Core Viewpoint - The U.S. semiconductor industry is crucial for economic competitiveness and national security, with a recommendation for a comprehensive policy strategy to maintain and enhance its leadership position [1][2][5]. Group 1: Industry Importance and Current Status - The U.S. semiconductor industry holds a global market share of 50.7% and has been a leader for decades [2][5]. - Approximately 70% of the U.S. semiconductor industry's revenue comes from sales to customers outside the U.S., highlighting the importance of international markets [2][13]. - SIA member companies are investing over $500 billion across 28 states to build manufacturing and R&D facilities, which is expected to create over 500,000 jobs [12][2]. Group 2: Recommendations for Policy and Strategy - The SIA suggests forming industry agreements with allies to create favorable markets for U.S. chips and downstream electronic products [2][3]. - Implement domestic tax incentives to stimulate additional investment in the semiconductor ecosystem, including extending and expanding the Advanced Manufacturing Investment Credit (AMIC) [3][43]. - Simplify regulations to accelerate investment in the U.S. chip supply chain, addressing potential regulatory barriers that could hinder manufacturing capabilities [3][46]. Group 3: Economic and Competitive Challenges - The total construction and operational costs of U.S. semiconductor fabs are 30-50% higher than those in Asia, necessitating ongoing government support to close this cost gap [5][33]. - The semiconductor industry faces a long-term challenge of achieving efficient production scales, with high fixed capital costs and lengthy timeframes for profitability [28][33]. - Broad tariffs could increase costs for semiconductor manufacturing inputs, potentially harming the competitiveness of U.S. firms in the global market [35][37]. Group 4: Labor and R&D Development - The government should fund R&D and workforce development programs to support the long-term growth and leadership of the U.S. semiconductor industry [3][47]. - There is a need to strengthen the pipeline of skilled STEM talent to meet the demands of the semiconductor sector [47][48]. Group 5: Global Supply Chain and Trade Considerations - The complexity of the semiconductor supply chain requires U.S. companies to maintain access to critical components, many of which lack domestic alternatives [27][24]. - The SIA emphasizes the importance of international cooperation to ensure a resilient supply chain and to avoid unintended consequences from unilateral trade policies [6][41].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自华盛顿邮报。 据《华盛顿邮报》获悉，一家由萨姆·奥特曼支持的新兴芯片制造商正在探索出售，此前该公司 从 私人投资者那里筹集 1.5 亿美元的计划失败了，而 OpenAI 也是其中的竞购者之一。 据消息人士透露，总部位于旧金山的初创公司 Rain AI 表示，其正在开发的芯片比 Nvidia 等巨头 目前销售的芯片更强大、更节能，该公司已就收购事宜进行了数周的谈判。 目前尚不清楚 OpenAI 是否已向 Rain AI 提出正式报价，但一位消息人士称，Altman（他是 Rain AI 2022 年 2500 万美元种子轮融资的主要投资者）在 B 轮融资失败后正在考虑收购。 一位知情人士向《华盛顿邮报》透露："萨姆·奥特曼希望通过让 OpenAI 以极低的价格收购 Rain 来挽救他的投资。" 联合创始人威尔帕索 (Will Passo) 已悄然辞去 Rain AI 首席执行官一职，由联合创始人杰克肯德 尔 (Jack Kendall) 接任，后者目前在公司网站上被列为首席执行官。 此前，Rain 的 B 轮融资原定于去年 12 月启动，但随后被多次推迟。 ...

Core Viewpoint - The Taiwanese semiconductor industry is expected to see a significant growth of over 19% this year, driven by strong performance in integrated circuit (IC) manufacturing and design [1][2]. Group 1: Industry Growth Projections - The output value of Taiwan's semiconductor industry is projected to reach NT$6.33 trillion (approximately $209.8 billion), marking a 19.1% increase compared to the previous year [1]. - The forecast for IC manufacturing output is expected to grow by 23.1% year-on-year, reaching NT$4.2 trillion [1]. - IC design output is anticipated to grow by 13.9%, reaching NT$1.44 trillion, surpassing earlier estimates [1]. Group 2: Quarterly Performance - In Q1, the output value of Taiwan's semiconductor industry was NT$1.48 trillion, a 0.4% decrease from the previous quarter but a 27.6% increase year-on-year [2]. - The forecast for Q2 anticipates an output value of NT$1.53 trillion, representing a 20.6% year-on-year growth and a 2.9% increase from Q1 [2]. Group 3: Market Dynamics and Challenges - The industry is facing challenges due to U.S. tariffs, which have led many clients to place large orders in advance to avoid potential disruptions [2][4]. - TSMC predicts a sales growth of 24% to 26% in dollar terms, driven by strong demand for advanced processes related to artificial intelligence applications [1][4]. - Despite concerns over tariffs, industry leaders express optimism about Taiwan's continued prominence in the semiconductor sector [4].

如果您希望可以时常见面，欢迎标星收藏哦~ 参参考考链链接接 https ://nltimes .nl////asml-becoming-tool-trade - war-us - china-dutch-gov t-fear s END 半导体精品公众号推荐 ▲点击上方名片即可关注 专注半导体领域更多原创内容 ▲点击上方名片即可关注 关注全球半导体产业动向与趋势 *免责声明：本文由作者原创。文章内容系作者个人观点，半导体行业观察转载仅为了传达一种不同的观点，不代表半导体行 业观察对该观点赞同或支持，如果有任何异议，欢迎联系半导体行业观察。 | "半导体行业观察"交流群 | | | | --- | --- | --- | | 扫码添加小助手微信，注明：加群+姓名+公司名称 | | | | · RISC-V群 · Al群 · ● 先进封装群 | ● 汽车电子群 | | | · Chiplet群 ● 硅光群 ● 设备材料群 | ● 功率半导体/三代半群 | | | 获取行业资讯 交流业务机会 | 解决技术难题 | 拓展行业人脉 | 来源：内容来自 nltimes。 荷兰政府越来越担⼼，ASML 正成为中美之间迫在眉 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自路透 。 在美国政府限制其 Hopper H 芯⽚在中国的销售后， ⾸席执⾏官⻩仁勋周六表⽰，Nvidia 正 在评估如何应对中国⼤陆市场，但不会推出 Hopper 系列的其他版本。 据报道，当被问及继 H 之后他们将为中国⼤陆市场推出的下⼀款芯⽚是什么时，⻩仁勋回答 道："不是 Hopper，因为现在不可能再修改 Hopper 了。" ⻩仁勋⼀直表⽰，中国⼤陆对英伟达的发展⾄关重要。在美国对英伟达 H 芯⽚输往中国⼤陆实 施新的限制后，他⽴即访问了中国。H芯⽚是英伟达唯⼀可以在中国⼤陆合法销售的⼈⼯智能芯 ⽚。 路透社本⽉早些时候报道称，英伟达计划在未来两个⽉内为中国⼤陆市场推出降级版的 H 芯 ⽚，以提振其在中国⼤陆市场的销量。⽬前，英伟达在中国市场的份额已被其他竞争对⼿蚕⻝ 截⾄1⽉26⽇的财年，中国⼤陆市场为英伟达创造了170亿美元的收⼊，占公司总销售额的13%。 https :// w w w.reuter s .com/ world/china/nv idia- ceo- say s -next- chip-after-h- china- w ...

Core Viewpoint - The next-generation Xbox is expected to shift from AMD to Qualcomm's ARM-based Snapdragon chips, indicating a significant transformation in hardware and design philosophy for Microsoft's gaming console [1][2]. Group 1: Hardware Transition - The new Xbox is likely to adopt ARM-based Snapdragon chips, marking a major shift away from the AMD x86 architecture that has supported Xbox for over a decade [2][3]. - This transition aligns with reports suggesting that the next Xbox will feel more like a hybrid of a gaming console and a PC, potentially running a Windows system and supporting various software, including classic Xbox games through emulators and third-party PC game stores like Steam and Epic [2][3]. Group 2: Strategic Partnerships - A senior sales executive from Qualcomm indicated that the collaboration with Microsoft involves developing next-generation Surface and Xbox products based on Snapdragon solutions, highlighting the close partnership between the two companies [2][3]. - Microsoft's long-term hardware roadmap aims to launch the next Xbox by 2027, which is consistent with previous reports and suggests a focus on creating a flexible and forward-looking gaming system [3].

Core Viewpoint - Malaysia aims to reclaim its position in the semiconductor industry amidst rising competition from neighboring countries and geopolitical uncertainties, focusing on attracting investments and enhancing its manufacturing capabilities [2][8][9]. Group 1: Industry Position and Challenges - Malaysia is the sixth-largest exporter of semiconductors globally, but its early advantages have diminished due to corruption and political instability, allowing countries like Thailand and Vietnam to emerge as competitors [2][4]. - The Malaysian government is committed to reducing bureaucratic hurdles and providing incentives such as cheap land and utility subsidies to attract semiconductor investors [2][8]. - The semiconductor industry faces uncertainties due to potential tariff increases on exports to the U.S., which could impact costs and inflation [4][5]. Group 2: Investment and Development Initiatives - The Malaysian government has announced plans to attract at least 500 billion ringgit (approximately 116 billion USD) in semiconductor investments, with over 50 data centers already operating in the country [8][9]. - AT&S has invested around 1.2 billion USD in a high-tech facility in Kulim, expected to create 3,000 jobs and support the growing data center ecosystem in Malaysia [6][8]. - A 250 million USD, 10-year agreement with Arm Holdings aims to enhance Malaysia's capabilities in semiconductor design and technology [8][9]. Group 3: Geopolitical and Market Dynamics - The U.S. has increased scrutiny on semiconductor exports, particularly concerning national security, which has led to investigations into companies like Nvidia for illegal shipments to China [9][10]. - Despite challenges, the demand for chips is expected to grow due to advancements in artificial intelligence, which may mitigate the negative impacts of tariffs [10][11]. - The competitive landscape in Southeast Asia is intensifying, with countries like Thailand and Vietnam attracting significant investments from major companies [8][9].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自综合。 AMD 在服务器领域的收⼊份额创下了历史新⾼，同时在桌⾯领域也实现了⼤幅增⻓。 鉴于AMD⾃⾸款Zen系列发布以来所建⽴的势头，红队势不可挡。该公司已在开发Zen 6，软件⽀ 持也已准备就绪，正如之前报道的那样。预计AMD将继续凭借其未来的Zen系列在x领域发起全 ⾯进攻。 Mercury Research公布了其 2025 年第⼀季度的最新收⼊和出货量份额数据，红队似乎再次取得 了⼀些重⼤进展。最⼤的增⻓来⾃服务器领域，该领域在上⼀季度（2024 年第四季度）已经创下 了最⾼收⼊份额。 从服务器端来看，AMD 的出货量份额增⾄ 27.2%，⽽其收⼊份额则⼤幅增⻓⾄ 39.4%，环⽐分 别增⻓ 1.5 和 3.1 个百分点，同⽐分别增⻓ 3.6 和 6.5 个百分点。强劲的收⼊增⻓主要得益于 AMD 现有的基于 Zen 4 架构的 Genoa 和 Bergamo 系列产品，⽽ Turin 架构的"Zen 5"系列 产品也持续热销，为数据中⼼市场带来更⾼性能和更⾼效的性能。 服务器收⼊份额同⽐增⻓ 6.5%，环⽐增⻓ 3.1%，达到创纪录的 39. ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自财讯 。 ⽇本半导体之王—索尼半导体，近期传出要分拆上市的消息。彭博社4⽉28⽇报导，⽇本索尼公司 有意分拆半导体部⻔并分拆上市。虽然索尼发⾔⼈低调否认，但已引来外界⾼度关注。 但这种设计必须⽤到⾮常精确的先进封装技术，把两种电路制造后再叠合，「难度相当于将两个 120公尺宽的棒球场叠在⼀起，误差幅度不到⼀毫⽶。」梅林卓说。 市场热议分拆上市传闻 索尼半导体是⽇本半导体产业的领头⽺，也是全球CMOS的王者。索尼半导体虽不像台积电拥有先 进制程技术，但过去⼏年，这家公司在CMOS的市占率节节上升。 索尼半导体集团旗下有多家公司，除了负责设计产品的Sony Semiconductor Solution以及负 责制造的 Sony Semiconductor Manufacturing公司，在欧洲还有两家负责TOF传感器、先进影像传感 器的公司及泰国制造基地。除了CMOS，索尼还提供了微机电⻨克⻛、雷射2极体等产品。 但从营收来看，CMOS却占了绝⼤部分，2023年时，CMOS部⻔营收约1.6万亿⽇元，⽽索尼半导 体部⻔旗下⾮CMOS部⻔营收则只有1500亿⽇元 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 2024年，HBM成为半导体产业最炙⼿可热的产品之⼀。 随着AI⼤模型和⾼性能计算的狂飙突进，英伟达等巨头对HBM的需求⽔涨船⾼，内存⼚的HBM订 单早已售卖⼀空，尤其是SK海⼒⼠，其在HBM市场占有率⾼达70%，更是赚得盆满钵满。 然⽽，就在这股浪潮背后，名为"TCB（Thermal Compression Bonding）键合机"的设备， 正在悄然决定HBM产业链的上限，不论是SK海⼒⼠，还是美光三星，都在过去⼀年时间⾥加⼤了 设备⽅⾯的投⼊，也让更多设备⼚商有机会吃上这波AI红利。 什么是TCB？ 先来了解⼀下⽬前HBM芯⽚的键合技术。在传统的倒装芯⽚键合中，芯⽚被"翻转"，以便其焊 料凸块（也称为 C 凸块）与半导体基板上的接合焊盘对⻬。整个组件被放置在回流炉中，并根据 焊料材料均匀加热⾄ ºC-ºC 左右。焊料凸块熔化，在接合和基板之间形成电⽓互连。 随着互连密度的增加和间距缩⼩到 µm 以下，倒装芯⽚⼯艺⾯临⼀些挑战。由于整个芯⽚封装 都放⼊烤箱中，芯⽚和基板会因热量⽽以不同的速率膨胀（即不同的热膨胀系数，CTE），从⽽产 ⽣变形，导致互连出现故障。然后， ...