Group 1: Core Insights - The power SiC market is primarily driven by automotive applications, especially in battery electric vehicle (BEV) inverters, with a projected market size of $10 billion within the next five years [3][4] - The emergence of 800V fast charging technology is a significant trend driving the growth of the SiC market, despite a slowdown in the electric vehicle market expected in 2024-2025 [3][4] - Recent bankruptcies of major players like Wolfspeed and JS Foundry have significantly impacted the market landscape, with Wolfspeed completing its bankruptcy restructuring by September 2025 [3][4] Group 2: Transition to 200mm Wafers - The global SiC industry is transitioning from 150mm (6-inch) wafers to 200mm (8-inch) wafers, with companies like Wolfspeed and Infineon making significant advancements in this area [5][6] - Bosch and Mitsubishi Electric are also progressing in the 200mm SiC wafer production, with Mitsubishi's factory completion announced in October 2025 [5][6] Group 3: New Entrants in SiC Market - Countries like India and Singapore are actively entering the SiC market, with Indian companies forming partnerships and launching manufacturing facilities [7][8] - Notable developments include the establishment of a high-voltage SiC wafer supply partnership between LTSCT and HYS, and the construction of India's first end-to-end SiC manufacturing plant by SiCSem [7][8] Group 4: GaN Market Dynamics - The GaN power application market is primarily driven by consumer applications such as mobile chargers, with a projected market size exceeding $2.5 billion by 2030 [10][11] - Innoscience is expected to lead the global GaN power device market with a 29.9% share, followed by other key players [10][11] Group 5: GaN Technology and Trends - The GaN industry is shifting towards an IDM business model, contrasting with the previous dominance of fabless semiconductor companies [12][13] - Significant collaborations and agreements, such as GlobalFoundries' licensing agreement with TSMC for GaN technology, are shaping the market [14][19] Group 6: New Developments in GaN - The GaN market is also seeing advancements in wafer sizes, with 300mm (12-inch) wafers being developed, as demonstrated by Infineon's progress [15][16] - The emergence of vertical GaN architecture is a notable trend, offering advantages over traditional planar structures, with companies like Onsemi leading this innovation [24][27]

Core Viewpoint - The article discusses the declining reputation of LiDAR sensors in the automotive industry and explores the potential for Western LiDAR companies, particularly Voyant Photonics, to innovate with new technologies like FMCW LiDAR based on silicon photonics [1][4]. Group 1: Industry Trends - The investment boom in the LiDAR sector was driven by the autonomous vehicle craze, leading to the rise of SPACs [2]. - Chinese LiDAR suppliers, such as Hesai and RoboSense, have gained significant momentum, capturing 93% of the passenger vehicle market and 89% of the overall LiDAR market [4]. - The attempts of Western companies to penetrate the Chinese market have largely failed, as the market is considered inaccessible [4]. Group 2: Technological Innovations - FMCW LiDAR is viewed as superior to traditional ToF LiDAR due to its ability to directly measure speed, better sunlight interference resistance, and higher distance resolution [10]. - Voyant Photonics aims to leverage silicon photonics technology to create compact and affordable LiDAR sensors for various applications beyond automotive [7][10]. - The company has developed six generations of silicon photonic technology and plans to release its Carbon series FMCW LiDAR products in 2025, which will feature advanced capabilities [12]. Group 3: Competitive Landscape - There are 15 to 20 companies developing silicon photonic FMCW LiDAR, with American firms being particularly active [14]. - SiLC Technologies stands out among competitors for its maturity in FMCW development, while Voyant focuses on integrated beam control to eliminate complex mechanical components [15]. - The potential for Voyant to enter the automotive market remains uncertain, with suggestions that it could sell packaged photonic chips to existing LiDAR manufacturers [16].

公众号记得加星标⭐️，第一时间看推送不会错过。 成立于1923年的日东纺（Nittobo）最早可以追溯到1898成立的纺织公司。 作为日本历史最悠久的丝绸纺织公司之一，他们利用明治政府推动的朝香灌溉渠的剩余电力，他们开 始经营发电业务和纺织业务。直到1963年，他们都是生产的与纺织相关的产品，但进入1969年，为 了满足计算机和集成电路（IC）技术进步带来的日益增长的需求，我们开始生产印刷电路板用的玻璃 布。 1984年，该公司推出了具有高强度和低热膨胀系数特点的T-Glass。据介绍，该材料最初用于复合材 料，但后来，这个产品被逐渐现在用于高速处理和高可靠性服务器及智能手机的半导体封装基板。 历经后来四十年的发展，这家公司已经当前热门的AI核心材料供应商。 T-Gl a ss是什么？ 要了解T-Glass在芯片中的作用，就首先要清楚什么是玻纤布。 据介绍，玻纤布是一种由玻璃纤维纱编织而成的制品，具备绝缘性、耐热性、高强度等特性。由于制 造铜箔基板（CCL）时，主要是用铜箔和非导电复合材料（如玻纤布、环氧树脂）热压而成，因此玻 纤布可说是铜箔基板的关键原料。 铜箔基板又是PCB的核心基材，负责建构 PCB的骨 ...

Core Viewpoint - USB Power Delivery (USB PD) is an advanced fast charging standard that supports various power transmissions through USB connections, evolving from the original USB standard introduced in the late 1990s [1] USB PD Specifications - The latest version of USB PD is 3.2, which includes new branding and terminology, allowing devices to report their power capabilities [3] - USB PD 3.1, released in 2021, introduced Extended Power Range (EPR) and can deliver up to 240W of power, accommodating high-performance devices [12][13] USB PD Versions Overview - **USB PD 1.0**: Launched in 2012, it had five power modes with a maximum of 20V and was primarily used for basic charging needs [7] - **USB PD 2.0**: Introduced USB-C and expanded power options, allowing for up to 100W of power delivery, significantly impacting the market by reducing the need for proprietary chargers [9] - **USB PD 3.0**: Added Programmable Power Supply (PPS) for more efficient charging, maintaining a 100W limit while improving charging speed and reducing heat [11] - **USB PD 3.1**: Enhanced capabilities with EPR, allowing for higher voltage options (28V, 36V, 48V) and a maximum output of 240W, suitable for high-performance laptops and devices [13] Key Features - Smart power negotiation allows devices and chargers to communicate and determine appropriate power needs without user intervention [3] - AVS (Adjustable Voltage Supply) and EPR work together in USB PD 3.1 to provide higher voltage and power, achieving up to 240W when using compatible cables [5][13] - The introduction of GaN (Gallium Nitride) semiconductors in USB PD 3.1 devices enhances efficiency and reduces size compared to traditional silicon semiconductors [13]

Core Viewpoint - TSMC is considering changing the production technology for its Kumamoto second factory from the originally planned 6nm to a more advanced 4nm process due to declining demand in the automotive semiconductor market and increasing demand for AI-related products [1][2][4] Group 1: Construction Status - Reports indicate that the construction of the Kumamoto second factory has effectively stopped, with heavy machinery cleared from the site by early December [3] - TSMC's president of the Kumamoto factory, Yuichi Horita, stated that construction is still ongoing and that discussions with partners regarding the details and progress of the construction are continuing [1][3] Group 2: Production Plans - The first Kumamoto factory is set to begin mass production in December 2024, with a production cycle time comparable to TSMC's facilities in Taiwan, and is expected to employ 2,400 people, increasing to over 3,400 after the second factory starts production [1] - The second factory, initially planned to produce 6nm and 7nm chips, may now focus on 4nm technology, which is more suitable for AI semiconductors, reflecting a shift in market demand [2][4] Group 3: Market Dynamics - The demand for 6nm and 7nm chips has decreased, impacting TSMC's production capacity utilization rates at its main facility in Taiwan [3] - TSMC is also considering introducing advanced chip packaging technology in Japan, which is crucial for manufacturing AI chips, and there are discussions about potentially skipping 4nm technology altogether in favor of 2nm due to anticipated market shifts [4]

Core Viewpoint - The rapid development of artificial intelligence is set to fundamentally change the chip manufacturing landscape, with a shift towards open-source technologies like RISC-V, which is expected to experience explosive growth in the coming year [1]. Group 1: Current Landscape of Chip Architecture - The semiconductor industry has long been dominated by two major instruction set architectures: Intel's x86 and Arm's architecture, which dictate how processors execute software commands [1]. - Arm's revenue is projected to reach $7 billion by March 2028, up from $4 billion in 2025, driven by strong demand for its licensing and royalty fees [1]. - The reliance on Arm has raised concerns among tech giants, as Arm plans to enter the chip manufacturing space, potentially competing with its own customers like Nvidia and Qualcomm [2]. Group 2: Emergence of RISC-V - RISC-V, currently a niche product, is gaining traction as companies seek alternatives to proprietary architectures, particularly in China, where there is a push to reduce dependence on Western technologies [2]. - RISC-V's "geopolitical neutrality" is highlighted as a significant advantage, allowing for broader access and collaboration without the restrictions faced by proprietary technologies [2]. - As of 2024, RISC-V's market penetration is expected to be only 10.4%, with sales projected at $52 billion, primarily in low-end computing applications [3]. Group 3: Future Prospects and Developments - RISC-V's flexibility in adding custom instructions and extensions positions it favorably against proprietary architectures, with Nvidia planning to support RISC-V in its CUDA programming platform [4]. - The performance gap between RISC-V and existing architectures is expected to close by early 2027, marking a potential turning point for the architecture [4]. - The RISC-V market is projected to exceed $260 billion by 2030, indicating a significant shift towards open-standard chips in the AI domain [5].

Core Viewpoint - Jensen Huang, CEO of Nvidia, sparked controversy with his statement that China is leading in the AI race, prompting him to clarify his remarks during a discussion at the Center for Strategic and International Studies (CSIS) [1][4]. Group 1: Energy and Industrial Challenges - Huang emphasized that China's dominance in energy resources is a critical factor in the AI competition, noting that China's energy reserves are twice that of the U.S. [1] - He highlighted the importance of energy for building chip factories, computer systems, and AI data centers in the U.S., stating that without energy, revitalizing American industry would be challenging [2]. - Huang praised former President Trump for recognizing the significance of energy in national development, calling it one of his greatest contributions [2]. Group 2: Semiconductor and Infrastructure - While the U.S. leads in semiconductor technology, Huang warned against complacency, stating that the semiconductor manufacturing process is complex and that underestimating China's capabilities is a mistake [3]. - He pointed out that the U.S. takes about three years to build a data center, while China can construct a hospital over a weekend, indicating a significant difference in infrastructure development speed [3]. - Huang reiterated that although the U.S. is ahead in chip technology, the rapid growth of China's capabilities should not be overlooked [3]. Group 3: Clarification on AI Competition - Following his initial comments, Huang clarified that China is only a few nanoseconds behind the U.S. in AI development and stressed the need for the U.S. to rally global developers' support to win the competition [4].

公众号记得加星标⭐️，第一时间看推送不会错过。 Maxim 的 MAX232 于 20 世纪 80 年代末推出，它具有双驱动器、双接收器以及 +/-10 V 电源轨， 使得 RS-232 接口变得非常简单——所有这些都来自单个 +5 V 电源。 20 世纪 80 年代末，Maxim Integrated 公司推出 MAX232 时，串行端口仍然是微型计算机和工业设 备 的 标 配 ， 但 支 持 它 们 却 十 分 棘 手 。 RS-232 需 要 正 负 电 压 ， 通 常 在 +/-12V 左 右 ， 而 像 MC1488/1489 这样的传统驱动器需要双极性电源，这在当时新兴的单轨 +5V 数字逻辑领域已经不再 适用。 MAX232 通过集成发送和接收通道，并仅使用四个外部电容即可生成自身的 +/-10V 电源轨，从而解 决了这个问题。这种组合将原本笨拙的模拟接口变成了一个即插即用的模块。它使得小型电路板、微 控制器系统和嵌入式产品无需专用电源轨即可使用全电压 RS-232 功能。而且，它定义的功能至今仍 被无数的克隆产品和衍生产品所沿用。 每个发射通道都使用这些电源轨来产生正确的双极性输出摆幅。负载运 ...

Core Viewpoint - The semiconductor secondary market is experiencing significant fluctuations, with key manufacturers successfully launching IPOs, notable mergers failing, and the market capitalization of a few giants repeatedly reaching new heights. This article emphasizes the need to analyze the current industry landscape and the role of Chinese companies within the global semiconductor market [1]. Group 1: Market Capitalization Overview - As of mid-December 2025, there are 35 companies from China (17 from mainland China, 16 from Taiwan, and 2 from Hong Kong) in the global top 100 semiconductor companies by market capitalization, accounting for approximately 35% of the total [1]. - Notably, companies like Moore Threads and Muxi, which recently completed their IPOs, have market capitalizations of approximately 470 billion USD and 440 billion USD respectively, indicating their potential to rank among the top 25 globally [2]. Group 2: Major Players and Their Market Dynamics - The top three companies, Nvidia, Broadcom, and TSMC, have market capitalizations exceeding 1 trillion USD, reflecting their significant control over the semiconductor industry [5]. - Nvidia's market capitalization is approximately 4.26 trillion USD, marking it as the highest in the semiconductor sector and the world, driven by its pivotal role in AI computing [5]. - Broadcom's market capitalization is around 1.7 trillion USD, supported by its strategic positioning in custom AI ASICs and networking chips [5]. - TSMC holds a market capitalization of about 1.5 trillion USD, recognized for its advanced manufacturing capabilities [6]. Group 3: Storage and Memory Sector - The market capitalization of major memory companies has surged, with SK Hynix at approximately 258.6 billion USD (up 218%), Micron at about 271.4 billion USD (up nearly 175%), and Samsung at around 475.5 billion USD (almost doubling) [7]. - This growth indicates a shift in the value logic of DRAM, as high-bandwidth memory (HBM) becomes essential for high-performance computing systems [7]. Group 4: Equipment and Measurement Companies - Equipment and measurement companies are experiencing significant growth, with ASML at approximately 419.5 billion USD (up nearly 50%), and both Applied Materials and Lam Research surpassing 200 billion USD [8]. - The increasing complexity of manufacturing processes in the AI era is driving demand for advanced equipment and measurement solutions [9]. Group 5: Design Companies and Market Differentiation - Design companies are showing varied performance, with AMD at approximately 343.1 billion USD (up nearly 69%), while Qualcomm's growth is more modest at around 192.4 billion USD (up about 10%) [10]. - This differentiation reflects the varying market expectations and growth potential across different segments of the semiconductor design landscape [10]. Group 6: Chinese Semiconductor Landscape - Chinese companies are diversely positioned within the semiconductor industry, with 17 companies from mainland China primarily focused on manufacturing, equipment, and design [14]. - Taiwan's companies, such as TSMC and MediaTek, play a central role in the global semiconductor supply chain, while mainland China's companies are increasingly establishing their presence in critical segments [13][14]. - The recent IPOs of Moore Threads and Muxi highlight the growing importance of AI computing capabilities within China's semiconductor sector [15]. Group 7: Hong Kong's Role in the Semiconductor Market - Companies from Hong Kong, such as ASMPT and Silicon Motion, serve as connectors between global supply chains and capital markets, playing a stabilizing role in the semiconductor ecosystem [16].

Core Insights - The validation phase for MicroLED technology is taking longer than expected, with Apple canceling its smartwatch project in 2024 marking a significant setback [1] - Despite a recovery in momentum anticipated for 2025, the pace of development is noticeably slowing, leading to more pragmatic expectations regarding the technology's applications and challenges [1] - MicroLED is currently in its incubation stage, with the first small-batch commercial products expected to launch in 2025, specifically a smartwatch display for Garmin and an external display for Sony-Honda electric vehicles, both produced by AUO [1] Industry Dynamics - The supply chain landscape is becoming clearer, with most leading display manufacturers either controlling or forming alliances with MicroLED chip manufacturers [3] - The transition of large-size TFT-based displays and LED-on-Silicon (LEDoS) is evolving into two increasingly independent supply chains and technology platforms, yet they face common fundamental technical challenges such as yield and efficiency of ultra-small chips [3] - Initial funding for startups is projected to grow by 10-15% in 2025, although this is below the peak levels seen in 2023, indicating a cautious investment environment [3] Technical Challenges - Achieving mass production capabilities is essential for MicroLED to gain legitimacy among potential customers, but premature investment poses risks of obsolescence [3] - MicroLED must deliver differentiated performance while keeping costs comparable to OLED, with key challenges including chip cost, performance, and manufacturing infrastructure [4] - For AR applications, LED-on-Si currently meets high brightness, high resolution, low power consumption, lightweight, and small size requirements, but it has not yet reached an ideal state [4]