Core Viewpoint - TSMC is considering changing its plans for the second factory in Kumamoto, Japan, to produce advanced semiconductors, specifically 4nm chips for AI applications, due to low utilization rates at the first factory and global EV sales decline [2][8]. Group 1: TSMC's Operations in Japan - TSMC's first factory in Kumamoto has started production of 12-28nm products, but the utilization rate has not met initial expectations due to the sluggish global EV market [2][8]. - The second factory, originally planned to produce 6-40nm products, is now being adjusted to potentially include 4nm production equipment for mainstream AI semiconductors [2][6]. - The construction site for the second factory is currently halted, and if plans are adjusted, the expected production start date of 2027 may be delayed [8]. Group 2: Importance of AI Semiconductors - AI semiconductors are fundamental to technological innovation, making the establishment of a domestic supply chain crucial for enhancing industry competitiveness [6]. - The demand for AI semiconductors is increasing globally, with companies like NVIDIA facing competition for supply [4][6]. - Japan's government is supporting semiconductor initiatives, including a significant investment in TSMC's projects and the establishment of a new factory by Micron Technology for AI memory chips in Hiroshima [9]. Group 3: Economic and Strategic Implications - The total investment for TSMC's projects in Japan is approximately $22.5 billion (about 3.5 trillion yen), with the Japanese government providing around 1.2 trillion yen in funding support [8]. - Japan's efforts to reduce dependence on imported semiconductors are becoming increasingly important from an economic security perspective [8]. - Rapidus, a company supported by the Japanese government, plans to start mass production of 2nm products in 2027, indicating a push towards advanced semiconductor manufacturing in Japan [8].

在刚刚结束的IEDM 2025上，台积电首次证实了采用下一代晶体管技术——互补场效应晶体管（CFET）的集成电路的运行情况。 根据IEDM 官方此前的预告，台积电在本届大会宣布两项了重要里程碑：首款全功能 101 级 3D 单片互补场效应晶体管 (CFET) 环形振荡器 (RO)以及全球 最小的 6T SRAM 位单元，该位单元同时提供高密度和高电流设计。 据介绍，基于先前基于纳米片的单片 CFET 工艺架构，台积电研究人员引入了新的集成特性，进一步将栅极间距缩小至 48nm 以下，并在相邻 FET 之间采 用纳米片切割隔离 (NCI) 技术，以及在 6T SRAM 位单元内采用对接接触 (BCT) 互连技术实现反相器的交叉耦合。电学特性分析对比了两种环形振荡器布 局，重点展示了 6T 位单元对性能以及稳健 SRAM 器件指标的影响。 这些进展标志着 CFET 开发的关键性转变，从器件级优化迈向电路级集成。 台积电新进展 CFET 是一种通过垂直堆叠 n 沟道 FET 和 p 沟道 FET（CMOS 器件的基本组件）来提高晶体管密度的技术，理论上与目前最先进的晶体管技术纳米片 FET (NS FET) 相比， ...

公众号记得加星标⭐️，第一时间看推送不会错过。 在刚刚结束的IEDM 2025上，台积电首次证实了采用下一代晶体管技术——互补场效应晶体管 （CFET）的集成电路的运行情况。 根据IEDM 官方此前的预告，台积电在本届大会宣布两项了重要里程碑：首款全功能 101 级 3D 单 片互补场效应晶体管 (CFET) 环形振荡器 (RO)以及全球最小的 6T SRAM 位单元，该位单元同时提 供高密度和高电流设计。 据介绍，基于先前基于纳米片的单片 CFET 工艺架构，台积电研究人员引入了新的集成特性，进一 步将栅极间距缩小至 48nm 以下，并在相邻 FET 之间采用纳米片切割隔离 (NCI) 技术，以及在 6T SRAM 位单元内采用对接接触 (BCT) 互连技术实现反相器的交叉耦合。电学特性分析对比了两种环 形振荡器布局，重点展示了 6T 位单元对性能以及稳健 SRAM 器件指标的影响。 这些进展标志着 CFET 开发的关键性转变，从器件级优化迈向电路级集成。 台积电新进展 CFET 是一种通过垂直堆叠 n 沟道 FET 和 p 沟道 FET（CMOS 器件的基本组件）来提高晶体管密 度的技术，理论上与目前最先 ...

Group 1: Key Developments in the Industry - Disney announced a $1 billion investment in OpenAI to accelerate the application of artificial intelligence in entertainment content creation and user experience optimization [2] - Microsoft CEO Satya Nadella announced the launch of a new AI model, enhancing intelligent agents, and established partnerships with high-profile companies to accelerate the commercialization of autonomous AI applications [2] - Google is expected to face fines from the EU due to violations related to Google Play, with potential penalties to be announced in Q1 2026, while also opening an AI lab in the UK [2] Group 2: Financial Performance and Corporate Actions - Adobe reported record revenue of $6.19 billion for Q4, with adjusted earnings per share of $5.50, exceeding market expectations, driven by strong performance in digital media and creative software [2] - ZTE is in communication with the U.S. Department of Justice regarding ongoing matters, with timely disclosures to follow based on progress [4] - Nandu Power's controlling shareholder is planning a change in control, leading to a suspension of trading from December 12 [4] Group 3: Market Trends and Challenges - TSMC reported a 6.5% month-over-month revenue decline in November, raising concerns about further declines in December, while announcing a minimum dividend of 24 yuan for the next year [5] - Tesla's U.S. sales fell to a near four-year low in November despite launching lower-priced versions of Model Y and Model 3 [7] - Oracle's Q2 adjusted revenue was $16.06 billion, slightly below analyst expectations, with cloud revenue at $8 billion, also missing forecasts [8] Group 4: Strategic Partnerships and Innovations - Samsung Electronics is adjusting its Galaxy S26 series strategy, postponing production of standard and Plus models to early 2026, while launching a new fast-charging accessory [10] - Toyota announced the use of Wolfspeed's SiC MOSFET devices in its electric vehicle charging systems to enhance efficiency [10] - LG Electronics plans to showcase a localized AI cockpit platform at CES 2026, focusing on smart vehicle interaction technology [10]

Core Insights - Emerging-market (EM) economies are projected to grow at 4.2% in 2025, significantly outpacing the 1.6% growth expected for advanced economies according to the IMF [1] - EM economies now account for 50.6% of global GDP in 2025 and 66.5% of global GDP growth over the past decade [2] - Emerging-market equities are trading at a 35% discount compared to developed-market equities, the largest discount in 15 years, indicating potential for valuation re-rating [3] Sector Analysis - Easing monetary policies in developing nations are fostering healthier financing conditions, leading to double-digit year-over-year bank credit growth in countries like India, the Philippines, and Vietnam [5] - Global supply-chain diversification is boosting manufacturing activity in EMs, with India attracting $19.04 billion in manufacturing FDI and mobile phone exports reaching $20.5 billion in 2024 [6] Company Highlights - **ICICI Bank**: Focused on enhancing digital banking services, with significant growth in its mobile banking app and strong loan demand across key EM regions. Expected earnings growth of 13.9% for fiscal 2027 [7][9] - **Taiwan Semiconductor (TSMC)**: Dominates the semiconductor foundry space with advanced production capabilities, expected to report earnings growth of 20.2% in 2026 [10][11] - **MercadoLibre**: A leader in e-commerce and digital banking in Latin America, showing 39% revenue growth and 41% total payment volume expansion in Q3 2025, with expected earnings growth of 50.3% in 2026 [12][13]

台积电加速扩充先进封装产能，预计2026年底CoWoS月产能达12.7万片，较原先预期大幅提升20%以上。英伟达包揽过半产能，全年预订80- 85万片；博通位居第二，获24万片主供Meta和Google；AMD排名第三，联发科也进入ASIC市场。 台积电正加速扩充先进封装产能以应对人工智能芯片需求的爆发式增长。 12月11日，据中国台湾媒体报道，半导体设备业者透露，台积电与日月光集团、Amkor、联电等非台积阵营双双加速扩充CoWoS产能， 2026 年底台积电月产能将达12.7万片，而非台积阵营产能也从原预期的2.6万片激增至4万片，调升幅度超过5成。 在客户份额分布上，英伟达继续主导市场，包下台积电CoWoS过半产能， 全年预订量达80万至85万片 。紧随其后的 博通2026年约取得逾24 万片产能， 主要供应Meta与谷歌TPU等客户。AMD位居第三，而 联发科也正式进入ASIC赛局，预订近2万片产能 。 这一产能扩张计划与摩根士丹利11月的预测基本吻合。该行当时预计台积电CoWoS月产能将达12万至13万片，较此前估计的10万片大幅上调 超过20%。此举旨在匹配新增的3nm前端晶圆产能，以满足AI芯片 ...

Core Viewpoint - Taiwan Semiconductor Manufacturing Co. (TSMC) is considering producing its advanced 4-nanometer chip at its second plant in Japan to address the rising demand for AI-related products [1][4]. Group 1: Shift Towards Advanced Chips - The Kumamoto plant, initially designed for 6-nm and 7-nm chips, may undergo a transition to 4-nm technology, which could lead to design revisions and a delay in the plant's launch, currently scheduled for 2027 [2]. - Construction at the Kumamoto plant has been paused, and TSMC is also delaying new equipment installation at its existing plant, which produces mature chips for various applications [3]. Group 2: Demand for AI Chips - TSMC's potential shift to 4-nanometer production is a direct response to the surging demand for AI products, with plans to expand 2-nanometer chip production from seven to ten fabs, supported by a $28 billion investment [4]. - Major tech companies, including Nvidia, Google, Amazon, and MediaTek, are driving this demand, leaving TSMC with no spare capacity despite its expansion efforts [5]. Group 3: Financial Performance - TSMC reported NT$343.61 billion ($11.01 billion) in net revenue, reflecting a 24.5% year-over-year increase but a 6.5% decrease month-over-month. For the period from January to November, revenue reached NT$3.47 trillion ($110 billion), marking a 32.8% year-over-year increase [7]. - Year-to-date, TSMC's stock has increased by 53.85%, although it experienced a 2.22% decline recently, closing at $310.14 [8].

如果您希望可以时常见面，欢迎标星收藏哦~ 这起案件是台湾检方为保护岛内全球顶尖芯片制造商的商业机密而采取的新举措之一。台湾生产了 全球大多数的先进计算机芯片，它们应用于从iPhone到汽车的几乎所有领域。但随着各国竞相扶 持本土芯片制造商，台湾当局正加大力度保护这一宝贵技术。 这是台湾政府首次援引2022年出台的一项法律，将芯片制造商的商业机密纳入地方安全保护范 畴。 12月2日，在另一起案件中，检方起诉了台积电供应商、日本设备制造商东京电子的台湾子公司， 指控其未能阻止前员工窃取台积电最先进芯片的相关细节。这是台湾首次依据安全法以窃取芯片商 业机密为由起诉企业。 检方表示，半导体技术"是台湾产业的生命线"，窃取行为威胁台湾芯片企业的国际竞争力。 长期以来，台湾许多人将该岛在先进芯片制造领域的主导地位视为"硅盾"，可以威慑声称对台湾拥 有主权的中国采取军事行动。 特朗普政府第一任期内的美中贸易战以及新冠疫情凸显了全球对台湾先进芯片的依赖程度。中国、 美国、韩国和日本已投入数十亿美元扶持本土芯片制造商，这些企业大多使用相同的供应商，并多 次挖角台湾工程师。 台湾法务部检察官刘怡君表示，这一切促使台湾立法者扩大了 ...

Core Viewpoint - TSMC is considering advancing its chip production technology at its second factory in Japan to meet the demand for AI-related products, which may lead to construction delays and design changes [3][4]. Group 1: Factory Development - TSMC's second factory in Kumamoto, Japan, which began construction in late October, is now contemplating a shift to 4nm process technology, moving away from the initially planned 6nm and 7nm chips [3]. - The construction of the Kumamoto factory has reportedly been paused, with heavy machinery cleared from the site by early December [3]. - TSMC has informed suppliers that it will not add equipment to its existing factory in Kumamoto until at least 2026, as demand for 6nm and 7nm chips has decreased [4]. Group 2: Market Demand and Technology Shift - The demand for 6nm and 7nm chips has declined, impacting TSMC's production capacity utilization at its main facility in Taichung, Taiwan [4]. - TSMC has a history of adjusting its construction plans based on market demand, as seen with its facility in Kaohsiung, which shifted from mature processes to advanced 2nm technology [4]. - TSMC is also considering introducing advanced chip packaging technology in Japan, which is crucial for AI chip manufacturing [5]. Group 3: Partnerships and Support - TSMC's projects in Japan are supported by companies such as Sony Semiconductor Solutions, Denso, and Toyota [5].

Core Viewpoint - Taiwan Semiconductor Manufacturing Company Limited (TSMC) is recognized as a leading AI stock, with Bernstein SocGen Group raising its price target to $330.00 from $290.00 while maintaining an "Outperform" rating, citing TSMC's quality as a compounder driven by CoWoS ramp, AI demand, and pricing power across nodes [1]. Group 1: Revenue Growth Drivers - Increased CoWoS (Chip on Wafer on Substrate) capacity is projected to be a significant driver for revenue growth towards TSMC's 5-year AI target, with capacity expected to reach 125K wpm by the end of 2026, contributing to a total CoWoS capacity of 1,250K per year in 2026 [2]. - Bernstein anticipates TSMC's revenue to grow by 23% this year and 20% in 2027, supported by improving mature-node demand and price increases on N3/5 nodes, which will bolster smartphone revenue [3]. Group 2: Financial Projections - Bernstein has set a 1-year price target of NT$1,800.00 based on a 20x forward P/E ratio, projecting revenue slightly above consensus, margins slightly below, but EPS 5% above consensus, reinforcing TSMC's position as a quality compounder and a core holding for investors [4].