国芯网[原:中国半导体论坛] 振兴国产半导体产业！ 此次减持华虹半导体后，大基金仍通过参与中芯国际定增、华虹半导体科创板IPO保持战略影 响力。 华虹在特色工艺（如IGBT、嵌入式闪存）也仍具国际竞争力，其无锡12英寸厂产能利用率长 期保持在90%以上，市场预计2026年毛利率回升。 不拘中国、 放眼世界 ！ 关注 世界半导体论坛 ↓ ↓ ↓ 6月18日消息，香港交易所信息显示，国家集成电路产业投资基金（以下称大集基金）减持华 虹半导体633.3万股，持股比例从6.16%降至5.94%。 2021年大基金首次对华虹半导体减持，此后，减持行动持续，多次引发华虹半导体股价波 动。 2025年5月9日，大基金通过鑫芯（香港）投资有限公司减持华虹半导体633.3万股，同时减 持中芯国际6597.72万股，同时中国国有企业结构调整基金二期也大幅减持华虹公司1237.96 万股，华虹半导体股价应声下跌超11%。 而2025年一季度，华虹半导体营收同比增长18.66%至39.13亿元，但净利润仅剩2276万 元，同比骤降89.73%。 不过，业界认为，本次减持并非否定华虹半导体企业价值，但也确实反映了大基金对成熟制程 赛道 ...

Core Viewpoint - Honda plans to invest in Rapidus, a semiconductor startup aimed at revitalizing Japan's semiconductor industry, signaling a strategic shift in the automotive semiconductor landscape [1][2]. Group 1: Strategic Considerations for Honda - Honda's partnership with Rapidus is driven by three strategic considerations, including the need for supply chain stability and the potential for self-sufficiency in semiconductor production [1]. - The automotive industry is increasingly reliant on semiconductors, with their value in vehicles rising annually, prompting manufacturers to strengthen their control over chip production [1][2]. Group 2: Challenges and Opportunities for Rapidus - Rapidus aims to develop 2nm GAA technology, bypassing mature processes like 28nm, which reflects both technological ambition and governmental support for Japan's semiconductor industry [2][3]. - The current stage of Rapidus is still in prototype development, with significant technical and manufacturing challenges ahead before achieving mass production by 2027 [2][3]. Group 3: Implications for the Japanese Automotive and Semiconductor Ecosystem - If Rapidus successfully achieves stable mass production of its 2nm technology, it could reduce Honda's reliance on overseas foundries and enhance its competitive edge in specific applications like autonomous driving and edge computing [3]. - The collaboration between Honda and Rapidus represents a shift from policy-driven initiatives to industry-driven demands, potentially establishing a robust domestic semiconductor ecosystem in Japan [2][3].

晨 会 纪 要 [2025]第 108 号 主 题：对近期重要经济金融新闻、行业事件、公司公告等进行点评 时 间：2025 年 6 月 17 日 8:50-9:30 会议形式：腾讯会议 参会人员：曹旭特 朱毅 仇华 许雯 王攀 蒋栋 张德燕 轩鹏程 文正平 李杰 王文瑞 张智珑 郭怡萍 何超 李育文 李正威 别璐莎 邢维洁 王逸奇 孙菲 马丽明 贺钰偲 汪炜 聂孟依 顾华昊 整理记录：李正威 研究所今日晨会要点如下: 一、行业公司 1、中药行业（许雯） 核心要点： 市场表现：上周中药Ⅱ下跌0.32%，医药板块涨跌互现，中药表现相对较弱 根据wind数据，上周（2025.06.08-2025.06.14）医药生物报收7895.79点，上涨1.4%；中 药Ⅱ报收6410.24点，下跌0.32%；化学制药报收12686.19点，上涨3.53%；生物制品报收6212.51 点，上涨0.33%；医药商业报收5099.4点，下跌0.83%；医疗器械报收6147.18点，下跌0.52%； 医疗服务报收5403.37点，上涨2.42%。医药二级子板块涨跌互现，化学制药表现最好，中药 表现相对较弱。 根据wind数据，上周中药 ...

Core Viewpoint - The article discusses the current state and future directions of photomask manufacturing, emphasizing the importance of curved masks and advanced computational tools in extending the viability of non-EUV lithography technologies [1][3][4]. Group 1: Innovations in Photomask Technology - The use of curved photomasks is a significant innovation that leverages current writing technologies to create complex shapes previously unattainable [3]. - Advanced computational tools, such as Mask Process Correction (MPC) and high-level simulations, are increasingly used in the mask design flow, reducing the need for expensive experiments and pushing technological limits [3][6]. - The evolution of variable shape beam (VSB) writing technology to multi-beam writing technology has made curved mask shapes feasible without increasing writing time or costs [5]. Group 2: Challenges and Infrastructure Needs - There is a substantial need for infrastructure development to support the complexity of curved shapes, as traditional rectangular descriptions are simpler to manage [8]. - The transition to curved processes is seen as an exception rather than the norm, impacting economics and infrastructure, particularly in the reliance on GPU-based computing [9]. - Measurement technologies must evolve to handle the complexities of curved shapes, requiring higher resolution and faster measurement tools [11]. Group 3: EUV Masking Issues - EUV masks face challenges such as lower durability compared to 193i masks, necessitating frequent replacements that increase costs and complexity [13]. - The performance of EUV pellicles is currently suboptimal, leading to significant wafer throughput losses due to energy loss during transmission [13][15]. - The balance between using pellicles and the associated costs is contingent on the specific use case, with larger, high-value chips benefiting more from pellicles than smaller, redundant designs [16]. Group 4: Future Directions and Research - Research is ongoing into alternative materials for pellicles, such as carbon nanotube films, which could address current limitations but are not yet in mass production [17]. - The industry is exploring ways to improve the durability and transmission rates of EUV pellicles, which could lead to broader applications if successful [15][16].

Core Viewpoint - The article discusses the evolving challenges and innovations in photomask manufacturing, particularly focusing on the shift towards curved mask designs and the implications for lithography technology [2][3][4]. Group 1: Innovations in Photomask Technology - The use of curved masks is identified as a significant innovation that enhances the capabilities of current writing technologies, allowing for more complex shapes that were previously unattainable [3]. - Advanced computational tools, such as Mask Process Correction (MPC) and high-level simulations, are increasingly utilized in the mask design process, reducing the need for expensive experiments and pushing technological boundaries [3][5]. - The transition to curved mask designs is seen as a way to improve device performance without the need for new exposure equipment, even in older wafer fabs [3][4]. Group 2: Challenges in Implementation - The industry faces substantial infrastructure challenges when transitioning from rectangular to curved designs, as the complexity of defining and adjusting curved shapes is significantly higher [6][7]. - Measurement techniques need to evolve to accommodate the full 2D profiles of curved masks, requiring higher resolution and faster measurement tools [9]. - The current reliance on CPU-based workflows in many mask shops limits the adoption of GPU-based processes that are essential for curved mask technology [7][8]. Group 3: EUV Masking Issues - EUV masks face durability challenges, requiring frequent replacements that add to costs and complexity, with some needing replacement weekly [10][11]. - The performance of EUV protective films is currently suboptimal, leading to significant wafer throughput losses due to energy loss during the masking process [10][12]. - The balance between using protective films and the associated costs is contingent on the specific application, with larger, high-value chips benefiting more from protective measures compared to smaller, redundant designs [11][13]. Group 4: Future Directions - The industry is exploring alternative materials, such as carbon nanotube films, to address the limitations of current DGL films used in EUV applications, although these alternatives still face challenges [14]. - Continuous research and development are necessary to improve the performance and durability of EUV masks, as well as to streamline the processes involved in their maintenance and replacement [12][14].

证券研究报告：电子 | 公司点评报告 股票投资评级 买入 |维持 个股表现 2024-06 2024-08 2024-11 2025-01 2025-04 2025-06 -29% -20% -11% -2% 7% 16% 25% 34% 43% 52% 华虹公司 电子 资料来源：聚源，中邮证券研究所 公司基本情况 | 最新收盘价（元） | 46.78 | | --- | --- | | 总股本/流通股本（亿股）17.26 | / 3.91 | | 总市值/流通市值（亿元）808 | / 183 | | 52 周内最高/最低价 | 60.28 / 27.08 | | 资产负债率(%) | 28.7% | | 市盈率 | 212.64 | | | 香港中央结算(代理人) | | 第一大股东 有 | 限 公 司 (HKSCC | | NOMINEES | LIMITED) | 研究所 分析师:吴文吉 SAC 登记编号:S1340523050004 Email:wuwenji@cnpsec.com 华虹公司(688347) 我 们 预 计 公 司 2025/2026/2027 年 分 别 实 现 收 入 166.9 ...

| 【数字经济周报】高通 24 亿收购 SerDes IP 巨头 | 产业研究中心 | | | --- | --- | --- | | Alphawave | 3 | 朱峰(分析师) | | 摘要:数字经济动态事件速览 第 18期(2025.06.07-2025.06.13) | 8 | 021-38676666 | | o 半导体板块动态: | 登记编号 | S0880522030002 | | 1)高通24亿收购 SerDes IP 巨头 Alphawave | | | | 2）世界首台非硅二维计算机问世:有助造出更薄更快更节能电子产品 | | 鲍雁辛(分析师) | | 3 ) AMD: 发布基于 CDNA 4 架构的 Instinct MI350 系列 GPU | CS | | | 4)美光:追加美国制造投资至2000亿美元 | 2 | 021-38676666 | | ○ 汽车电子板块动态 | 登记编号 | S0880513070005 | | 1）广汽集团:高域 AirCab 飞行汽车全球首发 | | | | 2)蔚来在重庆区域已成功实现"换电县县通"网络建设目标 | | | | 3）零跑汽车 C1 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 玻璃中介层支持嵌入基板的芯粒与直接堆叠于顶部的芯粒（chiplets）之间的3D堆叠，这是硅中 介层无法实现的。在本研究中，我们通过关键系统级指标（包括面积、线长、信号完整性、电源 完整性和热完整性）论证了玻璃中介层相较于硅中介层在这种堆叠方式下的优势。我们利用芯粒 和中介层的GDS版图设计以及签核仿真实现了这一目标。 实验表明，玻璃中介层相比硅中介层可实现2.6倍的面积优化、21倍的线长缩短、全芯片功耗降 低17.72%、信号完整性提升64.7%、电源完整性改善10倍，但温度会升高15%。 引言 如今及未来，提升高复杂度系统良率的一个可行方法是将系统划分为"芯粒"。这些芯粒需集成以构成 完整系统。根据物理结构，芯粒集成有两种类型：2.5D中介层集成和3D堆叠集成。2.5D集成因允许 在中介层上集成多个现成芯粒或复用不同技术节点的知识产权 (IP)（异构集成），成为颇具吸引力的 选择。在2.5D集成中，芯粒以倒装芯片方式并排置于中介层封装顶部，如图1 (a) 所示。此外，它们 通过再分布层 (RDL) 连接，RDL是无源中介层基板上的金属层，用于提供芯粒间的横向 ...

北交所策略专题报告 2025 年 06 月 15 日 北交所打新策略：募资规模提升，中签率迎来改善窗口 北交所研究团队 ——北交所策略专题报告 诸海滨（分析师） zhuhaibin@kysec.cn 证书编号：S0790522080007 专题：2025 年 Q2 北交所过会提速，募资规模提高或改善中签率 从发审会节奏上来看，截至 2025 年 6 月 13 日，2025 年 1-6 月北交所合计过会 9 家企业，2025 年 2 季度开始，随着申报企业补充 2024 年报数据的结束，北交所 上市节奏或提升。北交所打新高热度，从 2024 年三季度末开始，随着北交所市 场逐步活跃，2025 年 1-6 月北交所网上发行有效申购户数均值达 46.01 万户，网 上冻结资金均值达 4752 亿元。募资规模提高或改善中签率，2024 年-2025 年 6 月 13 日期间北交所合计上市 28 家企业，中签率均值达 0.09%，其中首发募集资 金超过 2 个亿企业的平均中签率在 0.14%，首发募集低于 2 个亿企业的平均中签 率在 0.06%。募资规模方面，2025 年 1-6 月北交所单家企业平均募集资金达 3. ...

全球碳化硅市场爆发，国产厂商加速突围 据弗若斯特沙利文预测，全球碳化硅功率器件市场规模将从2024年的227亿元增至2029年的1106亿元， 年复合增长率达37.3%。中国作为全球最大新能源汽车市场，碳化硅渗透率有望从2024年的6.5%提升至 2029年的20.1%。 三年亏损8.2亿，研发投入与产能扩张成双刃剑 尽管营收高速增长，基本半导体仍未摆脱亏损泥潭。2022-2024年，公司归母净利润分别亏损2.42亿 元、3.42亿元、2.37亿元，三年累计亏损8.21亿元。毛利率从2022年的-48.55%提升至2024年的-9.69%， 但仍未转正。 亏损主因在于高研发投入与产能扩张成本。2022-2024年，公司研发开支分别为0.59亿元、0.76亿元、 0.91亿元，占营收比重达50.8%、34.4%、30.5%。截至2024年底，公司持有163项授权专利及122项专利 申请，研发团队占比达28.9%。此外，公司正在运营光明生产基地、无锡生产基地、坪山测试基地三个 生产基地，并在坪山、中山新建两个生产基地，预计分别于2027年末及2026年末投产，彼时公司产能将 大幅提升。 2025年5月27日，中国 ...