Core Viewpoint - The company is implementing a differentiated and high-end development strategy focused on electroplating and photolithography, with significant progress in product testing and upcoming mass production, which is expected to drive continuous growth in performance [1][3]. Electroplating - The company has established a competitive product matrix for electroplating solutions, achieving full category coverage in traditional and advanced packaging fields, and has made breakthroughs in high-end markets [1]. - In the advanced packaging sector, multiple products for electroplating solutions and additives have entered mass production, widely used in Bumping and RDL processes [1]. - The high-purity copper electroplating solution has achieved stable supply to Huada Technology and Tongfu Microelectronics, while the tin-silver electroplating additive has passed stringent certification from Changdian Technology and received small batch orders [1]. - The copper electroplating additive for advanced packaging is currently undergoing batch stability verification, and the 28nm Damascus copper interconnect process copper plating additive is in the final stages of product certification [1]. - The ultra-high purity cobalt-based solution and additives for 5-14nm advanced processes are progressing well in client testing, and the cleaning solution for copper processes in wafer manufacturing has entered the mass production scaling phase [1]. Photolithography - The advanced packaging negative photoresist has covered multiple mainstream packaging factories, with market penetration continuously increasing, and the company plans to enrich product models for full category coverage [2]. - The self-developed positive PSPI photoresist has successfully obtained the first domestic order from a mainstream wafer factory, breaking the long-standing technology monopoly of the US and Japan, and is expected to gradually achieve mass shipments by 2025 [2]. - The company is also developing negative PSPI and high-sensitivity chemical amplification PSPI, with plans to continue advancing product certification in advanced packaging and wafer manufacturers by 2025 [2]. - The wafer ICA chemical amplification photoresist is undergoing successful client validation testing, with some indicators outperforming international benchmark products [2]. - The OLED high-sensitivity photoresist is in client testing for OLED backplane array photolithography processes, and the company has reached a consensus with BOE on future cooperation and strategic planning [2]. - The high-thickness KrF photoresist is currently in the laboratory research phase, aiming to fill domestic gaps [2]. Market Expansion - The company has acquired INOFINE to expand into the Southeast Asian market, further solidifying its leading position in wet electronic chemicals [3]. - INOFINE, established in 2009, is one of the early entrants in the semiconductor wet electronic chemicals business in Malaysia and holds a certain influence in the local market [3]. - From 2025, INOFINE will be included in the company's consolidated financial statements [3]. Financial Projections - The company expects revenues of 600 million, 727 million, and 913 million yuan for the years 2025, 2026, and 2027, respectively, with net profits attributable to the parent company projected at 50 million, 71 million, and 103 million yuan for the same years [3].

Group 1 - Huawei's recent patent application for a "four-chip" packaging design has garnered attention, potentially resembling NVIDIA's Rubin Ultra architecture, indicating Huawei's commitment to developing advanced packaging technology [1] - The Guangzhou Development Zone has issued policies to support the high-quality development of the integrated circuit industry, aiming to establish a core area for China's integrated circuit sector [1] - Advanced packaging technology is seen as a crucial method to enhance chip performance and reduce costs, particularly for AI training chips and automotive-grade SoCs, with major domestic packaging and wafer factories improving 2.5D packaging processes and expected to scale up production in the second half of the year [1] Group 2 - The advanced packaging materials market is characterized by high technical barriers and is largely dominated by foreign companies, but the domestic production of these materials is expected to accelerate due to the shift of global semiconductor capacity to China and considerations of supply chain security and cost control [2] - Key companies in the advanced packaging sector include Changdian Technology, Weicai Technology, Yongxi Electronics, and Huada Technology, indicating a competitive landscape in the industry [3]

Core Viewpoint - The article emphasizes the rapid development of data centers in Shaoguan, Guangdong, positioning it as the "computing power heart" of the Guangdong-Hong Kong-Macao Greater Bay Area, essential for artificial intelligence and various industries [1][2]. Group 1: Development of Computing Power Infrastructure - Shaoguan has established a computing power scale with over 600 billion yuan in total investment, attracting 31 upstream and downstream projects, including major companies like Tencent and China Unicom [1][3]. - The city has built a high-speed optical network with 13 400G connections and 12 inter-provincial cables, achieving extremely low latency of 1 millisecond within the city and 3 milliseconds across the Greater Bay Area [5][6]. Group 2: Economic Impact and Future Prospects - The computing power cluster in Shaoguan is projected to generate significant demand for equipment, with an estimated 300 billion yuan for electromechanical equipment and 2 trillion yuan for server procurement [6]. - By Q1 2025, the total computing power scale of the "East Data West Computing" initiative is expected to reach 215.5 EFLOPS, accounting for over 70% of the national total [3][6]. Group 3: Policy Support and Ecosystem Development - The local government has implemented various incentives for businesses, including rent subsidies and financial support for startups, to attract companies to the computing power cluster [7][8]. - The Guangdong provincial government has also committed to channeling computing and data needs from its agencies to the Shaoguan cluster, reinforcing its strategic importance [7][8]. Group 4: Robotics Industry and Future Opportunities - The demand for computing power in the robotics sector is increasing, with Shaoguan's infrastructure providing a solid foundation for the development of intelligent robots [9][10]. - There is a call for Shaoguan to leverage its industrial advantages to attract core component manufacturers for the robotics industry, aiming for a differentiated development strategy [10].

粤北青山之间，一座座数据中心如"钢铁森林"般拔节生长。在广东韶关，13条连接大湾区的400G全光 运力网络和12条省际光缆如同"神经网络"般贯穿全市，将庞大数据分别以1.3毫秒和1.66毫秒的速度输向 广州和深圳的核心机房。仅有正常人眨眼速度百分之一的极低时延，满足了大湾区绝大部分算力业务的 需求。作为国家在华南布局的唯一数据中心集群，韶关已成为粤港澳大湾区抢占人工智能高地的"算力 心脏"。 "算力就是生产力，没有算力就没有人工智能。"在近日召开的第四届粤港澳大湾区（广东）算力产业大 会暨第三届中国算力网大会上，韶关市委书记陈少荣表示，韶关算力规模从零开始，总投资超600亿 元，招引上下游项目31个，移动、电信、联通、鹰硕等项目建成投产，腾讯、万国、中联、华韶二期等 项目动工建设。 从曾经的"华南重工业基地"到如今的"智算新城"，韶关正以算力为支点，撬动一场从"算力承载"到"全 链智造"的产业跃迁。 扩量提速："算力心脏" 这样的时延到底有多低？鹏城实验室数据智能研究所副所长、韶关市数据产业研究院院长相洋向证券时 报记者举例称，一分钟可以切分成1000毫秒，以正常人的反应，一眨眼的时间就需要100毫秒左右，所 ...

Core Insights - The semiconductor industry is expected to benefit from the ongoing AI-driven demand recovery and the deepening of domestic substitution, entering a recovery cycle since the second half of 2023, with positive revenue and net profit growth projected for 2024 and Q1 2025 [5][20][21] - The report maintains an overweight recommendation, emphasizing the importance of self-sufficiency and the AI wave as key investment themes for 2025 [1][5] Section Summaries 1. Semiconductor Sector Performance in 2024 & Q1 2025 - The semiconductor sector is projected to achieve a total revenue of CNY 602.23 billion in 2024, representing a year-on-year growth of 21.10%, and a net profit of CNY 35.34 billion, up 12.82% [13] - For Q1 2025, the sector is expected to generate revenue of CNY 148.35 billion, a 15.95% increase year-on-year, with a net profit of CNY 9.28 billion, reflecting a significant growth of 35.13% [13][20] - Profitability metrics indicate a slight decline in gross and net profit margins for 2024, with a recovery anticipated in Q1 2025, where gross margin is expected to rise to 26.29% and net margin to 6.24% [16][20] 2. Subsector Performance - The semiconductor equipment sector is projected to achieve revenue of CNY 17.88 billion in Q1 2025, a year-on-year increase of 33.38%, with a net profit of CNY 2.57 billion, up 24.12% [22] - The semiconductor materials sector is expected to see revenue of CNY 10.41 billion in Q1 2025, reflecting a 10.93% increase, and a net profit of CNY 0.67 billion, up 40.35% [26] - The digital chip design sector is projected to generate revenue of CNY 37.97 billion in Q1 2025, a 20.27% increase, with a net profit of CNY 3.26 billion, up 20.59% [29] 3. External Factors Driving Domestic Substitution - Increasing restrictions from overseas, particularly from the U.S., are accelerating the domestic substitution process in the semiconductor industry [47][48] - The report highlights that U.S. sanctions have intensified, impacting various segments of the semiconductor supply chain, including advanced AI chips and semiconductor manufacturing equipment [47][48]

Core Viewpoint - New Henghui (301678.SZ) has initiated its subscription with an issue price of 12.80 yuan per share and a price-to-earnings ratio of 17.76 times, focusing on integrated circuit services including chip packaging materials and testing services [1] Company Overview - New Henghui is an integrated circuit enterprise engaged in the research, production, sales, and packaging testing services of chip packaging materials [1] - The company's main business segments include smart card business, etched lead frame business, and IoT eSIM chip packaging and testing services [1] Smart Card Business - The smart card business is the company's traditional core segment, focusing on the development, production, and sales of flexible lead frame products essential for smart card chip packaging [2] - The company has established long-term partnerships with several well-known security chip design manufacturers and smart card manufacturers, ensuring a broad application of its products in communications, finance, transportation, and identity recognition sectors [2] - The company adopts an integrated operating model, producing its own key packaging materials to ensure low-cost, high-quality supply, enhancing delivery capabilities and profit margins [2] Market Position and Competition - The flexible lead frame industry has high entry barriers, with only three major manufacturers capable of stable mass supply globally, positioning New Henghui as the second-largest player in the market [2] - The company has an annual production capacity of approximately 2.374 billion smart card modules, making it one of the main suppliers in China [2] New Business Segments - The etched lead frame and IoT eSIM chip packaging businesses were newly developed in 2019, with significant investment in technology leading to successful mass production and sales [3] - The company has built a solid customer base among quality semiconductor packaging manufacturers, laying a good foundation for future business growth [3] - The eSIM technology is crucial for the IoT industry, and the company is leveraging its advantages in traditional SIM card packaging to establish specialized factories for eSIM chip packaging and testing [3] Financial Performance - The company reported revenues of approximately 548 million yuan, 684 million yuan, 767 million yuan, and 414 million yuan for the years 2021, 2022, 2023, and the first half of 2024, respectively [4] - Net profits for the same periods were approximately 101 million yuan, 111 million yuan, 153 million yuan, and 101 million yuan [4] - Detailed financial data shows revenue growth from 548.03 million yuan in 2021 to 766.73 million yuan in 2023, with net profit increasing from 100.72 million yuan to 153.33 million yuan during the same period [5]

Core Viewpoint - The article discusses the launch of the "Oriental Red Hui Xuan Growth" fund by Oriental Red Asset Management, highlighting its investment strategy, management fees, and the performance of its fund manager, Xu Xijia [1][2][4]. Fund Details - The "Oriental Red Hui Xuan Growth" fund is a mixed equity fund set to be publicly offered from June 10, 2025, to September 9, 2025, with a minimum fundraising target of 200 million shares [2]. - The fund aims for long-term stable asset appreciation while strictly controlling investment risks, with a performance benchmark comprising 85% of the CSI 800 Index, 5% of the Hang Seng Index (adjusted for exchange rates), and 10% of the China Bond Total Index [2]. - The fund will invest 60%-95% of its assets in stocks, including a 0%-50% allocation to Hong Kong Stock Connect stocks, utilizing a multi-factor stock selection model [2]. Management Fees - The management fee for the "Oriental Red Hui Xuan Growth" fund is set at an annual rate of 1.2% based on the previous day's net asset value [4][2]. Fund Manager Profile - Xu Xijia, the proposed fund manager, has a Ph.D. in Finance from Temple University and extensive experience in asset management and investment banking [4]. - Xu currently manages two active equity funds, both initiated in 2024, and has a history of managing various index and mixed funds [5][6]. Performance Analysis - As of June 9, 2025, the "Oriental Red Quantitative Stock A" fund managed by Xu has achieved a return of 6.78% this year, outperforming its benchmark by over 7 percentage points [7]. - In contrast, the "Oriental Red Dividend Quantitative Stock A" fund has seen a decline of 0.62% since its inception in August 2024, underperforming its benchmark by over 9 percentage points [7].

[Table_Title] 自强者胜——关税应对策略三部曲（三） %% %% %% %% research.95579.com 1 丨证券研究报告丨 联合研究丨行业深度 报告要点 [Table_Summary] 在宏观环境持续扰动的大背景下，世界"新格局"逐步显现，中国有望在各个领域得到长足发 展。在科技领域，我国明确提出自主可控发展路线，着力解决各"卡脖子"领域面临的技术和 产业化难题。在本篇报告中，长江策略联合金属、化工、机械、军工、电子、计算机、通信和 医药组，构建自上而下的自主可控行业研究框架，再结合自下而上视角梳理自主可控领域的核 心细分赛道和核心标的，以期得到较为完整的自主可控领域的投资图谱。 分析师及联系人 [Table_Author] 戴清 王鹤涛 马太 SAC：S0490524010002 SAC：S0490512070002 SAC：S0490516100002 SFC：BTR264 SFC：BQT626 SFC：BUT911 赵智勇 王贺嘉 杨洋 SAC：S0490517110001 SAC：S0490520110004 SAC：S0490517070012 SFC：BRP550 SFC ...

Investment Rating - The investment rating for the company is not explicitly stated in the report, but the AHP score is 1.83, placing it in the 24.7% percentile of the non-technology innovation system AHP model, indicating a below-average position [7][8]. Core Insights - The company, Xin Heng Hui, is expected to see growth in its etching lead frame business, supported by its established smart card and IoT eSIM chip packaging services. The smart card business remains a core revenue driver, contributing 70%-85% of total revenue from 2022 to 2024 [9][10]. - The company has a strong market position in the smart card sector, ranking second in market share for flexible lead frames, with shares of 31.63% and 32.32% in 2022 and 2023, respectively [10]. - The etching lead frame and eSIM packaging businesses are emerging as new growth drivers, with their combined revenue contribution increasing from 14.70% in 2022 to 29.84% in 2024 [16][17]. - The company has a robust production capacity of approximately 2.342 billion smart card modules annually, with global market shares of 20.71% and 17.87% in 2022 and 2023, respectively [10][11]. - The company is actively expanding its overseas customer base, with international sales accounting for 21.12% to 27.77% of total revenue from 2022 to 2024 [10][11]. Summary by Sections AHP Score and Expected Allocation - The AHP score for Xin Heng Hui, after excluding liquidity premium factors, is 1.83, indicating a mid-to-low ranking in the AHP model [7][8]. Company Fundamentals and Highlights - The company is a key player in the smart card market, with a significant focus on expanding its international client base and enhancing its product offerings through innovation [9][10]. - The etching lead frame and eSIM chip packaging sectors are identified as new growth avenues, with increasing revenue contributions projected [16][17]. Comparable Company Financial Metrics - Xin Heng Hui's revenue from 2022 to 2024 is relatively small compared to comparable companies, with net profits showing a compound annual growth rate (CAGR) of 10.97% to 30.06% [19]. - The company's gross margins are higher than those of comparable firms, with rates of 32% to 37% from 2022 to 2024, reflecting its competitive advantage in production [25]. Fundraising Projects and Development Vision - The company plans to raise funds through the issuance of new shares, with proceeds allocated to projects aimed at enhancing production capacity and R&D capabilities [28][29].

21世纪经济报道记者胡慧茵广州报道 特朗普关税政策遭遇司法挑战仅一天，再迎来变数。 据新华社报道，当地时间5月29日，美国联邦巡回上诉法院批准特朗普政府的请求，暂时搁置美国国际 贸易法院此前做出的禁止执行特朗普政府依据《国际紧急经济权力法》对多国加征关税措施的行政令的 裁决。 前一天，美国国际贸易法院裁定禁止执行特朗普政府依据《国际紧急经济权力法》对多国加征关税措施 的行政令。当天，马来西亚半导体板块受此利好消息影响强势上涨。然而仅过去一天，据记者29日查询 Investing数据，马来西亚半导体与半导体设备基本转跌。马来西亚半导体股价受消息面反应之大，恰恰 反映出马来西亚半导体对全球贸易环境的依赖。 在近期举行的第46届东盟峰会上，马来西亚总理安瓦尔在"吉隆坡宣言"的签署仪式上表示，东盟国家将 紧密携手，巩固其作为全球稳定支柱与新兴经济体的重要地位。促进区域半导体供应链的发展，也是马 来西亚今年担任东盟轮值主席国期间的重要议程之一。 作为全球半导体产业的重要一环，马来西亚的目标是打造高端芯片，但美国频繁摇摆的关税政策很可能 会破坏这一计划。对马来西亚来说，美国的关税政策始终是"达摩克利斯之剑"。有专家认为， ...