如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自ZDNET，谢谢。 三星电⼦今年第⼀季度开始为NVIDIA量产12层HBME，似乎是⼀个⼤胆举措，希望通过及时供 应产品，让落后的HBM业务重回正轨。 尽管仍在与客⼾进⾏质量测试，但据了解，这是⼀种在获 得供应批准的情况下提前确保产品安全的策略。 然⽽， 如果 Nvidia 的供应批准再次延迟，该产品最终可能会陷⼊数百亿的库存。不过，三星电 ⼦抢先量产的原因是为了尽可能提前市场切⼊点。据悉，内部对12层HBME的性能和稳定性有相 当的信⼼。 NVIDIA批准供货前提前量产…愿意在合适的时机 进⼊市场 据业内⼈⼠2⽇透露，三星电⼦⾃2⽉份起已转⼊HBME 12层量产。 三星电⼦采⽤1a DRAM的 HBME 12层⽬前正在与其主要客⼾NVIDIA进⾏质量测试。三星电⼦原本计划在去年下半年供应 该产品。然⽽，由于性能问题导致测试计划不断推迟，我们正在推动重新提供性能有所改进的产 品。 三星电⼦最早可能在 6 ⽉或 7 ⽉获得 NVIDIA 的批准，供应改进的 12 层 HBME 产品。 尽管如此，三星电⼦⾃去年 2 ⽉以来已⼤幅增加了 HBME 12 层产量 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自彭博，谢谢。 苹果公司计划今年从美国采购超过190亿美元的芯⽚，作为其全球供应链调整的⼀部分，逐步减少 对中国⼤陆的依赖，并提升印度在iPhone⽣产中的地位。 ⾸席执⾏官蒂姆·库克提到，苹果将更多依赖台积电，该公司正在亚利桑那州扩建⾄六座⼯⼚。他 还确认了苹果未来将把⼤部分⾯向美国市场的iPhone⽣产转向印度的预期⸺在唐纳德·特朗普 政府威胁对中国征收惩罚性关税的背景下，苹果将减少在中国⼤陆的产量。在周四的财报电话会议 上，"印度"被提及的次数⼏乎与"中国"相当，显⽰出印度地位的提升。 不过，库克对于潜在的消费电⼦关税将如何影响苹果业务的问题保持沉默，仅表⽰"6⽉之后的情 况很难预测"。⾸席财务官凯⽂·帕雷克表⽰，苹果在电话会议上的陈述是假设当前的全球关税政 策维持不变，且全球宏观经济形势不恶化。 这家总部位于加州库⽐蒂诺的公司备受关注的季度财报未能缓解投资者对其主要挑战的担忧，包括 不断上升的关税成本和在中国⼤陆的销售放缓。在苹果发布第⼆季度业绩、其中中国⼤陆销售低于 预期后，该公司股价在周四盘后交易中⼀度下跌4.2%。 苹果已加快在印度的制造扩张 ...

Core Viewpoint - TSMC is adapting its strategies to meet the increasingly diverse demands of its customers in the semiconductor industry, emphasizing a shift towards tailored manufacturing capabilities for specific market segments [1][17]. Group 1: Industry Trends - The semiconductor industry is evolving with the rise of artificial intelligence, which is expected to drive demand for data center processors as a primary application of TSMC's advanced manufacturing technology [2][3]. - TSMC's future roadmap includes three key directions: maximizing transistor density and performance efficiency, achieving high performance efficiency at reasonable costs, and providing multi-chip packaging solutions suitable for data centers [3][5]. Group 2: Technological Advancements - TSMC plans to introduce advanced process technologies such as NP, N, NP, and A for mobile and consumer-grade SoCs, which are optimized for high performance without the complexity and cost of back-end power supply [5][17]. - The company is also expanding its advanced packaging product portfolio to meet the growing demand for multi-chip packaging solutions in AI and high-performance computing applications [5][18]. Group 3: Innovation and Efficiency - TSMC's transition from N to N nodes has seen a 30% increase in mixed chip density, while the transition to A is expected to yield a 7% to 10% increase in transistor density [6][13]. - The company is confident in achieving significant geometric scaling advantages with the A node, which is expected to be mass-produced by 2028 [6][11]. Group 4: Customer-Centric Approach - TSMC serves over 500 customers from various segments and is continuously improving its strategies to meet the diverse needs of its clientele, moving from a one-size-fits-all approach to a series of dedicated nodes and packaging solutions [17][18]. - The company is committed to allowing customers to reuse their IP throughout the development of its manufacturing processes, reinforcing its long-standing "everyone can be a foundry" philosophy [17].

Core Viewpoint - Baikal Electronics, a Russian CPU developer, has produced and sold 85,000 processors since its establishment in 2012, primarily focusing on low-end embedded applications with the Baikal-T processor, while seeking to expand production to meet the demand for consumer PCs [1][2]. Group 1: Company Performance and Production - As of 2019, Baikal Electronics delivered 17,000 processors to the Russian market, operating with only one office and 81 employees. By the end of 2024, the company aims to increase chip production fivefold to 85,000 units, expanding to four offices and doubling its workforce to 200 employees [1]. - The 85,000 processors include three series: Baikal-T for embedded applications, Baikal-M for consumer PCs, and Baikal-S for data centers, with Baikal-T accounting for the majority of shipments [2]. Group 2: Impact of Sanctions - Following the onset of the Russia-Ukraine war in early 2022, Taiwan, the US, and Europe imposed sanctions on Russia, severely restricting the export of processors. Baikal Electronics faced challenges in sourcing modern technology, being limited to low-performance CPUs [3]. - Baikal attempted to smuggle produced processors into Russia but faced failures, including the confiscation of Baikal-T chips during transit [3]. Group 3: Future Plans - Baikal Electronics plans to start producing the Baikal-L processor for laptops and tablets, aiming to meet consumer PC demands again. Additionally, the company is preparing to manufacture Baikal-S CPUs for data centers, with production expected to take place in mainland China [4].

如果您希望可以时常见面，欢迎标星收藏哦~ 全球芯⽚⾏业或迎来⾰命性突破！上海科技⼤学冯继成课题组（AIL）成功开发出全球⾸套"芯⽚纳⽶⾎管3D打 印机"，突破下⼀代互连⾦属材料难以加⼯的瓶颈⸺⽤铱、钌等下⼀代互连材料替代传统的铜互连，并实现最 ⼩17 nm特征尺⼨的三维桥连结构加⼯以及晶圆级的加⼯通量（图1）。这项名为"法拉第3D打印"的国产技 术，将制造能耗砍⾄传统⼯艺的百万分之⼀，为未来国产⾼端芯⽚量产，打破⾼端芯⽚对进⼝设备和材料的依赖 提供了有⼒保障。 为什么需要"纳⽶⾎管⾰命"？ 揭秘下⼀代互连⾦属材料 芯⽚内部数亿条"⾦属⾎管"正⾯临⼀场⽣死危机！当前⾼端芯⽚依赖的铜互连，⼀旦线宽缩⾄10 nm以下，就 会像"⽣锈的⽔管"⼀样⸺电阻率暴增300%、发热严重甚⾄失效，直接卡死⽽⽆法提升算⼒。铱、钌等材料由 于电阻尺⼨效应弱，⽽被认为是可以替代铜的"下⼀代互连⾦属材料"（图2）。 然⽽由于下⼀代互连材料多为 贵⾦属，且⽬前主流的⼤⻢⼠⾰⼯艺⽆法完全适配，因此下⼀代互连⾦属材料未能在真正的芯⽚中亮相。 图4.研究团队开发出基于脉冲电场的晶圆级⾼通量法拉第3D打印，1⼩时内即可打印晶圆级纳⽶结构阵列。 上 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容综合自网络，谢谢。 2024年全球半导体材料市场收入将达到675亿美元 根据SEMI的数据，2024年全球半导体材料市场收入将增长3.8%，达到675亿美元。 根据国际半导体产业协会（SEMI）材料市场数据订阅（MMDS）的数据，2024年全球半导体材 料市场收入增长3.8%，达到675亿美元。整体半导体市场的复苏，以及高性能计算和高带宽存储 器制造对先进材料需求的不断增长，支撑了2024年材料收入的增长。 台湾半导体材料产值达201亿美元，连续15年位居全球首位 中国台湾地区以201亿美元的营收连续15年成为全球最大的半导体材料消费地区。中国大陆地区 以135亿美元的营收继续实现同比增长，将在2024年位居第二；韩国则以105亿美元的营收位居 第三。除日本外，所有地区在2024年均实现了个位数增长。 | Region | 2024 | 2023 | YoY % Growth | | --- | --- | --- | --- | | Tawan | $20,090 | $18,734 | 7.2% | | China | $13.458 | $12,779 ...

纳芯微近日重磅推出基于 全国产供应链 、 采用HSMT公有协议 的车规级SerDes芯片组，包括 单通 道的加串器芯片NLS9116 和 四通道的解串器芯片NLS9246 。 该系列芯片专为ADAS（摄像头、域控制器）及智能座舱（摄像头、显示屏、域控制器）系统中的高 速数据传输场景设计，通过兼容性更强的公有协议、优异的模拟性能和全国产供应链，为汽车智能 化、网联化提供关键基础支撑。 随着汽车智能化的发展，车载摄像头、显示屏、激光雷达等设备剧增，数据传输量呈指数级上升，SerDes作为 高带宽、低延时、低功耗的数据传输方案代表，在满足摄像头、座舱显示屏等高像素、高分辨率图像传输等方 面具有独特优势。 以L2/L3级的智能汽车为例， 平均每车搭载8-16颗加串器和2-4颗解串器 ；更高阶的高端车型在新增侧视激光 雷达、电子后视镜的情况下，对SerDes芯片的数量要求则更多。目前， 单车搭载SerDes芯片价值大约是几十 美元左右 ，未来随着摄像头、显示屏数量的增多，单车价值还有望继续增加。 全国产供应链+HSMT互联互通， 打造弹性供应标杆 当前，SerDes芯片领域仍由国际厂商主导。主流国际厂商基于GMSL、F ...

Core Viewpoint - The compound semiconductor market is projected to grow from $90.7 billion in 2019 to $347 billion by 2031, with a compound annual growth rate (CAGR) of 11.6% from 2022 to 2031 [2]. Market Growth Drivers - Key factors driving the growth of the compound semiconductor market include the increasing demand for LED technology, emerging trends in the automotive industry, and the advantages of compound semiconductors over silicon-based technologies. Compound semiconductor devices have three times the thermal conductivity and ten times the breakdown electric field strength compared to silicon devices, enhancing reliability and enabling high-voltage applications [4][5]. Market Segmentation - The compound semiconductor market is segmented by type, product, deposition technology, application, and region. Types include III-V, II-VI, sapphire, IV-IV, and others. The III-V segment further includes GaN, GaP, GaAs, InP, and InSb [6]. - By product, the market is divided into power semiconductors, transistors, integrated circuits (ICs), diodes, and rectifiers. The transistor segment includes HEMT, MOSFET, and MESFET [7]. - Applications are categorized into IT and telecommunications, industrial and energy, aerospace and defense, automotive, consumer electronics, and healthcare [8]. Market Share Insights - In terms of revenue, the IV-IV compound semiconductor segment is leading the market growth and is expected to continue this trend during the forecast period. The power semiconductor segment contributed the largest revenue in 2021 and is anticipated to grow significantly [8]. - The IT and telecommunications sector was the largest revenue contributor in 2021, while the Asia-Pacific and North America regions accounted for approximately 74.2% of the market share in 2019 [9]. Key Players - Major players in the compound semiconductor industry include Cree Inc., Infineon Technologies, Nichia Corporation, NXP Semiconductors, Qorvo, Renesas Electronics, Samsung Electronics, STMicroelectronics, Taiwan Semiconductor Manufacturing Company, and Texas Instruments. These companies are employing various strategies such as product launches, acquisitions, collaborations, and expansions to strengthen their market position [10].

4月14日，美国政府通知英伟达，H20出口许可证要求将无限期生效。该许可证旨在应对相关产 品可能被用于中国超级计算机或被转移至此类用途的风险。 英伟达15日交易日股价报收112.2美 元/股，小幅上涨1.35%。此消息公布后，股价盘后大跌6.3%。 英伟达主要生产支持AI大模型训练及推理所需要的GPU加速计算处理器，H20是公司为应对美国 对华高性能AI芯片出口禁令推出的特供版产品。2022年9月，在旗下多款先进AI芯片GPU产品 A100与H100、A800与H800相继被禁后，英伟开发了降低性能配置的H20 芯片，旨在符合美国 出口管制的性能红线，同时满足中国市场的需求。 H20采用了与H100相同的上一代Hopper架构，算力性能据称只有后者的六分之一左右，同时配 置了HBM3E高带宽内存。根据美国政府最新针对其的出口管制要求，此次不只H20制成品，H20 所涉及的高带宽内存、NVlink通信互连或其他相关技术方案都需要审查。 如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容综合自网络 ，谢谢。 芯片访问权可用于谈判贸易协议。 前不久，经过多轮的市场传言猜测与情绪反转，美国政府最终对英伟达对华特供版 ...

Core Insights - A recent survey of over 120 semiconductor professionals provides an objective view on the industry's assessment of Non-Volatile Memory (NVM) technology and its future direction [2][3][5] Group 1: Survey Findings - 81% of respondents are currently evaluating or have used NVM IP, indicating active design decision-making [5][3] - ReRAM has gained recognition from over 60% of respondents, positioning it as a significant alternative to traditional embedded flash memory [5][3] - Many respondents expect to choose NVM IP within the next 6 to 12 months, with some evaluating multiple NVM options, reflecting a changing market landscape [7] Group 2: Selection Criteria - Key factors for selecting NVM IP include power efficiency, reliability, integration flexibility, and scalability, with reliability (42%) and high-temperature performance (37%) being particularly emphasized [8] - Existing solutions face challenges such as limited endurance, high power consumption, and complex integration workflows, driving interest in exploring new NVM types [8] Group 3: Market Trends - The survey highlights several recurring themes in product development across various markets, including IoT, automotive, and AI/ML, where power efficiency, high-temperature resilience, and rapid access are critical [10] - The traditional NVM, especially flash memory, is not disappearing but is no longer the sole development direction, with new technologies like ReRAM being seriously evaluated [10]