公众号记得加星标⭐️，第一时间看推送不会错过。 存储大缺货、价格飙涨，存储大厂晟碟（SanDisk）先前传出要找力积电合作后，业界最新消息指 出，美光（Micron）也正与力积电（6770）谈合作，形成「双龙抢珠」态势，也让力积电在这波存 储热潮下，身价同步水涨船高。 美光与晟碟一样，希望能在力积电已完工、仍可新增至少四、五万片产能空间的铜锣新厂，导入其技 术与机台生产存储，在最短时间开出新产能。消息人士透露，美光与力积电已有至少三种合作模式讨 论中，「一切就等力积电点头」。 对于相关消息，美光至昨（21）日截稿前尚无回应；力积电则说，确实与多家大厂洽谈合作当中，但 无法透露细节。 不过，美光上周已于财报会议预告追加存储投资与建立新产能的急迫性，并将2026财年资本支出将由 原规划的180亿美元，上调至200亿美元，执行长梅罗塔直言，目前存储供货「远远无法跟上客户需 求」，短期内难以缓解，在可预见的未来，整个产业供应仍将明显低于需求。对于数家关键客户，美 光目前仅能满足约五成至三分之二的供货量，对新产能需求殷切。 （来源 ：经济日报 ） 消息人士透露，美光与力积电讨论的合作模式至少有三种。第一种是「纯代工」模 ...

Group 1 - The core viewpoint of the article is that the FTC has approved a $5 billion partnership agreement between Nvidia and Intel, indicating that the transaction does not immediately raise antitrust concerns [1][2] - Nvidia will purchase Intel stock at a price of $23.28 per share to jointly develop AI and chip technologies for next-generation personal computing products and data centers [1] - The agreement aims to integrate Nvidia's GPU technology with Intel's CPU technology, competing against rivals like TSMC and AMD [1] Group 2 - Nvidia currently holds approximately 85-95% of the data center GPU market, and completing the deal with Intel would further solidify its market position [1] - The FTC's approval contrasts with its previous rejection of Nvidia's $40 billion acquisition of ARM in 2022, suggesting a shift in regulatory stance [1][2] - Analyst Stacy Rasgon noted that Nvidia's current trading price is about 13% discounted compared to the Philadelphia Semiconductor Index, making it an attractive investment opportunity [2]

公众号记得加星标⭐️，第一时间看推送不会错过。 美国存储大厂美光科技上周公布亮眼财报，不仅最新一季业绩大幅超越市场预期，对当前季度的展望 同样强劲。然而，这份「爆表」成绩单，正凸显科技硬体产业正在酝酿的一项重大变化：2026年全球 存储芯片恐出现严重短缺，规模甚至可能超越2020 至2021 年疫情期间的芯片供应危机。 根据《巴隆周刊》报导，这样的趋势对存储制造商如美光而言是明显利多，但对涵盖智能手机、 PC、汽车等终端产品的下游客户来说，却可能带来成本上升与供应压力。 长期以来，存储芯片被视为高度商品化的产业，价格与库存向来呈现剧烈循环。美光、SK 海力士 （SK Hynix）与三星电子三大存储厂，过去经常面临营收与毛利率大起大落的情况。 根据市调机构IDC 统计，全球伺服器市场第三季年增61%，规模达1,120 亿美元。 随着AI 数据中心资本支出快速膨胀，英伟达仍是最大赢家，但存储芯片厂紧追在后。 由于HBM 价格高、毛利率优渥，包含美光在内的存储制造商，正尽可能将产能转向HBM。 以美光为例，在2023 会计年度第二季，其营收年减53%，毛利率一度转为大幅负值；但最新财报显 示，营收年增57%，毛利率 ...

Core Viewpoint - TSMC has solidified its position as the core pillar of the global foundry market, capturing over 70% market share and achieving a revenue of $33.063 billion in Q3 2025, reflecting a 9.3% quarter-on-quarter growth [1][2]. Group 1: TSMC's Market Position - TSMC's revenue growth is significantly higher than its competitors, with a market share increase to 71% [1]. - The overall foundry market is growing, but TSMC is capturing the most substantial portion of this growth [1][2]. - Other foundry players, such as Samsung and SMIC, are struggling to close the gap in market share despite their revenue increases [2]. Group 2: Intel's Strategic Shift - Intel is aggressively transforming its strategy, focusing on advanced technology and ecosystem restructuring to regain competitiveness in the foundry market [3][4]. - The 14A process node is central to Intel's strategy, utilizing High-NA EUV technology to enhance power efficiency and chip density [4][5]. - Intel's EMIB technology is emerging as a viable alternative to TSMC's CoWoS packaging, addressing the demand for advanced packaging solutions [6][7]. Group 3: Customer Acquisition and ASIC Business - Intel has made significant strides in securing major clients, including Apple, which is expected to utilize Intel's 18A-P process for its M-series chips [8][9]. - Intel is establishing a dedicated ASIC department to provide customized chip solutions, leveraging its manufacturing capabilities to attract clients [10][11]. Group 4: Samsung's 2nm Strategy - Samsung is betting heavily on its 2nm process technology, aiming to turn its foundry business profitable by 2027 [12][13]. - The yield rate for Samsung's 2nm process has improved from 50% to a target of 70%, which is crucial for attracting major clients [13][21]. - Samsung has secured contracts with Tesla and Qualcomm, indicating a successful shift in its client base [14][15]. Group 5: UMC's Differentiation Strategy - UMC is focusing on mature processes and high-value applications, avoiding the high-risk advanced process competition [22][23]. - UMC has made significant progress in advanced packaging, securing a partnership with Qualcomm for high-performance chips [24]. - UMC is also entering the silicon photonics market through collaboration with IMEC, aiming to capture the next-generation high-speed connectivity applications [25][26]. Group 6: GlobalFoundries' Focus on Specialty Processes - GlobalFoundries is concentrating on mature and specialty processes, with a clear strategy to establish a unique position in specific markets [29][30]. - The acquisition of Advanced Micro Foundry enhances GlobalFoundries' capabilities in silicon photonics, positioning it as a leader in this field [31][32]. - GlobalFoundries is also acquiring MIPS to strengthen its computing capabilities, providing clients with ready-to-use IP modules [33][34]. Group 7: European Expansion and Local Manufacturing - GlobalFoundries plans to invest €1.1 billion to expand its Dresden facility, aiming to meet the growing demand for secure and differentiated technology in Europe [35][36]. - The company is also exploring partnerships for local manufacturing in the U.S. to address the increasing demand in key industries [27][37]. Conclusion - The foundry market is evolving, with TSMC maintaining a dominant position while competitors like Intel, Samsung, UMC, and GlobalFoundries are carving out their niches through strategic adjustments and technological advancements [38].

公众号记得加星标⭐️，第一时间看推送不会错过。 今年第三季度，三星电子超越美光科技，重夺高带宽内存（HBM）市场第二的位置。此前，该公司 在第一季度和第二季度一度落后于美光，位居第三，但随着HBM3E（第五代）产品供应量的增加， 其市场份额呈现回升趋势。在DRAM市场，三星也紧随领先企业SK海力士之后。 据市场研究公司Counterpoint Research 12月19日发布的数据显示，三星电子第三季度全球HBM市 场份额（按营收计）达到22%，较上一季度的15%大幅增长7个百分点。同期，美光科技的市场份额 为21%，被三星电子超越，位居第二。 三星电子在整体DRAM市场也展开了激烈的争夺。在第三季度基于营收的DRAM市场份额排名中， SK海力士以34%的份额稳居榜首，三星电子紧随其后，市场份额为33%，两家公司之间的差距仅为 1个百分点。SK海力士在今年第一季度实现了突破，历史上首次超越三星电子，荣登DRAM营收榜 首。三星电子自1992年以来一直占据半导体行业霸主地位，如今却跌至第二位，这在半导体历史上 是前所未有的。三星电子的市场份额从第二季度的32%提升至第三季度的33%，重夺第一的希望越 来越大。 ...

Core Viewpoint - The article discusses the significant advancements in optical computing technology, specifically the LightGen chip developed by Shanghai Jiao Tong University, which addresses the growing demand for computational power and energy efficiency in large-scale generative AI models [5][12]. Group 1: Breakthroughs in Optical Computing - The LightGen chip represents a major breakthrough in the field of optical computing, enabling the support of large-scale semantic visual generation models [5]. - It integrates over a million optical neurons on a single chip and employs all-optical dimension conversion, which are recognized as key bottlenecks in the industry [9]. - The chip achieves a closed-loop process of "input-understanding-semantic manipulation-generation," allowing it to "understand" and "cognize" semantics [9]. Group 2: Performance Evaluation - LightGen chip demonstrates a significant performance leap, achieving two orders of magnitude improvement in computational power and energy efficiency compared to leading digital chips, even with less advanced input devices [11]. - Theoretical calculations suggest that with cutting-edge input devices, the chip could achieve a seven-fold increase in computational power and an eight-fold increase in energy efficiency [11]. Group 3: Implications for AI Development - The advancements in LightGen are crucial for the practical application of next-generation computing chips in modern AI, particularly for high-latency and energy-intensive tasks like large-scale generative models [12]. - This development opens new pathways for exploring faster and more energy-efficient generative intelligent computing [12].

Core Insights - AMD has released a document detailing the architecture of its Zen 6 CPUs, indicating a complete redesign rather than an evolution from Zen 5, with a focus on throughput and performance [1][3] - The Zen 6 architecture supports up to 256 cores and utilizes TSMC's 2nm process technology, featuring an eight-slot dispatch engine and simultaneous multithreading (SMT) [1][2] Performance Characteristics - The design allows two hardware threads to dynamically compete for shared dispatch resources, which may result in lower single-thread performance compared to Apple's CPUs under certain conditions, but it is expected to unleash high performance in specific scenarios [2] - Zen 6 enhances visibility into vector and floating-point execution, emphasizing its capability for intensive mathematical workloads, although it does not directly confirm performance superiority in AVX-512 [2][6] Architectural Focus - Zen 6 is characterized as AMD's first microarchitecture designed from the ground up specifically for data center applications, with uncertain retention of features in consumer products [3] - The architecture supports full-width AVX-512 execution for various data formats, including FP64, FP32, FP16, and BF16, and maintains high throughput that necessitates merged performance counters for accurate measurement [6]

Group 1 - The core viewpoint of the article highlights the global semiconductor industry's shift towards regional diversification, driven by geopolitical factors, with the U.S. expected to capture 28% of the global advanced process capacity by 2030 [1] - The semiconductor industry is recognized as a strategic resource, with the U.S. pushing for domestic manufacturing, while China, Japan, the EU, and India are also intensifying their semiconductor development efforts [1] - TSMC is continuing to strengthen its presence in Taiwan, contributing to the growth of Taiwan's semiconductor industry [1] Group 2 - According to IDC, Taiwan's foundry capacity is projected to grow at a compound annual growth rate (CAGR) of approximately 2.8% from 2025 to 2029, while the U.S. is expected to see a CAGR of 8.4% due to TSMC's expansion in Arizona and increased capital expenditures from Samsung and Intel [1] - Japan's foundry capacity is anticipated to grow at a CAGR of 10% due to TSMC's expansion in Kumamoto and contributions from Rapidus, while the EU's foundry capacity is expected to grow at a CAGR of about 6.3% [1] - By 2030, China's semiconductor mature process capacity is projected to account for 52% of the global mature process capacity, surpassing Taiwan's 26%, making China the largest supplier in this segment [2]

公众号记得加星标⭐️，第一时间看推送不会错过。 END 致新以消费性为基础，往车载、工规及伺服器产品进军，产品线避开与大厂直接竞争。 PMIC业者分 析，大厂涨价将有利客户寻找替代料源，台系业者以后进者身分分食市场大饼。致新看好，今年存储 涨价趋势下，将有利PC存储规格迭代至DDR5，对其产品组合有利。 市场总体需求、明年展望相对不明朗，相关业者担忧，存储价格问题，造成终端买盘不振；推测大厂 以差别订价因应，主要也是反映应用不同调，AI独强所致。 原文链接 https://www.ctee.com.tw/news/20251220700106-430503 （来源 ：ctee ） *免责声明：本文由作者原创。文章内容系作者个人观点，半导体行业观察转载仅为了传达一种不同的观点，不代表半导体行业观察对该 观点赞同或支持，如果有任何异议，欢迎联系半导体行业观察。 全球模拟芯片市场释出明确复苏讯号。全球第二大模拟IC大厂亚德诺半导体（ADI）近日向客户发出 调价通知，规划自2026年2月1日起，针对全系列产品启动涨价机制，整体平均涨幅约15％。在此之 前，模拟芯片龙头德州仪器（TI）已于第三季月率先调涨价格，涨幅达1 ...

Core Viewpoint - India is emerging as a potential player in the semiconductor industry, with significant investments and government support, but challenges remain in manufacturing capabilities and supply chain resilience [1][11][18]. Group 1: Market Growth and Strategic Importance - India's semiconductor market is valued at approximately $38 billion in 2023, expected to grow to $45-50 billion by the end of 2025, and further expand to $100-110 billion by 2030, potentially accounting for about 10% of global consumption [1][11]. - The Indian government launched the Indian Semiconductor Mission (ISM) in December 2021, with a budget of $10 billion to build a self-sufficient semiconductor ecosystem [11][16]. Group 2: Key Developments with Major Companies - Apple is in preliminary discussions with CG Semi for chip packaging and assembly collaboration in India, indicating a shift in its supply chain strategy [2][3]. - Intel is also focusing on India's packaging and manufacturing systems, establishing a strategic alliance with Tata Group to enhance local semiconductor capabilities [5][9]. Group 3: Manufacturing and Infrastructure Initiatives - Major projects under the ISM include a $2.56 billion packaging and testing facility by Micron in Gujarat and a $10.37 billion collaboration between Tata Electronics and PSMC for a foundry [11][12]. - Tata Group plans to invest approximately $14 billion in two semiconductor factories, with one in Gujarat for wafer manufacturing and another in Assam for OSAT [8][9]. Group 4: Challenges and Future Outlook - Over 90% of India's semiconductor demand is currently met through imports, making the country vulnerable to global supply chain disruptions [11]. - While India is making strides in semiconductor packaging, it still faces significant challenges in achieving stable production and supply chain integration, with a timeline of 5-8 years for full-scale wafer production [14][18].