01 周价格表 | 多晶硅 (Per KG) | 高点 | 低点 | 均价 | 涨跌幅 | | --- | --- | --- | --- | --- | | N型复投料(RMB) | 39.000 | 36.000 | 37.500 | -1.32% | | N型致密料(RMB) | 37.000 | 35.000 | 35.000 | -2.78% | | N型颗粒硅(RMB) | 35.000 | 32.000 | 34.000 | -1.45% | | 非中国区多盟娃(USD) | 22.000 | 13.100 | 18.200 | 0.00% | | 硅片 (Per pc) | 高点 | 低点 | मुद्री | 涨跌幅 | | N型183单晶硅片-183mm/130pm (RMB) | 0.950 | 0.920 | 0.930 | -2.11% | | N型210单晶硅片-210mm/130µm (RMB) | 1.300 | 1.250 | 1.300 | 0.00% | | N型210R单晶硅片-210*182mm/130μm (RMB) | 1.100 | 1.050 | 1.080 ...

May. 21, 2025 产业洞察 根 据 TrendForce 集 邦 咨 询 最 新 统计，2025年第一季全球纯电动车 （ BEV ） 、 插 电 混 合 式 电 动 车 （PHEV）和氢燃料电池车等新能源车合计销量达402万辆，年增39%，新能源车占第一季全球汽车销 售比例为18.4%。 | Rank | BEV | Market Share | PHEV | Market Share | | --- | --- | --- | --- | --- | | 1 | 比亚迪 | 15.4% | 比亚迪 | 38.7% | | 网 | Tesla | 12.6% | 理想 | 6.7% | | 3 | 書利 | 6.9% | 吉利 | 5.9% | | 4 | 上汽通用五菱 | 6.6% | 奇瑞 | 3.6% | | 5 | Volkswagen | 4.0% | BMW | 3.5% | | 6 | 小鵬 | 3.5% | Mercedes-Benz | ﻟﻴﻨﻴ 3.4% | | 7 | BMW | 3.3% | 同界 | 3.2% | | B | 小米 | 2.8% | Volvo cars | ...

Core Insights - The panel prices for televisions and laptops remained stable in May 2025, while monitor panel prices saw a slight increase [3][4][6]. Group 1: Television Panel Market - Demand for television panels has shown signs of weakening as brand clients increase their inventory, leading to adjustments in orders and price negotiations with panel manufacturers [4][7]. - Manufacturers are implementing capacity adjustments to stabilize panel prices amid decreasing demand, with expectations of a price standoff between buyers and sellers [4][7]. - Overall, television panel prices are projected to remain flat in May 2025 [4][7]. Group 2: Monitor Panel Market - The monitor panel market is experiencing good demand driven by tariff issues, with some brand clients increasing their stock ahead of the expiration of a three-month tariff exemption [6][7]. - Prices for Open Cell panels are expected to rise by $0.2, with specific sizes like 21.5-inch and 27-inch projected to increase by $0.1, and the 23.8-inch size expected to rise by $0.2 due to strong demand [6][7]. - Despite some urgent orders, the demand remains inconsistent due to varying progress in Southeast Asia, leading to a cautious approach from manufacturers regarding price increases [7].

Core Viewpoint - The panel prices for televisions and laptops remained stable in May 2025, while monitor panel prices experienced a slight increase [1]. Group 1: Television Panels - The average price for a 65-inch television panel was $177, with a minimum of $173 and a maximum of $182 [5]. - The average price for a 55-inch television panel was $127, with a minimum of $122 and a maximum of $130 [6]. - The average price for a 43-inch television panel was $66, with a minimum of $64 and a maximum of $67 [8]. - The average price for a 32-inch television panel was $36, with a minimum of $35 and a maximum of $37 [9]. Group 2: Monitor Panels - The average price for a 27-inch IPS monitor panel was $63, reflecting an increase of $0.1 or 0.2% from the previous month, with a minimum of $57.6 and a maximum of $65.8 [11]. - The average price for a 23.8-inch IPS monitor panel was $49.9, showing an increase of $0.2 or 0.4% from the previous month, with a minimum of $47.1 and a maximum of $51.4 [12]. Group 3: Laptop Panels - The average price for a 17.3-inch TN laptop panel remained stable at $38.3, with a minimum of $37.7 and a maximum of $39.8 [14]. - The average price for a 15.6-inch Value IPS laptop panel was $40.3, unchanged from the previous month, with a minimum of $38.6 and a maximum of $41.9 [14]. - The average price for a 14.0-inch TN laptop panel remained stable at $26.9, with a minimum of $26.4 and a maximum of $28.1 [14]. - The average price for an 11.6-inch TN laptop panel remained stable at $25.1, with a minimum of $24.2 and a maximum of $26.5 [14].

May.19, 2025 产业洞察 根据TrendForce集邦咨询最新研究，2025年随着生成式AI逐步融入人们的生活应用，SK Telecom、Deutche Telekom 等全球主要电信商陆续针对一般用户推出代理式AI (Agentic AI) 服务。在电信商和CSP大厂持续建置数据中心的情况 下， 数据中心互连(Data Center Interconnect, DCI)技术日益受到关注，预估2025年产值将年增14.3%，突破400亿 美元 。 聚焦新趋势，6/10 锁定TrendForce集邦咨询2025半导体产业高层论坛，与讲者共探新机 TrendForce集邦咨询表示，DCI技术可连接两个或多个数据中心，在短、中长距离范围内进行高速数据传输，有助于 降低数据中心庞大的AI数据运算负载。现阶段主要由光通讯设备厂与美国、北欧、东南亚区域电信商合作，共同部署 DCI场景验证。其中以美国的Ciena最为积极提供DCI服务，其合作的电信商Telia、e&和Arelion皆有采用Wavelength Logic6 Extreme方案。 Nokia则拓展其DCI业务至沙特阿拉伯和越南等国家，在越南，Nok ...

6,10 ★ TSS2025 2025年，全球半导体产业在复杂国际形势、终端市场需求波动及颠覆性技术突破的三重变量中深度演 进。AI算力革命与人形机器人产业风口加速形成，晶圆代工市场呈现高端制程与成熟工艺两极化发展， 先进封装产能需求持续攀升，存储芯片周期波动仍存不确定性，第三代半导体产业化进程全面提速。 展望未来，在AI与机器人浪潮驱动下，半导体产业技术变革与产业机遇并存，但也同样面临一系列挑 战。 2025年6月10日（周二） ，TrendForce集邦咨询将在深圳举办" 2025集邦咨询半导体产业高层论坛 （TrendForce Semiconductor Seminar 2025）"。 本次会议为主要面向产业链高层的精品会议，行业精英云集，全程干货分享交流。 目前，演讲嘉宾团队已集结完毕。届时，集邦咨询多位重量级资深分析师将持续聚焦AI人工智能领域， 围绕晶圆代工、IC设计、内闪存、服务器、宽禁带半导体等产业链热门议题，全方位剖析半导体产业现 状与未来，敬请期待！ 演讲阵容 TSS2025 演讲嘉宾： 郭祚荣 集邦咨询资深研究副总经理 分享主题： AI持续升温，全球半导体市场战略布局 ✦ • ✦ 分享 ...

Group 1: SiC Substrate Market - The global N-type SiC substrate market is projected to experience a revenue decline of 9% in 2024, amounting to $1.04 billion, due to weakened demand in the automotive and industrial sectors, alongside intensified market competition and significant price drops [1] Group 2: Semiconductor Packaging and Testing Market - The combined revenue of the top ten semiconductor packaging and testing companies is expected to reach $41.56 billion in 2024, reflecting a year-on-year growth of 3% [4] - ASE Holdings and Amkor maintain their leading positions, while companies like JCET and Tianshui Huatian are experiencing double-digit growth, posing strong challenges to the existing market structure [4][5] Group 3: AI Chip Development - The demand for AI servers is accelerating the self-research of ASIC chips among major North American cloud service providers, with new versions expected to be released every 1-2 years [6] - The proportion of AI chips sourced from foreign suppliers like NVIDIA and AMD in the Chinese market is anticipated to decrease from approximately 63% in 2024 to about 42% in 2025, while local suppliers are expected to increase their share to 40% under government policy support [6]

Core Insights - The article discusses the accelerating trend of AI server demand driving major North American Cloud Service Providers (CSPs) to develop their own Application-Specific Integrated Circuits (ASICs) to reduce reliance on external suppliers like NVIDIA and AMD [1][2][3][4][5]. Group 1: North American CSP Developments - Google has launched the TPU v6 Trillium, focusing on energy efficiency and optimization for large AI models, with plans to significantly replace the TPU v5 by 2025 [2]. - AWS is collaborating with Marvell on the Trainium v2, which supports generative AI and large language model training, and is expected to see substantial growth in ASIC shipments by 2025 [2]. - Meta is developing the next-generation MTIA v2 in partnership with Broadcom, emphasizing energy efficiency and low-latency architecture for AI inference workloads [3]. - Microsoft is accelerating its ASIC development with the Maia series chips, optimizing for Azure cloud services, and is collaborating with Marvell for the Maia v2 design [3]. Group 2: Chinese AI Supply Chain Autonomy - Huawei is actively developing the Ascend chip series for domestic markets, targeting applications in LLM training and smart city infrastructure, which may challenge NVIDIA's market position in China [4]. - Cambricon's MLU AI chip series is aimed at cloud service providers for AI training and inference, with plans to advance its solutions to the cloud AI market by 2025 [4]. - Chinese CSPs like Alibaba, Baidu, and Tencent are rapidly developing their own AI ASICs, with Alibaba's T-head launching the Hanguang 800 AI inference chip and Baidu working on the Kunlun III chip [5].

Core Viewpoint - The article discusses the recent price trends and dynamics in the photovoltaic (PV) industry, highlighting a general decline in prices across various segments, including polysilicon, wafers, cells, and modules, due to supply-demand imbalances and inventory pressures [2][3][21]. Polysilicon Segment - The mainstream transaction prices for N-type polysilicon are reported at 38 RMB/KG for re-investment material, 36 RMB/KG for dense material, and 34.5 RMB/KG for granular silicon [5][6]. - The trading volume of polysilicon remains low as downstream demand is insufficient to stimulate purchasing, leading to a cautious procurement approach [6][9]. - Inventory levels have increased, surpassing 300,000 tons, prompting manufacturers to consider production cuts to alleviate price pressures [8][9]. Wafer Segment - The mainstream transaction prices for N-type wafers are 0.95 RMB/piece for M10, 1.30 RMB/piece for G12, and 1.10 RMB/piece for G12R [11]. - Wafer prices have been declining for several weeks, forcing some manufacturers to adjust their operating rates, but this has not significantly impacted the overall market [12][14]. - Inventory levels are around 20 GW, with a high proportion of 183N and 210RN wafers, indicating a shift in demand structure [13]. Cell Segment - The mainstream transaction prices for N-type cells are 0.260 RMB/W for M10, 0.280 RMB/W for G12, and 0.260 RMB/W for G12R [16]. - Manufacturers are initiating production cuts to maintain prices, but the supply-demand balance remains tight, particularly for 183N cells [16][17]. - Inventory pressure is relatively light compared to other segments, with stable turnover days [17]. Module Segment - The mainstream transaction prices for modules are 0.68 RMB/W for 182mm TOPCon and 0.84 RMB/W for 210mm HJT [18]. - Demand for high-power modules is supported by short-term factors, while low-power products face intense competition [19]. - Prices for concentrated and distributed projects have stabilized, but overall market conditions suggest limited potential for price recovery without significant upstream production cuts [20].

Industry Insights - The global OSAT market is facing dual challenges of technological upgrades and industry restructuring in 2024 [1] - The top ten OSAT companies are projected to generate a combined revenue of $41.56 billion in 2024, reflecting a year-on-year growth of 3% [2][3] Company Performance - ASE Holdings (日月光控股) remains the leader with a revenue of $18.54 billion in 2024, a slight decrease of 0.7% from 2023, holding a market share of 44.6% [3][5] - Amkor (安靠) ranks second with a revenue of $6.32 billion, down 2.8% year-on-year, primarily due to weak demand in automotive electronics [3][6] - JCET (长电科技) is third with a revenue of $5 billion, showing a significant growth of 19.3%, driven by improving demand in consumer electronics and AI PC markets [3][7] - TFME (通富微电) ranks fourth with a revenue of $3.32 billion, up 5.6%, benefiting from recovering demand in communications and consumer electronics [3][8] - PTI (力成科技) is fifth with a revenue of $2.28 billion, reflecting a modest growth of 1% due to transitional challenges in advanced packaging [3][9] - TSHT (天水华天) ranks sixth with a revenue of $2.01 billion, achieving the highest growth rate of 26% among the top ten OSAT companies, supported by advancements in packaging technology [3][10] - WiseRoad (智路封测) is seventh with a revenue of $1.56 billion, up 5%, driven by semiconductor demand recovery [3][11] - Hana Micron (韩亚微) ranks eighth with a revenue of $0.92 billion, growing 23.7% due to strong performance from memory clients [3][12] - KYEC (京元电子) is ninth with a revenue of $0.91 billion, down 14.5%, impacted by the sale of a subsidiary but benefiting from growth in AI server and HPC chip markets [3][13] - ChipMOS (南茂科技) rounds out the top ten with a revenue of $0.71 billion, up 3.1%, driven by stable demand in automotive and OLED sectors [3][14] Market Trends - The 2024 OSAT market indicates a restructuring of the value chain, with increasing demands for advanced packaging technologies driven by AI and edge computing [14] - The market is characterized by a dual-axis trend of "mature leaders' stability and the rise of regional new forces," setting the stage for future competition in advanced packaging and heterogeneous integration technologies [14]