先进封装
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长电科技(600584):点评报告:2024Q4营收规模超百亿,先进封装盈利能力有望提升
Wanlian Securities· 2025-05-06 14:26
证券研究报告|电子 [Table_Title] 2024Q4 营收规模超百亿,先进封装盈利能 力有望提升 投资要点: ⚫ 2024Q4 单季度营收超百亿,再创单季度营收新高:2024 年第四季度, 营收方面,公司实现单季度营业收入 109.84 亿元,同比+18.99%,环比 +15.73%;毛利率方面,2024Q4 单季度毛利率为 13.34%,同比+0.17pct, 环比+1.11pct;营收再创单季度历史新高,毛利率有所提升,主要系下 游需求持续复苏,产能利用率提升。期间费用方面,2024Q4 销售费用 率 / 管 理 费 用 率 / 研 发 费 用 率 / 财 务 费 用 率 分 别 为 0.60%/3.58%/4.43%/0.32%,同比分别+0.05pct/+1.25pct/+0.55pct/- 0.93pct,期间费用整体同比+0.92pct;净利率方面,2024Q4 单季度净 利率为 4.93%,同比-0.45pct,环比+0.15pct,毛利率上升但净利率下 降,主要系费用率增长所致。归母净利润方面,2024Q4 公司实现归母 净利润 5.33 亿元,同比+7.28%,环比+16.63%。现 ...
化工行业周报20250505:海外天然气、TDI价格上涨,国际油价、醋酸价格下跌-20250506
Bank of China Securities· 2025-05-06 01:30
基础化工 | 证券研究报告 — 行业周报 2025 年 5 月 6 日 投资建议 海外天然气、 TDI 价格上涨,国际油价、醋酸价 格下跌 五月份,行业受关税相关政策、原油价格大幅波动等因素影响较大,建议整体均衡配置,关注 自主可控日益关键的电子材料公司,以及分红派息政策稳健的能源企业等。 行业动态 风险提示 地缘政治因素变化引起油价大幅波动;全球经济形势出现变化。 相关研究报告 《化工行业周报 20250427》20250427 《化工行业周报 20250420》20250421 《化工行业周报 20250413》20250413 中银国际证券股份有限公司 具备证券投资咨询业务资格 强于大市 化工行业周报 20250505 基础化工 证券分析师:余嫄嫄 (8621)20328550 yuanyuan.yu@bocichina.com 证券投资咨询业务证书编号:S1300517050002 证券分析师:范琦岩 qiyan.fan@bocichina.com 证券投资咨询业务证书编号:S1300525040001 本周(04.28-05.04)均价跟踪的 100 个化工品种中,共有 22 个品种价格上涨,47 ...
路维光电(688401):业绩稳健增长,半导体掩膜版表现亮眼
Huaan Securities· 2025-04-30 09:06
Investment Rating - The investment rating for the company is "Accumulate" (maintained) [1] Core Views - The company reported a revenue of approximately 880 million yuan for 2024, representing a year-on-year growth of about 30.2%. The net profit attributable to shareholders was approximately 190 million yuan, with a year-on-year increase of about 28.3%. The gross margin was approximately 34.8%, showing a slight decline of 0.3 percentage points [5] - In Q1 2025, the company achieved a revenue of approximately 260 million yuan, a year-on-year growth of about 47.1%, but a quarter-on-quarter decline of about 4.7%. The net profit attributable to shareholders was approximately 50 million yuan, with a year-on-year increase of about 19.7% and a quarter-on-quarter decline of about 29.6% [5] - The strong performance in 2024 and Q1 2025 is attributed to high demand in the mask plate downstream market, steady capacity expansion, product structure adjustments towards high-end AMOLED and advanced packaging products, and effective cost control [5] Financial Performance Summary - The company expects net profits for 2025, 2026, and 2027 to be approximately 296 million, 403 million, and 583 million yuan respectively, with corresponding P/E ratios of 22.14, 16.26, and 11.23 [9] - The revenue for 2024 is projected at 876 million yuan, with a year-on-year growth of 30.2%. The gross margin is expected to be 34.8% [13] - The company is also expected to see a rise in the revenue contribution from semiconductor mask plates, with ongoing projects aimed at producing 40nm and 28-40nm mask plates [8][9]
AMD盯上了FOPLP?
半导体芯闻· 2025-04-30 08:19
如果您希望可以时常见面,欢迎标星收藏哦~ 来源:内容来自 Source:moneyDJ ,谢谢 。 FOPLP(面板级扇出型封装)成为新的先进封装竞逐市场,封测大厂力成(6239)执行长谢永达昨(29) 日于法说会上透露,公司正与一家美国客户合作验证中,即日前宣布投产晶圆代工龙头2奈米制程 的公司(这意指超微AMD)。尽管公司未公布合作细节,供应链则透露,公司技术将应用在PC或游 戏机芯片,最快2027年可以看到产品上市。 国内封测厂多年来一直在推行FOPLP案,至今约莫9年,但一直没有看到有太多终端应用落地,主 要是因为起初因良率问题而迟迟未见显著成效,客户端态度也相对观望。再加上,早前应用层次停 留在RF IC、PMIC等相对成熟领域,如今在台积电(2330)登高一呼下,封测厂也加速转往消费性 电子、AI等更多元的应用场域。 谢永达表示,力成的FOPLP 技术自2016 年量产以来,当时技术相对简单,经过历年来的持续优 化,目前朝异质整合发展,规格主要采510X515 毫米。他也强调,目前全球真正具大规模FOPLP 生产能力的业者仅有公司一家,良率也大幅超出预期,现正与与一家美国客户合作验证中。 关 注 ...
光力科技(ADT)与锐杰微(RMT)在先进封装磨切领域签署战略合作协议
news flash· 2025-04-30 07:24
4月28日,光力科技(300480)半导体装备板块全资子公司光力瑞弘电子科技有限公司(ADT)与锐杰微 科技(郑州)有限公司(RMT)签署战略合作协议。双方将围绕先进封装的磨切领域开展深度合作,共同搭 建"需求牵引、技术攻坚、产业验证"的协同创新联盟框架,打造"材料表征-设备优化-工艺验证-应用闭 环"的国产全自动化先进封装研发生产平台。此次合作标志着国内先进封装产业链上下游企业协同创 新、突破技术瓶颈的重要实践迈出实质性步伐。(人民财讯) ...
华海清科(688120):2024年报及2025年一季报点评:经营业绩再创新高,积极推进新产品新业务布局
Huachuang Securities· 2025-04-30 06:47
Investment Rating - The report maintains a "Strong Buy" rating for the company, expecting it to outperform the benchmark index by over 20% in the next six months [2][21]. Core Views - The company achieved record high operating performance in 2024, with revenue reaching 3.406 billion yuan, a year-on-year increase of 35.82%, and a net profit of 1.023 billion yuan, up 41.40% year-on-year [5][6]. - The company is actively advancing new product and business layouts, particularly in the AI-driven advanced packaging market, which is projected to grow significantly [5][6]. - The company has successfully increased its market share and sales scale in CMP products, enhancing its core competitiveness through increased R&D investment and production capacity [5][6]. Financial Performance - In 2024, the company reported total revenue of 34.06 billion yuan, with a year-on-year growth of 35.82%, and a net profit attributable to shareholders of 10.23 billion yuan, reflecting a year-on-year increase of 41.40% [5][6]. - For Q1 2025, the company achieved revenue of 9.12 billion yuan, a year-on-year increase of 34.14%, and a net profit of 2.33 billion yuan, up 15.47% year-on-year [5][6]. - The company’s earnings per share (EPS) are projected to be 5.70 yuan in 2025, 7.15 yuan in 2026, and 8.36 yuan in 2027 [6][7]. Market Position and Strategy - The company is focusing on the development of new products and technologies, achieving significant results in CMP equipment, thinning equipment, and other product lines [5][6]. - The company has completed the construction of new production bases to support its platform strategy, enhancing its production scale and competitiveness [5][6]. - The global advanced packaging market is expected to grow from 37.8 billion USD in 2023 to 69.5 billion USD by 2029, with a compound annual growth rate of 10.7%, presenting significant opportunities for the company [5][6].
硅芯科技推出三维堆叠芯片系统建模工具3Sheng_Zenith
半导体行业观察· 2025-04-30 00:44
来源: 硅芯科技官微 硅芯科技自研3Sheng Integration Platform,实现三维堆叠芯片的系统级规划、物理实现与分 析、可测性与可靠性设计等,集成"系统-测试-综合-仿真-验证"五引擎合一,具有统一数据底 座,支持三维异构集成系统的敏捷开发与可定制化的协同设计优化,并在多个功能和性能上具有 独创性。 直面需求 3月在HiPi联盟大会,已听到 多位业内顶级设计专家发声Chiplet和3D IC对设计和EDA挑战。 近年来国内设计三维异构集成芯片的困扰似乎集中于设计出的堆叠结构,却在仿真和验证以后 仍然发现诸多问题!于是 "缺乏架构设计,急需设计协同和优化,设计要素全线左移" 已经成 为了业界对三维芯片堆叠设计的共识! 要做一个设计,初心始于SoC的迭代,如果没有架构设计,严格说是能融合支持IP划分、工艺 选择、版图探索、前仿真、互连检查与优化、基于电源和热的物理实现、跨Die物理签核的多 点协同设计的架构设计和早期分析工具,那这样的设计通常会南辕北辙。 在近期硅芯科技的行业分享讲座上,创始人赵毅博士 基于业界3D IC设计遇到的问题 做了又 一轮的总结。其中提到:顶层架构对于应用场景、有效探索 ...
披露1.4nm细节,英特尔更新晶圆代工路线图
半导体行业观察· 2025-04-30 00:44
如果您希望可以时常见面,欢迎标星收藏哦~ 今天,英特尔举办了晶圆代工大会,会上公司指出,正在与主要客户洽谈即将推出的14A工艺 节点(相当于1.4纳米),该节点是18A工艺节点的后续产品。英特尔已有多家客户计划流片 14A测试芯片。英特尔还透露,公司至关重要的18A节点目前已进入风险生产阶段,并计划于 今年晚些时候实现量产。 英特尔新的18A-P扩展节点(18A节点的高性能变体)目前正在晶圆厂早期生产。此外,该公司正 在开发一种新的18A-PT变体,该变体支持带有混合键合互连的Foveros Direct 3D,使该公司能够 在其最先进的前沿节点上垂直堆叠芯片。 在英特尔的新方案中,Foveros Direct 3D 技术是一项关键的进展,因为它提供了竞争对手台积电 (TSMC)已在生产中使用的功能,最著名的是 AMD 的 3D V-Cache 产品。事实上,英特尔的实 现在关键互连密度测量方面与台积电的产品不相上下。 在成熟节点方面,英特尔代工厂目前已在晶圆厂中完成其首个 16nm 生产流片,并且该公司目前 还在与联华电子合作开发的 12nm 节点吸引客户。 接下来,我们来看一下这家巨头的晶圆代工最新路线图 ...
通富微电(002156):市场复苏+结构优化,25Q1业绩持续向好
Guotou Securities· 2025-04-29 14:04
Investment Rating - The investment rating for the company is "Buy-A" with a target price of 30.65 CNY per share [5]. Core Views - The company reported a revenue of 23.882 billion CNY in 2024, representing a year-on-year increase of 7.24%, and a net profit of 678 million CNY, up 299.9% year-on-year [1]. - In Q1 2025, the company achieved a revenue of 6.092 billion CNY, a year-on-year increase of 15.34%, and a net profit of 101 million CNY, up 2.94% year-on-year [1]. - The overall gross margin for 2024 was 14.84%, an increase of 3.18 percentage points year-on-year, with a net profit margin of 3.31%, up 2.34 percentage points year-on-year [2]. Summary by Sections Financial Performance - The company’s revenue and net profit for 2024 were 238.82 billion CNY and 6.78 billion CNY, respectively, with significant growth in net profit due to improved operational efficiency and cost control [1][2]. - For Q1 2025, the company reported a revenue of 60.92 billion CNY and a net profit of 1.01 billion CNY, indicating a positive trend in financial performance [1]. Market and Industry Trends - The industry is experiencing a recovery driven by demand in data centers, automotive electronics, and consumer electronics, contributing to the company's improved market conditions [2]. - The company has seen a notable increase in revenue from mid-to-high-end products, with a significant rise in capacity utilization and effective cost management [2]. Product and Business Development - The company has diversified its product offerings, achieving a 46% increase in revenue from high-end mobile SOCs and a 70% increase in revenue from RF products [3]. - The automotive sector has shown exceptional growth, with revenue from power devices, MCUs, and smart cockpit products surging over 200% [3]. - The company’s Memory business grew by 40% due to enhanced collaboration with original manufacturers, and the display driver business successfully introduced advanced cutting processes [3]. Capacity Expansion and Acquisitions - The company is accelerating its global capacity expansion, with ongoing projects in various locations aimed at enhancing high-end packaging capacity [8]. - The acquisition of a 26% stake in Jinglong Technology is expected to strengthen the company's position in the high-end IC testing sector, providing stable financial returns [8].
艾森股份(688720):先进封装相关产品需求增加,公司业绩稳健增长
Ping An Securities· 2025-04-29 12:07
Investment Rating - The report maintains a "Recommended" investment rating for the company [1][5][13] Core Views - The demand for advanced packaging-related products is increasing, leading to stable growth in the company's performance. In 2024, the company achieved a revenue of 432 million yuan, a year-on-year increase of 20.04%, and a net profit attributable to shareholders of 33.48 million yuan, up 2.51% year-on-year [4][5] - The company's revenue growth is supported by the overall recovery in industry demand, particularly for advanced packaging products, and the company's technological advantages in core products such as electroplating solutions and photoresists [5][8] - The company is expanding its market share in the advanced packaging sector and has made significant investments in R&D, with R&D expenses increasing by 40.42% year-on-year, which has impacted profit margins [5][8] Financial Performance Summary - In 2024, the company reported a revenue of 432 million yuan, with a gross margin of 26.42% and a net margin of 7.75%. The revenue for Q1 2025 was 126 million yuan, reflecting a year-on-year growth of 54.13% [4][5][6] - The company's revenue structure shows that sales of electroplating solutions and related reagents reached 196 million yuan in 2024, a 9.67% increase year-on-year, while photoresists saw a 37.68% increase in sales to 95 million yuan [8] - The company is positioned as a leading supplier in the domestic traditional packaging sector and is expanding into other application areas, including passive components, PCBs, advanced packaging, and wafer manufacturing [8] Future Projections - The company is projected to achieve revenues of 573 million yuan in 2025, 735 million yuan in 2026, and 926 million yuan in 2027, with corresponding net profits of 47 million yuan, 72 million yuan, and 106 million yuan respectively [6][11] - The expected EPS for 2025, 2026, and 2027 are 0.53 yuan, 0.82 yuan, and 1.20 yuan, respectively, indicating a positive growth trajectory [6][11] Market Position and Strategy - The company is focusing on expanding its product line in the advanced packaging sector and has successfully launched several products for mass production, which are widely used in various processes [8] - The company aims to enhance its market share in the advanced packaging and wet electronic chemicals market, driven by the expansion wave among domestic manufacturers [8][11]