Core Insights - TSMC stands out in the Q2 2025 foundry revenue report, achieving over 40% year-on-year growth and expanding its market share to 70% [1][2] - The top ten foundries collectively generated revenues of $41.718 billion in Q2 2025, marking a 14.6% increase from the previous quarter [2] - TSMC's revenue reached $30.239 billion in Q2 2025, a significant increase from $25.517 billion in Q1 2025, while Samsung and SMIC showed more modest growth [2] Company Performance - TSMC's revenue growth of 18.5% quarter-on-quarter is the highest among the top foundries, reinforcing its leading position in the industry [2] - Samsung's revenue increased by 9.2% to $3.159 billion, while SMIC's revenue slightly declined by 1.7% to $2.209 billion [2] - TSMC's 3nm process technology has significantly contributed to its revenue, accounting for 22% of its total revenue in Q1 2025 [3] Technological Advancements - TSMC has consistently made the right technological choices, such as adopting EUV lithography for the 7nm node, which allowed it to surpass Intel [3][4] - The company utilized FinFET architecture for its 3nm process, achieving better performance and yield compared to Samsung's GAA architecture, which has struggled with yield issues [3][4] - TSMC's investment in R&D for the 3nm node exceeded $10 billion, similar to Samsung's investment [3] Industry Trends - The semiconductor industry is witnessing a shift towards collaborative development between design and manufacturing, driven by recent U.S. export restrictions on EDA tools [12] - The Chinese semiconductor industry is increasing its focus on manufacturing capabilities, recognizing the importance of this segment in the supply chain [12] - TCAD simulation software is becoming a critical tool for optimizing semiconductor processes, significantly reducing development cycles and costs [8][12] Future Outlook - The importance of TCAD is expected to grow as the industry moves towards more advanced nodes like 2nm, where new challenges such as three-dimensional heterogeneous integration will arise [14] - Companies that effectively leverage TCAD for process optimization will gain a competitive edge in the ongoing technological race [14]

Core Viewpoint - MediaTek has successfully completed the design tape-out of its first flagship SoC using TSMC's 2nm process technology, marking a significant milestone in their partnership and is expected to enter mass production by the end of next year [2][3] Group 1: Technology Advancements - TSMC's 2nm process technology introduces a new nanosheet transistor structure, enhancing performance, power efficiency, and yield [2] - Compared to the existing N3E process, the new technology increases logic density by 1.2 times, improves performance by up to 18% at the same power level, and reduces power consumption by approximately 36% at the same speed [2] Group 2: Strategic Collaboration - The collaboration between MediaTek and TSMC aims to maximize performance and energy efficiency across various applications, including mobile platforms, computing, automotive, and data centers [2][3] - MediaTek's General Manager highlighted the company's commitment to applying advanced semiconductor process technologies to diverse innovative solutions [2]

Group 1 - TSMC's stock price increased by 1.7% to $265 in pre-market trading, reaching a new high [1] - NVIDIA is considering adopting TSMC's most advanced process, the A16 process, which is expected to begin mass production in the second half of next year [1] - The A16 process will utilize backside power delivery technology, marking the first time AI applications will lead TSMC's most advanced process [1] Group 2 - MediaTek's first system-on-chip (SoC) using TSMC's 2nm process has completed tape-out and is expected to launch by the end of 2026 [1]

Taiwan Semiconductor Manufacturing Company (NYSE: TSM ) remains one of the top picks in the SA Quant rating, and the way developments are unfolding, it is difficult to argue with Quant's optimism. TSM is stillWith a decade at a Big 4 audit firm specializing in the banking, mining, and energy sectors, I bring a strong foundation in finance and strategy. Currently, I serve as the Head of Finance for a leading owner and operator of retail real estate, where I oversee complex financial operations and strategy. ...

Taiwan Semiconductor Manufacturing Company (NYSE: TSM ) remains one of the top picks in the SA Quant rating, and the way developments are unfolding, it is difficult to argue with Quant's optimism. TSM is stillWith a decade at a Big 4 audit firm specializing in the banking, mining, and energy sectors, I bring a strong foundation in finance and strategy. Currently, I serve as the Head of Finance for a leading owner and operator of retail real estate, where I oversee complex financial operations and strategy. ...

每经记者｜王晶 每经编辑｜文多 封面图片来源：视觉中国-VCG211478193393 9月16日，联发科方面宣布，公司首款采用台积电2纳米制程的旗舰系统单芯片（SoC）已成功完成设计 流片，预计将于明年底进入量产。"流片"是半导体研发过程中一个关键节点，它标志着芯片设计阶段基 本完成，进入到真正的制造验证环节。 在半导体产业中，纳米数越小，代表晶体管的体积更小、密度更高，芯片性能越强。目前，台积电、三 星、英特尔等均在竞逐更小制程，因为2纳米制程不仅意味着手机处理器性能和能效的进一步跃升，它 还能为端侧大模型、生成式AI、高性能计算等应用提供保障。 具体来看，台积电的2纳米制程技术首次采用纳米片电晶体结构，能够带来更优异的性能、功耗与良 率。联发科方面表示："台积电增强版2纳米制程技术与现有的N3E（台积电3纳米制程工艺升级版）制 程相比，逻辑密度增加1.2倍，在相同功耗下性能提升高达18%，并能在相同速度下功耗减少约36%。" 尽管台积电在技术方面取得突破，但高昂的制造成本仍然是行业面临的一大考验。有消息称，一枚2纳 米制程晶圆的成本约为3万美元，包括苹果、英伟达等在内的厂商需要在"性能"与"成本"之间进 ...

内容来源于智通财经APP 贝塔投资智库 为投资交易提供更有价值的服务 Counterpoint高级分析师William Li指出，随着先进封装技术在芯片性能提升中的关键作用日益凸显， 芯片设计商将日益依赖先进封装来提升方案性能。鉴于台积电目前的技术领先优势及稳固的客户关 系，预计该公司不仅在先进制程节点领域持续领跑， 未来在先进封装领域也将保持主导地位。 从同业对比看，第二季度多数其他晶圆代工厂商(含 IDM 外包份额)市场份额维持或微降： 德州仪器 (TXN.US)与英特尔(INTC.US)均稳定保持6%市场份额;英飞凌科技从6%微降至5%，三星则从5%下滑 至4%。 Counterpoint高级分析师Jake Lai分析，消费电子传统旺季效应、AI 应用订单加速及中国现有补贴政 策，将成为三季度主要驱动力。 点击蓝字，关注我们 智通财经APP获悉，根据Counterpoint Research数据， 台积电(TSM.US)在2025年自然年第二季度半导 体代工市场占有率飙升至38%，同比提升7个百分点，而去年同期为31%。这一增长源于行业整体晶圆 代工收入同比攀升19%， 主要受人工智能对先进制程及封装技 ...

Counterpoint高级分析师Jake Lai分析，消费电子传统旺季效应、AI 应用订单加速及中国现有补贴政策， 将成为三季度主要驱动力。 从同业对比看，第二季度多数其他晶圆代工厂商(含 IDM 外包份额)市场份额维持或微降：德州仪器 (TXN.US)与英特尔(INTC.US)均稳定保持6%市场份额;英飞凌科技从6%微降至5%，三星则从5%下滑至 4%。 智通财经APP获悉，根据Counterpoint Research数据，台积电(TSM.US)在2025年自然年第二季度半导体 代工市场占有率飙升至38%，同比提升7个百分点，而去年同期为31%。这一增长源于行业整体晶圆代 工收入同比攀升19%，主要受人工智能对先进制程及封装技术的强劲需求驱动，同时中国补贴政策引发 的提前拉货效应亦贡献显著。Counterpoint预测，2025年第三季度晶圆代工收入将延续增长态势，实现 中等个位数增幅。 Counterpoint高级分析师William Li指出，随着先进封装技术在芯片性能提升中的关键作用日益凸显，芯 片设计商将日益依赖先进封装来提升方案性能。鉴于台积电目前的技术领先优势及稳固的客户关系，预 计该公司不 ...

Core Insights - Taiwan's semiconductor manufacturing company, TSMC, is projected to increase its foundry market share to 38% by Q2 2025, up from 31% year-over-year, driven by a 19% increase in foundry revenue due to AI demand and Chinese subsidies [1] - Advanced packaging technology is becoming increasingly important, with TSMC expected to maintain its leadership in both advanced process nodes and advanced packaging in the foreseeable future [1][2] - The OSAT (Outsourced Semiconductor Assembly and Test) industry is experiencing a revenue growth rate acceleration from 5% to 11%, with companies like ASE and King Yuan benefiting significantly from AI GPU demand [2] Summary by Sections TSMC Market Share and Revenue Growth - TSMC's foundry market share is expected to rise to 38% by Q2 2025, compared to 31% in the same period last year [1] - The overall foundry revenue is anticipated to grow by 19% year-over-year, primarily due to the demand for advanced processes and packaging driven by AI and subsidies from China [1] - Counterpoint Research forecasts moderate single-digit growth in foundry revenue by Q3 2025 [1] Advanced Packaging and Technology Trends - Advanced packaging is becoming a crucial growth driver for chip manufacturers, with TSMC's strong technology and customer relationships positioning it well for future leadership [2] - The shift towards Foundry 2.0 indicates a transition from traditional foundry services to a more integrated technology platform, encompassing various semiconductor manufacturing processes [2] Application Processor (AP) Market Dynamics - TSMC is expected to dominate the application processor market with a projected 90% share in the 5nm or smaller process technology segment [3] - The demand for advanced semiconductor processes is increasing due to the growing need for performance and energy efficiency in high-end smartphones [4] - TSMC's market share in the sub-3nm AP manufacturing segment is projected to be around 87% this year, increasing to 89% by 2028 [4] Competitive Landscape - Samsung is working to improve its yield rates in the 3nm and below processes to catch up with TSMC, having recently stabilized its 3nm process [5] - Despite Samsung's efforts, TSMC continues to lead in advanced process technology, with significant market share in AP manufacturing for major clients like Apple and Qualcomm [4][5]

Group 1 - The global semiconductor foundry market (Foundry 2.0) is expected to see a revenue growth of 19% year-on-year by Q2 2025, driven primarily by advanced processes and advanced packaging [1] - TSMC's market share is projected to increase from 31% in Q2 2024 to 38% in Q2 2025, attributed to the ramp-up of 3nm technology and CoWoS expansion [1] - The OSAT industry is expected to accelerate its revenue growth rate from 5% to 11%, with notable contributions from companies like ASE and KYEC, the latter benefiting from AI GPU demand with over 30% year-on-year growth [1] Group 2 - Advanced packaging technology is becoming increasingly important, with chip manufacturers expected to rely on it to enhance chip performance [2] - The third quarter growth drivers include the traditional consumer electronics peak season, accelerated AI applications and orders, and current subsidy policies in mainland China [2] - Foundry 2.0 is defined as a transformation from traditional foundry services to a technology integration platform, encompassing pure foundry, non-memory IDM, OSAT, and photomask manufacturers [2]