公众号记得加星标⭐️，第一时间看推送不会错过。 国际数据公司（IDC）发布了最新的设备市场展望报告，其结论直言不讳：情况正在恶化。在最新公 布的悲观预测情景下，2026年个人电脑出货量可能下降高达9%，而较为温和的预测情景则显示市场 萎缩幅度为5%。这些数据较IDC 11月份发布的2.5%的降幅有所修正。 自10月中旬加速恶化开始，全球内存短缺问题的程度已经超过了IDC最初的预测。虽然该公司并未正 式完全修改其官方预测，但其目前提出的情景明显比几周前的预测更为悲观。 其根本驱动力与2025年末席卷科技行业的诸多因素相同：人工智能基础设施。超大规模数据中心对内 存的需求激增，导致DRAM和NAND闪存的生产重心从消费级设备转向高利润的企业级组件，例如高 带宽内存和高密度DDR5内存。对于内存制造商而言，这是一个经济上合理的选择，但IDC明确指 出，这并非典型的繁荣与萧条周期；而是硅产能的战略性重新配置，其影响可能持续数年而非数个季 度。 对于智能手机而言，这种影响是真实存在的，但程度并不均衡。内存成本在手机物料清单中占据相当 大的比例，尤其是在利润本就微薄的中端机型中。IDC 警告称，OEM 厂商可能会采取提高 ...

SK海力士位于美国首家工厂——Lastwepiet Packaging工厂，计划成为人工智能存储器尖端封装生产 基地。该工厂预计将于2028年下半年投产。为实现这一目标，SK海力士宣布将在美国投资38.7亿美 元（约合5.4万亿韩元）。 SK海力士之所以在加州西拉法叶新建一条封装生产线，主要原因在于其高带宽内存（HBM）。HBM 是人工智能半导体的关键组件，而美国政府一直在积极吸引包括SK海力士在内的主要半导体公司进 行本地投资，以加强美国尖端半导体供应链。 此外，SK海力士正计划在该工厂建设一条2.5D封装的量产生产线。2.5D封装技术通过在半导体和基 板之间插入一层称为硅中介层的薄膜，来提升芯片的性能和能效。全球科技巨头英伟达的高性能AI加 速器也采用2.5D封装技术制造，将HBM显存与高性能GPU和CPU集成在一起。 SK海力士此举被解读为旨在通过建立2.5D量产生产线来增强其整体人工智能半导体封装能力，包括 HBM。 公众号记得加星标⭐️，第一时间看推送不会错过。 SK海力士计划投资以获取超越HBM技术的尖端封装技术。据报道，该公司正准备在其位于美国的新 封装工厂建立首条2.5D封装量产生产线。 2. ...

公众号记得加星标⭐️，第一时间看推送不会错过。 中芯国际重磅收购，迎来新进展。 12月29日晚间，中芯国际公告称，公司拟向国家集成电路基金等5名中芯北方股东发行5.47亿股股份 购买其所持有的中芯北方49%股权，交易价格406.01亿元。公告显示，这五名股东分别为国家集成电 路基金、集成电路投资中心、亦庄国投、中关村发展、北京工投。 据悉，标的公司中芯北方成立于2013年，是中芯国际与北京市政府共同投资设立的12寸先进制程集 成电路制造厂，是中芯国际控股子公司。公司主要从事半导体（硅片及各类化合物半导体）集成电路 芯片的制造（含线宽28纳米及以下大规模数字集成电路制造）、针测及测试、光掩膜制造、测试封 装，是中芯国际重要的12英寸晶圆厂。 中芯国际作为中芯北方的控股股东与核心技术供给方，全面主导并负责中芯北方的生产运营管理，为 其技术落地与产能释放提供了坚实保障。 对于此次收购，公司表示，本次交易有利于进一步提高上市公司资产质量、增强业务上的协同性，促 进上市公司的长远发展。交易前后上市公司的主营业务范围不会发生变化。 公开资料显示，中芯国际拥有全方位一体化的集成电路晶圆代工核心技术体系，快速有效地帮助客户 ...

Core Viewpoint - TSMC has quietly announced the commencement of volume production of its N2 (2nm) process technology, achieving its goal set for Q4 2025 without a formal press release [1][5]. Group 1: N2 Technology Overview - The N2 process utilizes the first-generation nanosheet transistor technology, providing significant improvements in performance and power consumption [1]. - TSMC's N2 technology is expected to be the most advanced in the semiconductor industry in terms of density and energy efficiency, addressing the growing demand for energy-efficient computing [1]. - The N2 design aims for a 10%-15% performance increase at the same power level and a 25%-30% reduction in power consumption at the same performance level [3][4]. Group 2: Performance Metrics - For mixed designs including logic, analog, and SRAM, transistor density is expected to increase by 15% compared to N3E, while pure logic designs will see a 20% increase [3][4]. - The N2 process will feature a significant reduction in power consumption, with estimates ranging from 25% to 30% compared to N3E [4]. Group 3: Production and Capacity - TSMC has begun production of 2nm chips at its Fab 22 facility near Kaohsiung, Taiwan, with expectations for ramp-up in capacity driven by demand from smartphones and high-performance computing AI applications in 2026 [5][8]. - The company is constructing two new fabs capable of N2 technology to meet the strong interest from partners, with plans to produce N2P and A16 chips starting in late 2026 [8]. Group 4: Future Developments - TSMC plans to introduce N2P, an enhanced version of the N2 process, which will further improve performance and power efficiency, with volume production expected in the second half of 2026 [8]. - The A16 chip, designed for complex AI and HPC processors, will also begin production in the second half of 2026, utilizing TSMC's advanced Super Power Rail design [8].

Core Viewpoint - NVIDIA's acquisition of Intel shares for $5 billion has turned into a strategic financial operation, now valued at $7.58 billion, following the approval from the Federal Trade Commission [1] Group 1: Acquisition Details - NVIDIA CEO Jensen Huang and Intel CEO Pat Gelsinger agreed on a purchase price of $23.28 per share for Intel stock, totaling 214 million shares [1] - The acquisition was completed on December 26, with Intel's stock closing at $36.68 per share on the following Monday [1] Group 2: Joint Development Agreement - NVIDIA and Intel will collaborate on developing "multi-generation" chips for data centers and personal computers, aiming to capture market share across their customer base [1] - Intel will customize x86 CPUs for NVIDIA, which will integrate these CPUs into its AI infrastructure platform [1] Group 3: Technical Advancements - The partnership will utilize NVIDIA's NVLink technology, providing a bandwidth of up to 1.8 TB/s per GPU, which is 14 times the bandwidth of PCIe 5.0 x16 slots [1] - Intel will also manufacture x86 system-on-chip (SoC) integrated with NVIDIA's RTX GPU chips, enhancing the performance of integrated CPU and GPU PCs [2] Group 4: Regulatory Context - The agreement is reminiscent of NVIDIA's previous attempt to acquire Arm for $40 billion, which faced regulatory scrutiny and was ultimately abandoned [2] - The Federal Trade Commission had previously expressed concerns that such mergers could stifle competition and innovation in the semiconductor industry [2]

公众号记得加星标⭐️，第一时间看推送不会错过。 据报道，Weebit Nano 已将其 ReRAM 技术授权给 TI。 根据协议条款，Weebit 的 ReRAM 技术将集成到 TI 的先进嵌入式处理器工艺节点中。 该协议包括知识产权许可、技术转让、Weebit ReRAM 在 TI 工艺技术中的设计和认证。 Weebit ReRAM 是一款低功耗、高性价比的非易失性存储器，声称在高温下具有优异的保持性能， 并已通过 AEC-Q100 150°C 运行认证。 德州仪器 (TI) 嵌入式处理高级副总裁 Amichai Ron 表示： "我们很高兴与 Weebit Nano 合作，将 ReRAM 存储器技术集成到我们的工艺技术和产品中。TI 与 Weebit Nano 的合作将使我们的客户能 够获得业界领先的非易失性存储器 (NVM) 技术，该技术在性能、规模和可靠性方面均具有优势，这 将有助于我们巩固作为领先的嵌入式处理器供应商的地位。" " 我 们 很 高 兴 能 与 Weebit Nano 合 作 ， 将 ReRAM 存 储 器 技 术 集 成 到 我 们 的 工 艺 技 术 和 产 品 中，"Weebit ...

Core Viewpoint - TSMC is set to increase advanced process pricing from 2026 to 2029 due to high demand driven by AI applications, with a projected price increase of 3% to 10% for advanced processes starting January 2026 [1][2][3]. Group 1: Pricing Strategy - TSMC has communicated with clients about raising prices for advanced processes over the next four years, reflecting increased production costs and high demand [1][3]. - Despite the price increase, clients are actively reserving advanced process capacity, indicating strong demand in the AI sector [2][3]. - The expected price increase for 2026 is in the single-digit percentage range, with variations based on client procurement levels [1][3]. Group 2: Capital Expenditure - TSMC's capital expenditure for 2026 is projected to reach a historical high of between $42 billion and $45 billion, maintaining a strong investment trend [3]. - The company has already reported a capital expenditure of $29.39 billion for the first three quarters of 2023, with expectations for the fourth quarter to reach between $10.61 billion and $12.61 billion [3]. - Global semiconductor manufacturing capital expenditure is estimated to reach $160 billion in 2023, primarily supported by TSMC and Micron's investments [4]. Group 3: Market Dynamics - The semiconductor industry is experiencing a seller's market for advanced processes, with rising costs reflected in pricing strategies across various segments, including wafer foundry and advanced packaging [5][6]. - The strong demand for AI chips positions TSMC at the core of the AI market, enhancing its bargaining power [6]. - The anticipated price increases in advanced packaging and memory also indicate a trend towards "chip inflation," which may impact consumer electronics demand [5][6].

Core Insights - The recent semiconductor technology roadmap by the Korean Society of Semiconductor Engineers (ISE) predicts advancements down to 0.2nm, indicating a shift in the competitive landscape of the semiconductor industry rather than just a focus on smaller process nodes [1][3]. Device and Process Technology Roadmap - The roadmap outlines a 15-year vision from 2025 to 2040, focusing on nine key semiconductor technology trends, including AI semiconductors, optical interconnects, and quantum computing [1][3]. - The evolution of logic devices aims to maintain performance and power efficiency while reducing size, with a shift from Design-Technology Co-Optimization (DTCO) to System-Technology Co-Optimization (STCO) [4][5]. Logic Technology Trends - Logic device nodes are projected to progress from 2nm in 2025 to 1nm by 2031, and approach 0.2nm by 2040, with key variables including gate length and 3D integration capabilities [5][12]. - The transition from FinFET to Gate-All-Around (GAA) structures is expected, with further innovations like CFET (Complementary FET) enhancing performance through 3D stacking [8][10]. Metal Interconnect Technology - Metal interconnects are becoming a critical performance bottleneck, necessitating innovations in materials and processes to achieve lower resistance and higher reliability [14][15]. - Backside Power Delivery Networks (BSPDN) are anticipated to be introduced around 2028, improving power efficiency and area utilization [14][15]. Memory Technology Trends - The semiconductor industry is shifting focus from computation to memory, with AI and HPC driving demand for high-capacity, high-bandwidth, low-latency, and low-power memory solutions [16][17]. - DRAM technology is evolving towards vertical channel transistors and stacked architectures, with significant advancements expected in the coming years [19][21]. Non-Volatile Memory (NVM) Developments - 3D NAND technology is projected to increase in layer count, reaching up to 2000 layers by 2040, while facing challenges in manufacturing processes [23][25]. - New NVM technologies like PCM and ReRAM are being explored, with PCM seen as having balanced scaling potential [26][27]. AI Semiconductor Roadmap - The AI hardware market is expected to grow significantly, with AI-related computing projected to account for about 20% of global computing demand by 2025 [29][30]. - Performance for training and inference hardware is expected to improve dramatically, with TOPS/W metrics increasing significantly by 2040 [30][31]. Optical Interconnect Technology - Optical interconnects are viewed as a key solution to the limitations of traditional copper interconnects, with applications expanding in data centers and AI-driven systems [33][36]. - The roadmap anticipates the introduction of Co-Packaged Optics (CPO) technology, which integrates optical and electronic components to enhance data transmission capabilities [42][44].

根据新闻稿，智能集成电路基板提供集成电路芯片与外部读卡器之间的物理和电气接口。当智能卡插 入ATM机或被护照读卡器扫描时，电子信号通过基板表面形成的触点进行传输。该公司指出，传统 上，为了确保低接触电阻、耐腐蚀性和机械耐久性，需要在基板表面镀上金、钯等贵金属。 公众号记得加星标⭐️，第一时间看推送不会错过。 LG Innotek宣布开发出全球首款"下一代智能IC基板"，该基板是信用卡、电子护照和USIM卡等智能 卡的核心组件。该公司表示，这款新型基板在提高产品耐用性的同时，还能将生产过程中产生的碳排 放量减少一半。 这项公告意义重大，因为它重点介绍了一种材料和封装方面的创新，该创新直接影响信号可靠性、长 期磨损以及 ESG 合规性。这些都是从事安全集成电路、卡接口和大批量电子产品制造的工程师需要 考虑的关键因素。 LG Innotek推出全球首款"下一代智能IC基板" LG Innotek于 12 月 22 日宣布，该公司已成功开发出"下一代智能 IC（集成电路）基板"，该基板具 有更高的性能，并且生产过程中产生的碳排放量减少了一半。 智能IC基板是安装IC芯片的关键组件，这些芯片用于存储智能卡（例如信用卡、 ...

Core Viewpoint - TSMC is set to benefit from the booming AI applications, leading to a tight supply of advanced process capacity below 3nm, with plans to raise prices for advanced processes from 2026 to 2029 [1][2] Group 1: Price Increase and Demand - TSMC has communicated with clients about a price increase for advanced processes, expected to be in the single-digit percentage range starting January 2026, reflecting higher production costs and strong demand [1][3] - Analysts predict that TSMC's advanced process pricing could increase by 3% to 10% in 2026, with variations depending on client procurement levels [1][2] Group 2: Capacity and Client Engagement - Major clients like NVIDIA and AMD are actively expanding AI applications, contributing to the sustained demand for TSMC's advanced processes [1][2] - TSMC's clients are eager to secure advanced process capacity to maintain a competitive edge in technology [2] Group 3: Capital Expenditure - TSMC's capital expenditure for 2026 is projected to reach a historical high of between $42 billion and $45 billion, maintaining a flexible approach to ensure revenue growth outpaces capital spending [3] - The actual capital expenditure for TSMC in the first three quarters of this year reached $29.39 billion, with expectations for the fourth quarter to contribute an additional $10.61 billion to $12.61 billion [3] Group 4: Industry Context - Global semiconductor manufacturing capital expenditure is estimated to reach $160 billion this year, with a 3% year-over-year growth, primarily driven by TSMC and Micron's significant investments [4]