本届会议聚焦固态数字集成电路与系统设计、模拟电路、器件研发、工艺技术等核心方 向，为期四天的议程将通过口头报告、海报展示、专题研讨及特色活动等多元形式，全面呈现 全球该领域的前沿突破与创新成果。会议以"推进集成电路技术进步、促进产学研深度融合"为 宗旨，届时将有来自世界各国和地区学术界、产业界的 500 余位杰出代表齐聚杭州，共话技术 发展趋势，探索产业应用前景。 Co-sponsored by ICSICT • Technically Co-sponsored by ICSICT 2026 IEEE 18 th International Conference on Solid-State and Integrated Circuit Technology (ICSICT) 2026年10月27日-30日 中国 · 杭州 会议简介 由 IEEE 中国联合会、IEEE 北京分会、四川省电子学会、电子科技大学及武汉理工大学 联合主办，电子科技大学长三角研究院（湖州）承办的 2026 IEEE 第十八届国际固态和集成 电路技术会议 （2026 IEEE 18th International Conference ...

Core Insights - The explosion of artificial intelligence (AI) is transforming Vietnam's semiconductor industry, shifting from processing and testing to deeper involvement in the global value chain [2] - The semiconductor industry is becoming a strategic pillar for modern economies, with reliance on chip design and production capabilities across various sectors including AI, IoT, and defense technology [2] - Vietnam aims for its digital economy to account for 20% of GDP by 2025 and 30% by 2030, with investments in science, technology, and innovation reaching at least 3% of GDP [2] Government Policies - The Vietnamese government has introduced significant policies to support the semiconductor industry, including the 57th Resolution on promoting breakthroughs in science, technology, and digital transformation [3] - The new "Technology and Innovation Law" allows for a sandbox mechanism, intellectual property protection, and the development of international standards, laying a solid legal foundation for the semiconductor sector [3] - As of November, Vietnam has over 170 semiconductor projects abroad with a total investment of nearly $11.6 billion, involving around 60 design companies and over 20 production and supply firms [3] Talent Development - Vietnam has over 1.9 million IT professionals, including 7,000 semiconductor design engineers, with a government plan to train over 50,000 semiconductor engineers by 2030 [3] - Collaboration between government, enterprises, and universities is crucial for Vietnam to become a semiconductor talent hub, with training programs designed in partnership with top Japanese universities [4] Strategic Initiatives - The Ministry of Science and Technology is developing an "AI Law" and building a national cloud computing and big data center to support AI and semiconductor infrastructure [5] - Viettel, a military telecommunications group, is constructing its first chip factory to develop 5G, IoT, and cybersecurity chips, aiming to master core technologies [5]

Core Viewpoint - The article discusses advancements in GaN (Gallium Nitride) technology, particularly focusing on the development of 300mm GaN substrates and their implications for power electronics applications, highlighting collaborations and innovations in the semiconductor industry [2][5][6]. Group 1: GaN Technology Developments - Shin-Etsu Chemical announced the achievement of over 650V breakdown voltage using a 5μm GaN HEMT structure on a 300mm QST substrate, marking it as the highest breakdown voltage globally on such substrates [2]. - The QST substrate, developed by Qromis, is specifically designed for GaN growth, and Shin-Etsu has begun large-scale production of 300mm QST substrates after initial collaborations [3][4]. - imec has initiated a 300mm GaN project, collaborating with major industry players to develop GaN epitaxy growth technology and processes for low and high voltage applications [5][6]. Group 2: Industry Collaborations and Ecosystem - imec's 300mm GaN project includes partnerships with AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco, aiming to innovate in GaN power electronics [5][7]. - The transition to 300mm wafers is expected to enhance production scale and reduce manufacturing costs, facilitating the development of advanced GaN power devices [6][7]. - Infineon has successfully developed the first 300mm power GaN wafer technology, leveraging existing silicon wafer manufacturing infrastructure to reduce costs and increase production efficiency [7][8]. Group 3: Market Implications and Future Prospects - The larger wafer size allows for the production of double the number of power integrated circuits per wafer, significantly lowering the cost per chip, which is beneficial for applications in electric vehicles, solar inverters, and AI processors [8][9]. - Infineon plans to showcase its new 300mm GaN production capabilities at the upcoming Munich Electronics Fair, indicating a strong market push for GaN technology [8]. - The article emphasizes the importance of a robust ecosystem for the successful development of advanced GaN power electronic devices, highlighting the need for close integration between design, epitaxy, process integration, and applications [7].

Core Viewpoint - Samsung Electronics is in early-stage discussions with Japanese substrate manufacturers, including its subsidiary Samsung Electro-Mechanics, to collaborate on next-generation semiconductor glass substrate technology, but formal sample evaluations are not yet complete [2][3]. Group 1: Collaboration and Development - Samsung Electronics is collaborating with three major substrate partners—Samsung Electro-Mechanics, Ibiden, and Shin-Etsu Chemical—for preliminary sample testing of glass core substrates, which is expected to enhance power efficiency and thermal resistance [2]. - The discussions regarding glass substrates have been ongoing for about one to two years, indicating Samsung's interest in adopting glass substrates to secure advanced packaging technology [2]. Group 2: Technical Challenges and Market Uncertainty - Industry experts believe that Samsung Electronics views glass substrates as a candidate for next-generation technology but has not established any concrete commercialization plans due to the lack of compliant samples from its partners [3]. - The samples provided by the substrate partners are still in very early stages and do not meet Samsung's size and characteristic requirements, leading to slow progress in commercialization discussions [3][4]. - There are significant technical challenges associated with glass substrates, such as the risk of cracks during manufacturing processes like single-crystal formation and through-silicon vias (TSVs), which raises concerns among engineers regarding the necessity of this investment [4].

Group 1 - Taiwan authorities announced a revision of the export control list for strategic high-tech goods, adding 18 new controlled items including advanced 3D printing equipment, semiconductor equipment, and quantum computers [2] - The revision requires Taiwanese manufacturers to apply for export permits for controlled items, with the Trade Bureau assessing the risk of military expansion before granting permission [2][3] - The Trade Bureau aims to align Taiwan's controlled goods list with international export control organizations, referencing agreements such as the Wassenaar Arrangement and the Nuclear Suppliers Group [3] Group 2 - The semiconductor industry is experiencing significant market fluctuations, with major chip companies facing declines in market value [4] - Huang Renxun described High Bandwidth Memory (HBM) as a technological marvel, indicating its importance in the semiconductor landscape [5] - Jim Keller expressed confidence in the RISC-V architecture, predicting its eventual success in the industry [5]

如果您希望可以时常见面，欢迎标星收藏哦~ 来 源 ： 内容 编译自 chosun ，谢谢 。 三星电子和SK海力士于16日宣布，将继续推进大规模半导体设施投资。三星电子将在其平泽园区 启动第五座工厂（P5）的建设，计划于2028年竣工，以扩大下一代存储半导体（例如高带宽内存 （HBM））的产能。预计投资额至少为60万亿韩元。SK海力士将在龙仁半导体产业集群投资至少 128万亿韩元，建设共计四座晶圆厂，同样旨在提高高附加值存储产品（例如HBM）的产能。 这些大规模投资的背后，是人工智能（AI）普及带来的内存需求激增。由于人工智能数据中心和 其他基础设施的扩张，大型科技公司持续面临内存短缺的困境，市场普遍预期三星电子和SK海力 士明年的营业利润将远超今年的两倍。科技行业预测，此次"半导体超级周期"并非每七八年一次的 周期性繁荣，而是由结构性因素引发的史无前例的繁荣。 三星+SK海力士预计明年营业利润将超过200万亿韩元 据 科 技 行 业 和 证 券 公 司 预 测 ， 三 星 电 子 今 年 的 合 并 营 业 利 润 预 计 将 比 上 年 增 长 15.14% ， 达 到 37.6809万亿韩元。SK海力士 ...

Core Insights - The 2025 "China Chip" Integrated Circuit Industry Promotion Conference was held in Hengqin, focusing on the theme "Chip Creates Everything, Intelligent Computing Without Boundaries" [1] - The conference announced the results of the annual "China Chip" product collection and inaugurated the "China Chip"-RISC-V demonstration base, aiming to enhance innovation resources in the Guangdong-Hong Kong-Macao Greater Bay Area [1][8] Industry Development - The integrated circuit industry is recognized as a strategic and foundational industry crucial for economic development and national security [8] - Guangdong is striving to establish itself as the "third pole" of the national integrated circuit industry, with the Hengqin area focusing on building a distinctive industrial chain and innovation ecosystem [8][13] - The conference highlighted the significant growth of China's integrated circuit industry, with the market size increasing from 15 billion yuan in 2005 to 646 billion yuan in 2024, and domestic products' market share rising from 0.81% to 14.5% during the same period [16] Event Highlights - The 20th anniversary of the "China Chip" product collection was celebrated, with a record 133 products awarded from 411 submissions, showcasing the continuous innovation in China's integrated circuit sector [18] - The conference featured various expert presentations on topics such as artificial intelligence and semiconductor cooperation between China and ASEAN [22] - The establishment of the "China Chip"-RISC-V demonstration base aims to promote the integration of RISC-V technology across government, industry, academia, and application sectors [20] Regional Collaboration - The Hengqin area is positioned as an international hub for the "China Chip" initiative, leveraging its geographical advantages to attract talent and foster collaboration between enterprises and educational institutions [27][28] - The region has seen significant growth in technology enterprises, with revenue increasing from 1.15 billion yuan in 2020 to 4.2 billion yuan in 2024, reflecting the effective transformation of policy benefits into industrial innovation [28]

Group 1 - The core issue highlighted is the interference of the Dutch government in the internal affairs of Nexperia, which has led to confusion and disruption within the company, particularly affecting Nexperia China [4][5] - Nexperia China asserts that it is capable of maintaining normal operations and ensuring full payment of salaries and benefits to its employees despite the challenges posed by the Dutch management and government interference [5] Group 2 - The Chinese government has emphasized its commitment to stabilizing the global semiconductor supply chain and has called for the Dutch government to take constructive actions to resolve the issues [4] - Nexperia China is actively engaging in "self-rescue" measures to maintain production and comply with government requirements for restoring exports for civilian use [4][5]

Core Insights - Samsung is expected to use Snapdragon 8 Elite Gen 5 in 75% of its Galaxy S26 models, with the Galaxy S26 Ultra exclusively featuring this Qualcomm flagship SoC in all markets [2] - Samsung's chip expenditure reached approximately $9 billion in 2023, driven by rising costs from Qualcomm's next-generation processes and self-developed CPU cores [2] - The price of Snapdragon 8 Elite Gen 5 is around $280 per unit, leading Samsung to increase the price of Galaxy S26 Ultra, as Exynos 2600 will only cover the remaining models [2] Group 1 - Samsung's continued procurement of Qualcomm chips is influenced by a contractual obligation that could incur significant penalties if terminated early [3] - The low yield of Exynos 2600 complicates Samsung's situation, making its reliance on Qualcomm a "double-edged sword" [3] - Qualcomm's aggressive business strategy has drawn criticism for being "greedy," as it charges high fees for 5G modem licenses and related patent royalties, pushing companies like Apple to develop their own chips [3] Group 2 - Apple's licensing agreement with Qualcomm for modems is set to expire in March 2027, suggesting that Samsung may have a similar long-term agreement [4] - The reality is that Samsung's self-sufficiency in chip production is not its strong suit, allowing companies like Qualcomm to expand their influence [4]

Core Insights - Intel's CEO, Lip-Bu Tan, acknowledged significant changes in the AI leadership team following the departure of Sachin Katti, who was appointed as Chief Technology and AI Officer earlier this year [2][3] - Katti is set to join OpenAI to help build computing infrastructure for its general AI goals, highlighting a shift in Intel's AI strategy [2][3] - Tan emphasized the importance of AI as a top priority for Intel, aiming to establish the company as a preferred computing platform for next-generation AI workloads [3] Leadership Changes - The announcement of Katti's departure coincided with the exit of Saurabh Kulkarni, a senior executive in the data center AI division, who has joined AMD [4][5] - Anil Nanduri has taken over Kulkarni's responsibilities in AI product management [5] - Tan has been actively restructuring Intel's organization to reduce complexity and enhance innovation, marking his second major adjustment in two months [6][8] AI Strategy and Market Position - Intel's AI strategy aims to challenge Nvidia's dominance in the AI infrastructure market, with a focus on high-performance GPUs and cost-effective systems [2][10] - Katti previously outlined a new strategy involving heterogeneous systems designed to optimize performance for different stages of AI workloads, claiming a 70% cost-performance improvement compared to existing homogeneous systems [10][11] - The company is committed to an open software approach that supports multiple infrastructure vendors without requiring developers to change their usage habits [11]