来源：内容转自 TrendForce，谢谢 。 根据TrendForce集邦咨询最新调查，2025年第一季因国际形势变化促使终端电子产品备货提前启 动，以及全球各地兴建AI数据中心，半导体芯片需求优于以往淡季水平，助力IC设计产业表现。 第一季前十大无晶圆IC设计业者营收合计季增约6%，达774亿美元，续创新高。 以下文章来源于TrendForce集邦 ，作者TrendForce TrendForce集邦 . TrendForce集邦咨询是一家全球高科技产业研究机构，研究领域横跨存储器、AI服务器、集成电路与半 导体、晶圆代工、显示面板、LED、AR/VR、新能源（含太阳能光伏、储能和电池）、AI机器人及汽 车科技等，提供前瞻性行业研究报告、产业分析 如果您希望可以时常见面，欢迎标星收藏哦~ | (unit: US$M) | | --- | | Ranking | Company | | Top 10 Fabless Revenue | | Revenue Performance | | Top 10 Revenue Share | | --- | --- | --- | --- | --- | --- | ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源 ：内容编译自 japantimes 。 东京大学和台积电开设了一个研究实验室，他们将共同研究芯片相关技术并支持教育和研发机会。 台积电执行副总裁 YJ Mii 周四在东京大学举行的新闻发布会上表示："今天对台积电来说是一个 里程碑，因为这标志着我们与中国台湾以外的大学建立了第一个联合实验室。" 他们当时强调，开发节能专用半导体而非通用芯片的重要性，因为随着人工智能处理需求的增长， 数据量将进一步增加。 该大学和芯片制造商表示，该项目将主要侧重于研究、教育和人才孵化。在芯片领域，他们将致力 于材料、器件和设计的研究。他们还计划开展芯片原型设计教育。 东京大学工程研究生院教授池田诚表示，过去几年，美国和欧洲的大学一直在加大芯片原型教育力 度。 "我认为东京大学在这方面已经相当落后了。从这个意义上来说，我希望利用这样的机会赶上世 界，甚至超越世界，"将担任新实验室联合主任的池田说道。 东京大学校长藤井照夫 ( 左 ) 与台积电执行副总裁三井英机 (YJMi) 周四出席新闻发布会 YJ Mii表示，由于日本与中国台湾地理位置接近，台积电与该大学将能够有效沟通并顺利共享资 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 转载自快科技 。 全球首款L3级算力的AI汽车小鹏G7已于昨晚开启全球首秀预售。预售仅46分钟，小鹏G7小订就突 破了10000台。 参考链接 https://news.mydrivers.com/1/1053/1053404.htm 点这里加关注，锁定更多原创内容 今日，小鹏G7也在香港车博会上亮相，引发大量用户围观。车辆最核心的亮点就是首发搭载了小 鹏自研的图灵AI芯片，并且一次性用上了三颗，带来了行业首个L3级算力平台。 在媒体提问下，何小鹏现场揭秘G7的三颗图灵芯片位置在哪里。 何小鹏打开小鹏G7车门后介绍，芯片加上内存后，被包装在域控制器里面。在车辆中控扶手下方 的域控制器内，配备有两颗图灵芯片，是用来跑自动驾驶的；副驾手套箱里面，还有一颗图灵芯 片，是负责语音控制和整车大脑。 据了解，小鹏自研图灵AI芯片拥有40核处理器、最高30B可运行模拟参数、2xNPU自研神经网络 处理大脑、DSA集成神经网络特定领域架构、2个独立图像ISP，拥有超2000Tops全本地算力支 撑。 目前行业主流算力约在80～700TOPS，但小鹏G7直接把行业旗舰的算力 ...

Core Insights - The STM32 series from STMicroelectronics has established itself as a benchmark in the MCU/MPU market, with over twenty series developed since its launch in 2007, recognized for high performance, low power consumption, and ease of development [1][3] - STMicroelectronics plans to introduce 18 new product lines utilizing embedded non-volatile memory technology at 40nm and below by 2025-2026, aiming to double the proportion of products from advanced process nodes in the STM32 product line by 2025-2027 [4][6] Group 1: Market Position and Strategy - STMicroelectronics has maintained its leading position in the general microcontroller market, with market share continuing to grow since Q2 2024 [3] - The company has adopted a "In China, For China" strategy to enhance its local supply chain and manufacturing capabilities, including a joint venture with Sanan Optoelectronics for SiC production in Chongqing [6][7] Group 2: Product Development and Innovation - The STM32C0 series, launched in January 2023, offers the lowest price point in the STM32 lineup while providing superior performance compared to existing 8-bit architectures [11][12] - The STM32C0 series is designed to replace mid-to-high-end 8-bit platforms, featuring a 90nm process and Cortex M0+ core with a maximum frequency of 48MHz [12][15] - The STM32U3 series, recognized as the most energy-efficient MCU on the market, significantly extends battery life and enhances security features compared to its predecessor, STM32L4 [22][24] Group 3: Collaboration and Supply Chain - STMicroelectronics collaborates with Huahong Semiconductor for front-end manufacturing, ensuring consistent product quality across domestic and international production [7][9] - The first product from this collaboration, a 40nm MCU, is expected to enter mass production by the end of 2025, with dual supply chain options for wafer manufacturing [8][9] Group 4: Ecosystem and Development Tools - The STM32 ecosystem is a key asset, providing developers with tools like STM32CubeMX and STM32CubeIDE for easy project setup and configuration [17][30] - The introduction of the STM32WBA6 wireless MCU supports multiple wireless protocols, enhancing its applicability in smart home and industrial sensor applications [44][46] Group 5: Future Directions - STMicroelectronics plans to expand its MPU product line with the STM32MP23 series, which offers optimized costs and enhanced performance compared to the MP25 series [35][39] - The company is also set to launch a cost-optimized MP21 and a higher-performance MP27 by the end of the year, aiming to cover a wide range of industrial applications [43]

Core Viewpoint - The automotive industry is facing increasing challenges in ensuring the reliability and quality of integrated circuits and systems, particularly as vehicles become more reliant on advanced driver-assistance systems (ADAS) and software-defined functionalities [2][4][19]. Group 1: Challenges in Automotive Chip Development - The traditional development cycle for automotive chips is five to seven years, but the shift towards ADAS and complex infotainment systems has accelerated this process [2][4]. - Achieving automotive-grade quality with a defect rate below one part per million (DPPM) is a significant challenge, necessitating innovative testing methods [2][4]. - Manufacturers are under pressure to maintain low testing costs while ensuring high quality, creating a delicate balance [2][4][5]. Group 2: Advances in ADAS and Software-Defined Vehicles - ADAS has driven the automotive industry towards smaller technology nodes and more complex systems, transitioning to fully software-defined vehicles (SDVs) [4][5]. - The shift to advanced nodes below 5nm presents reliability and safety challenges, particularly for systems expected to operate for extended periods [4][5][19]. - Most new vehicles are currently at Level 2 or Level 3 automation, with increasing safety standards required for higher levels of automation [7][8]. Group 3: Testing and Quality Assurance - Automotive chips must undergo rigorous testing at three temperature extremes to simulate operational conditions, as defined by AEC-Q100 standards [9]. - Machine learning-based anomaly detection methods are increasingly used to enhance quality levels close to zero DPPM [9][10]. - Advanced fault models are being developed to better simulate common defects in silicon, improving testing accuracy [10]. Group 4: Virtual Testing and Predictive Maintenance - Virtual testing is becoming essential to reduce the complexity of real-world testing, allowing for parallel development and faster time-to-market [8][19]. - Continuous monitoring and feedback throughout the vehicle's lifecycle are critical, especially as more advanced nodes are introduced [19]. - On-chip monitoring and machine learning are being utilized to track performance degradation and predict failures [18][19]. Group 5: Future Directions in Automotive Testing - The industry is moving towards chiplet-based designs to improve yield and reuse rates while managing the complexity of advanced packaging [12][13]. - Acoustic and optical technologies are being employed to analyze inter-chip bonding characteristics, which are crucial for reliability [14]. - System-level testing is becoming a standard requirement to ensure that both hardware and software meet functional and non-functional requirements [16].

Core Viewpoint - The global semiconductor foundry market is undergoing significant shifts, with Samsung Electronics facing increasing pressure from China's SMIC, leading to a narrowing market share gap. TSMC remains the dominant player, while Samsung's position as the second-largest foundry is at risk due to various geopolitical and technological factors [1][2]. Group 1: Market Overview - According to TrendForce, the total revenue of the top ten foundries in Q1 2025 is projected to be $36.43 billion, a decrease of 5.4% from the previous quarter's $38.48 billion, attributed to seasonal market slowdowns [1][3]. - Despite the overall revenue decline, TSMC's revenue in Q1 2025 is $25.52 billion, down 5% from Q4 2024, yet its market share increased by 0.5 percentage points to 67.6%, further widening the gap with Samsung [2][3]. Group 2: Company Performance - Samsung's revenue in Q1 2025 fell significantly by 11.3% to $2.89 billion, resulting in a market share drop from 8.1% to 7.7%, primarily due to limited benefits from Chinese consumer subsidies and U.S. restrictions on advanced process nodes [4]. - In contrast, SMIC's revenue grew by 1.8% to $2.25 billion in Q1 2025, making it the only top-three foundry to achieve revenue growth, with its market share rising from 5.5% to 6%, closing the gap with Samsung to just 1.7 percentage points [5]. Group 3: Future Outlook - TrendForce forecasts a general slowdown in the global foundry market in Q2 2025, mainly due to reduced demand from tariffs. However, specific applications and policy support, such as demand driven by Chinese subsidies and high-performance computing, are expected to sustain capacity utilization among the top foundries [6].

Core Viewpoint - NVIDIA has commissioned Micron, Samsung, and SK Hynix to develop SOCAMM memory modules, with Micron surprisingly being the first to receive mass production approval, outpacing its competitors [1][2]. Group 1: SOCAMM Technology - SOCAMM is a memory module designed by NVIDIA, consisting of 16 stacked LPDDR5X chips in four groups, primarily aimed at supporting AI accelerators by ensuring peak performance [1]. - Unlike HBM, which connects DRAM through vertical drilling, SOCAMM uses wire bonding with copper wires, which helps reduce heat generation due to copper's high thermal conductivity [1]. - Micron claims its latest low-power DRAM has a power efficiency that is 20% higher than its competitors [1]. Group 2: Market Position and Innovations - NVIDIA's next-generation AI servers will feature four SOCAMM modules, equating to 256 LPDDR5X chips, indicating a significant technological advancement [2]. - Micron's later adoption of EUV exposure equipment has allowed it to supply products earlier than Samsung and SK Hynix, focusing on structural design innovations to enhance memory efficiency while minimizing heat [2]. - Micron is expected to expand its HBM market share due to its low heat generation technology, as the number of stacked DRAM chips continues to increase [3]. Group 3: Competitive Landscape - Despite entering the HBM market later, Micron's thermal management technology and geographical advantages as a U.S. company position it to catch up with competitors [3]. - Micron's capital expenditure for this year is projected to reach $14 billion, indicating potential stable orders from major clients [3].

Group 1 - The core ambition of the new South Korean president is to establish the country as the world's leading semiconductor power through overwhelming technological superiority and support for the semiconductor industry [2] - The Semiconductor Special Act is expected to be passed by mid-October, which includes provisions for talent development, up to 10% production tax credits, and R&D support [2][3] - There is uncertainty regarding the inclusion of the "52-hour workweek exception" in the Semiconductor Special Act, which has raised concerns among industry insiders about the potential impact on the semiconductor sector [3] Group 2 - The government plans to create a "K-Fabless Valley" to foster the fabless semiconductor industry, aiming to replicate the success of companies like Nvidia [4] - The focus on renewable energy policies is seen as a critical task for nurturing the AI and semiconductor industries, although there are concerns about the reliability of renewable energy sources for continuous factory operations [5][6] - Speculation exists that the government will provide renewable energy for residential use while ensuring stable power supply for semiconductor manufacturing facilities [7]

Core Viewpoint - AOSemi is a comprehensive power semiconductor supplier that integrates design, development, production, and global sales, focusing on the electric vehicle (EV) onboard charger (OBC) market [1]. Group 1: Product Overview - The AOS 6.6KW bidirectional EV onboard charger (OBC) is designed for universal single-phase input with an output voltage range of 250 VDC to 450 VDC [3]. - The OBC features a front-end composed of a totem pole bidirectional Power Factor Correction (PFC) and a bidirectional isolated DC/DC stage using a symmetrical CLLC converter [3]. - The input and output of the bidirectional isolated DC/DC stage utilize H-bridge topology, with isolation provided by a high-frequency transformer [3]. Group 2: Technical Specifications - The OBC demonstration board uses AOM040V75X2Q and AOK060V75X2Q SiC MOSFETs, rated at 750V, with on-resistances of 40mΩ and 60mΩ respectively [6]. - The input voltage range is 90 VAC to 265 VAC, providing an isolated output voltage of 250 VDC to 450 VDC [6]. - The system includes protections for input and output, such as under-voltage, over-voltage, and over-current protections [10][16]. Group 3: Performance Metrics - The OBC operates with a peak efficiency of 96% [15]. - The PFC operates at a fixed frequency of 65 kHz, while the DC/DC CLLC stage operates at approximately 200 kHz [15]. - The maximum power output is limited to 6.6 kW in AC/DC mode and 3.3 kW in DC/AC mode [16]. Group 4: Features and Functionality - The OBC supports a wide input voltage range of 85-265 VAC and a wide output voltage range of 250-450 VDC [16]. - It includes multiple fault LED displays and allows for switching between AC/DC and DC/AC modes [19].

人工智能的浪潮不再仅仅是实验室里的惊鸿一瞥，它正以前所未有的深度和广度，重塑着产业肌理，定义着未来图景。 ICDIA 2025 创芯展同期 AI开发者大会专题 扫码报名 带你洞见AI落地现实，预见未来AI蓝海。 在半导体产业，人工智能的到来正驱动芯片架构、制造、封测及材料的多维度变革 ：专用处理器在边缘端快速普及，比起通用算力芯片GPU，专用处理 器在能效方面更有优势，能更好地支持边缘端的推理应用；摩尔定律不断逼近物理上的极限，在当下算力与数据爆炸的时代，不少芯片企业开始关注异构集成 及Chiplet技术，意图从封装技术端延续算力增长；制造与封装技术的突破也催生新材料的需求，比如新的金属材料替代原来的铜金属互连体系。 人工智能的强大之处正是在于其能够赋能各行各业，它是一个增量市场，它能够重塑行业，打造新的生态 。例如AI终端的渗透率激增，市场调研机构 Canalys 最新预测， 2025 年 AI 手机渗透率将达到 34%，端侧模型的精简以及芯片算力的升级将进一步助推 AI 手机向中端价位段渗透；2024是AI PC概念后 第一个完整销售年，其销量占据全球笔记本电脑市场27%的份额，Counterpoint预 ...