capacities exceeding 5,000 tons per year [12]. Upcoming Events - The 2025 TrendBank (Fifth) Photoresist Materials Industry Conference will be held from July 8-10 in Hefei, focusing on new applications, current trends, and in-depth discussions on the photoresist supply chain [13].

Core Insights - The global wafer foundry market is expected to rebound rapidly in 2024, driven by high demand for high-performance computing chips, smartphone chips, and advanced automotive chips [2] - In Q1 2025, the global wafer foundry business revenue increased by 27% year-on-year, marking the fifth consecutive quarter of recovery, although it experienced a 5% quarter-on-quarter decline due to seasonal factors [2] - Chinese domestic company Chipalliance has shown impressive performance, surpassing South Korea's Dongbu HiTek in overall revenue since Q3 2024, ranking 11th globally in wafer foundry business [4] Industry Events - The 2025 TrendBank (5th) Lithography Materials Industry Conference will be held from July 8-10 in Hefei, focusing on in-depth discussions of the lithography materials supply chain and industry development [7] - The conference aims to create an efficient communication platform for government, industry, academia, research, and capital, promoting collaborative innovation in the lithography materials industry [7] Company Overview - TrendBank is a leading industry research and data company in China, providing data, research, consulting, and conference services to support decision-making and business development resources [12]

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 重要会议： 2025势银（第五届）光刻材料产业大会（ 7月8日-10日，安徽·合肥） 点此报名 添加文末微信，加 人形机器人 群 会议背景 加快人工智能技术创新及应用步伐，对促进我国经济高质量发展、经济结构转型升级和现代化产业体系建设具有长远战略意义。我国正处于城市数智 化、新能源化、国际化转型的关键阶段，以科技创新引领新质生产力发展成为重要任务。人形机器人与人工智能技术的发展，能够为我国产业升级提供 强大技术基础，推动企业数字化转型智能化升级，促进形成定制化生产方式，实现经济结构的转型升级。 宁波作 为 我国重要的经济城市 ， 在 新兴产业发展方面具有良好的基础和条件。基于此，在 第四届中国—中东欧国家博览会暨国际消费品博览会 上， 将增设人形机器人与人工智能展区 ，并于 5月23日下午举办" 人形机器人产业创新发展交流会" ，推动人形机器人与人工智能领域的共同发展。 会议主题 具身智能引领未来 会议时间与地点 会议 时 间 ： 202 ...

Core Viewpoint - The semiconductor market is expected to perform better in 2024 compared to 2023, driven by inventory replenishment, advancements in AI and HPC, and increased demand in automotive electronics and new energy sectors [4][5]. Market Overview - The global semiconductor market sales are projected to reach $627.6 billion in 2024, marking a significant growth of 19.1% compared to 2023 [4]. - The global photoresist market is anticipated to grow by 16.15% year-on-year in 2024, with specific growth rates for different types of photoresists: I-line (10.22%), G-line (14.06%), KrF (17.89%), ArF (16.74%), and EUV (21.26%) [5]. Photoresist Market in China - China's semiconductor photoresist market is expected to reach $771 million in 2024, becoming the largest in the world, with a year-on-year increase of 42.25% [5]. - The growth rates for different types of photoresists in China are as follows: G/I-line (29.8%), KrF (42.61%), and ArF (45.84%) [5]. Production Capacity of Photoresist Companies - A survey of 15 companies in mainland China reveals their design production capacities for semiconductor photoresists, with notable capacities including: - Tongcheng New Materials: 1,000 tons/year for G-line, KrF, and ArF [5] - Jingrui Electric Materials: 2,800 tons/year [5] - Feikai Materials: 5,000 tons/year [5] - The continuous investment in new production capacities supports steady growth in the photoresist market [5]. Upcoming Industry Events - The 2025 TrendBank (5th) Photoresist Industry Conference will be held from July 8-10 in Hefei, focusing on new applications, trends, and supply chain discussions [6][7].

Core Viewpoint - The article discusses the advancements and challenges in the 2.5D/3D IC backend design EDA tools, emphasizing the need for collaborative innovation in the heterogeneous integration and advanced packaging sectors to meet the growing demands for AI computing power and overcome existing technological barriers [3][4][5]. Group 1: Event Overview - The "2025 TrendBank Heterogeneous Integration Packaging Industry Conference" was held on April 29, 2025, in Ningbo, co-hosted by TrendBank and Yongjiang Laboratory, with support from Zhuhai Silicon Core Technology Co., Ltd. and Ningbo Electronics Industry Association [1]. - Dr. Zhao Yi, founder and chief scientist of Zhuhai Silicon Core Technology Co., Ltd., delivered a keynote speech focusing on the EDA platform for 2.5D/3D advanced packaging, exploring collaborative innovation in backend design, simulation, and verification [1][3]. Group 2: Industry Insights - The demand for AI computing power has surged, outpacing the growth rate predicted by Moore's Law, leading to a conflict between increasing computational needs and the slow performance growth of chips [4]. - Advanced packaging technologies, such as stacked chips, allow for flexible integration and high-density interconnections, significantly enhancing integration levels and driving improvements in computing speed and storage capacity [4][5]. Group 3: Technical Challenges - The design complexity of stacked chips has increased exponentially, creating a scarcity of comprehensive EDA design toolchains that can address the new challenges in design, testing, and simulation [5]. - Key challenges in the 2.5D/3D Chiplet design field include achieving a cohesive top-level architecture, managing various packaging types, and understanding the benefits of architectural-level analysis [5]. Group 4: Solutions and Innovations - Zhuhai Silicon Core Technology has developed the 3Sheng Integration Platform, which provides a comprehensive solution covering the entire backend design process for Chiplets [5]. - The platform integrates five centers: architecture design, physical design, multi-die testing, analysis simulation, and multi-Chiplet integration verification, facilitating a collaborative design approach that maximizes performance, cost, and testability [5].

Core Viewpoint - The article discusses the advancements and challenges in the field of Electronic Design Automation (EDA) for 2.5D/3D stacked chip design, emphasizing the need for innovative tools and methodologies to enhance design efficiency and address the complexities of multi-chip integration [2][5][9]. Group 1: EDA Tools and Innovations - EDA suppliers are exploring new methods to improve the efficiency of design and verification engineers, particularly in the context of advanced chips that require early-stage multi-physical field analysis [2]. - The 3Sheng Integration Platform developed by Silicon Chip Technology integrates system-level planning, physical realization, analysis, testability, and reliability design, supporting agile development and customizable collaborative design optimization for 3D heterogeneous integration systems [3][5]. - The introduction of the 3Sheng_Zenith system modeling tool aims to address key challenges in Chiplet and advanced packaging design, facilitating system-level planning, interconnect design, and early system analysis [9][10]. Group 2: System-Level Planning and Design - System-level planning involves partitioning a System on Chip (SoC) into smaller Chiplet modules, allowing for flexible layout planning and resource optimization [13][15]. - Chiplet modeling is a core step in system-level planning, ensuring design repeatability and scalability, with each Chiplet being treated as an independent IP for physical planning [16]. - The floorplan optimization ensures efficient resource allocation among Chiplets in 2.5D/3D integrated circuits, preparing for subsequent routing and simulation [19]. Group 3: Testing and Reliability - The design of multi-chip integrated systems requires careful planning for testability and fault tolerance, as the complexity of interconnects can pose risks to system stability and quality [19]. - The 3Sheng_Zenith tool incorporates early DFT (Design for Testability) and FT (Fault Tolerance) design resources to ensure the stability and integrity of 3D systems [19][21]. Group 4: Early System Analysis - Early system analysis involves multi-level co-design and simulation, utilizing various analysis tools to ensure the reliability and stability of the designed system [30][32]. - The robustness of interconnect routing is assessed to ensure performance, particularly in high-bandwidth, high-power scenarios, by checking parasitic parameters and overall routing constraints [33]. - Manufacturing cost assessments are integral to Chiplet architecture design, considering wafer, packaging, bonding, and testing design costs to ensure the feasibility of the new system [34][36].

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 势银研究： 势银产业研究服务 势银数据： 势银数据产品服务 势银咨询： 势银咨询顾问服务 添加文末微信，加 先进封装 群 在全球半导体产业持续演进的当下，先进封装已从幕后走向台前，成为产业竞争的新焦点。随着摩 尔定律渐趋瓶颈，传统芯片制程工艺的推进愈发艰难，成本也水涨船高。在此背景下，先进封装技 术凭借其能够提升芯片性能、降低功耗、缩小尺寸且可灵活集成不同功能芯片的优势，成为延续芯 片 "摩尔定律" 的关键路径，受到行业的广泛关注与大力投入。 尤其在 5G 通信、人工智能、汽车电子等新兴应用领域需求的强劲拉动下，先进封装市场的增长势 头更为迅猛。从市场数据来看，先进封装市场规模正经历着显著扩张。Yole数据显示，2023 - 2029 年全球先进封装市场规模预计从 378 亿美元攀升至 695 亿美元，年复合增长率达 10.7%。 截至4月底，长电科技、通富微电、华天科技、甬矽电子、深科技、颀中科技、汇成股份、苏州固 锝、晶方科技、气派科技、蓝箭电子等布局先进封装业务的上市企业已经公布年报，相较于2023 年，先进封装业务都出 ...