Core Viewpoint - The global semiconductor foundry 2.0 market revenue is projected to grow by 13% year-on-year in Q1 2025, reaching $72.29 billion, driven by the surge in demand for AI and high-performance computing (HPC) chips [1][4]. Group 1: Market Dynamics - The traditional semiconductor foundry model (foundry 1.0) is evolving into a technology integration platform, emphasizing vertical coordination and faster innovation, influenced by AI trends and system-level optimization [1]. - TSMC leads the market with a share of 35.3% in Q1 2025, achieving approximately 30% year-on-year revenue growth, followed by Intel and Samsung [4][6]. Group 2: OSAT and Advanced Packaging - OSAT suppliers are becoming a critical segment in the foundry 2.0 supply chain, with a nearly 7% year-on-year growth in Q1 2025, benefiting from TSMC's excess demand for AI-related CoWoS [4][5]. - Advanced packaging demand is increasing, with key players like ASE, SPIL, and Amkor enhancing their capacities [4]. Group 3: Non-Memory IDM and Light Mask Suppliers - Non-memory IDMs such as NXP, Infineon, and Renesas are experiencing a decline in revenue by 3% in Q1 2025, particularly in the automotive and industrial sectors, with recovery expected to be delayed until the second half of 2025 [5]. - Light mask suppliers are benefiting from the adoption of 2nm EUV technology and the increasing complexity of AI/Chiplet designs [5]. Group 4: Future Outlook - The foundry 2.0 ecosystem is expected to transition from a linear manufacturing model to a seamlessly integrated value chain, enhancing collaboration between design, manufacturing, and advanced packaging [8].

Industry Overview - The global semiconductor industry is expected to activate 32 new wafer fabs by 2025, with a projected capacity growth of 7% year-on-year, reaching 33.7 million wafers per month [1] - The capacity in mainland China is anticipated to exceed 10.1 million wafers by 2025, maintaining a double-digit year-on-year growth rate, and increasing its share of global capacity to approximately 30% [1] - The wafer foundry industry is entering a traditional peak season in Q2 and Q3, with increasing market demand expected [1] Cost and Pricing Dynamics - Since April, fluctuations in US-China tariffs have led to increased costs for raw materials and equipment necessary for semiconductor manufacturing, adding pressure on the cost side [1] - There is a widespread expectation of price increases in the wafer foundry industry due to the dual impact of supply-demand tension and rising costs [1] AI and Technological Innovations - The growing scale of AI models and the continuous increase in computational demands are highlighting performance bottlenecks in traditional computing architectures [1] - Innovative solutions such as coarse-grained reconfigurable architectures and wafer-level integrated chips are expected to enhance AI computing efficiency and flexibility [1] - As the number of GPUs increases, interconnectivity between chips may become a major bottleneck, severely limiting the effective scaling of AI training and inference, with wafer-level chips potentially serving as a fundamental solution [1] Company Insights - Crystal Integrated Circuits holds a leading position in the global market share for display driver chip foundry [2] - Guokewai has achieved a full industry chain layout through mergers and acquisitions, integrating "chip design + wafer processing" [3]

6月24日，市场调研机构Counterpoint Research发布的研究报告显示，2025年第一季度全球半导体晶圆代 工2.0市场收入同比增长12.5%至722.9亿美元，这主要得益于对人工智能（AI）和高性能计算（HPC） 芯片的需求激增，刺激了对先进节点（3nm、4nm/5nm）和先进封装（例如CoWoS）的需求。 晶圆代工2.0这一定义由台积电于2024年7月的二季度业绩会上提出；新定义不仅包括传统的晶圆制造， 还涵盖了封装、测试和光罩制作等环节，并且将所有除存储芯片外的整合元件制造商(IDM)纳入其中。 彼时，台积电解释称，"晶圆制造2.0"的提出是由于IDM厂商介入代工市场，晶圆代工界线逐渐模糊。 台积电与三星也进入先进封装，英特尔不论内外客户都采用先进制程，也会用到先进封装，甚至部分产 品也交给台积电代工，与纯晶圆代工有差异，因此扩大晶圆制造产业初始定义到"晶圆制造2.0"。就规 模而言，新定义"晶圆制造2.0"产业规模2023年近2500亿美元，较旧定义1150亿美元更高。 回看这份"晶圆制造2.0"2025年第一季度榜单，台积电以35.3%份额稳坐头把交椅，英特尔以6.5%份额排 第二，日 ...

Core Viewpoint - The article discusses the challenges faced by Laiyifen, a leading snack company in China, particularly regarding its employee stock ownership plans and financial performance, while also highlighting the competitive landscape in the snack industry. Group 1: Employee Stock Ownership Plans - Laiyifen completed a share buyback plan, repurchasing 2.9054 million shares for a total of 30.2236 million yuan, intended for an employee stock ownership plan [1] - The company faced setbacks with its employee stock ownership plans, having previously failed to meet performance targets in 2022 and terminating its second plan in 2024 due to poor financial results [2][3] - The second plan's performance criteria were adjusted to a 3% revenue increase or a 20% net profit increase, but the company reported a 15.25% decline in revenue and a net loss of 75.27 million yuan for the year [2] Group 2: Financial Performance - In 2024, Laiyifen's revenue was 3.37 billion yuan, down 15.25% year-on-year, and it reported a net loss of 7.527 million yuan, marking a second consecutive year of declining revenue and profit [2] - The company's first quarter of 2024 saw revenue of 1.048 billion yuan, a decrease of 1.23%, and a net profit of 12.43 million yuan, down nearly 80% year-on-year [2] - Laiyifen's gross margin for 2024 was reported at 38.82%, the highest in the industry, exceeding the average by nearly 8 percentage points [6][7] Group 3: Competitive Landscape - The snack industry is witnessing a rise in volume snack brands, with companies like Mingming Hen Mang achieving significant growth, reporting 39.344 billion yuan in revenue and a net profit of 0.913 billion yuan in 2024 [5] - Laiyifen's management indicated that they would maintain strategic focus and not enter the volume snack market, despite the competitive pressure [6] - Other companies in the industry, such as Three Squirrels and Salted Fish, have successfully implemented employee stock ownership plans, while others like Good Idea and Qiaqia Foods have faced challenges [3][5] Group 4: Quality Control and Safety Issues - Laiyifen faced a food safety crisis when a consumer reported finding a foreign object in a product, prompting the company to initiate an internal investigation [10] - The company utilizes an outsourcing model for production, which poses challenges for quality control, necessitating a robust quality management system [11] - Laiyifen has implemented a comprehensive quality control system, including supplier selection and regular inspections, to mitigate risks associated with its outsourcing strategy [11]

Core Insights - The article emphasizes the importance of scale, standardization, professionalism, and market responsiveness for brands seeking reliable holiday food manufacturing partners. Fujian Qipihongma Food Group positions itself as a leading OEM in China's festive food sector, offering comprehensive and high-value solutions to help brands seize market opportunities [1]. Group 1: Foundational Strengths - Scale of production and standardized management ensure delivery and quality, with industry-leading capacity [2]. - Management is enhanced by hiring experienced professionals from major companies, implementing a three-pronged management model of refined processes, standardized operations, and standardized outputs [4]. - The company has established a fully digitalized management system, ensuring efficient and reliable operations through strategic partnerships with logistics providers [4][6]. Group 2: Vertical Integration and Smart Manufacturing - The company controls costs and quality through a vertically integrated supply chain, with 100% self-researched core fillings, reducing costs by 15%-20% [7]. - Automation in the production process has reduced manual intervention by 60%, enhancing efficiency and minimizing pollution risks [12]. - The company has developed innovative health-focused products, such as low-sugar mooncakes, aligning with market trends towards healthier options [10][13]. Group 3: Research and Market Innovation - The company focuses on health and innovation in product development, with significant reductions in sugar and fat content in traditional mooncake recipes [10]. - It has successfully launched several best-selling products, including various types of mooncakes that have achieved significant sales milestones [15]. - Continuous innovation is planned for future product lines, including new types of mooncakes and health-oriented series [17]. Group 4: Comprehensive Service Offering - The company provides end-to-end services from market analysis to product development, ensuring tailored solutions for clients [19]. - It offers creative packaging design and brand strategy services to enhance product visibility and market positioning [19]. - Fujian Qipihongma Food Group positions itself not just as a manufacturer but as a strategic partner for brands, aiming to navigate complex supply chain challenges while enabling market success [21].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容编译自businesskorea 。 三星电子正在加速美国尖端晶圆代工厂的量产准备工作，继近期重启此前一直拖延的基础设施建设 后，据悉已开始为明年初首次引入量产设施做准备。 据业界消息人士23日透露，三星电子正在讨论最早于明年1月或2月向美国泰勒代工厂引入2纳米 （nm）工艺量产设施的计划。 三星电子Taylor Foundry Fab是2021年做出投资决定的新工厂，最初目标是量产4nm工艺，但考虑 到市场情况，将重点放在了2nm工艺上。 然而，三星电子已多次推迟泰勒代工厂的全面竣工和量产线的建立。这是因为人们担心，在2nm工 艺需求尚未得到保障的情况下，先发制人的投资将导致巨大的成本损失。 不过，三星电子已于今年第二季度重启泰勒工厂的洁净室装修工程。洁净室是控制生产线内污染和 湿度的基础设施，只有在洁净室建成后，才能引入各种辅助设施和制造设备。洁净室的竣工日期为 今年年底。 由于这是第一条量产线，预计短期投资规模较小。然而，随着三星电子正在为下一代晶圆代工的量 产做准备，业界对此的期待也日益高涨。 未来工厂运营的关键在于获得大客户。三星电子的2纳米工艺（ ...

关注台湾半导体20年，早稻田大学教授长内厚用日本观点解析，台日半导体合作带来的改变与机会。 投身学界之前，早稻田大学经营管理研究科教授长内厚，就对台湾的半导体产业，留下深刻印象。 那是2005年，仍任职于索尼，负责电视事业的长内厚，为了学术调查造访新竹科学园区，研究台湾独 特的产业聚落模式，以及半导体大厂台积电。当年才30来岁的他，对半导体还相当陌生，只知道「很 多日本电子业，都非常依靠台湾半导体产业。」 此后在多次来台的行程中，长内厚因缘际会参访了台积电创新馆，深刻认识了台积电创办人张忠谋强 调「晶圆代工」的先见之明，从此对这个所有家电、资通讯产品必备的晶片产生浓厚兴趣。这股热 情，甚至推着他一头栽进学界，如今成为日本半导体产业研究权威，近期出版了《半导体逆转战略》 一书，试图解答日本如何扭转多年的半导体制造颓势。 公众号记得加星标⭐️，第一时间看推送不会错过。 来源：内容来自工商时报，谢谢 。 日本近年来半导体布局动作不断，在熊本启用JASM晶圆厂，Rapidus在北海道全力研发先进制程。 作为公司内部一分子，日本半导体制造自然以服务自家产品为主，「但后来日本家电逐渐被韩国、中 国取代，这些公司的半导体部 ...

1. 【错误率降低1000倍！微软量子计算重大技术突破，可商用】6月19日，微软首席执行官 SatyaNadella分享了，微软在量子计算的重大技术突破成果4D拓扑量子纠错码。与2D相比，4D拓扑 量子纠错码在编码效率、纠错能力、逻辑操作都非常出色，并且每个逻辑量子比特只需要极少的物理 量子比特，可以一次性检查错误，并将错误率降低1000倍。同时，这项全新的量子计算成果将应用 在微软的Azure Quantum量子计算平台中，加速科研、医疗的研发效率。（AIGC开放社区） 2. 【中国首制16000TEU甲醇双燃料集装箱船交付】6月20日消息，由扬州中远海运重工建造的国内 首制16000TEU甲醇双燃料集装箱船"中远海运洋浦"轮，今日在上海长兴岛交付。该船的交付实现了 大型甲醇双燃料箱船建造领域"国内船东第一单、国内船厂交付第一艘、国产甲醇主机第一次实船应 用" 三个历史性突破，标志着我国在该领域跻身世界前列，为全球航运业绿色低碳转型提供了"中国 方案"。（第一财经） 3.【朱雀三号一级动力系统试车试验成功】6月20日消息，蓝箭航天自主研制的朱雀三号可重复使用 运载火箭一级动力系统试车，在东风商业航天创新试验 ...

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【思摩尔国际股价大跌，亿纬锂能计划减持】今日，思摩尔国际(06969.HK)股价大跌9.95%，收盘于 17.92港元/股，最新市值1109亿港元，成交额达12.8亿港元。 6月16日，股东亿纬锂能(300014)计划即日 起一年内，通过大宗交易、集中竞价等方式，减持思摩尔国际最多3.5%股本，约2.16亿股。减持后，亿 纬锂能将不再是控股股东，目前其持有思摩尔国际总股本30.73%。 按最新股价算，亿纬锂能持有的思 摩尔国际市值为340.8亿港元，本次计划减持市值为38.82亿港元。2024年6月27日，亿纬锂能曾授权董事 长择机减持不超3.5%股份，但未实施。 今年以来，思摩尔国际股价持续走强，6月5日达23.1港元阶段 性高点。亿纬锂能投资思摩尔国际超十年，2014年收购麦克韦尔50.1%股份，2020年思摩尔国际在港交 所上市，上市后9次现金分红，亿纬锂能获近20亿港元收益。 亿纬锂能正着力发展动力电池产业，投资 大，计划香港上市融资。因政策原因，2021年起思摩尔国际业绩下滑，2021 - 2024年营收和净利润均呈 下降趋势。 2024年2月，思摩尔国际股价最低至4.51港元/股。近年其未把握一次 ...