Investment Rating - The report maintains a "Strong Buy" rating for the company, expecting it to outperform the benchmark index by over 20% in the next six months [2][21]. Core Views - The company achieved record high operating performance in 2024, with revenue reaching 3.406 billion yuan, a year-on-year increase of 35.82%, and a net profit of 1.023 billion yuan, up 41.40% year-on-year [5][6]. - The company is actively advancing new product and business layouts, particularly in the AI-driven advanced packaging market, which is projected to grow significantly [5][6]. - The company has successfully increased its market share and sales scale in CMP products, enhancing its core competitiveness through increased R&D investment and production capacity [5][6]. Financial Performance - In 2024, the company reported total revenue of 34.06 billion yuan, with a year-on-year growth of 35.82%, and a net profit attributable to shareholders of 10.23 billion yuan, reflecting a year-on-year increase of 41.40% [5][6]. - For Q1 2025, the company achieved revenue of 9.12 billion yuan, a year-on-year increase of 34.14%, and a net profit of 2.33 billion yuan, up 15.47% year-on-year [5][6]. - The company’s earnings per share (EPS) are projected to be 5.70 yuan in 2025, 7.15 yuan in 2026, and 8.36 yuan in 2027 [6][7]. Market Position and Strategy - The company is focusing on the development of new products and technologies, achieving significant results in CMP equipment, thinning equipment, and other product lines [5][6]. - The company has completed the construction of new production bases to support its platform strategy, enhancing its production scale and competitiveness [5][6]. - The global advanced packaging market is expected to grow from 37.8 billion USD in 2023 to 69.5 billion USD by 2029, with a compound annual growth rate of 10.7%, presenting significant opportunities for the company [5][6].

来源： 硅芯科技官微 硅芯科技自研3Sheng Integration Platform，实现三维堆叠芯片的系统级规划、物理实现与分 析、可测性与可靠性设计等，集成"系统-测试-综合-仿真-验证"五引擎合一，具有统一数据底 座，支持三维异构集成系统的敏捷开发与可定制化的协同设计优化，并在多个功能和性能上具有 独创性。 直面需求 3月在HiPi联盟大会，已听到 多位业内顶级设计专家发声Chiplet和3D IC对设计和EDA挑战。 近年来国内设计三维异构集成芯片的困扰似乎集中于设计出的堆叠结构，却在仿真和验证以后 仍然发现诸多问题！于是 "缺乏架构设计，急需设计协同和优化，设计要素全线左移" 已经成 为了业界对三维芯片堆叠设计的共识！ 要做一个设计，初心始于SoC的迭代，如果没有架构设计，严格说是能融合支持IP划分、工艺 选择、版图探索、前仿真、互连检查与优化、基于电源和热的物理实现、跨Die物理签核的多 点协同设计的架构设计和早期分析工具，那这样的设计通常会南辕北辙。 在近期硅芯科技的行业分享讲座上，创始人赵毅博士 基于业界3D IC设计遇到的问题 做了又 一轮的总结。其中提到：顶层架构对于应用场景、有效探索 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 今天，英特尔举办了晶圆代工大会，会上公司指出，正在与主要客户洽谈即将推出的14A工艺 节点（相当于1.4纳米），该节点是18A工艺节点的后续产品。英特尔已有多家客户计划流片 14A测试芯片。英特尔还透露，公司至关重要的18A节点目前已进入风险生产阶段，并计划于 今年晚些时候实现量产。 英特尔新的18A-P扩展节点（18A节点的高性能变体）目前正在晶圆厂早期生产。此外，该公司正 在开发一种新的18A-PT变体，该变体支持带有混合键合互连的Foveros Direct 3D，使该公司能够 在其最先进的前沿节点上垂直堆叠芯片。 在英特尔的新方案中，Foveros Direct 3D 技术是一项关键的进展，因为它提供了竞争对手台积电 （TSMC）已在生产中使用的功能，最著名的是 AMD 的 3D V-Cache 产品。事实上，英特尔的实 现在关键互连密度测量方面与台积电的产品不相上下。 在成熟节点方面，英特尔代工厂目前已在晶圆厂中完成其首个 16nm 生产流片，并且该公司目前 还在与联华电子合作开发的 12nm 节点吸引客户。 接下来，我们来看一下这家巨头的晶圆代工最新路线图 ...

Investment Rating - The investment rating for the company is "Buy-A" with a target price of 30.65 CNY per share [5]. Core Views - The company reported a revenue of 23.882 billion CNY in 2024, representing a year-on-year increase of 7.24%, and a net profit of 678 million CNY, up 299.9% year-on-year [1]. - In Q1 2025, the company achieved a revenue of 6.092 billion CNY, a year-on-year increase of 15.34%, and a net profit of 101 million CNY, up 2.94% year-on-year [1]. - The overall gross margin for 2024 was 14.84%, an increase of 3.18 percentage points year-on-year, with a net profit margin of 3.31%, up 2.34 percentage points year-on-year [2]. Summary by Sections Financial Performance - The company’s revenue and net profit for 2024 were 238.82 billion CNY and 6.78 billion CNY, respectively, with significant growth in net profit due to improved operational efficiency and cost control [1][2]. - For Q1 2025, the company reported a revenue of 60.92 billion CNY and a net profit of 1.01 billion CNY, indicating a positive trend in financial performance [1]. Market and Industry Trends - The industry is experiencing a recovery driven by demand in data centers, automotive electronics, and consumer electronics, contributing to the company's improved market conditions [2]. - The company has seen a notable increase in revenue from mid-to-high-end products, with a significant rise in capacity utilization and effective cost management [2]. Product and Business Development - The company has diversified its product offerings, achieving a 46% increase in revenue from high-end mobile SOCs and a 70% increase in revenue from RF products [3]. - The automotive sector has shown exceptional growth, with revenue from power devices, MCUs, and smart cockpit products surging over 200% [3]. - The company’s Memory business grew by 40% due to enhanced collaboration with original manufacturers, and the display driver business successfully introduced advanced cutting processes [3]. Capacity Expansion and Acquisitions - The company is accelerating its global capacity expansion, with ongoing projects in various locations aimed at enhancing high-end packaging capacity [8]. - The acquisition of a 26% stake in Jinglong Technology is expected to strengthen the company's position in the high-end IC testing sector, providing stable financial returns [8].

Investment Rating - The report maintains a "Recommended" investment rating for the company [1][5][13] Core Views - The demand for advanced packaging-related products is increasing, leading to stable growth in the company's performance. In 2024, the company achieved a revenue of 432 million yuan, a year-on-year increase of 20.04%, and a net profit attributable to shareholders of 33.48 million yuan, up 2.51% year-on-year [4][5] - The company's revenue growth is supported by the overall recovery in industry demand, particularly for advanced packaging products, and the company's technological advantages in core products such as electroplating solutions and photoresists [5][8] - The company is expanding its market share in the advanced packaging sector and has made significant investments in R&D, with R&D expenses increasing by 40.42% year-on-year, which has impacted profit margins [5][8] Financial Performance Summary - In 2024, the company reported a revenue of 432 million yuan, with a gross margin of 26.42% and a net margin of 7.75%. The revenue for Q1 2025 was 126 million yuan, reflecting a year-on-year growth of 54.13% [4][5][6] - The company's revenue structure shows that sales of electroplating solutions and related reagents reached 196 million yuan in 2024, a 9.67% increase year-on-year, while photoresists saw a 37.68% increase in sales to 95 million yuan [8] - The company is positioned as a leading supplier in the domestic traditional packaging sector and is expanding into other application areas, including passive components, PCBs, advanced packaging, and wafer manufacturing [8] Future Projections - The company is projected to achieve revenues of 573 million yuan in 2025, 735 million yuan in 2026, and 926 million yuan in 2027, with corresponding net profits of 47 million yuan, 72 million yuan, and 106 million yuan respectively [6][11] - The expected EPS for 2025, 2026, and 2027 are 0.53 yuan, 0.82 yuan, and 1.20 yuan, respectively, indicating a positive growth trajectory [6][11] Market Position and Strategy - The company is focusing on expanding its product line in the advanced packaging sector and has successfully launched several products for mass production, which are widely used in various processes [8] - The company aims to enhance its market share in the advanced packaging and wet electronic chemicals market, driven by the expansion wave among domestic manufacturers [8][11]

Investment Rating - The report maintains a "Buy" rating for the company with a target price of 46.74 RMB [4][7][8] Core Views - The company reported a revenue of 9.335 billion RMB in Q1 2025, representing a year-on-year growth of 36.44% but a quarter-on-quarter decline of 15.01%. The gross margin was 12.63%, up 0.43 percentage points year-on-year but down 0.71 percentage points quarter-on-quarter. The net profit attributable to shareholders was 203 million RMB, a year-on-year increase of 50.39% but a quarter-on-quarter decrease of 61.86% [1][2] - The growth in revenue and profit is primarily attributed to the consolidation of Shengdi Semiconductor and an increase in orders from the advanced packaging market both domestically and internationally. The company is optimistic about future performance driven by new capacity releases and the ramp-up of advanced packaging business [1][2][3] Summary by Sections Financial Performance - In Q1 2025, the company focused on advanced technologies and key application markets, achieving significant revenue growth in computing electronics (92.9%), automotive electronics (66.0%), and industrial and medical electronics (45.8%). This optimization in business structure contributed to a gross margin increase [2] - The company completed the acquisition of Shengdi Semiconductor, which reported a revenue of 799 million RMB and a net profit of 94 million RMB in Q4 2024. The consolidation of Shengdi has positively impacted the company's Q1 2025 performance [2] Market Outlook - The global semiconductor market is expected to grow by 19% to 627 billion USD in 2024, which will drive an 8% growth in the global packaging and testing market to 82 billion USD. The report is optimistic about the recovery of the semiconductor market and structural growth in AI-related fields [3] - The company is actively expanding its production capacity, with a new automotive electronics packaging production base in Shanghai expected to commence operations in the second half of 2025. The company is also set to benefit from high-performance computing, AI, and automotive electronics demand [3] Valuation Metrics - The report forecasts net profits for 2025, 2026, and 2027 to be 2.04 billion RMB, 2.38 billion RMB, and 2.90 billion RMB respectively, with corresponding EPS of 1.14 RMB, 1.33 RMB, and 1.62 RMB. The company is assigned a 2025 PE ratio of 41.0x, which is a premium compared to the industry average of 33.5x due to its leading position in advanced packaging technologies [4][6]

Core Insights - The company reported a revenue of 390 million yuan for Q1 2025, representing a year-on-year increase of 22.49%, but incurred a net loss of 220 million yuan [1] - The gross margin improved to 39.06% in Q1 2025 from 33.34% in Q4 2024, indicating better cost management or pricing power [1] - The company continues to invest heavily in R&D, with an expenditure of 1.247 billion yuan planned for 2024 and 300 million yuan spent in Q1 2025 [1] Revenue Breakdown - Revenue from downstream sectors such as system manufacturers, internet companies, cloud service providers, and automotive companies accounted for 37.3% of total revenue [3] - Consumer electronics revenue saw a significant year-on-year increase of 103.81%, making up 44.12% of total revenue [3] - Chip design business revenue reached 122 million yuan, up 40.75%, with 89.05% of this from 28nm and below process nodes [3] Business Segments and Growth Areas - The company is focusing on AIGC, data centers, intelligent driving systems, smart wearable devices, IoT, and Chiplet technologies [3] - In the AIGC sector, the company has 82 clients and 142 chip applications across various devices [3] - The automotive electronics segment has made strides in cockpit and autonomous driving technologies, with multiple IPs adopted by automotive chip companies [3] Investment Outlook - The company is positioned as a leading IP and custom chip service provider, expected to benefit from trends in cloud-side AI, edge AI, autonomous driving, and advanced packaging [4] - Revenue projections for 2025 to 2027 are 2.902 billion yuan, 3.512 billion yuan, and 4.32 billion yuan respectively, with net losses expected to decrease over the same period [4] - The target price is set at 104.3 yuan, based on an 18x PS for 2025, maintaining an "Accumulate-A" investment rating [4]

Investment Rating - The report assigns a "Buy" rating for the company, indicating a positive outlook for its stock performance [1][7]. Core Insights - The company is expected to experience a fruitful year in 2025, driven by multiple business segments resonating positively [1]. - The report highlights significant growth in various business areas, particularly in the automotive and semiconductor sectors, while acknowledging short-term challenges in lithium battery equipment [5][6]. Financial Performance Summary - In 2024, the company achieved revenue of 585 million, a year-on-year increase of 11.3%, and a net profit of 86 million, up 29% [4]. - The fourth quarter of 2024 confirmed a performance turnaround with revenue of 176 million, a year-on-year increase of 153%, and a net profit of 65 million, marking a significant recovery [4]. - For Q1 2025, the company reported revenue of 148 million, a year-on-year increase of 22%, and a net profit of 24 million, reflecting a substantial improvement of 2152% [4]. Business Segment Analysis - **New Energy Battery Equipment**: Revenue expected to decline by 53.48% in 2024 due to slower expansion in the lithium battery sector [5]. - **Wire Harness Equipment**: Revenue projected to grow by 352% in 2024, driven by opportunities in the new energy vehicle market [5]. - **Semiconductor Equipment**: Revenue anticipated to increase by 196% in 2024, showcasing strong growth in this segment [5]. - **Accessories**: Revenue expected to rise by 70% in 2024, supported by increased utilization of existing equipment [5]. - **Services and Others**: Revenue projected to grow by 129% in 2024, reflecting rapid growth in automation solutions [5]. Future Outlook - The company is poised for recovery in its lithium battery equipment business in 2025, with continued high growth in wire harness and accessories [6]. - The report anticipates significant revenue growth from 2025 to 2027, with projected revenues of 767 million, 1.074 billion, and 1.439 billion respectively, alongside net profits of 186 million, 275 million, and 375 million [8][9]. - The company is expected to benefit from advancements in semiconductor packaging and medical device sectors, positioning itself as a leading ultrasonic technology platform [6][7].

以下为研究报告摘要： 中银证券近日发布化工行业周报：本周（04.21-04.27）均价跟踪的100个化工品种中， 共有17个品种价格上涨，58个品种价格下跌，25个品种价格稳定。跟踪的产品中29%的产品 月均价环比上涨，64%的产品月均价环比下跌，另外7%产品价格持平。周均价涨幅居前的 品种分别是高效氯氟氰菊酯、聚合MDI（华东）、石脑油（新加坡）、R134a（巨化）、双 酚A（华东）；而周均价跌幅居前的品种分别是NYMEX天然气、维生素A、DMF（华 东）、煤焦油（山西）、丙烯腈。 四月份，行业受关税相关政策、原油价格大幅波动等因素影响较大，建议关注年报季报 行情，自主可控日益关键的电子材料公司，以及分红派息政策稳健的能源企业等。 投资建议 截至4月27日，SW基础化工市盈率（TTM剔除负值）为21.45倍，处在历史（2002年至 今）的56.30%分位数；市净率为1.76倍，处在历史水平的8.83%分位数。SW石油石化市盈率 （TTM剔除负值）为10.41倍，处在历史（2002年至今）的9.89%分位数；市净率为1.16倍， 处在历史水平的0.93%分位数。四月份，行业受关税相关政策、原油价格大幅波动等因 ...

Core Viewpoint - The company, Jiao Cheng Ultrasonic (688392), has shown significant growth in its first quarter of 2025, with a notable increase in revenue and net profit, driven by a favorable product mix and strategic market expansions. Financial Performance - In Q1 2025, the company reported a revenue of 148 million yuan, representing a year-on-year increase of 22.35% [12] - The net profit attributable to shareholders reached 23.63 million yuan, a staggering increase of 2152.47% year-on-year [12] - The gross profit margin for the first quarter was 64.91% [12] Product and Market Insights - The increase in gross margin is attributed to a shift in product mix, with higher-margin products like wire harness connectors and semiconductor equipment gaining a larger share of revenue [2] - The primary revenue sources in Q1 2025 were ultrasonic equipment for wire harness connectors, new energy battery applications, and accessory business [3] - The company is optimistic about the wire harness connector and semiconductor sectors, expecting continued high demand due to established technology and market presence [4] Advanced Packaging and Medical Sector Developments - The company has made progress in the advanced packaging sector, with its advanced wafer ultrasonic scanning microscope receiving validation orders from well-known industry clients [5] - In the medical field, the company is advancing its ultrasonic dental equipment, which is expected to achieve sales within the year [6] Production Capacity and Expansion Plans - The company is currently operating at full capacity and is expanding production through the acquisition of precision manufacturing equipment [7] - Plans for overseas market expansion are underway, particularly targeting Europe with established products like ultrasonic equipment for wire harnesses and semiconductors [8] Strategic Collaborations - The company has signed a cooperation agreement with Shanghai Jiao Tong University to establish a joint laboratory focusing on advanced packaging and intelligent robotics, aiming to break foreign technology monopolies [11] Market Outlook - The company’s ultrasonic welding equipment in the power semiconductor sector is projected to see an annual market demand increase of approximately 500 to 1,000 million yuan [10] - The company is also exploring new applications for ultrasonic technology in aerospace and composite materials [11]