Core Viewpoint - Samsung Electronics' Device Solutions (DS) department has set the maximum performance bonus for the first half of the year at 25% of the base salary due to underperformance in the high bandwidth memory (HBM) market and deteriorating conditions in the NAND flash market [1][2]. Summary by Sections Performance Bonuses - The Target Achievement Incentive (TAI) for Samsung Electronics is paid biannually, with a maximum of 100% of the monthly base salary, depending on departmental performance [1]. - The DS department will receive a TAI of 0-25%, with the memory division receiving 25%, system LSI 12.5%, semiconductor research center 12.5%, and foundry 0% [1]. - Executives in the DS department have decided to return their TAI to demonstrate a commitment to improving management performance [1]. Historical Performance - From 2015 to the first half of 2022, the DS department consistently received the maximum TAI of 100% but saw a decline starting in the second half of 2022 due to slowing performance [2]. - In the second half of 2023, the TAI reached a historical low, with memory at 12.5% and foundry and system LSI at 0%, but it gradually improved to 37.5-75% in the first half of 2023 [2]. - The second half of 2023 saw performance bonuses reach 200%, exceeding the maximum standard, with system LSI and foundry departments receiving 25% [2]. Other Departments - Samsung Electro-Mechanics will pay 100% bonuses to the components division and 75% to the packaging solutions division, reflecting strong sales in multilayer ceramic capacitors (MLCC) [3]. - Samsung Display will pay 100% bonuses to the small and medium-sized business units responsible for IT panels and 75% to the large business units producing TV panels [3]. - Samsung SDI's electronic materials division will receive a 25% bonus, while medium and small divisions will receive 0% [3].

如果您希望可以时常见面，欢迎标星收藏哦~ 推荐阅读 来 源： 内容来自 technews 。 近年来，超微半导体（AMD） 是当前能在市场中与英特尔（Intel） 和英伟达（NVIDIA） 竞争 的重要半导体公司。尤其，AMD 在资料中心处理器（CPU）市场上的占比已逐渐抢走了原属于英 特 尔 的 市 场 占 有 率 。 近 期 ， 市 场 分 析 师 开 始 有 一 种 看 法 指 出 ， 未 来 AMD 的 GPU 在 人 工 智 能 （AI）运算方面有望赶上英伟达。 根据wccftech 的报导，除了英伟达之外，AMD 是世界上唯一一家同时向消费者销售游戏产品， 并向人工智能企业销售企业级运算GPU 厂商。因此，该公司能够从英伟达无法满足的客户，或者 是无法提供的需求情况中获利。受到市场分析师对其GPU 和AI 市场的乐观情绪影响，AMD 股价 在6 月份强劲升值，达到28% 的涨幅。 鉴于公司亮眼的股价表现，AMD 在最近送交给美国证券交易委员会（SEC） 的文件中也透漏了包 括执行长及其他高阶主管的薪酬方案。这份名单包括AMD 执行长苏姿丰、财务长Jean Hu 和技术 长Mark Papermas ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来 源： 内容来自半导体芯闻综合 。 美国取消了对中国芯片设计软件开发商和乙烷生产商的出口限制，这进一步表明中美贸易紧张局势 正在缓和，包括北京在稀土问题上做出让步。 "随着美国和中国继续遵守这项框架协议，我们将看到很多限制措施取消。回到二月/三月的现 状，"这位未获授权对媒体发言并拒绝透露姓名的消息人士表示。 西门子在一份声明中表示，在最近收到美国商务部关于不再对中国客户实施出口管制限制的通知 后，该公司已恢复对中国客户的销售和支持。 新思科技表示，公司于 7 月 2 日收到美国商务部工业与安全局来函，通知基于 2025 年 5 月 29 日收到的限制令所实施的对华出口管制措施现予以撤销，即时生效。公司正恢复近期受限产品在中 国市场的供应和全面客户支持。 Cadence也表示，美国已取消对中国芯片设计软件的出口限制，并正在恢复受影响客户对软件和技 术的访问。 据路透社看到的公司致员工的一封信显示，新思科技预计将在三个工作日内完成系统更新，以恢复 中国客户的访问和支持。 包括新思科技、Cadence设计系统公司和西门子在内的全球三大电子设计自动化 (EDA) 软件开发 ...

Core Viewpoint - The article discusses the unconditional approval of the acquisition of Konka Group by China Resources Limited, highlighting the strategic move to optimize resource allocation among state-owned enterprises [1][3]. Summary by Sections Acquisition Details - On June 30, 2023, Konka Group disclosed that its controlling shareholder, Overseas Chinese Town Group, planned to transfer all shares of Konka Group to China Resources Limited's wholly-owned subsidiary, Panshi Runchuang (Shenzhen) Information Management Co., Ltd. [3][5]. - The transfer involves 524 million A-shares and 275,500 A-shares from Overseas Chinese Town Group and its affiliates, respectively, to Panshi Runchuang [3][6]. Regulatory Approval - The State Administration for Market Regulation announced the approval of the acquisition case on June 23-29, 2025, confirming the transaction's compliance with regulatory standards [1][4]. Shareholding Structure Post-Transfer - After the completion of the share transfer, Panshi Runchuang will hold 524.022 million A-shares, accounting for 21.76% of the total share capital, while Hehui Co., Ltd. will hold 198.361 million B-shares, representing 8.24% of the total share capital [6].

Group 1 - The company provides professional measurement insights aimed at enhancing performance and transforming various possibilities into reality [3] - Tektronix designs and manufactures solutions that assist in testing and measurement, helping to overcome complexities and accelerate global innovation [3] - The company emphasizes collaboration with engineers to facilitate the creation and realization of technological advancements more conveniently, quickly, and accurately [3] Group 2 - Contact information for further product and application details is provided, including email, website, and phone number [2] - The company encourages users to engage with their services through a dedicated assistant for personalized support [4]

Core Viewpoint - The semiconductor industry faces critical challenges in data transmission speed and security, driven by the explosive growth of AI, connected vehicles, 5G, and IoT, leading to increased demand for high-performance computing and low-power chips [1] Group 1: Industry Challenges and Innovations - The bottlenecks in memory bandwidth and data processing security are becoming increasingly prominent [1] - Interface IP and security IP technologies are identified as core drivers for breakthroughs in the industry, directly impacting chip performance, compatibility, and attack resistance [1] Group 2: Company Overview - Rambus, established in 1990, is a pioneer in the field of high-speed interface technology, redefining data transmission standards between memory and systems [1] - Rambus offers a robust product portfolio, including DDR memory interfaces, HBM3/4, and PCIe 5/6 solutions, significantly enhancing performance in data centers and edge computing [1] - The company also provides various security IP solutions, such as root of trust technology, security protocol engines, inline cryptographic engines, and post-quantum cryptography accelerators [1] Group 3: Upcoming Event - Rambus is hosting a technology seminar on July 9, 2025, in Beijing, focusing on AI and automotive sectors, featuring industry partners and technical experts [2][3] - The morning session will cover the latest interface and security IP solutions for AI and advanced applications, including quantum-safe encryption and various memory technologies [6] - The afternoon session will delve into automotive security solutions, addressing trends and challenges faced by hardware and software designers in smart connected vehicles [7]

Core Viewpoint - TSMC's employee bonuses and dividends for 2024 have reached a record high, reflecting strong revenue and profit growth from the previous year, with an average payout of over NT$200 million per employee [1][2]. Group 1: Employee Compensation - TSMC will distribute a total of NT$140.59 billion in employee performance bonuses and dividends for 2024, marking a year-on-year increase of over 40% [1][2]. - The average annual bonus per employee is NT$200.84 million, which represents a year-on-year increase of NT$51.32 million, or approximately 34.32% [2]. - Employees with six years of service can expect bonuses as high as NT$1.8 million, while those with five years and top performance ratings can receive around NT$1.16 million [1]. Group 2: Financial Performance - TSMC's total revenue for 2024 is projected to reach NT$2.8943 trillion, with a net profit of NT$1.1732 trillion, both figures representing new highs [1]. - The earnings per share (EPS) is expected to be NT$45.25, showcasing TSMC's strong competitive position in the semiconductor industry [1]. Group 3: Industry Context - The global semiconductor industry is facing challenges, with competitors like Samsung and Intel experiencing delays and operational difficulties in their advanced process technologies [4][5]. - TSMC maintains its leadership in advanced process technology, with plans to mass-produce 2nm processes in the second half of this year and A16 processes by the second half of 2026 [5]. - The demand for high-end processes is expected to rise due to the growing need for AI servers, further solidifying TSMC's position as a leading foundry [5].

Core Viewpoint - The article highlights the optimistic outlook for the artificial intelligence (AI) chip sector, prompting major South Korean semiconductor companies to increase their facility investments to capture future market share [1]. Group 1: Samsung's Developments - Samsung is preparing to restart the construction of its P4 chip manufacturing line in Pyeongtaek, which was halted last year. The P4 factory will have a total monthly capacity of 200,000 wafers, with the fourth phase expected to contribute 40% of this capacity, equating to 80,000 wafers per month [2][3]. - The P4 factory's production lines, initially intended for foundry services, are now expected to be converted to DRAM production lines using 10nm technology for the sixth generation 1c DRAM. Samsung has confirmed the successful development of this advanced technology for the next generation high bandwidth memory (HBM4) chips [2]. - There are reports that Samsung is also considering restarting the construction of its fifth manufacturing plant (P5) in Pyeongtaek, which was paused earlier. The P5 plant is projected to require an investment of over 30 trillion KRW (approximately 22 billion USD) and will produce DRAM, NAND flash, and foundry products [3]. Group 2: SK Hynix's Expansion - SK Hynix is also planning to expand its production capacity in the coming years. The company is set to complete the construction of its new M15X factory in Cheongju, South Korea, later this year, which will produce fifth-generation 10nm DRAM chips for the next generation HBM4 products. This factory is expected to have a monthly capacity of around 90,000 wafers [4]. - Additionally, SK Hynix is investing in a new backend production facility named "P&T 7" in Cheongju to enhance its packaging capabilities and improve the performance and power efficiency of its advanced chips [4]. Group 3: Market Outlook - Strong demand for DRAM is anticipated in the second half of the year, particularly for HBM chips that support AI processors. According to the Korea Export-Import Bank, the global AI semiconductor market is expected to grow from 41.1 billion USD in 2022 to 133 billion USD by 2028 [5].

Core Viewpoint - Samsung Electronics is set to supply 12-layer HBM3E to Broadcom, with plans for mass production starting as early as the second half of this year to next year, aiming to mitigate the impact of NVIDIA's HBM supply delays [1][3]. Group 1: Supply Agreements - Samsung has completed quality testing for HBM3E 12-layer with Broadcom and is negotiating supply volumes estimated between 12 billion to 14 billion Gb, with mass production expected soon [1]. - Samsung is also in active discussions to supply HBM3E 12-layer memory to Amazon Web Services (AWS), which plans to produce the next generation AI semiconductor "Trainium 3" using this memory [2]. Group 2: Market Dynamics - The surge in development of proprietary ASICs by major tech companies presents an opportunity for Samsung to offset the downturn in its HBM business [3]. - Samsung's initial plan to supply NVIDIA with HBM3E 12-layer was delayed due to performance issues, and the company is now adjusting its production rates for HBM3E lines [3]. Group 3: Production Goals - Samsung aims to double its total HBM supply to between 8 billion to 9 billion GB this year, compared to last year [1]. - The successful supply to NVIDIA and acquisition of more ASIC clients in the second half of this year is crucial for stabilizing Samsung's HBM business [3].

Core Viewpoint - The seventh Yangtze River Delta Integrated Circuit Skills Competition has been officially launched, focusing on talent cultivation and industry advancement in the integrated circuit sector, with the theme "Chip Wisdom, New Future" [1][12]. Group 1: Event Overview - The competition is co-hosted by various local government bodies and organizations, aiming to establish a benchmark project for labor and skills competitions in the Pudong New Area [1][6]. - This year marks the third time the event is held at the Shanghai Integrated Circuit Design Industrial Park, which has developed into a core area for the integrated circuit industry in China since its establishment in 2018 [4]. Group 2: Competition Structure - The competition features two main tracks: "Design Competition for Security Encryption Chips Based on National Secret Standards" and "Integrated Circuit CAD Programming Competition Based on AI Tools," focusing on cutting-edge fields of security encryption and artificial intelligence [8]. - The competition aims to address critical technology challenges and enhance the efficiency and precision of integrated circuit design through digital and automated processes [8]. Group 3: Talent Development and Industry Collaboration - The event will include a series of preliminary rounds, interviews, and final competitions, along with training sessions and talent matchmaking events to foster high-level talent in the Pudong New Area [11]. - Participants will have opportunities to deepen their understanding of professional knowledge and improve their problem-solving skills through practical experience [11]. Group 4: Awards and Incentives - Awards will be given to individuals and teams, including certificates and monetary prizes, with additional incentives such as guaranteed rental housing and office space for winners [11].