Group 1 - The article reports a workplace accident at TSMC's advanced CoWoS packaging plant in Chiayi, where a worker was killed after being struck by a falling transformer box during installation work [2] - TSMC has two CoWoS packaging plants planned in the Chiayi Science Park, with the first one having started construction in May last year and expected to be completed by the end of next year, aiming for mass production in 2028 and creating 3,000 job opportunities [2] - Following the accident, TSMC has voluntarily halted work at the site and is cooperating with investigations to clarify the cause of the incident [2]

Core Viewpoint - The global semiconductor foundry market is witnessing significant advancements with TSMC and Samsung Electronics set to begin mass production of 2nm technology in the second half of the year, indicating a competitive landscape in advanced semiconductor manufacturing [1][2]. Group 1: TSMC Developments - TSMC plans to start mass production of 2nm technology at its Hsinchu and Kaohsiung facilities in the second half of this year, utilizing the GAA technology previously introduced by Samsung in its 3nm process [1]. - Major clients such as Apple, Nvidia, and AMD are expected to launch new products based on TSMC's 2nm semiconductors [1]. Group 2: Samsung Electronics Progress - Samsung Electronics has announced plans to mass-produce 2nm semiconductors for mobile applications in the second half of the year, aiming to recover its foundry profitability [1]. - The upcoming Galaxy S26 smartphone is predicted to feature the Exynos 2600 processor, which will be based on Samsung's 2nm technology [1]. Group 3: Market Competition and Trends - TSMC has achieved a 100% utilization rate for its 3nm process after five quarters of mass production, while it is expected that the 2nm process will reach full utilization within four quarters post-launch [2]. - Samsung, despite initial challenges with its 3nm process, has secured contracts for the upcoming Nintendo Switch 2, marking a significant competitive win against TSMC [2]. - In response to the U.S.-China trade tensions, Samsung is expanding its customer base in China and increasing production to meet strong demand from American clients [2].

Core Viewpoint - The article discusses the insights of H.-S. Philip Wong, TSMC's Chief Scientist, on the future of semiconductor technology and the challenges posed by U.S. policies towards China’s semiconductor industry [1][2]. Group 1: Background of H.-S. Philip Wong - H.-S. Philip Wong was born in Hong Kong and earned his Ph.D. in Electrical Engineering from Lehigh University after graduating from the University of Hong Kong [2]. - Before joining Stanford University, he led advanced semiconductor research at IBM and is known for creating the world's first carbon nanotube computer in 2013 [2]. Group 2: TSMC's Research and Development Strategy - Wong emphasized the importance of having a forward-looking research team that can identify valuable technologies, even if they are not developed in-house [3]. - He formed a small team with members from universities, other companies, and TSMC, focusing on close interaction with the external research community [3]. Group 3: Challenges in Semiconductor Manufacturing - Wong pointed out that the importance of lithography technology is decreasing, suggesting that future advancements may not rely heavily on extreme resolution [4]. - He noted that the manufacturing process has become overly time-consuming, with the entire process taking up to seven months, and emphasized the need to reduce cycle times [5]. Group 4: U.S. Policies and China's Semiconductor Industry - Wong expressed skepticism about the long-term effectiveness of U.S. strategies to contain China's semiconductor industry, suggesting that these policies may inadvertently create a market for domestic Chinese equipment manufacturers [6][7]. - He observed that while the quality of Chinese research papers has improved significantly in the past 5 to 10 years, Chinese universities still struggle to establish new research directions [7].

Group 1 - Credit bond ETFs will soon implement a pledge-style repurchase system, with multiple public fund institutions' credit bond ETFs meeting the criteria to be included in the repurchase collateral pool [2] - The new medical credit evaluation regulations will enforce stricter measures, requiring untrustworthy pharmaceutical companies to reduce prices as a corrective action [2] - The Shanghai Composite Index experienced a slight decline, while the nuclear power sector saw significant gains, with multiple stocks reaching their daily limit [3][4] Group 2 - The onshore and offshore RMB exchange rates against the US dollar both surpassed 7.17, marking a new high in over six months, with the onshore rate rising over 200 points from the previous close [4] - The bond market in China saw a total issuance of 79.62 trillion yuan in various bonds last year, with a total custody amount reaching 177 trillion yuan by year-end [4] - Meituan reported a first-quarter revenue of 86.56 billion yuan, reflecting an 18% year-on-year growth, with its core local business also showing steady development [8] Group 3 - Xiaomi's YU7 car models have sold out in some versions, with second-hand platforms marking up prices by 100-200 yuan [7] - Wang Jianlin is selling 48 Wanda Plaza locations to a consortium including Tencent, with the transaction recently receiving unconditional approval from regulatory authorities [6] - A subsidiary of China National Petroleum Corporation organized a group purchase of properties that have not been delivered for over nine years, affecting funds exceeding one billion yuan [7]

Investment Rating - The report maintains a "Recommended" investment rating for the semiconductor and semiconductor equipment industry [7] Core Insights - The overseas AI chip index fell by 2.3% this week due to uncertainties in U.S. trade policy, including proposed tariffs on imported iPhones and a 50% tariff on the EU, leading to a decline in stock prices of international chip companies [1][10] - The domestic AI chip index also decreased by 2.5%, with all constituent stocks showing a downward trend [1][10] - The NVIDIA mapping index dropped by 2.8%, influenced by expectations of increased tariffs on European goods, affecting NVIDIA's stock and related industry stocks [1][10] - The server ODM index fell by 4.3%, as rising uncertainties regarding U.S. tariff policies began to impact shipment expectations for U.S. AI chip companies [1][10] - The storage chip index saw a significant decline of 4.5%, with all constituent stocks experiencing price drops [1][10] - The power semiconductor index remained stable, while the A-share fruit chain index fell by 2.8% and the Hong Kong fruit chain index dropped by 3.9% [1][10] Market Data - In Q1 2025, the global wearable wristband market grew by 13% year-on-year, with shipments reaching 46.6 million units. Xiaomi regained the top position with a 44% increase in shipments to 8.7 million units [2][25] - Apple's Apple Watch shipments grew by 5% to 7.6 million units, while Huawei maintained third place with a 36% increase to 7.1 million units [2][25][27] - The global TWS market rebounded strongly, with shipments increasing by 18% year-on-year to 78 million units, marking the highest growth rate since 2021 [2][30] - Apple's market share in the TWS market reached 23%, while Xiaomi rose to second place with a historical high market share of 11.5% [2][30] Major Events - The U.S. government announced plans to impose a 25% tariff on products from Apple and other smartphone manufacturers unless they relocate production back to the U.S., with the policy expected to take effect by the end of June [3][32] - Apple plans to launch smart glasses in 2026, with prototype production expected to begin in late 2025 [3][32] - NVIDIA released a new AI hardware and software suite, including the upcoming GB300 system and desktop-level DGX Spark AI workstation [3][35]

华尔街见闻从供应链权威渠道获悉，由于台积电（TSMC）封测产能扩张，日本旭化成全力供应低温PI （PSPI）材料给台积电，导致这种材料的全球供应链条紧绷，旭化成因而限供中国封测公司，致使中国 封测公司转向求购国内低温PI材料供应商同类产品。由此，国产供应商"意外"承接泼天富贵。先进封装 是低温PSPI材料的主要应用场景之一。（作者 周源） ...

Core Viewpoint - The semiconductor industry is characterized by a complex, interwoven global supply chain, making unilateral actions by either the US or China difficult in their competition for chip manufacturing dominance [1][2]. Group 1: Supply Chain Dynamics - The semiconductor production process relies on a global network for mining, design, manufacturing, packaging, and testing, with certain countries and companies holding proprietary technologies that dominate the market [1]. - Ultra-pure quartz, essential for semiconductor production, is primarily sourced from a single location in North Carolina, which supplies about 90% of the global ultra-pure quartz [1]. Group 2: Market Share and Competition - Shin-Etsu Chemical holds approximately 30% of the global wafer market, establishing itself as a leader in the industry [1]. - TSMC commands a significant 67.1% share of the global foundry market, followed by Samsung at 8.1% and China's SMIC at 5.5%, collectively accounting for over 80% of the market [2]. - The concentration of market power is expected to persist as leading companies continue to invest heavily in research and development, making it challenging for new entrants to disrupt their dominance [2].

Core Viewpoint - TSMC has reserved half of the land in the Shalun Ecological Science Park for future construction of a 1.2nm advanced manufacturing facility, with expected development permits by the second half of 2027 [1] Group 1 - TSMC has made a reservation for land in the Nanke Tainan Park Phase IV, specifically in the Shalun Ecological Science Park [1] - The Nanke Park management department indicates that the Shalun Ecological Science Park is currently in the planning stage [1] - Development permits for the site are anticipated to be obtained by the second half of 2027 [1] Group 2 - The Nanke Park management department has not confirmed whether TSMC has formally requested land or if the area has been pre-reserved for TSMC [1] - The management department stated that any announcements regarding TSMC's land needs should be based on TSMC's official communications [1]

Core Viewpoint - TSMC has issued a strong warning against potential U.S. semiconductor tariffs, stating that such measures could jeopardize its investment plans in Arizona, which amount to $165 billion [1][3][4]. Group 1: TSMC's Investment Plans - TSMC plans to invest $165 billion in the U.S., which includes the construction of six advanced wafer fabs, two advanced packaging plants, and one R&D center, marking the largest single foreign direct investment in U.S. history [3][4]. - The company emphasizes that its investment will create significant job opportunities, including 40,000 jobs during the construction phase and thousands of semiconductor manufacturing and R&D positions once operational [4]. Group 2: Response to U.S. Tariffs - TSMC's letter to the U.S. Department of Commerce strongly suggests that any tariffs or import controls should not undermine U.S. national security goals, including TSMC's investment plans in Arizona [3][4]. - The letter is viewed as one of TSMC's most forceful responses to the potential tariffs, indicating that the company might reconsider its investment if tariffs are imposed [3][4]. Group 3: Economic Impact and Industry Reactions - TSMC's investment is expected to generate $200 billion in indirect economic benefits for the U.S. [4]. - The Taiwanese media and political figures have expressed concern over the government's response to TSMC's position, questioning the adequacy of support from the Taiwanese authorities in light of U.S. pressures [5][6][7].

Core Viewpoint - The article discusses the current state and future prospects of semiconductor manufacturing, particularly focusing on the challenges and methodologies involved in producing advanced nodes like 5nm and 3nm without EUV lithography. It emphasizes the importance of transistor density as a key metric for evaluating semiconductor technology advancements. Group 1: Semiconductor Manufacturing Techniques - DUV lithography combined with multiple exposure techniques can theoretically produce 5nm chips, and even 3nm under extreme conditions, although this approach is costly and not commonly adopted by mainstream foundries [5][23][48]. - The concept of "5nm" has evolved from a direct measurement of line width to a symbolic representation of a process node, with actual transistor gate lengths often exceeding the nominal node size [6][12][23]. Group 2: Transistor Density and Performance - Transistor density (MTr/mm²) is a more relevant metric than line width for comparing semiconductor technologies, as it reflects the number of transistors that can fit in a given area [13][21]. - The article provides a comparative analysis of transistor densities across various nodes, highlighting that the upcoming domestic 5nm technology may only achieve densities comparable to optimized 7nm processes [14][49]. Group 3: Industry Competition and Challenges - The competition among major players like TSMC, Intel, and Samsung is intense, with each company defining process nodes differently, leading to discrepancies in reported capabilities [21][22]. - The article points out that while Samsung claims to have achieved 5nm production, its actual transistor density and yield rates are significantly lower than those of TSMC, raising questions about the validity of such claims [15][21]. Group 4: Future Prospects and Technological Innovations - The semiconductor industry is expected to continue advancing, with predictions of achieving one trillion transistors on a single GPU chip within the next decade, driven by innovations beyond traditional lithography [19][48]. - The article stresses the need for domestic semiconductor manufacturers to focus on improving deposition and etching equipment, as these are critical for achieving high yields and performance in advanced nodes [48][50].