Core Viewpoint - Vietnam is rapidly emerging as a promising player in the global semiconductor industry due to increasing global demand, fragile supply chains, and escalating geopolitical tensions [2][4]. Group 1: Market Potential - The global semiconductor market is projected to exceed $600 billion in 2024 and surpass $1 trillion by 2030, with Vietnam identified as a key emerging market within this ecosystem [2]. - Vietnam's semiconductor industry is expected to grow at an annual rate of 9%, reaching $31.39 billion by 2029 [3]. Group 2: Government Support and Investment Climate - The Vietnamese government offers attractive tax incentives for semiconductor investors, including corporate tax reductions starting from October 2025 and exemptions on certain imports and VAT for specific high-tech activities [4]. - Specialized zones with advanced infrastructure and tailored support services have been established to bolster the semiconductor manufacturing sector, including high-tech parks in Ho Chi Minh City, Hanoi, and Da Nang [4]. Group 3: Challenges and Recommendations - The semiconductor industry in Vietnam faces challenges such as power supply, talent acquisition, technology, and supply chain issues [5]. - Recommendations for overcoming these challenges include investing in talent and ecosystems, establishing reliable international partnerships, focusing on strategic niche markets, and supporting SMEs and auxiliary industries [5][6]. Group 4: Global Positioning and Future Outlook - Vietnam is positioned to play a more influential role in the Southeast Asian semiconductor supply chain and potentially expand its global impact [7]. - Companies from the Netherlands, such as BESI and NXP Semiconductors, are expanding their operations in Vietnam, reinforcing the country's growing position in the global semiconductor value chain [6].

Core Viewpoint - United Microelectronics Corporation (UMC) reported a consolidated revenue of NT$18.823 billion for June, showing a month-over-month decline for the second consecutive month, but a slight growth of 1.55% quarter-over-quarter, aligning with the company's expectations [1] Group 1: Revenue Performance - UMC's June consolidated revenue was NT$18.823 billion, reflecting a month-over-month decrease of 3.37% and a year-over-year growth of 7.26% [1] - For the second quarter, UMC's consolidated revenue reached NT$58.758 billion, which is a slight increase of 1.55% compared to the previous quarter and a 3.45% increase year-over-year [1] - Cumulatively, UMC's revenue for the first half of the year was NT$116.617 billion, marking a year-over-year growth of 4.65% [1] Group 2: Market Strategy and Future Plans - Due to the oversupply in the mature process market driven by increased capacity from Chinese manufacturers, UMC is considering a gradual shift towards advanced processes to enhance long-term competitiveness [2] - Reports suggest that UMC is contemplating expanding its partnership with Intel, potentially moving from a 12nm process to a 6nm process, although UMC has refrained from commenting on market speculation [2] - UMC plans to diversify its expansion beyond traditional wafer manufacturing to include advanced packaging and other high-value areas, with ongoing investments in 2.5D packaging processes in Singapore [2] - The company aims to develop a comprehensive advanced packaging solution rather than focusing solely on process technology, integrating wafer foundry services with packaging to create a complete service system [2]

Core Viewpoint - Marvell Technology is experiencing revenue growth driven by the popularity of its custom AI chips among large-scale data center operators, despite facing significant margin pressure due to high manufacturing costs and competition from peers like Broadcom and AMD [1][4]. Revenue Growth - Marvell's revenue growth is attributed to the strong demand for its custom AI XPU, optical solutions, and high-bandwidth memory chips, which enhance the performance and connectivity of custom AI servers [1]. - The company reported a non-GAAP gross margin of 59.8% for Q1 of fiscal 2026, a decrease of 260 basis points year-over-year and 30 basis points quarter-over-quarter [1]. Margin Pressure - The profit margins for Marvell's custom silicon semiconductor business are fundamentally lower, impacting the overall gross margin [1]. - For Q2 of fiscal 2026, Marvell forecasts a non-GAAP gross margin range of 59% to 60%, down from 61.9% in Q2 of fiscal 2025 [1]. Competitive Landscape - Marvell faces intense competition from Broadcom and AMD in the custom silicon solutions market, with Broadcom's semiconductor division showing an 11% year-over-year growth in Q1 of fiscal 2025 [4]. - AMD's custom silicon solutions and AI accelerators are also gaining traction in data centers, further intensifying competition [4]. Stock Performance and Valuation - Year-to-date, Marvell's stock has declined by 32.2%, while the semiconductor industry has grown by 13.3% [6]. - Marvell's expected price-to-sales ratio is 7.23, which is below the industry average of 8.63 [7]. Earnings Forecast - Zacks Consensus predicts that Marvell's earnings will grow by 77.7% and 27.73% for fiscal years 2026 and 2027, respectively, with upward revisions in earnings forecasts over the past 30 days [8].

Core Viewpoint - The semiconductor industry is entering the 1.4nm era, with significant implications for technology, strategy, and market positioning among key players like TSMC, Intel, and Samsung [1][21]. Group 1: Samsung's 1.4nm Delay - Samsung Electronics announced a delay in its 1.4nm (14A) semiconductor mass production target to 2029, two years later than previously planned [2]. - The delay is attributed to Samsung Foundry's strategic response to significant losses, including a 4 trillion KRW loss last year and a 2 trillion KRW loss in Q1 of this year [2][3]. - Samsung aims to improve the maturity and yield of its 2nm process, which currently has a yield of about 40%, compared to TSMC's over 60% [3][4]. Group 2: Intel's Shift in Focus - Intel's CEO is considering shifting focus to the 14A chip manufacturing process, potentially deprioritizing the previously emphasized 18A process [5][8]. - The 18A process, which includes advanced technologies like RibbonFET and PowerVia, may face cancellation or reduced priority due to insufficient customer appeal and the need for more external orders [7][8]. - Intel's 14A process is expected to provide a 15-20% performance improvement and a nearly 30% increase in chip density, with a projected 25% reduction in power consumption [10][11]. Group 3: TSMC's Steady Progress - TSMC is positioned as a leader in the 1.4nm race, with expectations to begin production in 2028, having already achieved good yield rates [13][14]. - TSMC's A14 process utilizes innovative architectures to enhance performance and energy efficiency, achieving a 10-15% speed increase at the same power level [13][19]. - The company adopts a cautious approach to new technologies, balancing the need for maturity and stable mass production capabilities [16][17]. Group 4: Competitive Landscape - The competition among TSMC, Intel, and Samsung in the 1.4nm space is not only about technological capabilities but also strategic decisions and market positioning [21]. - Intel's potential shift to prioritize 14A over 18A may indicate a significant strategic pivot, impacting its future in the foundry market [8][12]. - The adoption of High-NA EUV lithography varies among the companies, with Intel leading, TSMC being cautious, and Samsung still evaluating its use [21].

Core Viewpoint - The establishment of a new factory by SuperSiC in Malaysia marks a significant step in enhancing the semiconductor manufacturing capabilities in the region, particularly in advanced wafer production [1][2][3]. Group 1: Project Overview - The new facility in Penang, Malaysia, will cover an area of 40,000 square meters and is part of JSG's global expansion strategy, with construction expected to begin within a year [1]. - The first phase of the project aims to produce 240,000 pieces of 8-inch silicon carbide wafers annually, which are essential for high-performance electronic products such as electric vehicle chargers and telecom power systems [1]. Group 2: Strategic Importance - The Malaysian Investment Development Authority (MIDA) highlighted that this facility will support several strategic development plans, including the New Industrial Master Plan 2030, Chemical Industry Roadmap 2030, and National Semiconductor Strategy 2030 [2]. - The project is expected to catalyze further investments in the semiconductor sector, reinforcing Malaysia's position as an advanced manufacturing hub in Asia [2]. Group 3: Company Strategy - The chairman of JSG stated that the launch of the Penang factory signifies a critical advancement in the company's internationalization strategy, facilitating local production capacity in Southeast Asia and fostering collaboration with the local semiconductor ecosystem [3]. - The establishment of the factory is also aimed at enhancing global supply chain stability and fulfilling the commitment to be closer to customers and respond quickly [4].

Core Viewpoint - Rambus, established in 1990, is a pioneer in interface IP and security IP, enhancing data transmission standards and addressing complex network security threats through innovative solutions [1] Group 1: Company Overview - Rambus has redefined data transmission standards between memory and systems with its high-speed interface technologies, including DDR memory interfaces, HBM3/4, and PCIe 5/6, significantly improving performance in data centers and edge computing [1] - The company offers a robust product portfolio with various security IP solutions, such as root of trust technology, secure protocol engines, inline cryptographic engines, and post-quantum cryptography accelerators [1] Group 2: Event Details - Rambus is hosting a technology seminar on July 9, 2025, at the Beijing Liting Huayuan Hotel, focusing on AI and automotive sectors [2][3] - The event will feature industry partners and technical experts from companies like M31, Chipone, Brightsight, ETAS, DPLSLab, CoMIRA, and Riscure, providing insights throughout the day [1] Group 3: Agenda Highlights - The morning session will cover silicon IP for AI and next-generation applications, discussing topics such as memory selection for training and inference, and the importance of PCIe and CXL in the AI era [5][6] - Afternoon discussions will focus on automotive security solutions, addressing trends and challenges faced by hardware and software designers in smart connected vehicles [6][7]

Core Insights - DDR4 memory prices have doubled in the past two months due to supply shortages, with 8GB DDR4-3200 chips now exceeding $5, up from $1.75 earlier this year [1] - Smaller manufacturers are starting to ramp up DDR4 production in response to rising prices, while larger manufacturers like Micron are unlikely to follow suit as they focus on DDR5 and HBM production [1] - The overall DDR4 memory market is expected to stabilize once smaller manufacturers resume production, but a return to previous price levels may take time [2] Group 1 - Major DRAM manufacturers, including Micron, Samsung, and SK Hynix, have announced plans to cease DDR4 production by the end of 2025, contributing to the price surge [1] - Nanya Technology, a Taiwanese memory manufacturer, is benefiting from the price increase due to its extensive DDR4 product lineup and limited DDR5 offerings [1] - The demand for HBM chips driven by the growth of artificial intelligence is causing major manufacturers to shift their production focus away from DDR4 [2] Group 2 - The DDR5 standard was officially introduced by JEDEC in 2020, and while Intel's latest CPUs support both DDR4 and DDR5, AMD's Zen 4 and later processors only support DDR5 [2] - Despite the transition to newer technologies, the widespread use of DDR4 in existing systems means that the technology will not disappear immediately [2]

Core Viewpoint - Hengxuan Technology plans to reduce shareholding by major shareholders, with a total reduction not exceeding 2.00% of the company's total share capital, primarily due to personal funding needs [1][2]. Shareholding Reduction Plan - Major shareholders Liang Zhang, Zhao Guoguang, and Tang Xiaodong, along with their concerted actions, plan to reduce a total of 2,014,888 shares, accounting for 1.20% of the total share capital, through centralized bidding or block trading [1][2]. - Run Yuan Capital I Limited and Run Yuan Capital II Limited also plan to reduce up to 1,343,500 shares, representing 0.80% of the total share capital, due to funding arrangements [1][2]. - The reduction period is set from July 28, 2025, to October 27, 2025, with the reduction price based on market conditions at the time [2]. Shareholding Structure - As of the announcement date, the controlling shareholders and their concerted actions hold a total of 53,591,591 shares, which is 31.91% of the total share capital [3]. Company Performance - Hengxuan Technology achieved a record high revenue of 999.5 million yuan in Q1 2025, representing a year-on-year increase of 52.25% [4]. - The net profit attributable to the parent company reached 191 million yuan, a significant year-on-year growth of 590.22%, marking the highest quarterly net profit since the company's establishment [4]. - The growth in revenue is attributed to an increase in market share in the smartwatch segment, which accounted for 32% of revenue in 2024, with a year-on-year growth of approximately 116% [4][5]. Profitability and R&D - The gross profit margin for Q1 2025 was 38.47%, an increase of 5.54 percentage points year-on-year and 0.77 percentage points quarter-on-quarter, driven by changes in sales structure and cost optimization [6]. - R&D expenses for Q1 2025 were 167 million yuan, remaining stable compared to the previous year, with expectations for higher expenses in the second half of the year [6].

来源：内容来自wccftech & udn 。 台积电已决定优先在美国建设工厂，而不是其他所有国家，因为一份新报告显示，台积电正在向其他 项目投入大量资金，并推迟其他项目。 据报道，台积电在日本的第二家晶圆厂无限期推迟，所有焦点转向美国工厂。 公众号记得加星标⭐️，第一时间看推送不会错过。 毫无疑问，台积电在美国设立晶圆厂的计划备受关注，尤其是在特朗普政府上台后。这家台湾巨头宣 布将在美国投资超过1000亿美元时，成功引起了美国政府的关注，台积电也宣布将美国作为优先事 项。如今，据《华尔街日报》报道，由于公司资金已转向美国，台积电正在推迟在日本的工厂建设。 台积电突然对美国产生兴趣并非出于"商业"考虑；相反，这是在特朗普总统施压以及他计划对台湾芯 片征收高达100%关税之后发生的。台积电显然已将所有精力转移到维持来自美国的客户需求上，因 此其在日本和德国的项目目前已暂停。目前，台积电在日本建造的第二家工厂也面临不确定性，这家 台湾巨头尚未公布正式的投产日期。 有趣的是，台积电亚利桑那州工厂是目前台湾以外唯一一家生产尖端工艺节点的工厂，最重要的是， 该工厂计划在2020年前将工艺节点扩展到1.4纳米。NVIDI ...

公众号记得加星标⭐️，第一时间看推送不会错过。 来源：内容来自 moneyDJ 。 *免责声明：本文由作者原创。文章内容系作者个人观点，半导体行业观察转载仅为了传达一种不同的观点，不代表半导体行业 观察对该观点赞同或支持，如果有任何异议，欢迎联系半导体行业观察。 END 今天是《半导体行业观察》为您分享的第 4084 期内容，欢迎关注。 AI伺服器用GPU、HBM需求旺盛，加上受惠台积电(2330)将量产2纳米(nm)，日本半导体制造装置 协会(SEAJ)上修2025年度日本制半导体(芯片)设备销售额预估、将续创历史新高纪录，且预估2026 年度销售额将史上首度冲破5兆日圆大关、改写历史新高。 SEAJ 3日公布预估报告指出，因AI伺服器用GPU、HBM需求旺盛，台湾先进晶圆代工厂(台积电)将 开始量产2纳米、对2纳米的投资增加，加上南韩对DRAM/HBM的投资增加，因此2025年度(2025年4 月-2026年3月)日本制芯片设备销售额(指日系企业于日本国内及海外的设备销售额)自前次(2025年1 月)预估的4兆6,590亿日圆上修至4兆8,634亿日圆、将较2024年度增加2.0%，年销售额将连续第2年 ...