格隆汇1月28日丨晶升股份(688478.SH)近日接受特定对象调研时表示，公司对于2026年的订单规模增长 保持积极预期。碳化硅与半导体硅业务均有望较2025年实现大幅增量，另外新产品方面预计也会对公司 未来营收做出贡献。 ...

格隆汇1月28日丨晶升股份(688478.SH)近日接受特定对象调研时表示，目前公司已和4家台湾客户达成 碳化硅方面的业务合作。2023年起我们就开始向台湾客户批量供应用于功率器件的6英寸、8英寸碳化硅 长晶设备。部分客户用简单改造后的8英寸设备进行了12英寸碳化硅衬底的生产。公司现已为台湾客户 定制开发了12英寸碳化硅长晶设备，并正与客户就12英寸设备的新增批量需求进行洽谈。 ...

格隆汇1月28日丨晶升股份(688478.SH)近日接受特定对象调研时表示，公司对于2026年的订单规模增长 保持积极预期。碳化硅与半导体硅业务均有望较2025年实现大幅增量，另外新产品方面预计也会对公司 未来营收做出贡献。 ...

这是一场有关信心与决心的"长跑"。 十二年的时间，从一间不足100平方米的办公室起步，到成为资本 市场的"新兵"——深圳市恒运昌真空技术股份有限公司（下称"恒运昌"）做对了什么？ "首先是信心， 我始终相信，中国半导体产业会实现自强自立；其次是决心，闯出一条新路，不一定能够成功，但是如 果不迈出第一步，那绝对不会成功。"坐在镜头前，恒运昌董事长乐卫平整理了一下西装，又微微调整 了坐姿，口中的话语鲜有停顿。 1月28日，恒运昌在科创板挂牌。"上市是一个新的起点，我们不满足 于仅实现自主可控，恒运昌的愿景是成为一家围绕等离子体工艺提供核心零部件整体解决方案的平台型 公司。"乐卫平说。 在缝隙中寻找"火种" 2013年，中国半导体产业还处于萌芽阶段，国产半导体零部件 装备在晶圆厂中几乎没有一席之地。 彼时，乐卫平已经在美国AE公司工作了十一年，他见证了国内客 户的普遍困境——国内晶圆厂的建设和生产标准完全参照美国，装备清一色来自国外，不仅没有定价 权，也无法保证交付期。 这种"卡脖子"的困境，触动了乐卫平创业的决心。"尽管这意味着要放弃外企 的优厚待遇，但我毫不犹豫。"乐卫平表示。 在深圳市宝安区一间不到100平方 ...

Group 1: Hengyun Chang (恒运昌) - Hengyun Chang is a leading supplier of core components for semiconductor equipment in China, focusing on the research, production, and sales of plasma RF power systems and related devices [2] - According to Frost & Sullivan, Hengyun Chang holds the largest market share among domestic plasma RF power system manufacturers in China for 2024 [2] - The company has 108 authorized invention patents and 133 invention patents pending, and is recognized as a national high-tech enterprise and a key "little giant" in specialized and innovative sectors [2] - Major clients include top semiconductor equipment manufacturers such as Tuojing Technology and North Huachuang, with 38 self-developed products generating millions in revenue [2][3] - The revenue concentration among the top five clients is high, accounting for 73.54% to 90.62% from 2022 to the first half of 2025, with Tuojing Technology being the largest client [3] Group 2: Kema Materials (科马材料) - Kema Materials, established in 2002, specializes in the research, production, and sales of dry clutch friction plates and wet paper-based friction plates [4] - The company is a leading player in the domestic dry friction plate industry and has participated in drafting multiple national and industry standards [4] - Major clients include well-known automotive manufacturers such as China National Heavy Duty Truck Group and Volvo, indicating a strong market presence [4] - Kema Materials faces challenges in increasing its market share due to competition from companies like Schaeffler and Valeo, and is actively seeking to expand its international market presence [5][6]

Group 1: Semiconductor Sector Performance - The semiconductor industry chain showed strong performance, with significant capital focus on semiconductor equipment, materials, computing chips, and storage chips, leading to a notable "herding effect" among leading stocks [3] - Dongxin Co. saw a 20% limit-up, while Kangqiang Electronics and Huatiankechnology also hit the limit-up; Huahong Semiconductor, a leading foundry, reached a historical high with a price increase of over 9% [3] - The semiconductor price increase trend has spread from storage to other segments, with notable price hikes in packaging and testing, as well as CPU prices, which are expected to impact downstream consumer electronics costs [3] Group 2: Precious Metals Sector Activity - The precious metals sector remained active, with Zijin Mining reaching a new high of 42.68 CNY per share, driven by a significant acquisition announcement and strong market performance [5] - Zijin Mining announced a 28 billion CNY acquisition of Allied Gold Corporation, which includes three large gold mines in Africa, potentially increasing its gold production significantly [5] - Spot gold prices continued to rise, surpassing 5100 USD per ounce, with Morgan Stanley predicting a target price of 5700 USD per ounce in a bullish scenario due to geopolitical risks and central bank strategies [6] Group 3: Market Outlook and Investment Strategies - Institutions suggest a gradual shift towards high-performing sectors, with a focus on price increase chains, high-end manufacturing, and AI-related investments [7] - Despite high outflows from broad-based ETFs, there remains potential for capital inflow, indicating continued market momentum [7] - The market is expected to maintain a volatile trend, with structural opportunities available, particularly in sectors like electric equipment, basic chemicals, and semiconductor equipment [7]

每经AI快讯，1月27日，阿斯麦(ASML)再涨3%，股价创历史新高，总市值超过5600亿美元，更加巩固 了其欧洲公司市值第一地位。 ...

证券研究报告|宏观点评报告 [Table_Date] 2026 年 01 月 27 日 [Table_Title] 资产配置日报：科技归来 [Table_Title2] [Table_Summary] 1 月 27 日， 股市低开高走，科技板块重新升温，上证指数几经周折，尾盘再度收于 4140 点，资金经历短期 纠结后，继续涌向双创领域，科创综指、创业板指单日上涨 1.72%、0.71%。"股债跷跷板"效应成为日内债市 定价主导变量，风险偏好小幅提振的背景下，债市收益率普遍上行。 权益市场缩量上涨。万得全 A上涨 0.14%，全天成交额 2.92 万亿元，较昨日（1 月 26 日）缩量 3592 亿 元。港股方面，恒生指数上涨 1.35%，恒生科技上涨 0.50%。南向资金净流出 6.35 亿港元，其中中国移动和紫金 矿业分别净流出 11.47 亿港元和 8.43 亿港元，而腾讯控股净流入 10.24 亿港元。 指数呈现 V 型走势。早盘 4000+只股票下跌，万得全 A 跌幅一度达 1.40%。不过前期在窄幅震荡区间聚集的 筹码，支撑指数从负转正。正如我们在《暗流涌动》中提及，这部分筹码在牛市延续的共识下进 ...

Core Viewpoint - Advanced packaging is emerging as a new engine for computing power in the "post-Moore's Law" era, addressing the limitations of traditional chip performance improvements through innovative bonding technologies [4][5]. Group 1: Hybrid Bonding Overview - Hybrid bonding is an advanced packaging technology that combines dielectric bonding and metal interconnects, allowing for high-density, high-performance 3D integration [8][19]. - The development of hybrid bonding has evolved through various stages, from wire bonding to flip chip, and now to hybrid bonding, which enables ultra-fine pitch stacking and packaging [10][11]. - Hybrid bonding can be categorized into wafer-to-wafer (W2W) and chip-to-wafer (C2W) processes, with C2W offering higher flexibility and lower defect rates for smaller chips [14][16]. Group 2: Advantages and Challenges of Hybrid Bonding - The technology allows for extreme interconnect density and performance breakthroughs, achieving interconnect pitches below 1 μm, significantly enhancing data transfer bandwidth [23]. - Hybrid bonding is compatible with existing wafer-level manufacturing processes and can be integrated with TSV and micro-bump technologies, providing cost optimization potential [24]. - Challenges include yield issues, surface smoothness requirements, cleanliness standards, and complex testing processes that need to be addressed for successful mass production [26]. Group 3: Market Demand and Future Prospects - Major HBM manufacturers, including Samsung, Micron, and SK Hynix, have committed to adopting hybrid bonding technology for HBM5, which aims to meet the extreme demands of AI and high-performance computing [28]. - TSMC's SolC technology, which utilizes hybrid bonding, is expected to double its production by 2026, highlighting the growing adoption of this technology [29][30]. - The global market for hybrid bonding equipment is projected to exceed $600 million by 2030, with significant growth anticipated in the Asia-Pacific region [37]. Group 4: Competitive Landscape - The hybrid bonding equipment market is dominated by international players such as BESI, EV Group, and SUSS MicroTec, with BESI holding a market share of 67% in 2023 [44]. - The competitive landscape is evolving, with Chinese companies like Piotech entering the market, indicating advancements in domestic semiconductor equipment capabilities [42].

Group 1 - The core point of the article is that Chipbond Technology has reported a total of 17,825 shareholders as of January 9, 2026 [2]