今年早些时候，美国总统唐纳德·特朗普称台积电是"世界上最重要的企业之一"。虽然他的说法并不准确，台积电的确是世 界上最重要的企业，但他的政府和其他国家确实意识到将台积电引入本国的重要性。 公众号记得加星标⭐️，第一时间看推送不会错过。 五年过去了，这些项目都已产出晶圆。但代价是什么？台积电（以及台湾）和这些海外晶圆厂是否都实现了目标？海外晶 圆厂在经济上是否具有竞争力？台积电的传奇创始人张忠谋博士一直对美国晶圆厂持悲观态度（重点为笔者所加）： 我们认为，美国最近为增加半导体本土制造所做的努力，目前仅仅投入数百亿美元的补贴，远远不够。我认为这将是一项 代价高昂却徒劳无功的尝试。（原文：We think that the recent effort of the U.S. to increase onshore manufacturing of semiconductors, right now you're talking about spending only tens of billions of dollars of money of subsidy. Well, it's not going to be ...

Core Viewpoint - The expansion of Google's TPU ecosystem is reshaping the HBM market, consolidating competition primarily between Samsung and SK Hynix, while Micron has effectively exited the ASIC market due to capacity constraints [1][2][4]. Group 1: Market Dynamics - Google's TPU ecosystem is reducing the global HBM supply chain competition to Samsung and SK Hynix, as Micron's capacity limitations hinder its participation [1][2]. - Micron's monthly wafer-level HBM production capacity is approximately 55,000 wafers, significantly lower than Samsung's 150,000 and SK Hynix's 160,000, making it unable to meet the demands of major clients like Google and NVIDIA [2][6]. - The competition in the HBM market is intensifying as Google's TPU challenges NVIDIA's dominance, which has historically controlled 90% of the AI accelerator market [4][5]. Group 2: Future Projections - Analysts predict that the situation will change with the mass production of Google's TPU starting next year, with Samsung expected to double its supply to Google compared to this year [3][6]. - The demand for HBM is anticipated to surge due to the increasing competition between GPU and ASIC industries, with projections indicating a supply shortage by 2027 [6]. - Micron plans to build a new factory in Hiroshima, Japan, to produce next-generation HBM, aiming to catch up with SK Hynix technologically [7].

Core Viewpoint - The forum focused on the integration of industry, academia, and research in the semiconductor sector, emphasizing the importance of collaboration for innovation and ecosystem development in the integrated circuit industry [2][28]. Group 1: Forum Overview - The "2025 Integrated Circuit Specialty Process and Advanced Packaging Testing Industry Technology Forum" was held in Chengdu, attracting over 600 representatives from more than 200 companies in the integrated circuit field [2]. - The forum was guided by various governmental and academic institutions, aiming to create a platform for deep integration of production, learning, research, and application [2][28]. Group 2: Key Events and Activities - A council appointment ceremony for the Integrated Circuit Alumni Association of the University of Electronic Science and Technology was held, with new members from various sectors of the industry being recognized [6]. - The Advanced Packaging and System Integration Pilot Platform was officially launched, enhancing public service capabilities in the advanced packaging sector [9]. Group 3: Main Forum and Discussions - The main forum featured six experts discussing topics such as "Technology Routes in the Post-Moore Era" and "Power Integration Specialty Processes," showcasing the intersection of innovation and industrial application in integrated circuits [11]. - Three specialized sub-forums and a roundtable forum were conducted, focusing on cutting-edge semiconductor materials and technologies, advanced packaging, and the construction of an alumni ecosystem [14][20]. Group 4: Investment and Development Insights - A roundtable discussion highlighted the semiconductor industry's transition to a 2.0 phase, emphasizing the importance of early and stable investments, as well as the pursuit of synergistic effects in mergers and acquisitions [22]. - The Chengdu-Chongqing region was identified as a strategic area for semiconductor development, leveraging local talent and manufacturing capabilities to enhance the industry [22]. Group 5: Future Outlook - The focus on AI inference chips and 3D packaging was emphasized, with a call for local governments to support educational institutions like the University of Electronic Science and Technology to foster innovation [23].

公众号记得加星标⭐️，第一时间看推送不会错过。 根据券商Kiwoon Securities的高级研究员预计，三星明年的营业利润将达到90兆至100兆韩元（约台 币2.14兆元）。这呼应了先前报告指出，三星计划在2027年实现晶圆代工业务获利，意味着提高2nm GAA制程的良率是其首要任务，还有高频宽记忆体HBM4和DRAM价格56%上涨的加持。 wccftech报导，三星面临的第一个真正考验是，其首款采用上述曝光技术制造的晶片组Exynos 2600 在应用于Galaxy S26系列后的性能表现。 资深研究员朴有岳（Park Yoo-ak，音译）对三星在2026年登顶业界霸主地位做出了最为乐观的预 测，他表示该公司明年的营业利润将达到100兆韩元。根据《韩国经济日报》报导，他的预测基于高 频宽记忆体HBM4市场占额的显著增长，以及通用DRAM价格56%的上涨。 朴有岳也提 到，由于NAND 快 闪记忆体价格上涨，三星的营收可望大幅 提升。此外，该公司2nm GAA制程的良率有望提高，目前已获得两家中国加密货币挖矿设备制造商的订单，并与特斯拉签署 了价值165亿美元的巨额交易，这将有助于三星建立稳固的客户基础。 ...

Core Viewpoint - The article emphasizes the transition from silicon to diamond as a key material in the semiconductor industry, highlighting the advantages of diamond in power electronics and its potential for industrial applications [1][4][10]. Group 1: Company Overview - DIAMFAB, a French company derived from the CNRS, focuses on the industrialization of synthetic diamond technology for high-demand electronic applications [1][4]. - The company is currently in the early stages of product promotion, primarily providing prototype products to customers and partners [7]. Group 2: Market Trends and Investments - The investment landscape is shifting, with significant funding for diamond-based semiconductor technologies, including a reported €2.35 billion investment for a new microchip manufacturing plant in Spain [2]. - The diamond semiconductor market is gaining traction, with companies like Diamond Foundry and Ookuma Diamond Device securing substantial investments for expansion [1][2]. Group 3: Technical Advantages of Diamond - Diamond exhibits superior properties compared to silicon and silicon carbide, including three times the pressure resistance of silicon carbide and thirteen times that of silicon, along with excellent thermal conductivity [5][6]. - The use of diamond can lead to more compact, lightweight, and energy-efficient semiconductor devices, making it valuable for applications in electric vehicles, aerospace, and radiation-resistant systems [6][8]. Group 4: Industrialization Challenges - One of the main challenges for DIAMFAB is convincing customers to adopt this cutting-edge technology, as many industrial companies have outdated perceptions of diamond's capabilities [7][8]. - The company aims to integrate into existing supply chains, leveraging standard semiconductor processing equipment once diamond substrates are sufficiently large [9]. Group 5: Future Outlook - The article suggests that the diamond power electronics technology represents an emerging opportunity for the European semiconductor industry, which is well-positioned to build a new industrial ecosystem around this technology [10].

近年来，在电动化与智能化浪潮下，汽车产业正在经历一场颠覆性变革。从单纯的交通工具 制造，加速进化为集智能计算、实时感知、复杂控制于一体的"超级移动智能终端"。 作为车辆的"神经中枢"，MCU的角色早已超越传统功能控制，成为决定车辆智能化水平、驾驶安 全性与用户体验的核心部件，其性能表现直接影响智能座舱的流畅度、智能驾驶的响应速度以及动 力系统的运行效率。 图源：芯联资本 在这样的背景和趋势之下，传统MCU在算力、存储、外设和安全性能上的短板日益凸显，已经难 以负担更多的功能集成。新一代整车架构对于更高算力、更强存储、更丰富的外设接口、更高安全 需求的高性能车规MCU需求日趋高涨，以支撑跨域融合场景下的复杂控制任务。 这场变革背后，是汽车电子电气架构（E/E）的根本性革新。传统分布式架构下，车辆各系统独立 控 制 、 线 束 繁 杂 ， 已 难 以 承 载 当 前 软 件 定 义 汽 车 （ SDV ） 带 来 的 海 量 数 据 处 理 与 跨 域 协 同 需 求。"中央计算+区域控制"的新型架构应运而生，将分散的控制功能整合，通过区域控制器实现多 域融合管理。 自去年以来，小鹏、零跑、广汽等主机厂纷纷开始量 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 碳化硅 (SiC) 供应链正步入一个分阶段的市场，SiC 原材料价格上涨，而 6 英寸器件衬底则面临巨 大的价格压力。对于电源和汽车设计人员而言，这种分化可能会重塑器件成本结构，而此时 SiC 正 被广泛应用于人工智能加速器和高性能计算平台。 *免责声明：本文由作者原创。文章内容系作者个人观点，半导体行业观察转载仅为了传达一种不同的观点，不代表半导体行业观察对该 观点赞同或支持，如果有任何异议，欢迎联系半导体行业观察。 END 今天是《半导体行业观察》为您分享的第 4245 期内容，欢迎关注。 据TrendForce援引的市场数据显示，包括黑色和绿色等级在内的散装碳化硅粉末和颗粒的价格持续上 涨。近期交易价格约为每吨6271元人民币，环比上涨约0.21%。价格上涨的原因在于原料成本坚挺、 下游需求扩大以及与环保检查和产能限制相关的供应调整，这些因素共同推高了分销环节的成本。 相比之下，用于功率器件的6英寸碳化硅（SiC）晶圆衬底市场则陷入了一场所谓的"价格战"。全球主 要供应商的产能快速扩张导致供应过剩，据报道，从2024年年中到第四季度，晶圆价格将跌破每片 5 ...

Group 1 - The core viewpoint of the articles indicates a cautious outlook for the electronic components supply network, with expectations of revenue decline due to various global trade issues and high inventory levels among customers [1][2] - ECSN's market analysts report that internal inventories are being consumed to lower stock levels, but customers remain reluctant to place long-term orders [1] - Predictions for 2025 suggest a revenue decline of 2% to 4.9%, with indications that actual revenue could drop by 9% due to weak component demand and industry-wide inventory buildup [1] Group 2 - Factors limiting growth include a downturn in manufacturing, particularly in German automotive production, although the connector market shows signs of growth, especially in electric vehicles [2] - Strong demand for electronic components persists in the military and aerospace markets, but this segment represents a small portion of the overall market [2] - The semiconductor industry is expected to see robust revenue growth driven by the demand for specialized storage products like GPUs, essential for AI applications [2]

Core Viewpoint - The article discusses UMC's strategic transformation in response to the competitive landscape in the mature process foundry market, focusing on high-value applications such as silicon photonics and advanced packaging to create new growth opportunities [1][2]. Group 1: UMC's Strategic Initiatives - UMC is accelerating its transformation by leveraging its existing special process capabilities to enter high-value applications like silicon photonics and advanced packaging [1]. - The company has reported successful developments in advanced packaging, with its self-developed high-end interposer achieving electrical validation from Qualcomm and entering trial production, with mass production expected by Q1 2026 [1]. - UMC is expanding its overseas packaging capabilities, with its Singapore facility now utilizing 2.5D processes and wafer-to-wafer technology, which is critical for 3D IC manufacturing [1]. Group 2: Collaboration and Market Position - UMC is reportedly interested in collaborating with Intel to challenge the 6nm process, while emphasizing its ongoing collaboration with Intel on the 12nm FinFET process, set for mass production in 2027 [2]. - The company’s diversification into silicon photonics and advanced packaging is seen as a way to create new opportunities in the mature foundry market [2]. Group 3: Silicon Photonics Development - UMC is entering the silicon photonics field in collaboration with IMEC, aiming for trial production next year and mass shipments by 2027, capitalizing on the growing demand driven by AI applications [4][6]. - The company has a natural advantage in silicon photonics due to its reliance on mature processes, which predominantly use 28nm and 22nm platforms, allowing it to expand into higher-margin product lines [4][5]. - The collaboration with IMEC provides UMC with access to advanced design rules and significantly shortens the time to commercialize silicon photonics products [6]. Group 4: Industry Trends and Advantages - The demand for silicon photonics is expected to surge, particularly with NVIDIA's next-generation AI platform Rubin incorporating silicon photonics components, which will drive significant market growth [4][6]. - Silicon photonics technology offers substantial advantages, including over tenfold reductions in power consumption and improvements in latency, making it a consensus technology for next-generation data centers [5].

Core Viewpoint - The article discusses the growing application of silicon photonics technology as a potential replacement for copper wire in data transmission, particularly in data centers, while highlighting the current limitations and future prospects of this technology [1][2]. Group 1: Current State of Transmission Technologies - Currently, silicon photonics is primarily used for long-distance transmission in data centers, while copper wire is still dominant for medium and short distances due to its high speed of up to 200 Gbit per second [1][2]. - The advancements in copper wire technology have exceeded initial expectations, achieving speeds of 200 Gbit per second, which matches the current capabilities of silicon photonics [1][2]. Group 2: Advantages and Future Developments of Silicon Photonics - Silicon photonics has the potential for significant cost reductions and efficiency improvements in the future, especially as technology advances [2]. - Future developments aim to integrate optical engines directly with switch chips on the same substrate, potentially allowing for transmission speeds of up to 400 Gbit per second per fiber [2]. - The integration of multiple optical engines could lead to a total transmission capacity of 25.6 terabits per second, significantly enhancing data transfer capabilities [2]. Group 3: Challenges and Market Dynamics - Despite the advantages of silicon photonics, challenges remain in terms of production costs and the complexity of integrating optical components, which currently limits its market share compared to copper wire [2]. - The co-packaged optics (CPO) industry is highlighted as a part of the silicon photonics manufacturing process, with many Taiwanese manufacturers focusing on contract manufacturing and backend processes [2]. Group 4: Industry Context and Demand - The demand for data transmission is rapidly increasing, driven by the explosion of generative AI and the need for higher computational power, which exposes the limitations of traditional copper wire [5][6]. - Data centers are projected to consume vast amounts of electricity, with the energy demands potentially increasing twentyfold, underscoring the need for more efficient transmission technologies [6].