Core Insights - Major investments in AI infrastructure by global tech giants are driven by the urgent need for energy infrastructure upgrades and the new challenges posed by high-density computing on power supply [1] - The rapid development of renewable energy is outpacing the construction of grid infrastructure, necessitating accelerated grid development to keep up with power generation [1] - The rise of AI is providing new growth momentum for the power equipment industry, with data centers (AIDC) being central to AI infrastructure and their stable operation relying on energy supply [1] Group 1 - The traditional 415V AC systems are becoming inadequate due to increasing rack power density, leading to a potential shift towards 800V DC distribution systems [2] - The concentration of AC-DC conversion equipment is expected to rise, with the use of Solid State Transformers (SST) simplifying systems and aiding in carbon reduction for data centers [2] - The white paper from NVIDIA highlights significant fluctuations in rack power due to GPU power increases, presenting challenges for power supply and grid stability [2] Group 2 - Solutions proposed for managing power fluctuations include software optimization, energy storage systems, and limiting GPU performance, which opens up application spaces for supercapacitors and energy storage [2] - The development of new power systems, such as virtual power plants, is suggested to enhance system stability by matching electricity consumption with generation [2] - Companies with strong systemic solution capabilities are expected to gain a competitive advantage in this evolving landscape [2]

Investment Rating - The report initiates coverage of Jentech with a Buy rating and sets a target price of TWD3,186. It also reiterates Buy ratings for AVC and Auras with target prices of TWD1,700 and TWD1,160 respectively [15][16][44]. Core Insights - The rapid development of AI performance upgrades is expected to revolutionize the liquid cooling industry, particularly with the introduction of microchannel lid (MCL) technology and potential new thermal interface materials (TIM) from late 2026 to 2028 [3][6]. - The thermal design power (TDP) of mainstream AI chips is projected to increase to approximately 2,000W by mid-2026, with expectations that chips will exceed 3,000W by 2027 [6][19]. - MCL is anticipated to be the most practical solution for cooling chips with TDPs over 3,000W, as it integrates a heat spreader with a cold plate to minimize thermal resistance [7][27]. - Current thermal component makers are expected to experience significant growth opportunities in the next two to three years, driven by the increasing adoption of liquid cooling solutions across various AI systems [14][39]. Summary by Sections Liquid Cooling Technology - Liquid cooling technology is evolving rapidly, with strong total addressable market (TAM) growth expected to benefit both existing and new players [6][19]. - The transition from air cooling to liquid cooling is becoming mainstream, particularly for AI GPUs, with full liquid cooling solutions anticipated to dominate by 2025 [6][19]. Microchannel Lid (MCL) Technology - MCL is viewed as a critical advancement for next-gen AI server architecture, offering compatibility with existing single-phase liquid cooling systems and a lower Z-height for higher-density designs [7][27]. - The adoption of MCL may face challenges, including design and manufacturing complexities, but its potential for earlier adoption compared to two-phase cooling solutions is noted [8][28]. Thermal Interface Materials (TIM) - The report discusses the potential shift to indium metal TIMs for high-performance chips, particularly as TDP levels rise and current graphite film TIMs face limitations [10][38]. - Optimized lids with highly thermal-conductive TIMs are expected to remain favored solutions for upcoming AI chips, with ongoing research into new materials like silicon carbide (SiC) [9][37]. Company Coverage - Jentech is positioned as a leading beneficiary of MCL technology due to its strong relationships with foundries and experience in heat spreader manufacturing [16][42]. - AVC and Auras are also highlighted for their potential growth as liquid cooling solutions become more prevalent in AI systems, with both companies maintaining Buy ratings [15][44].

Investment Rating - The report maintains a "Positive" investment rating for the electronic industry, indicating an expected return that is stronger than the market benchmark by over 5% [5]. Core Insights - The AI server market continues to grow, driven by demand for AI computing power and hardware upgrades [7]. - System assembly is emerging as a new driver for performance enhancement in AI servers, as traditional manufacturing processes may not keep pace with the rapid development of AI computing needs [8]. - Advanced packaging techniques are becoming crucial for improving chip performance, especially as traditional process upgrades slow down [8]. - Industry leaders are expected to benefit from the rising technical barriers and improved competitive environment in the system assembly sector [8]. Summary by Sections AI Server Market Dynamics - The demand for AI computing facilities is driving growth in the AI server market, with significant upgrades in hardware [7]. - The number of GPUs in AI servers is increasing dramatically, with projections for future upgrades to 144 GPUs per cabinet by 2027 [8]. Performance Enhancement Drivers - The report highlights that system assembly is becoming a key factor in enhancing AI server performance, as the number of GPUs per server increases [8]. - The complexity of system assembly is rising, which may limit production capacity for some companies [8]. Recommended Investment Targets - The report recommends several companies related to AI server system assembly, including: - Industrial Fulian (601138, Buy) - Haiguang Information (688041, Buy) - Lenovo Group (00992, Buy) - Huaqin Technology (603296, Buy) [8]. - Industrial Fulian is noted for significant improvements in product testing and production efficiency, with strong order growth expected [8]. - Haiguang Information is positioned to leverage vertical integration capabilities following its merger with Zhongke Shuguang [8]. - Lenovo Group is anticipated to launch various servers based on Nvidia's Blackwell Ultra starting in the second half of 2025 [8]. - Huaqin Technology is recognized as a core ODM supplier for AI servers, benefiting from increased capital expenditures by cloud service providers [8].

Group 1 - Major semiconductor companies, including TSMC, Samsung, Micron, and SanDisk, have announced price increases for their products, reflecting the strong demand driven by the AI wave and data center construction [1][3] - TSMC plans to raise prices for its 3nm and 2nm process nodes, with the 2nm process expected to see a price increase of at least 50% compared to the 3nm process, significantly exceeding market expectations [2][3] - The price hikes in memory chips include a 30% increase for DRAM products and a 5% to 10% increase for NAND flash products from Samsung, driven by supply constraints and surging demand from cloud enterprises [3] Group 2 - TSMC's strong pricing strategy highlights its dominant position in the supply chain, with major clients like Apple and Nvidia relying on its advanced process technologies for their next-generation chips [3] - The stock prices of major memory chip manufacturers, including Samsung and SK Hynix, have risen in response to the price increases, indicating a positive market reaction [3] - The overall performance of the US stock market remains mixed, with major tech stocks experiencing declines, while semiconductor stocks show strength due to the price increase announcements [3]

Summary of Key Points from Conference Call Records Industry Overview - The focus is on the North American cloud computing industry, particularly major players like Google, Meta, Microsoft, and Amazon, and their capital expenditure (CapEx) related to AI and cloud services [1][2][4][5]. Core Insights and Arguments - **Capital Expenditure Growth**: North American cloud providers are expected to exceed $366 billion in total capital expenditure in 2025, reflecting a year-on-year increase of over 47%, driven primarily by Google, Meta, Microsoft, and Amazon [1][2]. - **Google's Investment**: Google raised its 2025 CapEx guidance from $75 billion to $85 billion, a 62% increase year-on-year, with further growth anticipated in 2026 [2][4]. - **Meta's Strategic Goals**: Meta aims for "super intelligence" and has established a dedicated lab for this purpose, indicating a potential CapEx nearing $100 billion by 2026, driven by five key business opportunities [1][7]. - **Microsoft and Amazon's Commitment**: Microsoft plans to maintain over $30 billion in CapEx for the next fiscal quarter, while Amazon expects to sustain its investment levels in the second half of 2025 [2][4]. - **AI Industry Resilience**: Despite concerns over the delayed release of OpenAI's GPT-5, the AI industry continues to innovate, with significant advancements from companies like Anthropic and Xai [1][10]. Additional Important Content - **PCB Market Volatility**: The PCB sector has experienced significant fluctuations due to discussions around COVF/SOP technology paths and increased CapEx expectations from cloud providers [1][14]. - **ASIC Supply Chain Outlook**: The ASIC supply chain is expected to see significant demand elasticity by 2026, with emerging companies like New Feng Peng Ding and Dongshan Jingwang poised to enter the market [3][16]. - **Technological Innovations in PCB**: Innovations such as cobalt processes are being explored to simplify PCB structures, although challenges like heat dissipation and chip warping remain [3][17]. - **Market Trends and Future Projections**: The AI industry's growth is projected to continue, with hardware demand expected to rise significantly by 2026, despite short-term market fluctuations [11][15]. - **Investment Opportunities**: There is a recommendation to monitor potential market pullbacks to capitalize on investment opportunities, particularly in the PCB sector and traditional NB chain stocks [12][15][24]. Conclusion - The North American cloud computing industry is poised for substantial growth in capital expenditures, particularly in AI-related investments. Major players are demonstrating strong confidence in the future of AI, with ongoing innovations and strategic investments shaping the landscape. The PCB and ASIC markets are also highlighted as areas of potential growth and investment opportunity.

Core Viewpoint - Morgan Stanley believes that the transition from CoWoS to CoWoP faces significant technical challenges, and the reliance on ABF substrates is unlikely to change in the short term [1][2][8] Group 1: Technical Challenges - The CoWoP technology requires PCB line/space (L/S) to be reduced to below 10/10 microns, which is significantly more challenging than the current standards of ABF substrates [5][6] - The current high-density interconnect (HDI) PCB has an L/S of 40/50 microns, and even the PCB used in iPhone motherboards only reaches 20/35 microns, making the transition to CoWoP technically difficult [5][6] Group 2: Supply Chain Risks - Transitioning from CoWoS to CoWoP could introduce significant yield risks and necessitate a reconfiguration of the supply chain, which is not commercially logical given the timeline for mass production [8] - TSMC's CoWoS yield rate is nearly 100%, making a switch to a new technology unnecessarily risky [8] Group 3: Potential Advantages of CoWoP - Despite the short-term challenges, CoWoP technology has potential advantages, including shorter signal paths, improved thermal performance suitable for >1000W GPUs, better power integrity, and addressing organic substrate capacity bottlenecks [10] - The goals of adopting CoWoP include solving substrate warping issues, increasing NVLink coverage on PCBs without additional substrates, achieving higher thermal efficiency without packaging lids, and eliminating bottlenecks in certain packaging materials [10]

Core Viewpoint - Navitas Semiconductor's GaN and SiC technologies have been selected to support NVIDIA's next-generation 800 V HVDC data center power infrastructure, which is designed to enhance power delivery for AI workloads and support 1 MW IT racks and beyond [1][15]. Group 1: Technology Collaboration - The collaboration between Navitas and NVIDIA focuses on the 800 V HVDC architecture, which aims to provide high-efficiency and scalable power delivery for AI workloads, improving reliability and reducing infrastructure complexity [2][4]. - Navitas' GaNFast™ and GeneSiC™ technologies will enable the powering of NVIDIA's GPUs, such as the Rubin Ultra, directly from the 800 V HVDC system [1][6]. Group 2: Advantages of 800 V HVDC - The existing data center architecture, which uses traditional 54 V in-rack power distribution, is limited to a few hundred kilowatts and faces physical limitations as power demand increases [3]. - The 800 V HVDC system allows for a reduction in copper wire thickness by up to 45%, significantly decreasing the amount of copper needed to power a 1 MW rack, which is crucial for meeting the gigawatt power demands of modern AI data centers [5][6]. - This architecture eliminates the need for additional AC-DC converters, directly powering IT racks and enhancing overall system efficiency [6][13]. Group 3: Performance and Efficiency - NVIDIA's 800 V HVDC architecture is expected to improve end-to-end power efficiency by up to 5%, reduce maintenance costs by 70% due to fewer power supply unit (PSU) failures, and lower cooling costs by connecting HVDC directly to IT and compute racks [13]. - Navitas has introduced several high-efficiency power supply units (PSUs), including a 12 kW PSU that meets 98% efficiency, showcasing the company's commitment to innovation in power delivery for AI data centers [12]. Group 4: Company Background - Navitas Semiconductor, founded in 2014, specializes in next-generation power semiconductors, focusing on GaN and SiC technologies for various markets, including AI data centers and electric vehicles [17]. - The company holds over 300 patents and is recognized for its commitment to sustainability, being the first semiconductor company to achieve CarbonNeutral® certification [17].

Core Viewpoint - Huawei's CloudMatrix 384 super node claims to rival Nvidia's NVL72, but there are discrepancies in the hardware descriptions and capabilities between CloudMatrix and the UB-Mesh paper, suggesting they may represent different hardware forms [1][2][8]. Group 1: CloudMatrix vs. UB-Mesh - CloudMatrix is described as a commercial 384 NPU scale-up super node, while UB-Mesh outlines a plan for an 8000 NPU scale-up super node [8]. - The UB-Mesh paper indicates a different architecture for the next generation of NPUs, potentially enhancing capabilities beyond the current 910C model [10][11]. - There are significant differences in the number of NPUs per rack, with CloudMatrix having 32 NPUs per rack compared to UB-Mesh's 64 NPUs per rack [1]. Group 2: Technical Analysis - CloudMatrix's total power consumption is estimated at 500KW, significantly higher than NVL72's 145KW, raising questions about its energy efficiency [2]. - The analysis of optical fiber requirements for CloudMatrix suggests that Huawei's vertical integration may mitigate costs and power consumption concerns associated with fiber optics [3][4]. - The UB-Mesh paper proposes a multi-rack structure using electrical connections within racks and optical connections between racks, which could optimize deployment and reduce complexity [9]. Group 3: Market Implications - The competitive landscape may shift if Huawei successfully develops a robust AI hardware ecosystem, potentially challenging Nvidia's dominance in the market [11]. - The ongoing development of AI infrastructure in China could lead to a new competitive environment, especially with the emergence of products like DeepSeek [11][12]. - The perception of optical modules and their cost-effectiveness may evolve, similar to the trajectory of laser radar technology in the automotive industry [6].

图片来源：NVIDIA NVIDIA 的芯片产品组合涵盖了中央处理器（CPU）、图形处理器（GPU）以及网络设备（用于纵 向扩展和横向扩展）。 NVIDIA 发布了其最新的 " Blackwell超级AI工厂" 平台 GB300 NVL72，与 GB200 NVL72 相比，其 AI性能提升了 1.5 倍。 NVIDIA 分享了其芯片路线图，这样一来，行业内企业在现在采购 Blackwell系统时，便可以谨慎 规划其资本性支出投资，以便在未来几年内有可能从 "Hopper" 系列升级到 "Rubin" 系列或 "Feynman" 系列。 "Rubin" 和 "Rubin Ultra" 两款产品分别采用双掩模版尺寸和四掩模版尺寸的图形处理器（GPU）， 在使用 FP4 精度运算时，性能分别可达 50 petaFLOPS（千万亿次浮点运算）和 100 petaFLOPS，分 别搭载 288GB 的第四代高带宽存储器（HBM4）和 1TB 的 HBM4e 存储器，将分别于 2026 年下半 年和 2027 年推出。 全新的 "Vera" 中央处理器（CPU）拥有 88 个基于Arm公司设计打造的定制核心，具备更大的 ...

Core Viewpoint - The article discusses NVIDIA's advancements in AI technology, emphasizing the importance of tokens in the AI economy and the need for extensive computational resources to support complex AI models [1][2]. Group 1: Chip Developments - NVIDIA has introduced the "Blackwell Super AI Factory" platform GB300 NVL72, which offers 1.5 times the AI performance compared to the previous GB200 NVL72 [6]. - The new "Vera" CPU features 88 custom cores based on Arm architecture, delivering double the performance of the "Grace" CPU while consuming only 50W [6]. - The "Rubin" and "Rubin Ultra" GPUs will achieve performance levels of 50 petaFLOPS and 100 petaFLOPS, respectively, with releases scheduled for the second half of 2026 and 2027 [6]. Group 2: System Innovations - The DGX SuperPOD infrastructure, powered by 36 "Grace" CPUs and 72 "Blackwell" GPUs, boasts AI performance 70 times higher than the "Hopper" system [10]. - The system utilizes the fifth-generation NVLink technology and can scale to thousands of NVIDIA GB super chips, enhancing its computational capabilities [10]. Group 3: Software Solutions - NVIDIA's software stack, including Dynamo, is crucial for managing AI workloads efficiently and enhancing programmability [12][19]. - The Dynamo framework supports multi-GPU scheduling and optimizes inference processes, potentially increasing token generation capabilities by over 30 times for specific models [19]. Group 4: AI Applications and Platforms - NVIDIA's "Halos" platform integrates safety systems for autonomous vehicles, appealing to major automotive manufacturers and suppliers [20]. - The Aerial platform aims to develop a native AI-driven 6G technology stack, collaborating with industry players to enhance wireless access networks [21]. Group 5: Market Position and Future Outlook - NVIDIA's CUDA-X has become the default programming language for AI applications, with over one million developers utilizing it [23]. - The company's advancements in synthetic data generation and customizable humanoid robot models are expected to drive new industry growth and applications [25].