Core Viewpoint - The article discusses the current state and future directions of photomask manufacturing, emphasizing the importance of curved masks and advanced computational tools in extending the viability of non-EUV lithography technologies [1][3][4]. Group 1: Innovations in Photomask Technology - The use of curved photomasks is a significant innovation that leverages current writing technologies to create complex shapes previously unattainable [3]. - Advanced computational tools, such as Mask Process Correction (MPC) and high-level simulations, are increasingly used in the mask design flow, reducing the need for expensive experiments and pushing technological limits [3][6]. - The evolution of variable shape beam (VSB) writing technology to multi-beam writing technology has made curved mask shapes feasible without increasing writing time or costs [5]. Group 2: Challenges and Infrastructure Needs - There is a substantial need for infrastructure development to support the complexity of curved shapes, as traditional rectangular descriptions are simpler to manage [8]. - The transition to curved processes is seen as an exception rather than the norm, impacting economics and infrastructure, particularly in the reliance on GPU-based computing [9]. - Measurement technologies must evolve to handle the complexities of curved shapes, requiring higher resolution and faster measurement tools [11]. Group 3: EUV Masking Issues - EUV masks face challenges such as lower durability compared to 193i masks, necessitating frequent replacements that increase costs and complexity [13]. - The performance of EUV pellicles is currently suboptimal, leading to significant wafer throughput losses due to energy loss during transmission [13][15]. - The balance between using pellicles and the associated costs is contingent on the specific use case, with larger, high-value chips benefiting more from pellicles than smaller, redundant designs [16]. Group 4: Future Directions and Research - Research is ongoing into alternative materials for pellicles, such as carbon nanotube films, which could address current limitations but are not yet in mass production [17]. - The industry is exploring ways to improve the durability and transmission rates of EUV pellicles, which could lead to broader applications if successful [15][16].

公众号记得加星标⭐️，第一时间看推送不会错过。 台积电已与美国公司Amkor合作，在美国开发先进封装能力，但其首批芯片将运往台湾封装成集成电 路。封装产能一直是人工智能供应的关键瓶颈，今天的报告显示，台积电今年的产能可从去年的7.5 万片扩大到11.5万片。此次产能提升是为了应对CoWoS L/S封装技术，此前有报告称，到2025年中 期，台积电的封装产能可能达到7.5万片。 关于亚利桑那州的芯片生产，报道称，台积电已在该工厂生产了2万片晶圆，这是其首批芯片的一部 分。这些芯片包括NVIDIA、AMD和苹果的产品，这三家公司在该工厂正式投入使用后不久就宣布了 订单。据详细信息显示，这些晶圆包括用于NVIDIA Blackwell AI芯片的晶圆，这些芯片将运往台 湾，采用CoWoS技术进行先进封装。 除了英伟达的AI芯片外，亚利桑那州的工厂还生产苹果iPhone系列中使用的处理器以及AMD第五代 EPYC数据中心处理器。AI封装带来的高需求迫使台积电等公司扩大产能，同时也激励了其他参与者 进入市场。 其中包括台湾第二大芯片代工厂商联华电子。据报道，联华电子正与高通合作，利用其晶圆上晶圆 （WoW）技术封装芯片 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 来源：内容 编译自 IEEE 。 QuantumBloom首席运营官兼联合创始人安德里亚·穆罕默德 (Andrea Mohamed)表示，在这种支持 匮 乏 的 同 时 ， 预 计 会 出 现 严 重 的 劳 动 力 短 缺 。 QuantumBloom 致 力 于 帮 助 企 业 吸 引 、 留 住 和 提 升 STEM 领域早期职业女性。该公司专注于从高等教育到职场的过渡，这是许多女性离开 STEM 领域 的关键时期。 IEEE Spectrum采访了 Mohamed，谈到了对女性从事半导体工作的支持，以及为什么放弃这些举措 与行业需求相悖。 问：作为半导体行业的回归老手，请告诉我您的看法。 半导体行业的女性比例一直很低。根据4月份发布的一份报告，51%的公司报告称，其技术职位中女 性所占比例不到20%。同时，该报告发现，公开承诺在2024年实施平等机会措施的公司数量与前一年 相比有所减少。 安德里亚·穆罕默德： 20多年前，我在一家半导体初创公司工作，当时公司主要由男性主导。现在， 情况依然如此。以全新的视角看待半导体行业，我发现这个行业的发展速度不如其他 ...

Core Viewpoint - The Genesis project, involving 58 European companies and research institutions, aims to enhance the sustainability of semiconductor manufacturing, addressing environmental impacts and resource efficiency in the industry [1][2][3]. Group 1: Project Overview - The Genesis project has a budget of €55 million and focuses on making semiconductor production more sustainable globally, not just in Europe [1]. - The project includes four main workflows: monitoring and sensing, new materials, waste minimization, and critical raw materials mitigation [3]. - The initiative aims to produce 45 outcomes over the next three years, addressing emissions, material optimization, and recycling [3]. Group 2: Industry Challenges and Drivers - The semiconductor industry faces increasing pressure from customers to produce chips sustainably, managing water resources and achieving carbon neutrality [4]. - Regulatory measures are expected to strengthen over time, driven by climate change concerns, necessitating action from the industry [4]. - Major companies are pushing for sustainability in semiconductor production, indicating a shift in industry norms [4]. Group 3: Technological Innovations - The project will deploy integrated sensor systems to monitor and reduce emissions of harmful substances like PFAS and greenhouse gases [3]. - There is a focus on developing AI models based on sensor data to enhance wafer fabrication efficiency, although AI integration is not currently part of the Genesis project [7]. - The project aims to replace 30% of new materials used in lithography and packaging processes with more sustainable alternatives [8]. Group 4: Collaboration and Training - The project includes a partnership with Applied Materials to develop material engineering solutions for emerging infrastructure challenges in AI data centers [9][10]. - The FAMES Academy is being established to train engineers and technicians in low-power FD-SOI technology, supporting the European semiconductor community [11]. - The academy will focus on workshops and interactive sessions to equip the industry with necessary skills and knowledge [11].

随着半导体先进封装与FPD制造技术的不断演进，洁净室自动化生产设备面临的静电问题 日益严峻。为帮助行业同仁深入了解静电带来的潜在风险，并探索高效可靠的解决方案， 提升产能和良率， 戈尔诚邀您参与6月26日举办的半导体及FPD设备静电解决方案专题研 讨会 。 户经验,还曾负责东南亚市场,对国 内外大客户的设备及应用需求有深 入了解。 同 核心内容提要 本次研讨会将 聚焦于洁净室环境中静电控制的关键技术 ，分享前沿解决方案与真实应用案例， 助力您提升设备可靠性与产能表现。 > 痛点直击:半导体先进封装中的静电问题及风险 技术革新:戈尔新一代电缆技术:防止静电积聚, 提升可靠性和产效 全球案例: 1.全球知名先进封装设备商应用案例分析 2.全球知名FPD制造商在OLED设备为什么采用 抗静电电缆? ● Q&A环节:戈尔经验丰富的技术团队在线答疑 解惑。 Together, improving life 扫描下方二维码预约报名 即可激活抽奖资格 扫码立即锁定席位 倒计时提示 ⏳ 席位有限！ 6月26日前预约有效 （本文图源：戈尔） *免责声明：本文由作者原创。文章内容系作者个人观点，半导体行业观察转载仅为了传达一种不 ...

Core Viewpoint - The DRAM market is undergoing significant changes, highlighted by a rapid increase in DDR4 prices and shifts in market dynamics among major players like Micron, Samsung, and SK Hynix [1][5]. Group 1: Micron's Developments - Micron has announced the discontinuation of DDR4 production, leading to a dramatic price surge in DDR4 DRAM, with prices increasing over 100% this season [1]. - The company has introduced its 1γ (1-gamma) DDR5 technology, which boasts a 15% increase in data transfer speed compared to its predecessor and a 20% reduction in power consumption, crucial for AI and data center applications [2]. - Micron plans to invest $200 billion in expanding advanced DRAM manufacturing and R&D in the U.S., which is expected to significantly impact the future DRAM landscape [5]. Group 2: Samsung's Challenges - Samsung has faced difficulties with HBM certification, with reports indicating multiple failures in obtaining HBM3E certification, which is critical for its product offerings [7][9]. - Despite these challenges, Samsung has successfully delivered HBM3E chips to AMD, marking a significant step in its HBM product line [8]. - The company is also planning to expand its 1c DRAM production line, which is essential for its HBM4 technology, indicating a commitment to overcoming current production hurdles [9][10]. Group 3: SK Hynix's Strategy - SK Hynix has emerged as a leader in the DRAM market, capturing a 36% market share, surpassing Samsung's 34% [11]. - The company is taking a cautious approach to expanding its DRAM and HBM production capacity, delaying equipment investments and scaling back production expectations [12][13]. - SK Hynix is also focusing on future technology roadmaps, including the development of 4F² and 3D DRAM technologies to enhance performance and capacity [14]. Group 4: Future of DRAM Technology - The future of DRAM technology is promising, with advancements expected in 3D DRAM architectures and the transition to smaller nodes, including 0c/0d by 2033-2034 [19]. - Major manufacturers are exploring various architectural paths to achieve 3D DRAM integration, indicating a competitive landscape driven by innovation [19]. - The introduction of HBM4 and HBM5 is anticipated to significantly increase memory bandwidth and data transfer rates, with HBM4 expected to reach 2 TB/s by 2026 [21].

公众号记得加星标⭐️，第一时间看推送不会错过。 来源：内容 编译自 restofworld 。 三星电子曾是全球领先者，但在争夺人工智能供应主导权的激烈半导体竞争中却失利；该公司还失去 了工程师，留下的员工只能长时间高强度地工作以弥补空缺；工程师们表示，他们被要求伪造数据， 导致缺陷漏出，影响芯片质量。 午夜时分，在首尔郊外三星电子的半导体办公室里，芯片设计工程师韩基白（Han Ki-bak）看到一位 同事在连续数月通宵工作后晕倒了。韩基白惊呆了，动弹不得。 "因为我熬了那么多夜，我都疯了。我没有冲过去帮她，只是坐在椅子上，心想'我该怎么办？'"他在 2020年接受《restofworld》采访时回忆了这件事。 当医护人员赶到时，韩先生茫然地看着这一切。 10名三星现任和前任工程师向《restofworld》透露，由于工作时间长、工作量大以及奖金低于竞争 对手，许多三星工程师正转投韩国芯片制造商SK海力士。其中一些人则转投了美国的美光科技和英 特尔，以及长鑫存储和长江存储等中国竞争对手。他们表示，在人手短缺、本已捉襟见肘的团队中， 倦怠感正在加剧。除韩某外，所有员工都要求使用假名，因为他们担心遭到公司的报复。 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 来源：内容 编译自 NRC 。 如何粉碎一块薄饼？这个问题困扰着阿姆斯特丹纳米光刻高级研究中心 (ARCNL) 的研究员迪翁·恩 格尔斯 (Dion Engels)。 这里所说的薄饼指的是被粉碎的锡滴，它在 ASML 的光刻机中每秒被引爆五万次。这会产生等离子 体，发射出极紫外 (EUV) 光：一种极紫外辐射，将高度精细的芯片图案投射到硅片或晶圆上。 集成的晶体管越多，芯片的性能就越强。得益于 EUV 光刻机，如今用于手机或人工智能数据中心的 最先进处理器上的芯片设计线间距仅为几十纳米——百万分之一毫米。 ASML 与美国 Cymer 实验室合作研究 EUV 技术长达二十年，发现粉碎锡滴可以产生更多的 EUV 光。其结果是：生产英伟达、苹果、三星或英特尔先进芯片的机器很快就会更加高效地运转。 芯片元件尺寸缩小的速度正在放缓，因为芯片设计变得越来越高：制造商正在将芯片元件粘合在一 起，并想出更智能地排列晶体管的方法，例如从底部供电。 ASML 系统的许多基础设计都诞生于阿姆斯特丹东区的科学园。ARCNL 成立于十年前，与阿姆斯特 丹大学合作成立。其推动力来自 AS ...

公众号记得加星标⭐️，第一时间看推送不会错过。 来源：内容 编译自 eetjp 。 索尼集团透露，由于2024年主要客户销售额低于预期，以及中国市场高端领域竞争加剧，导致市场份 额与上一年持平，预计2025年实现60%市场份额的目标将推迟。 索尼集团影像与传感解决方案部门（I&SS）预测2024财年的销售额将达到1.799万亿日元，同比增长 12%，营业利润将达到2611亿日元，同比增长35%，均创历史新高。销售额的增长得益于有利的汇 率、产品结构的改善以及移动设备传感器销量的增长。 索尼半导体解决方案公司（以下简称"索尼半导体"）总裁指田真司在2025年6月13日发布的视频中解 释道："图像传感器业务一直以2025年实现60%的市场份额为目标，但2024年我们未能实现超过市场 的销售额增长，市场份额保持平稳。" 具体来说，2024年的实际业绩将与上一年持平，为53%。预计 2025年将达到56%。 索尼半导体CFO高野康弘解释称，2024年公司市场份额持平主要有两个原因，一是主要客户的销售 额没有达到预期，二是中国高端领域与对手的竞争加剧，"所以我们在这个领域有点挣扎"。 同日（6月13日），索尼半导体也公 ...

Core Viewpoint - The recent surge in DDR4 DRAM spot prices, with increases of nearly 8% in a single day, indicates a significant market shift, driven by supply constraints and increased demand from OEM/ODM manufacturers [1][4]. Price Trends - DDR4 8Gb (1G×8) 3200 spot price rose from an average of $2.73 on May 30 to $3.775, marking a 38.27% increase in just half a month [2]. - Since March 31, the DDR4 8Gb price has skyrocketed from $1.63 to nearly $3.775, representing an increase of approximately 132% [3]. - The DDR4 16Gb (1G×16) 3200 spot price increased from $6.1 on May 30 to $8.2, a rise of 34.42% in June alone, and over 107% since March 31 [3]. Market Dynamics - The current DDR4 spot prices have reached levels comparable to Q1 2022, where major suppliers like Nanya Technology and Winbond reported substantial profits [4]. - With major manufacturers like Samsung and Micron halting DDR4 supply, concerns over future supply shortages have led to aggressive purchasing behavior in the market [4]. - Nanya Technology is reportedly expanding its DDR4 production capacity, indicating a recognition of the significant market opportunity for DDR4 [5]. Supplier Insights - Nanya Technology and Winbond are positioned to benefit from the rising DDR4 prices, with DDR3 and DDR4 accounting for over 80% of Nanya's revenue [5]. - Memory IC design firms like Etron Technology and Gigabyte Technology are also beginning to receive customer orders, suggesting a positive outlook for their operations amid the DDR4 price surge [5].