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一篇价值2W刀的报告--HBM产业分析总结版
是说芯语· 2025-05-07 03:12
Market Overview and Demand Drivers - The global HBM (High Bandwidth Memory) consumption is expected to reach 16.97 billion Gb by 2025, with an annual growth rate of 162.2%, driven by unexpected demand from NVIDIA and AWS for AI chips [3] - NVIDIA holds a 70% market share, with its HBM3e 12hi products being the main demand driver, while AWS's share increases to 8% due to geopolitical risks [3] - HBM3e series dominates the market with over 95% share, while HBM3 and HBM2e are gradually exiting the market [3] Supplier Competitive Landscape - SK Hynix is projected to ship 12.4 billion Gb in 2025, capturing 52% market share, benefiting from exclusive supply to NVIDIA [4] - Samsung Electronics faces short-term challenges due to certification delays, with a revised shipment forecast of 6.8 billion Gb and a market share drop to 29% [4] - Micron Technology is expected to achieve a shipment of 4.5 billion Gb in 2025, increasing its market share from 4% to 19% due to aggressive capacity expansion [5] Customer Demand Dynamics - NVIDIA's demand is driven by upgrades in the Blackwell platform, with a 36% quarter-on-quarter increase in HBM consumption in Q1 2025 [6] - AMD's MI350 series faces stagnation in market share at 7%, with reliance on Samsung for HBM3e 12hi limiting its bargaining power [6] - Google and AWS show diverging ASIC demand trends, with AWS increasing its share to 8% through a multi-supplier strategy [7] Technological Evolution and Cost Challenges - The mass production of HBM3e 12hi is a key technological breakthrough for 2025, increasing single-chip capacity from 24GB to 36GB [8] - Production challenges arise from increased TSV perforation numbers, with initial yields at 65% for SK Hynix and 75% for Micron [8] - Innovations in packaging technology, such as NVIDIA's CoWoS-L, increase complexity and costs, while HBM4's larger die size raises unit costs [8] Supply-Demand Balance and Long-term Risks - The HBM supply-demand ratio is expected to narrow to 39.7% in 2025 from 88.6% in 2024, indicating a trend towards balance [9] - Hidden risks include long CoWoS packaging cycles leading to stockpiling, and potential demand slowdown due to algorithm optimizations [9] - Long-term growth in the HBM market will depend on technological iterations rather than mere capacity expansion, with NVIDIA planning to launch a next-generation platform with 512GB capacity by 2028 [10]
美媒:"英伟达已向中国三家企业通报"
是说芯语· 2025-05-06 07:54
Core Viewpoint - The article discusses the impact of U.S. export controls on semiconductor technology, particularly focusing on NVIDIA's adjustments to its supply chain and the implications for Chinese tech companies [2][3]. Group 1: NVIDIA's Supply Chain Adjustments - NVIDIA has informed three Chinese tech companies about its supply chain adjustments in response to U.S. government export control policies [2]. - The adjustments are linked to the U.S. restrictions initiated in October 2022, specifically targeting high-performance computing chips for AI training [2]. - NVIDIA previously created "downgraded" versions of its chips, A800 and H800, for the Chinese market, but these are now also restricted under new regulations [2]. Group 2: Impact on Chinese Tech Companies - The three companies likely include major Chinese server manufacturers and AI firms, such as Inspur and Huawei, which heavily rely on NVIDIA GPUs for AI model training and data center construction [3]. - These companies may face short-term challenges, including power shortages and delays in research and development [3]. - Some firms are testing domestic chips like Huawei's Ascend and Cambricon, but compatibility and performance issues remain significant hurdles [3]. Group 3: Long-term Implications for the Semiconductor Industry - U.S. technology controls may accelerate the domestic replacement of AI chips in China, with products like Huawei's Ascend 910B achieving 80% of the performance of international mainstream chips [3]. - The software ecosystem for these domestic chips still requires improvement, and some companies are exploring RISC-V architecture or distributed computing solutions to reduce dependency on foreign technology [3]. - The U.S. policies are leading to a bifurcation in the global semiconductor supply chain, creating different technical standards for Chinese and non-Chinese markets [3].
159家半导体上市公司2024年业绩哪家强?
是说芯语· 2025-05-06 01:32
申请入围"中国IC独角兽" 半导体高质量发展创新成果征集 | 序号 | 证券名称 | 24年和江 (1/27) | 序号 | 证券名称 | 24年和短 (1/27 | R = | 证券名称 | 24年利润 (1/27 | 吊号 | 证券名称 | 24 年利润 (1/27) | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | 1 | 北方华创 | 56.21 | 41 | 珂玛科技 | 3.11 | 81 | 炬芯科技 | 1.07 | 121 | 必易微 | -0.17 | | 2 | 中零屋配 | 36.99 | 42 | 南芯科技 | 3.07 | 82 | 江化微 | 0.99 | 122 | 唯捷创芯 | -0.24 | | 3 | 韦尔股份 | 33.23 | 43 | 中船特气 | 3.04 | 83 | 泰凌微 | 0.97 | 123 | 博通集成 | -0.25 | | 4 | 海光信息 | 19.31 | 44 | 中科蓝讯 | 3.00 | 84 | 国科微 | 0.97 | 124 ...
中环霓虹往事:半导体巨头的城市记忆与产业迁徙
是说芯语· 2025-05-06 00:33
申请入围"中国IC独角兽" 半导体高质量发展创新成果征集 编者按:香港半导体产业的变迁,是亚洲半导体格局演变的缩影。从 90 年代的辉煌到 2000 年代的调整,再到近年的 转型,香港的角色从 " 亚洲总部 " 逐渐转变为 " 区域跳板 " 。尽管国际巨头已搬离,但香港仍可凭借其独特的地理位 置和金融优势,在第三代半导体、芯片设计等领域探索新的定位。未来,如何与内地产业链深度融合,将是香港半导 体产业能否复兴的关键。 2000 年春末,我攥着客户名单,第一次踏入香港中环长江集团中心。玻璃幕墙上 "Linear Technology" 的霓虹招牌在阳光下微微发烫,作为EEPW 的销售,我未曾想到,此后二十年里这 片写字楼群的兴衰,会成为我职业生涯中最深刻的行业记忆。 黄金年代 会客厅 ( 2000-2002 ) 2001 年回访时, Linear Technology 亚洲区总监陈先生在海景会议室煮着普洱。 "96 年我们把大中 华区研发中心设在这里, " 他指着订单表, " 伟易达的玩具芯片,从设计到打样,全在湾仔实验 室完成。 " 墙上的亚太地图布满红点, " 香港的优势,在于上午去深圳看样品,下午就能和美 ...
中微半导体,尹志尧减持280000股!
是说芯语· 2025-05-05 23:45
Core Viewpoint - The article discusses the recent share reduction plan by the chairman and general manager of Zhongwei Semiconductor Equipment (Shanghai) Co., Ltd., highlighting the company's financial performance and market challenges in the semiconductor industry [2][3]. Financial Performance - Zhongwei's revenue for 2024 is projected to grow by 44.7% to 9.07 billion yuan, while net profit is expected to decline by 9.53% to 1.62 billion yuan, primarily due to a significant increase in R&D expenses, which surged by 94.3% to 2.45 billion yuan [2]. - In Q1 2025, revenue and net profit are anticipated to increase by 35.4% and 25.67%, respectively, indicating sustained growth momentum in core businesses such as etching equipment [2]. Share Reduction Plan - Chairman and General Manager Yin Zhiyao plans to reduce his shareholding by up to 280,000 shares, representing 0.045% of the total share capital, potentially cashing out approximately 52.71 million yuan [2]. - Since August 2022, Yin has cumulatively reduced his holdings by 1.87 million shares, realizing a total cash amount of 236 million yuan, with his ownership percentage decreasing from 1.5% at IPO to the current 0.7% [2][4]. Market Context - The global semiconductor sales are expected to grow by 19.1% in 2024, but the growth rate is projected to slow to 11.2% in 2025, posing challenges for the company as it navigates a decelerating market [2]. - Historical data indicates that share reductions by semiconductor founders often lead to short-term stock price declines, as seen in the case of Weier Co., which caused a market value loss of 1.7 billion yuan for Beijing Junzheng [3]. Product Development - The company continues to make breakthroughs in advanced etching and thin film equipment, with etching equipment sales expected to reach 7.28 billion yuan in 2024, reflecting a 54.72% increase [3]. - In Q1 2025, R&D expenditures reached 687 million yuan, marking a 90.53% increase, focusing on the development of metal film vapor deposition equipment and next-generation PECVD equipment [3].
外媒爆料:小米自研芯片 Xring 团队规模达千人
是说芯语· 2025-05-05 08:37
申请入围"中国IC独角兽" 半导体高质量发展创新成果征集 根据小米先前的内部宣布,将在手机部产品部组织架构下成立芯片平台部,任命秦牧云担任芯片平 台部负责人,除了向产品部总经理李俊汇报,也有一说是直接向执行长雷军汇报,意味整个开发进 度能受更密切监督。 秦牧云此前曾在高通任职,担任高通产品市场高级总监,后加入小米。 小米上一次推出自研芯片,已是 2017 年发布的 Surge S1,该芯片采用台积电 28 纳米制程。 目 前有传闻称,小米Xring将采用台积电4纳米制程,总体性能达到高通Snapdragon 8 Gen 1水平, 预期在今年上半年正式公开,但该芯片将采用Arm现有的设计架构,而非使用任何小米自研核心。 @Jukanlosreve认为, 如果 Xring 成功,可能鼓励更多公司参与其中,甚至目前在大公司工作的 工程师也可能会获得更好的薪资机会。 目前「削减成本、提高效率」已在几乎所有行业中得到普遍 应用,而 Xring 愿意花钱对生态系统的成长无疑是个正面信号。 先前市场消息传出,小米自研3纳米手机系统单芯片(SoC)已进入设计定案(tape out),当时 预期会在今年发布,但现在进入上半年尾 ...
60家A股半导体公司,亏损超160亿!
是说芯语· 2025-05-05 02:30
申请入围"中国IC独角兽" 半导体高质量发展创新成果征集 进入4月份,A股上市公司迎来年度报告披露期,而半导体板块上市公司也陆续交出自己的2024 年度"成绩单"。 据集微网不完全统计,截至4月30日,A股有221家半导体公司披露了2024年度报告,超过7成公 司营收出现同比增长。而盈利方面,更是有113家公司归母净利润出现同比增长,占比高达 51.13%,超过五成。 221家企业合计营收8822亿元 据集微网统计的A股半导体公司2024年业绩显示,221家公司实现营业收入合计8821.51亿元, 平均每家企业39.92亿元。 从业绩规模来看,营收超过200亿元的公司有10家,分别是环旭电子、中芯国际、楚江新材、中 电港、长电科技、太极实业、北方华创、纳思达、韦尔股份、通富微电,其营收分别为606.91亿 元、577.96亿元、537.51亿元、486.39亿元、359.62亿元、351.72亿元、298.38亿元、 264.15亿元、257.31亿元、238.82亿元。 营收在100~200亿元(含)区间的企业有9家,晶盛机电、江波龙、三安光电、深科技、闻泰科 技、华天科技、华虹公司、士兰微、华润微,其营收 ...
投石问路还是暗度陈仓?“英伟达开发新的中国版芯片”背后是复杂的5方博弈
是说芯语· 2025-05-05 01:42
以下文章来源于橙子不糊涂 ,作者橙子 橙子不糊涂 . 80后,集成电路背景,专注于AI硬科技、半导体领域的研究和投资。 申请入围"中国IC独角兽" 半导体高质量发展创新成果征集 昨天"英伟达致力于为中国客户开发定制芯片"的话题讨论比较多,此前还有传言"英伟达要为中国客户 开发提供设计服务,合作开发ASIC"…大家讨论的焦点在于这些潜在的可能性 是否会冲击国产AI芯片 的投资逻辑。 这个问题确实比较复杂,因为背后涉及了5个关键方,各种因素的扰动会非常多,下面具体讨论一下, 希望能给大家一点参考。 这5个关键方分别是: 英伟达、中国大客户、国产AI芯片厂商、中国 以及 美国政府 。 首先是英伟达 ,仍然 留在中国AI芯片市场并处在主导地位意义重大,尤其是在DeepSeek时刻之后。 2022年在拜登政府开始限制英伟达向中国销售芯片之前,中国市场占英伟达总收入的21%。现在这一比 例已降至13%,但即便如此,过去两年来自中国的收入仍增长了70%,达到170亿美元,因为中国企业 对人工智能计算的需求与美国同行一样旺盛。而且,一 个共识是2025年将是中国国内AI基础设施投资 爆发的起点。 所以从财务和成长故事上来说, ...
长川科技业绩狂飙3000%,追赶龙头北方华创?
是说芯语· 2025-05-05 01:17
Core Viewpoint - The semiconductor testing equipment sector is emerging as a significant player within the broader semiconductor industry, with companies like Changchuan Technology showing remarkable growth in performance and market potential [2][4][11]. Group 1: Changchuan Technology's Performance - In Q1 2025, Changchuan Technology reported a revenue of 815 million yuan, marking a year-on-year growth of 45.74%, outpacing the industry average [4]. - The company's net profit surged to 111 million yuan, reflecting an astonishing year-on-year increase of 2623.82%, driven by revenue growth and improved cost control [5]. - Changchuan's gross margin stood at 52.75%, with a net margin of 13.42%, indicating significant improvements in profitability despite a slight decline in gross margin [5]. Group 2: North Huachuang's Stability - North Huachuang, a leading player in the semiconductor equipment sector, achieved a revenue of 8.206 billion yuan in Q1 2025, with a year-on-year growth of 37.90% [7]. - The net profit attributable to shareholders was 1.581 billion yuan, up 38.80% year-on-year, showcasing stable growth driven by its extensive product range and market presence [7]. - The company demonstrated effective cost management, contributing to its consistent profit growth, although specific expense growth rates were not disclosed [7]. Group 3: Comparative Analysis - There is a significant revenue gap between Changchuan Technology and North Huachuang, with the latter being a giant in the industry [9]. - Despite the revenue disparity, Changchuan outperformed North Huachuang in revenue and net profit growth rates, indicating its strong competitive position in niche markets [9]. - Both companies maintain high gross margins, but Changchuan's net margin growth is more pronounced, reflecting its operational efficiency [9]. Group 4: Domestic Testing Equipment Industry Landscape - The domestic testing equipment industry is experiencing robust growth, driven by increased semiconductor production capacity and supportive government policies [11][16]. - The market size for domestic testing equipment is projected to reach 12.204 billion yuan in 2024, with a year-on-year growth of 13%, significantly higher than the global market growth rate of 10% [15]. - Key growth drivers include semiconductor capacity expansion, advancements in packaging technologies, and strong policy support for domestic manufacturers [15][16]. Group 5: Challenges and Opportunities - Domestic testing equipment manufacturers face challenges in high-end technology development, with significant gaps compared to international leaders [14][15]. - The domestic market has seen a 20% localization rate in certain equipment segments, but high-end testing equipment remains dominated by foreign companies [14]. - Companies like Changchuan Technology are positioned to capitalize on market opportunities through increased R&D investment and product innovation, aiming to break international monopolies in the long term [16][17].
百亿美元晶圆厂,不建了,印度芯片遭重创
是说芯语· 2025-05-04 10:23
申请入围"中国IC独角兽" 据报道,印度亿万富翁 Gautam Adani 的集团已暂停与以色列 Tower Semiconductor 合资建厂。 两位知情 人士向路透社透露,该集团拒绝参与一项价值 100 亿美元的芯片项目,因为这对集团来说没有战略和商 业意义。 印度西部马哈拉施特拉邦于 9 月 宣布 批准 Adani 和 Tower 建立一个每月可生产 80,000 片晶圆并创造 5,000 个就业岗位的工厂,帮助印度总理 纳伦德拉·莫迪 实现将印度打造为芯片制造中心的宏伟目标。 第一位直接了解情况的消息人士称,阿达尼集团此前曾表示正在对该项目进行评估,但与 Tower 的谈 判目前已被搁置,因为该印度企业集团的内部评估发现,该项目能够产生多少需求(尤其是在印度)仍 存在不确定性。 "这更像是一个战略决策。 阿达尼 评估了一下,决定先等等看。"该消息人士表示,并补充说,谈判也 有可能在稍后恢复。 第二位了解情况的消息人士表示,阿达尼集团对 Tower 愿意为此次合作做出的财务贡献数额并不满 意,但他没有透露细节。 这位知情人士补充说,Tower 将在交易中提供技术专长,但"Adani 希望 Tower ...