英伟达于周二上午晚些时候在X平台发文称："我们注意到媒体上出现不实言论，称英伟达H100/H200系 列GPU存在供应短缺且'已售罄'。正如我们在财报中所提及的，云服务合作伙伴可租用其平台上所有在 线的H100/H200 GPU——但这并不意味着我们无法承接新订单。" 公司进一步强调："我们拥有充足的H100/H200 库存，能够及时满足每一份订单需求，不存在延迟情 况。另有传言称H20系列GPU导致H100/H200或Blackwell系列供应减少，这种说法同样完全不实—— H20 的销售对我们其他英伟达产品的供应能力没有任何影响。" 智通财经APP获悉，针对近期媒体报道，英伟达(NVDA.US)出面澄清，明确表示其H100、H200及 Blackwell系列GPU的云服务接入不存在供应受限问题。 ...

Core Viewpoint - The advanced packaging industry is expected to enter a rapid development phase by 2025, with domestic packaging manufacturers likely to benefit from key breakthroughs in high-end advanced packaging technology [1] Group 1: Industry Development - Advanced packaging is a crucial path to enhance chip performance beyond Moore's Law, with significant upgrades in packaging processes leading to various advanced packaging types such as FC, FO, WLCSP, SiP, and 2.5D/3D [1] - The global advanced packaging market is projected to grow from $37.8 billion in 2023 to $69.5 billion by 2029, driven by strong demand in high-performance computing (HPC), AI/machine learning, data centers, and high-end consumer electronics [2] Group 2: Supply Side Dynamics - The growth in advanced packaging wafer numbers is primarily driven by 2.5D/3D packaging, with a CAGR of 30.5% from 2023 to 2029, supporting sectors like AI/ML, HPC, data centers, CIS, and 3DNAND [3] - TSMC is significantly expanding its CoWoS capacity, expecting to reach 90,000 to 110,000 wafers per month by 2026 due to high demand [3] - Domestic manufacturers are gaining advanced packaging industrialization capabilities, with leading firms capturing a significant share in the mid-to-high-end advanced packaging market [3]