Core Insights - The rapid development of AI chips is driving the demand for high-performance computing (HPC) components such as GPUs, AI ASICs, and HBM, with advanced packaging technologies like 2.5D/3D becoming crucial in the semiconductor industry [1][3] - Intel's advanced packaging technology EMIB is being evaluated by major tech companies like Apple and Qualcomm, indicating a potential shift in the competitive landscape as these companies consider alternatives to TSMC [1][11] - The advanced packaging market is projected to grow significantly, with revenues expected to exceed $12 billion by Q2 2025 and reach approximately $45 billion by 2024, growing at a compound annual growth rate (CAGR) of 9.4% to around $80 billion by 2030 [3] Advanced Packaging Landscape - TSMC, Intel, and Samsung have established a competitive "three-horse race" in the advanced packaging sector, each playing different roles in the supply chain [3][20] - TSMC's CoWoS technology has become the de facto standard for high-bandwidth packaging, but it faces capacity constraints primarily due to Nvidia's significant demand [7][8] - Intel's EMIB technology offers flexibility and cost advantages, making it suitable for custom ASICs and AI inference chips, positioning it as a viable alternative to TSMC's offerings [11][15] Market Dynamics - The demand for advanced packaging is driven by the strong growth in AI and HPC sectors, with TSMC planning to expand its CoWoS capacity by over 20% by the end of 2026 [8][24] - Samsung's advanced packaging technologies, I-Cube and X-Cube, are designed to leverage its HBM supply chain, aiming to enhance its influence in the AI chip market [20][23] - The competition in AI chip manufacturing is no longer limited to packaging technologies but encompasses computational architecture, supply chain security, capital expenditure, and ecosystem integration [24]

Core Viewpoint - Intel's EMIB advanced packaging technology is gaining attention from Apple and Qualcomm, being considered a viable alternative to TSMC's products [1] Group 1: Company Interest - Apple has recently posted job openings for DRAM packaging engineers, specifically seeking experience in advanced packaging technologies such as CoWoS, EMIB, SoIC, and PoP [1] - Qualcomm is also looking for a product management director for its data center business, with a requirement for familiarity with Intel's EMIB technology [1] Group 2: Technology and Market Position - Intel's CEO and executives have emphasized that their Foveros and EMIB technologies have attracted interest from multiple customers and are capable of large-scale production [1]

Core Viewpoint - Intel is lagging in chip business but has competitive options in advanced packaging technology, which is becoming essential in the supply chain as demand for powerful computing solutions grows rapidly [2][7]. Group 1: Advanced Packaging Technology - Advanced packaging solutions have become indispensable in the supply chain, with companies like AMD and NVIDIA integrating multiple chips into single packages to enhance chip density and platform performance [2]. - Intel's EMIB (Embedded Multi-Die Interconnect Bridge) technology connects multiple chipsets within a single package without the need for large intermediary layers, making it a viable alternative to TSMC's CoWoS [4]. - Intel also offers Foveros Direct 3D packaging technology, which utilizes TSV (Through-Silicon Via) for stacking on substrates, recognized as one of the industry's most esteemed solutions [4]. Group 2: Market Demand and Competition - Companies like Qualcomm and Apple are actively seeking talent skilled in Intel's EMIB technology, indicating a strong demand for advanced packaging expertise in the industry [2]. - Intel's advanced packaging solutions are seen as a strategic move for companies like Apple, Qualcomm, and Broadcom, especially as TSMC faces capacity bottlenecks due to high order volumes from competitors like NVIDIA and AMD [7]. - NVIDIA's CEO has praised Intel's Foveros technology, suggesting a promising market outlook for Intel's advanced packaging solutions, despite recruitment listings not guaranteeing adoption [9].

Core Viewpoint - The semiconductor industry chain is experiencing significant activity in the capital market, with multiple companies in various segments, including chip design, wafer processing, and packaging and testing, moving towards IPOs. Jiangsu Xinde Semiconductor Technology Co., Ltd. has submitted its prospectus to the Hong Kong Stock Exchange, indicating its intent to go public [1]. Company Overview - Jiangsu Xinde Semiconductor, established in September 2020 and headquartered in Nanjing, specializes in semiconductor packaging and testing [2][3]. - The company is controlled by a group of major shareholders, holding a combined voting power of 24.95% prior to the IPO [3]. - The management team includes experienced professionals with over 20 years in the semiconductor industry [3]. Financial Performance - Xinde Semiconductor has reported losses totaling 1.315 billion RMB over the past three and a half years, with significant cash flow pressures [8]. - Revenue figures for the years 2022 to 2025 show a growth trend, with revenues of 269 million RMB in 2022, 509 million RMB in 2023, and projected 827 million RMB in 2024 [9][10]. - The company has faced negative gross margins, with gross profit margins of -79.8% in 2022 and improving to -16.3% in the first half of 2025 [9]. Product and Service Offering - Xinde Semiconductor provides a diverse range of packaging technologies, including 2.5D/3D integration, flip chip, and wire bonding, catering to various semiconductor product needs [4][5]. - The product mix includes QFN, BGA, LGA, WLP, and 2.5D/3D products, with QFN and BGA contributing significantly to revenue [11]. Market Position - The company holds a market share of 0.6% in the Chinese semiconductor packaging and testing market, ranking seventh among general-purpose OSAT companies [16][29]. - The global semiconductor packaging and testing market is projected to reach 649.4 billion RMB in 2024, with the Chinese market expected to be 248.1 billion RMB [21][27]. Industry Trends - The semiconductor packaging and testing industry is driven by the demand for high integration and low-power chips, particularly in communications, consumer electronics, and AI sectors [27]. - Advanced packaging technologies are becoming crucial for enhancing chip performance and efficiency, with the market for advanced packaging expected to grow significantly [27][28].

Core Viewpoint - Jiangsu Xinde Semiconductor Technology Co., Ltd. has submitted its IPO application to the Hong Kong Stock Exchange, aiming to raise funds for expanding production capacity and enhancing advanced packaging technology research [1][2]. Company Overview - Xinde Semiconductor specializes in semiconductor packaging technology solutions, offering customized packaging products and testing services, with a product portfolio that includes QFN, BGA, LGA, WLP, and 2.5D/3D products [2]. - The company has completed over 2 billion RMB in financing over the past five years, attracting notable investors such as Xiaomi and OPPO [2]. Financial Performance - The company has reported negative gross and net profit margins for the past three years, with a debt-to-asset ratio exceeding 100% [2][7]. - In terms of operating performance, Xinde Semiconductor has experienced continuous losses from 2022 to 2025, with net losses of approximately 3.60 billion RMB, 3.59 billion RMB, 3.77 billion RMB, and 2.19 billion RMB respectively [4]. - The gross margins for the years 2022 to 2025 are reported as -79.82%, -38.43%, -20.13%, and -16.3% [5][6]. Market Potential - The semiconductor market is projected to grow significantly, with global and Chinese market sizes expected to reach 43,710 billion RMB and 16,022 billion RMB in 2024, respectively, and further increase to 65,480 billion RMB and 28,133 billion RMB by 2029 [3]. Use of IPO Proceeds - The funds raised from the IPO will primarily be used for building a production base, establishing new production lines, procuring production-related equipment, enhancing advanced packaging technology research, and improving the company's commercialization capabilities [1][2]. Challenges and Risks - The company faces challenges related to high production costs, including depreciation of production equipment and financing expenses, which contribute to its ongoing losses [4][5]. - The high asset-to-debt ratio reflects the capital-intensive nature of the advanced packaging sector, necessitating continuous investment in production capacity and technology upgrades [7]. Future Outlook - Xinde Semiconductor plans to attract a broader range of industry clients by continuously launching advanced packaging solutions and deepening cooperation with existing clients [9].

Investment Rating - The report maintains a "Buy" rating for the company [1] Core Insights - The company has shown steady growth in performance, with a significant increase in revenue from mid-to-high-end products. In the first three quarters of 2025, the company achieved revenue of 20.116 billion yuan, a year-on-year increase of 17.77%. The net profit attributable to the parent company reached 860 million yuan, up 55.74% year-on-year, driven by revenue growth and improved management and cost control [4][8] - The company is actively expanding its production capacity and customer base, particularly focusing on AI, high-performance computing products, and automotive smart driving chips. The overall packaging and testing market is expected to improve due to a new technological upcycle and a gradual recovery in application markets [4] - The company plans to invest a total of 6 billion yuan in facilities, production equipment, IT, and R&D from 2025, with specific allocations for new factory construction and upgrades to meet the growing demand for large-size multi-chip servers and AI PCs [5][10] Financial Performance and Forecast - The company is projected to achieve revenues of 27.342 billion yuan, 31.563 billion yuan, and 36.459 billion yuan for the years 2025, 2026, and 2027, respectively. The net profit is expected to be 1.347 billion yuan, 1.650 billion yuan, and 2.067 billion yuan for the same years [8][10] - The report indicates a significant growth rate in net profit, with expected increases of 299.9% in 2025, 98.9% in 2026, and 25.3% in 2027 [10][11] - The company's earnings per share (EPS) is forecasted to rise from 0.45 yuan in 2024 to 1.36 yuan in 2027, reflecting strong profitability growth [10][11]

Investment Rating - The investment rating for the company is "Accumulate" (maintained) [1] Core Views - The company's performance reversal is basically confirmed, with over 100 million yuan in orders for glass substrates [1] - The company has seen significant improvements in the shipment of nano-microcrystalline glass, driven by the demand for advanced packaging technology [8] - The market for glass substrates is expected to reach a scale of 460 million USD by 2030, with optimistic forecasts suggesting widespread adoption starting in 2027-2028 [8] - The company has received multiple customized orders in the high-end glass sector, providing stable support for overall operations [8] - Due to recent developments in the semiconductor sector and fluctuations in expenses, revenue forecasts for 2025-2027 have been slightly adjusted downwards [8] Financial Summary - For 2023, total revenue is projected at 808.34 million yuan, with a year-on-year growth of 88.26% [1] - The net profit attributable to shareholders is expected to be 104.21 million yuan, reflecting a year-on-year increase of 127.37% [1] - The earnings per share (EPS) for 2025 is estimated at 0.37 yuan, with a price-to-earnings (P/E) ratio of 108.12 [1] - The company anticipates total revenue of 606.38 million yuan in 2025, with a net profit of 54.07 million yuan [1] - The company's total assets are projected to reach 1,393 million yuan in 2024, with a debt-to-asset ratio of 37.89% [6][9]

Core Insights - Longji Technology (600584.SH) reported a record high in both revenue and net profit for Q3 2025, with revenue reaching 10.06 billion yuan, a quarter-on-quarter increase of 8.6%, and net profit attributable to shareholders at 480 million yuan, a significant increase of 80.6% [1] Financial Performance - For the first three quarters of 2025, the company achieved a total revenue of 28.67 billion yuan, representing a year-on-year growth of 14.8%, also a historical high for the period [1] - The net profit attributable to shareholders for the same period was 950 million yuan, showing a year-on-year decline of 11.4% [1] Business Segments - Several business segments experienced substantial year-on-year revenue growth, including: - Computing electronics: up 69.5% - Industrial and medical electronics: up 40.7% - Automotive electronics: up 31.3% [1] Cost and Investment Factors - The decline in net profit is attributed to new factories being in the product introduction and capacity ramp-up phases, which have not yet generated large-scale production revenue [1] - The company has increased its investment, with the expense ratio for Q1-Q3 2025 at 10%, an increase of 1.7% year-on-year, impacting short-term profit performance [1] - Fluctuations in international commodity prices have also put pressure on raw material costs, affecting gross margins [1] R&D and Innovation - Longji Technology is actively pursuing advancements in packaging technology, with R&D expenses increasing by 24.7% year-on-year to 1.54 billion yuan for the first three quarters of 2025 [1] - The company has made breakthroughs in key technology areas such as Co-Packaged Optics (CPO), glass substrates, large-size FCBGA packaging, and high-density System-in-Package (SiP) [1]

Investment Rating - The report assigns a "Buy" rating for the company [5] Core Views - The company achieved a revenue of 28.669 billion yuan in the first three quarters of 2025, representing a year-on-year increase of 14.78%. However, the net profit attributable to shareholders decreased by 11.39% to 0.954 billion yuan, and the net profit after deducting non-recurring items fell by 23.25% to 0.784 billion yuan [1][2] - The company's revenue in Q3 2025 was 10.064 billion yuan, up 6.03% year-on-year, with a net profit of 0.483 billion yuan, an increase of 5.66% year-on-year. The growth in revenue was driven by significant increases in the computing, industrial and medical electronics, and automotive electronics segments, which saw year-on-year growth of 69.5%, 40.7%, and 31.3%, respectively [2] - The company has a long-standing presence in the storage business, with its subsidiary benefiting from the global storage cycle. The subsidiary specializes in advanced flash memory packaging and testing, ensuring stable production and performance [3] - The company is investing heavily in advanced packaging technology, with R&D expenses increasing by 24.7% to 1.54 billion yuan in the first three quarters of 2025. It has made significant progress in key technology areas such as optical-electrical integration and high-density system-level packaging [3] Financial Summary - The company forecasts revenues of 38.986 billion yuan, 43.864 billion yuan, and 50.121 billion yuan for 2025, 2026, and 2027, respectively. The net profit attributable to shareholders is expected to be 1.429 billion yuan, 1.977 billion yuan, and 2.766 billion yuan for the same years, with corresponding P/E ratios of 49.86x, 36.05x, and 25.77x [4][5] - The financial summary indicates a projected revenue growth rate of 21.2% for 2024, followed by 8.4%, 12.5%, and 14.3% for the subsequent years. The net profit growth rate is expected to be 9.4% in 2024, with a decline of 11.2% in 2025, and then a recovery with growth rates of 38.3% and 39.9% in 2026 and 2027, respectively [4][11]

Core Viewpoint - The article discusses the upcoming 2025 Heterogeneous Integration Annual Conference organized by TrendBank and the Yongjiang Laboratory, focusing on advanced packaging technologies in the semiconductor industry, particularly heterogeneous integration and multi-material integration [14][18]. Conference Overview - The conference will take place from November 17-19, 2025, at the Nanyuan Wanghai Hotel in Zhenhai District, Ningbo, with an expected attendance of 300-500 participants [18]. - The event aims to gather industry and academic experts to discuss cutting-edge technologies in heterogeneous integration and advanced packaging [16]. Key Topics and Presentations - COMSOL's China Technical Manager, Zhong Zhenhong, will present on "The Application of COMSOL Multiphysics® in Advanced Packaging of Semiconductors" [2]. - The conference will cover various topics including 2.5D/3D heterogeneous integration, optical-electrical co-packaging, and wafer-level bonding technologies [16][14]. Industry Context - Heterogeneous integration is becoming a crucial direction in the semiconductor field, especially as traditional Moore's Law approaches physical limits [14]. - The conference aims to address the challenges and opportunities presented by new semiconductor technologies driven by applications in artificial intelligence, smart driving, and high-performance computing [14]. Supporting Organizations - The conference is supported by the Ningbo Electronic Industry Association and other local organizations, highlighting the collaborative effort to enhance the semiconductor industry in the Ningbo and Yangtze River Delta regions [14][18]. Registration and Fees - Registration fees are set at RMB 2500 per person, with early bird discounts available [19].