Group 1 - The semiconductor sector showed strength on November 28, 2025, with the Shanghai Stock Exchange Sci-Tech Innovation Board Chip Index rising by 1.22% [1] - Key stocks such as Jinghe Integrated rose by 11.32%, Tuojing Technology by 6.55%, and Tianyue Advanced by 6.13% [1] - The Chinese semiconductor industry is expected to see the chip design sector exceed 1 trillion yuan by 2030, indicating strong long-term growth potential [1] Group 2 - Dongguan Securities forecasts that artificial intelligence will remain the main innovation line in the technology sector through 2026, benefiting multiple segments including computing power, storage, equipment, and advanced packaging [1] - The top ten weighted stocks in the Sci-Tech Innovation Board Chip Index account for 60.55% of the index, with major companies including Haiguang Information, Cambricon, and SMIC [1] Group 3 - The Sci-Tech Chip ETF (588200) tracks the Shanghai Stock Exchange Sci-Tech Innovation Board Chip Index, providing a convenient tool for investing in the chip sector [2] - Investors without stock accounts can access domestic chip investment opportunities through the Sci-Tech Chip ETF Linked Fund (017470) [3]

Core Insights - As of November 27, the total market financing balance reached 2.46 trillion yuan, marking an increase of 2.75 billion yuan from the previous trading day, with a continuous rise over three consecutive trading days [1] - The financing balance in the Shanghai market was 1.24 trillion yuan, up by 493 million yuan, while the Shenzhen market saw a balance of 1.20 trillion yuan, increasing by 2.25 billion yuan [1] - A total of 1,781 stocks experienced net financing inflows, with 379 stocks having net inflows exceeding 10 million yuan, and 24 stocks surpassing 100 million yuan in net inflows [1] Individual Stock Highlights - The top stock for net financing inflow on November 27 was Shenghong Technology, with a net inflow of 501 million yuan, followed by Cambrian Technologies and ZTE Corporation with net inflows of 370 million yuan and 286 million yuan, respectively [2] - In terms of industry concentration, the electronics, communications, and power equipment sectors had the highest number of stocks with net inflows exceeding 100 million yuan, with 9, 4, and 3 stocks respectively [1] Financing Balance Analysis - The average ratio of financing balance to circulating market value for stocks with significant net inflows was 5.17%, with the highest ratio observed in Yintang Zhikong at 11.03% [2] - Other stocks with high financing balance ratios included Cambridge Technology, Yunnan Zhiye, and Huagong Technology, with ratios of 10.19%, 8.88%, and 7.68% respectively [2] Sector Performance - The main board had 9 stocks with significant net inflows, while the ChiNext board had 11, and the Sci-Tech Innovation board had 4 [1] - The performance of individual stocks varied, with some experiencing notable price changes alongside their financing activities, such as Yintang Zhikong with a 10.79% increase and Shenghong Technology with a slight increase of 0.06% [3]

Core Insights - The AI SoC for smart devices is a rapidly developing technology that serves as the "brain" for various smart devices, driven by advancements in artificial intelligence (AI) and the Internet of Things (IoT) [1][4] - The global market for smart device AI SoCs is projected to grow from $10.7 billion in 2020 to $31.8 billion in 2024, with an expected increase to $43.8 billion by 2025 [1][4] - Consumer electronics account for 40% of the AI SoC market, with low-power applications representing over 60% of that segment [4] Industry Definition and Characteristics - Smart devices are defined as devices with operating systems, data processing capabilities, and network connectivity, including smart cameras, cars, smartphones, smart speakers, tablets, and wearables [2] - The SoC directly influences the response speed, battery life, multitasking ability, and user interaction experience of smart devices, making it a key driver of their evolution [2] Industry Chain - The upstream of the smart device AI SoC industry includes raw materials such as wafers, photoresists, electronic gases, and target materials, as well as equipment like photolithography and etching machines [4] - The midstream involves the design, manufacturing, and packaging of AI SoCs, while the downstream encompasses application markets including smart homes, commercial and educational sectors, automotive, personal mobile devices, industrial, medical, and energy sectors [4] Cost Structure - The cost structure of smart device AI SoCs is primarily divided into raw material costs (65-80% of total costs) and processing fees (15-25% of total costs) [5] Competitive Landscape - The smart device AI SoC industry is characterized by a competitive landscape where international giants dominate the high-end market, while domestic companies carve out differentiated niches [6] - Major domestic players include companies like Rockchip, Xiamen Xingchen Technology, and Hengxuan Technology, each leveraging their technological expertise and market positioning [6][7] Representative Companies - Rockchip has over 20 years of experience in SoC design and has expanded into the AIoT market, achieving revenues of 3.141 billion yuan and a net profit of 780 million yuan in the first three quarters of 2025 [7][8] - Xiamen Xingchen Technology focuses on visual AI SoCs and reported revenues of 1.402 billion yuan with a gross profit of 464 million yuan in the first half of 2025 [9] - Hengxuan Technology leads in the smart audio SoC sector, achieving revenues of 2.934 billion yuan and a net profit of 502 million yuan in the first half of 2025 [10] Industry Development Trends - The smart device AI SoC industry is transitioning from a phase focused solely on computational power to a transformative era characterized by efficiency, intelligence, and integration across various application fields [11]

Group 1 - A total of 3735 stocks in the A-share market received financing purchases on November 27, with 325 stocks having purchase amounts exceeding 100 million yuan [1] - The top three stocks by financing purchase amount were Zhongji Xuchuang, Xinyi Sheng, and Shenghong Technology, with amounts of 4.428 billion yuan, 3.497 billion yuan, and 2.077 billion yuan respectively [1] - Four stocks had financing purchase amounts accounting for over 30% of the total transaction amount, with Jicheng Electronics, Tongling Shares, and Wuchan Zhongda leading at 35.54%, 31.53%, and 30.87% respectively [1] Group 2 - There were 24 stocks with net financing purchases exceeding 100 million yuan, with Shenghong Technology, Hanwujishi-U, and ZTE ranking the highest at 501 million yuan, 370 million yuan, and 286 million yuan respectively [1]

沪深两市数据显示，11月27日，融资净买入前十的股票分别为：胜宏科技（5.01亿元）、寒武纪（3.70 亿元）、中兴通讯（2.86亿元）、香农芯创（2.58亿元）、药明康德（2.54亿元）、芯原股份（2.47亿 元）、剑桥科技（1.81亿元）、汉得信息（1.59亿元）、鹏辉能源（1.45亿元）、海光信息（1.42亿 元）。 ...

Core Insights - The report discusses the development of artificial intelligence (AI) computing centers and their evolution into AI computing networks, emphasizing the importance of infrastructure for digital economy growth and technological advancement [6][7][10]. Group 1: Global AI Computing Center Development - AI computing centers are recognized as critical infrastructure for the digital economy, facilitating the integration of AI technologies with traditional industries [10][18]. - Major countries, including the US, Europe, Japan, and China, are actively investing in AI computing infrastructure to maintain global competitiveness [12][18]. - The US plans to invest approximately $69 billion in AI and quantum computing research and infrastructure over the next five years, aiming to triple the number of AI research institutions by 2025 [13][19]. Group 2: China's AI Computing Center Characteristics - China's AI computing centers are primarily government-led, focusing on autonomous technology development and market-oriented operational mechanisms [31][33]. - The construction of AI computing centers is seen as a vital support for the integration of AI with the real economy, with cities like Wuhan and Shenzhen leading the way in establishing operational centers [23][34]. - The report highlights the importance of creating a public service platform that aggregates innovation resources and empowers industrial development through AI computing centers [46]. Group 3: New Demands and Challenges - The demand for computing power in AI is increasing, driven by large-scale pre-trained models that are being applied across various industries [7][23]. - AI computing centers must adapt to the new landscape characterized by "large models + big data + high computing power" and align with national carbon reduction goals [7][31]. - The report suggests that AI computing centers should evolve into interconnected computing networks to enhance resource sharing and meet the new demands of the economy [7][8]. Group 4: Recommendations for High-Quality Development - The report recommends a coordinated approach to enhance the quality of AI computing center construction and to establish operational mechanisms for AI computing networks [7][8]. - It emphasizes the need for technological innovation and policy support to facilitate collaboration between academia, industry, and government [7][8]. - Standardization in the construction of AI computing networks is crucial for their sustainable development and scalability [7][8].

北京市中伦律师事务所 关于中科寒武纪科技股份有限公司 2025 年第一次临时股东大会的 法律意见书 $$\Xi{\bf{\cal{O}}}\!=\!\Xi{\bf{\cal{H}}}{\bf{\cal{H}}}\!+\!-\!\Xi$$ 北京 • 上海 • 深圳 • 广州 • 武汉 • 成都 • 重庆 • 青岛 • 杭州 • 南京 • 海口 • 东京 • 香港 • 伦敦 • 纽约 • 洛杉矶 • 旧金山 • 阿拉木图 Beijing • Shanghai • Shenzhen • Guangzhou • Wuhan • Chengdu • Chongqing • Qingdao • Hangzhou • Nanjing • Haikou • Tokyo • Hong Kong • London • New York • Los Angeles • San Francisco • Almaty 北京市中伦律师事务所 关于中科寒武纪科技股份有限公司 2025 年第一次临时股东大会的 法律意见书 致：中科寒武纪科技股份有限公司 北京市中伦律师事务所（以下简称"本所"）接受中科寒武纪科技股份有限 公司（以下简称"公司 ...

证券代码：688256 证券简称：寒武纪 公告编号：2025-075 特此公告。 中科寒武纪科技股份有限公司董事会 2025 年 11 月 28 日 附件：职工代表董事简历 关于选举第三届董事会职工代表董事的公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 中科寒武纪科技股份有限公司（以下简称"公司"或"寒武纪"）于 2025 年 11 月 27 日召开 2025 年第一次临时股东大会，审议并通过了《关于取消公司监事 会、变更注册资本及修订<公司章程>并办理工商变更登记的议案》。根据《公司法》 及修订后且已生效的《公司章程》等有关规定，公司董事会由 9 名董事组成，其 中职工代表董事 1 名。 为保证董事会正常运作，根据《公司法》《上海证券交易所科创板上市公司自 律监管指引第 1 号——规范运作》等法律、法规、规范性文件以及《公司章程》 等有关规定，公司于 2025 年 11 月 27 日召开了职工代表大会，选举王在先生（简 历附后）担任公司第三届董事会职工代表董事。王在先生任期自本次职工代表大 会审议通过之日起至公司 ...

证券代码：688256 证券简称：寒武纪 公告编号：2025-074 中科寒武纪科技股份有限公司 2025年第一次临时股东大会决议公告 本公司董事会及全体董事保证公告内容不存在任何虚假记载、误导性陈述或 者重大遗漏，并对其内容的真实性、准确性和完整性依法承担法律责任。 重要内容提示： 本次会议是否有被否决议案：无 一、 会议召开和出席情况 （三） 出席会议的普通股股东、特别表决权股东、恢复表决权的优先股股东及 其持有表决权数量的情况： | 1、出席会议的股东和代理人人数 | 1,103 | | --- | --- | | 普通股股东人数 | 1,103 | | 2、出席会议的股东所持有的表决权数量 | 272,076,900 | | 普通股股东所持有表决权数量 | 272,076,900 | | 3、出席会议的股东所持有表决权数量占公司表决权数量的比 | 64.5269 | | 例（%） | | | 普通股股东所持有表决权数量占公司表决权数量的比例（%） | 64.5269 | 注：截至本次股东大会股权登记日，公司回购专用账户中股份数为 36,600 股，不享有股东 大会表决权。 （四） 表决方式是否符合《公 ...

北京 • 上海 • 深圳 • 广州 • 武汉 • 成都 • 重庆 • 青岛 • 杭州 • 南京 • 海口 • 东京 • 香港 • 伦敦 • 纽约 • 洛杉矶 • 旧金山 • 阿拉木图 Beijing • Shanghai • Shenzhen • Guangzhou • Wuhan • Chengdu • Chongqing • Qingdao • Hangzhou • Nanjing • Haikou • Tokyo • Hong Kong • London • New York • Los Angeles • San Francisco • Almaty 北京 • 上海 • 深圳 • 广州 • 武汉 • 成都 • 重庆 • 青岛 • 杭州 • 南京 • 海口 • 东京 • 香港 • 伦敦 • 纽约 • 洛杉矶 • 旧金山 • 阿拉木图 Beijing • Shanghai • Shenzhen • Guangzhou • Wuhan • Chengdu • Chongqing • Qingdao • Hangzhou • Nanjing • Haikou • Tokyo • Hong Kong • Lon ...