Core Viewpoint - The seventh Pudong New Area Yangtze River Delta Integrated Circuit Skills Competition successfully concluded, focusing on the theme "Chip Intelligence, New Future," aiming to promote high-quality development in the integrated circuit industry through talent exchange and cooperation [1][3]. Group 1: Event Overview - The competition was co-hosted by various local government bodies and organizations, attracting over a hundred companies and professionals from the Yangtze River Delta region [3]. - The event featured two main competition tracks: a team competition on "Design of Security Encryption Chips Based on National Secret Standards" and an individual competition on "Integrated Circuit CAD Programming Based on AI Tools," aligning closely with real industry needs [5]. Group 2: Achievements and Awards - Six companies and three universities were awarded in the competition, with Shanghai Chip Color Intelligent Technology Co., Ltd. winning the first prize in the corporate group [6][8]. - East China Normal University won the first prize in the university group, while six individual winners were also recognized [10][12]. Group 3: Future Directions - The Pudong New Area Federation of Trade Unions plans to expand platforms for employee participation and develop more dynamic competition models to support the integrated circuit industry's growth [3][12]. - The event aims to create a collaborative network across regions, enhancing technology research, talent cultivation, and standard development within the integrated circuit industry [12].

如果您希望可以时常见面，欢迎标星收藏哦~ 过去几天，英伟达登上头条的原因，并不是它卖出了多少芯片，而是它能开出多大的支票。上周晚 些时候，公司宣布将向陷入困境的芯片制造商英特尔投资 50 亿美元。随后在周一，又传出消息 称，英伟达计划在未来几年向 OpenAI 投资 最高 1000 亿美元。 这个数字尤其惊人，因为就在三年前，英伟达每年的自由现金流还只有区区 60 亿美元出头。但人 工智能的狂热及其引发的"军备竞赛"，让英伟达不仅成为全球市值最高的公司，还成为"现金储备 最深"的科技巨头之一。 根据 FactSet 数据，英伟达在过去四个季度中创造了 720 亿美元自由现金流，本财年预计将接近 1000 亿美元。这一规模超过了除苹果之外所有超大市值科技公司的今年预期自由现金流。 然而，如何花掉这笔巨款并非易事。英伟达在过去四个季度回购了近 500 亿美元的股票，并在近 期又追加了 600 亿美元的回购计划。公司在过去两年中将研发投入翻了一番，但依旧难以追上爆 炸式的销售增长。过去四个季度，英伟达的研发费用仅占营收的 9%，而此前五个财年的年均比例 为 22%。 用 现 金 去 收 购 一 家 大 型 公 司 ...

为了解决这一问题，微软成功测试了一种新型冷却系统，其散热效果比目前常用的先进冷却技术 ——冷板——高出三倍。该系统采用微流体技术，将液体冷却剂直接引入硅片内部——也就是热量 的来源。硅片背面直接蚀刻出微小通道，形成凹槽，使冷却液能够直接流到芯片上，从而更高效地 散热。该团队还利用人工智能识别芯片上独特的热信号，并更精确地引导冷却剂流动。 研究人员表示，微流体技术可以提高下一代人工智能芯片的效率并增强其可持续性。目前，数据中 心运行的大多数GPU都采用冷板进行冷却，这些冷板与热源之间有多层隔离，从而限制了其散热 量。 随着新一代人工智能芯片的性能越来越强大，它们产生的热量也越来越多。微软云运营与创新高级 技术项目经理 Sashi Majety 表示："如果五年后你仍然严重依赖传统的冷却板技术，那你就陷入困 境了。" 今天，微软宣布成功开发出一种芯片内微流体冷却系统，可以有效冷却运行模拟 Teams 会议核心 服务的服务器。 如果您希望可以时常见面，欢迎标星收藏哦~ 来源 ： 内容 编译自微软 。 人工智能确实很热门。 数据中心用于运行最新人工智能突破的芯片产生的热量比前几代硅片要多得多。任何经历过手机或 笔记本 ...

一位熟悉情况的业内人士透露："SK海力士正在考虑提前启动新的EUV生产线，并与ASML保持紧 密协商，以加快设备交付速度。" EUV光刻机能够刻画10纳米级别的超微细电路，且由ASML垄断供应，全球半导体制造企业均需 排队采购，设备获取极其困难。截至去年底，拥有EUV设备数量最多的是台湾台积电，其次是三 星电子（韩国）、英特尔（美国）、SK海力士（韩国）和美光（美国）。 SK海力士自2021年在制造10纳米级第4代DRAM"1a"（约14纳米）时首次引入EUV后，逐步增加 设备数量。如果再追加20台，公司将跻身全球EUV设备保有量前三，与英特尔相当甚至超过。 此次扩充背后，是公司在下一代DRAM及HBM上的战略考量。采用EUV能够刻画更精细的电路， 从而提升单位晶圆的芯片产出，并增强能效与性能。预计将优先强化年底量产的HBM4用10纳米级 第5代DRAM（1b）以及正在准备量产的第6代DRAM（1c）的制造竞争力，这些产品将成为公司 明年的核心业务。未来，第7代DRAM（1d）以及更先进的10纳米级以下DRAM，也将导入EUV 工艺。业内预期，SK海力士最快将在明年启动1d DRAM的量产转移。 如果您希望可 ...

Core Insights - Samsung Electronics is expected to surpass a 30% market share in the High Bandwidth Memory (HBM) market next year, despite underperforming in the first half of this year compared to SK Hynix and Micron Technology [1][2] - Counterpoint Research reported that in Q2, SK Hynix held a 62% market share, Micron 21%, and Samsung 17%, indicating that 80% of global HBM products come from South Korean companies [1] - The anticipated growth for Samsung is attributed to the upcoming certification of its HBM3E products and the expansion of its market share through HBM4 exports [1] Group 1 - Samsung has launched HBM4 based on 10nm-class sixth-generation (1c) DRAM technology, which combines with 4nm foundry technology [2] - The HBM4 development was completed in July, with sample shipments to major clients, and mass production is expected to be established by the end of the year [2] - HBM4 offers a 40% improvement in power efficiency and a data processing speed of up to 11Gbps compared to the previous generation [2] Group 2 - The dominance of South Korean companies in the HBM market is expected to strengthen with the launch of HBM4 [2] - SK Hynix, the current market leader, has completed HBM4 development and established a mass production system, pending quality testing for application in NVIDIA's next-generation AI GPU Rubin [2] - Chinese companies are attempting to catch up in the HBM market, but face challenges due to high technical difficulties and have not yet achieved mature mass production [2]

不 过 根 据 最 新 的 招 聘 信 息 ， 英 特 尔 正 在 寻 找 一 名 SoC 性 能 工 程 师 （ SoC Performance Engineer），负责客户端桌面产品的开发，这意味着"蓝厂"仍在推进其独显产品线。 如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 wccftech 。 看起来，英特尔的独显（dGPU）野心依然存在。据报道，该公司近日发布了一份新的招聘启事， 其中包括为下一代桌面 GPU 进行开发。 目前英特尔在桌面游戏 GPU 方面的计划还不算明确，因为公司尚未公布具体的路线图。上一次公 开的产品还是 Arc Pro "Battlemage" GPU，此后英特尔在独显市场一直相对沉寂。 参考链接 https://wccftech.com/intel-isnt-backing-down-from-high-end-desktop-gpus/ 点这里加关注，锁定更多原创内容 *免责声明：文章内容系作者个人观点，半导体芯闻转载仅为了传达一种不同的观点，不代表半导体芯闻对该 观点赞同或支持，如果有任何异议，欢迎联系我们。 推荐阅读 10万亿，投向半导体 芯片巨头，市值大 ...

当人工智能掀起技术革命，5G、智能汽车、物联网加速融入生活，半导体作为"科技基石"的地位愈发凸显。如今走进任意一家科技企业，各类智能设备中几乎都 有芯片在飞速运转，半导体行业已融入到全球科技生态之中，并得到了前所未有的巨大发展。 深芯盟过去一年走访了全国200余家半导体企业，在行业飞速发展的同时，也洞察到行业不少痛点： 传统半导体制造企业依赖陈旧设备和人工经验操作，难以满足先进制程的 高精度要求； 供应链端长期依赖进口，自主可控成为迫切需求； 不少企业陷入"产品结构单一、客户集中于头部企业"的困境，同质化竞争挤压创 新和利润空间； 2025湾芯展将集结ASML、AMAT、北方华创、新凯来等600余家国内外领军企业，覆盖半导体设计、制造、封测、材料四大核心环节，构建全生态闭环，精准对 接超 6万来自全球的专业观众。 | | | | | | 部分参展企业 | | | | | | | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | --- | | ASML | C APPLIED 应用材料 | A Lam | 1101 | KI AF | ПЛ ...

Core Viewpoint - Samsung Electronics is expected to achieve an operating profit exceeding 10 trillion KRW for the first time in about a year in Q3 2023, driven by improvements in its high bandwidth memory (HBM) and foundry businesses, alongside strong global sales of its Galaxy series smartphones and the upcoming mass production of its 2nm Exynos 2600 mobile application processor [1][3][4]. Group 1: Financial Performance - Samsung Electronics' Q3 2023 sales are projected to reach 82.7 trillion KRW, with an operating profit of 10.7 trillion KRW, marking a return to the 10 trillion KRW profit club [3]. - The company's operating profit has seen a significant decline from 10.44 trillion KRW in Q2 2022 to 4.7 trillion KRW in Q2 2023, reflecting challenges in the HBM market and missed opportunities in the AI sector [1]. - Analysts predict that Samsung's operating profit could rise to 12 trillion KRW in Q4 2023, with a target stock price adjustment to 10.5 trillion KRW [3]. Group 2: Business Developments - Samsung has signed a contract worth approximately 23 trillion KRW to produce the next-generation AI6 chip for Tesla, indicating a potential recovery in its foundry business [2]. - The company is also set to supply image sensors to Apple and has secured a contract for IBM's next-generation Power11 data center chip, suggesting a strengthening of its foundry capabilities [2]. - The anticipated mass production of the Exynos 2600, which has received positive evaluations from global verification agencies, could lead to its integration into all models of the upcoming Galaxy S26 smartphone [2]. Group 3: Market Position and Future Outlook - There is speculation that Qualcomm may resume semiconductor foundry production with Samsung, following contracts with Tesla, Apple, and IBM, which could further stabilize Samsung's foundry business [3]. - Financial analysts expect Samsung's sales to grow by 12% year-on-year to 358 trillion KRW in the next year, with operating profit projected to increase by 66% to 53.4 trillion KRW, marking the highest performance in eight years [4].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自半导体芯闻综合。 英伟达与OpenAI于22日（当地时间）达成巨额交易，预计英伟达对韩国内存半导体行业的影响将 进一步扩大。三星电子和SK海力士围绕英伟达下一代人工智能（AI）平台Vera Rubin的HBM4供 应展开的竞争预计将加剧。 预计这项投资将增强英伟达在整个AI基础设施市场的影响力，并缩小快速增长的定制AI半导体 （ASIC）市场的规模。谷歌和亚马逊网络服务等大型科技公司在开发自己的ASIC的同时，计划减 少英伟达图形处理器（GPU）的使用，并扩大其AI半导体的使用。然而，由于OpenAI决定直接购 买英伟达GPU来构建数据中心，与英伟达GPU相比，ASIC的使用量预计将减少。 因此，全球内存公司之间对HBM4供应的竞争预计将更加激烈。与此同时，三星电子、SK海力士 和美光等能够生产HBM的内存公司越来越期望，随着ASIC市场的扩张，它们能够实现供应商多元 化，摆脱对Nvidia的依赖。然而，Nvidia构建强大护城河的重要性再次凸显。 *免责声明：文章内容系作者个人观点，半导体芯闻转载仅为了传达一种不同的观点，不代表半导体芯闻对该 观点赞同 ...

Core Viewpoint - The global semiconductor equipment market is experiencing unprecedented turbulence and adjustment, with a projected market size of $110.8 billion in 2025, reflecting a 6.2% year-on-year growth, and expected to reach $122.1 billion in 2026, growing by 10.2% [1] Demand and Policy: Dual Shift - The complexity of the current market is primarily due to the dual shift in demand rhythm and policy barriers, particularly in China, which was the largest buyer of semiconductor equipment during 2023-2024 [2] - After a period of intensive equipment procurement, the industry has entered a new cycle where yield ramp-up and capacity utilization are the main themes, leading to a natural slowdown in demand [2] - TechInsights predicts a 6% year-on-year decline in China's equipment purchases for 2025, while SEMI's estimate is as high as 24% [2] - On the policy side, stricter export approvals have slowed down shipments to China, with the U.S. further tightening export restrictions by the end of 2024 [2] Impact on Suppliers - The dual constraints of demand and policy have led to a decline in order visibility and rhythm for semiconductor equipment suppliers in China, with approval timelines becoming a critical risk factor for revenue recognition [3] International Equipment Manufacturers: The Other Side of Growth - Applied Materials (AMAT) reported a revenue of $7.32 billion for Q3 FY2025, an 8% year-on-year increase, but projected a decline to $6.7 billion in Q4 due to a drop in sales in China, which accounted for 35% of its revenue [4] - Tokyo Electron (TEL) anticipates a -5% growth rate in the front-end equipment market for FY2026, primarily due to reduced investments from emerging Chinese semiconductor manufacturers [5] - ASML continues to perform well but has expressed caution regarding 2026 due to potential tariffs and geopolitical uncertainties affecting North American clients [6] Domestic Equipment Manufacturers: Revenue Growth - In contrast to international firms, China's semiconductor equipment industry showed robust recovery in H1 2025, with major listed companies achieving revenue growth of 20% to 50% [9] - North Huachuang and Zhongwei contributed over $21 billion in revenue, dominating the market share [9] - North Huachuang's revenue reached $16.14 billion, a 29.51% increase, while Zhongwei's revenue was $4.96 billion, growing by 43.88% [9] Profitability Trends - The industry shows significant profit divergence, with companies like Shengmei Shanghai and Changchuan Technology experiencing explosive profit growth due to strong demand in AI and advanced packaging [10] - Shengmei Shanghai's revenue was $3.27 billion, up 35.83%, with net profit increasing by 56.99% [10] - Changchuan Technology's revenue reached $2.17 billion, a 41.80% increase, with net profit soaring by 98.73% [12] Emerging Growth Engines - New demand growth in emerging fields is offsetting the slowdown in the Chinese market, with companies like KLA focusing on process control and inspection equipment showing resilience [6] - Lam Research has seen strong non-China technical spending driven by AI and HBM, although market caution remains regarding the sustainability of Chinese orders [7] Conclusion - The semiconductor equipment market in 2025 presents both challenges and opportunities, with the long-term growth trend remaining solid, projected to reach approximately $1 trillion by 2030 [19]