Core Viewpoint - Advanced packaging has become a critical battleground for foundries and packaging companies amid the slowdown of Moore's Law and the explosive demand for AI/HPC solutions. Major players globally, including TSMC, Samsung, ASE, and domestic firms like JCET, Tongfu Microelectronics, and Huatian Technology, are accelerating capacity expansion to seize this key industry opportunity in the coming years [1]. Group 1: Market Trends and Projections - The global advanced chip packaging market is expected to grow from $50.38 billion in 2025 to $79.85 billion by 2032, with a compound annual growth rate (CAGR) of 6.8% [1]. - The demand for high-performance, low-power packaging solutions is driven by AI large models, autonomous driving, cloud computing, and edge computing [1]. Group 2: TSMC's Strategy and Expansion - TSMC's advanced packaging revenue is projected to exceed 10% in 2024, surpassing ASE to become the largest packaging supplier globally, driven by the surge in CoWoS demand [3]. - TSMC plans to invest an additional $100 billion in the U.S., including two advanced packaging plants in Arizona, expected to start construction in the second half of next year and enter mass production by 2028 [5]. - TSMC is set to launch CoWoS-L in 2026 and SoW-X in 2027, enhancing its capabilities significantly in the AI/HPC era [6]. Group 3: Samsung's Cautious Approach - Samsung has adopted a more cautious stance compared to TSMC, previously shelving a $7 billion advanced packaging facility due to uncertain customer demand [7]. - Recent contracts with Tesla and Apple highlight the necessity for Samsung to reconsider its advanced packaging investments [7][8]. - Samsung's integrated model of "memory + foundry + packaging" positions it well for future demand once customer needs become clearer [8]. Group 4: ASE's Expansion and Technological Advancements - ASE is enhancing its advanced packaging capabilities in Kaohsiung, focusing on CoWoS, SoIC, and FOPLP technologies [9]. - ASE's new K18B factory in Kaohsiung will serve AI and HPC demands, while the K28 factory will expand CoWoS testing capacity [9][10]. - ASE's technology evolution includes advancements in 3D Advanced RDL technology, which is crucial for various applications [10][11]. Group 5: Amkor's U.S. Investment - Amkor is expanding its advanced packaging facility in Peoria, Arizona, with a total investment of $2 billion, expected to create over 2,000 jobs [13]. - The new facility will primarily support TSMC's CoWoS and InFO technologies, establishing a local closed-loop for wafer manufacturing and packaging [14]. - Amkor's expansion aligns with U.S. semiconductor policies, emphasizing the need for a complete backend capability to maintain competitiveness in AI and HPC [14]. Group 6: Domestic Players' Development - JCET, Tongfu Microelectronics, and Huatian Technology are rapidly advancing in the advanced packaging sector, each developing unique strategies [15]. - JCET is focusing on various advanced packaging technologies and plans to invest 8.5 billion yuan in 2025, targeting high-performance applications [16][17]. - Tongfu Microelectronics has deepened its partnership with AMD, becoming its largest packaging supplier, and is making significant progress in large-size FCBGA technology [18][19]. - Huatian Technology is exploring CPO technology and has achieved significant growth in revenue, indicating a shift towards system integration in advanced packaging [20][21].

本报（chinatimes.net.cn）记者石飞月 北京报道 在AI浪潮席卷全球半导体产业的宏大叙事下，芯原股份在10月8日交出了一份亮眼的2025年第三季度成 绩单：单季营收创历史新高，同比猛增近八成，亏损大幅收窄，前三季度新签订单更是超越去年全年， 其中AI算力相关订单占据可观比重。然而，这份充斥着"大幅增长"的公告背后，却隐藏着一个令人费解 的现实：自2023年第四季度启动的、已持续八个季度的"订单高位"周期，为何迟迟未能将这家公司从亏 损的泥潭中彻底拖出？ AI算力驱动订单大增 芯原股份预计2025年第三季度实现营业收入12.84亿元，单季度收入创公司历史新高，环比大幅增长 119.74%，同比大幅增长78.77%。 具体到业务层面，一站式芯片定制业务实现了大幅增长。芯原股份的一站式芯片定制服务具体分为两个 主要环节：芯片设计业务和芯片量产业务。该公司预计2025年第三季度芯片设计业务实现收入4.29亿 元，环比增长291.76%，同比增长80.67%；预计量产业务实现收入6.09亿元，环比增长133.02%，同比增 长158.12%。 订单量的增加是推动收入增长的关键因素。芯原股份预计，该公司20 ...

2025 年 10 月1 5-17日 ， 第二届湾区半导体产业生态博览会（湾芯展2025） 将在 深圳会展中心（福田） 盛 大举办。 作为备受瞩目的半导体行业盛会，本届湾芯展 60,000m 2 展览面积，将携手国内外 600 余家 半 导体优质企 业，预计为 60,000+ 专业观众带来贯穿半导体产业链的前沿技术成果和最新解决方案。 展会时间 2025年10月15日 9:00-17:00（周三） 2025年10月16日 9:00-17:00（周四） 2025年10月17日 9:00-16:00（周五） 展会地点 深圳会展中心（福田） 1/2/9号馆 交通指引 福利放送： 免费公交/地铁乘车券 展会期间，观众可凭参观证到【咨询处】领取纸质乘车券，数量有限，先到先得。 行李寄存点 如需行李寄存服务，可前往1号馆1Q32【行李寄存处】 观众进馆流程 ①扫码注册 扫描下方二维码，填写基本信息完成预登记，凭"我的胸卡"，前往"自助打印处"打印证件。 ②自助/人工换证 自助换证：观众签到处（201、205、215） 人工换证：205 ③入场核验 一人一证，凭证件入场 注： 本展会为专业性展会，谢绝18周岁以下人士入场。 ...

每经记者｜孔泽思 每经编辑｜魏文艺 数百家国内外龙头企业将云集深圳，展现全球半导体产业最新成果。10月15日~17日，"2025湾区半导体产业生态博览会"（以下简称"湾芯展"）将在深圳会 展中心举行。 《每日经济新闻》记者（以下简称每经记者）从10月10日上午深圳市政府新闻办举行的新闻发布会上获悉，今年的湾芯展将全面对标"更高规格、更广辐 射、更深融合、更优服务"的目标，展览面积超过6万平方米，参展企业超过600家。 深圳市发展和改革委员会主任郭子平在发布会上透露，2024年深圳半导体产业规模达2564亿元，同比增长26.8%。今年上半年产业规模达1424亿元，继续保 持16.9%的快速增长，展现出强劲发展势头。 在国际化方面，湾芯展吸引了来自全球20多个国家超600家龙头骨干企业及知名院校机构参展，并特邀欧洲、东南亚、日韩等地区官方机构和龙头企业代 表，将举办中国制造出海国际供需对接会等多场国际专业论坛。 在品牌化方面，湾芯展着力打造具有全球影响力的"中国半导体自主品牌第一展"。据悉，北方华创、新凯来、拓荆科技、上海微电子、华虹宏力、华润微电 子、华天科技等国内头部企业将悉数参展。 "今年3月28日，新凯来 ...

（文章来源：证券日报） 证券日报网讯易天股份10月9日在互动平台回答投资者提问时表示，公司控股子公司微组半导体专注于 全自动微米级高精度微组装设备、Mini LED返修设备的研发，是一家集设计、生产和销售、服务为一 体的半导体微组装设备专业制造商。在半导体先进封装贴片设备持续优化核心架构，解决设备行业核心 痛点，已推出3μm高精度贴片类设备，可应用于Chiplet专用设备领域，可实现国产替代。部分设备可用 于军工级传感器组装和航天科技微波器件组装领域，相关微组装设备已进入中国航天科技集团公司九院 704所、中航光电、西安微电子技术研究所等供应链体系。 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 在全球AI加速演进的当下，算力已成为推动科技创新的核心引擎。从ChatGPT到DeepSeek，从多 模态大模型到Agent应用，指数级攀升的算力需求正在重塑半导体产业格局。与此同时，摩尔定律 趋缓、先进制程逼近物理极限，国际巨头纷纷押注Chiplet、CPO、3D-IC 等先进封装路线，产业 生态主导权日益集中。 对中国半导体而言，如何突破"低端锁定"，实现设计—制造—封测—EDA的全链条自主协同，已 成为迫在眉睫的战略课题。在这样的背景下，9月23日下午，由珠海硅芯科技有限公司与机械工业 出版社与联合发起的"引领AI算力'芯'时代——开创半导体产业新纪元"主题论坛在北京成功举办。 本次论坛由专攻2.5D / 3D堆叠芯片EDA领域的硅芯科技牵头组织，将分散在不同领域的议题包括 CPO、RISC-V、EDA/IP、存算一体这些高耦合、跨领域的议题首次整合进一场系统性论坛，既 打破了过去"各说各话"的局面，也标志着产业层面对"系统级协同"的认知正在提升。值得注意的 是，硅芯与机械工业出版社的合作，不仅是技术层面的联合，更是产业与知识平台的结合：前者深 耕产业痛点与工程 ...

"宁波膜智信息科技有限公司"为势银（TrendBank）唯一工商注册实体及收款账户 重要会议： 11 月 17-19 日，2025势银异质异构集成年会（浙江·宁波） 点此报名 11月19日-21日，2025势银显示技术与供应链产业年会（四川·成都） 点此报名 添加文末微信，加 异质异构集成产业 群 随着晶体管不断缩小，芯片尺寸达到光罩极限，将大芯片分割成更小的 Chiplet，通过2.5D、3D堆叠打破制程限制便成为破局关键。 其中，玻璃基板封装由于其物理特性更优、能实现比硅更大的封装尺寸，电气性能更好、能够减少传输损耗，能够有效对抗翘曲问题等优点， 被认为是提升芯片性能的关键材料技术。而在玻璃基板技术的发展中， TGV（玻璃通孔）的技术成熟度是关键所在。 玻璃通孔 (TGV) ，是玻璃芯基板的支柱之一，为更紧凑、更强大的设备铺平了道路，有助于提高层间连接密度。从实际应用中来看，这些通孔 有助于提高高速电路的信号完整性，连接之间的距离减小可减少信号损失和干扰，从而提高整体性能。 同时，TGV 的集成可以通过消除对单独互连层的需求来简化制造流程。然而从实际来看，尽管TGV 具有诸多优势，但也面临许多挑战—— 不 ...

Core Viewpoint - The Chiplet concept sector is experiencing a strong performance, with notable gains in specific stocks such as Pengding Holdings reaching the daily limit increase [1] Company Summary - Pengding Holdings has hit the daily limit increase, indicating strong investor interest and confidence in the stock [1] - Jintuo Co. and Lihexing are also among the stocks showing significant gains, reflecting a broader positive trend in the Chiplet sector [1]

Core Viewpoint - Chipone Technology (688521.SH), a leading company in the domestic semiconductor IP and chip customization sector, experienced a stock price surge, reaching the daily limit of 20% following the announcement of record-high new orders and a strategic acquisition plan [1][2][3]. Group 1: Financial Performance - As of September 11, 2025, Chipone signed new orders worth 1.205 billion yuan, marking a significant increase of 85.88% compared to the entire third quarter of 2024 [2][3]. - The total order backlog reached 3.025 billion yuan by the end of June 2025, representing a 23.17% increase from the end of the first quarter of 2025 [2][3]. - Approximately 64% of the new orders are related to AI computing, indicating a strong market demand in this segment [2][3]. Group 2: Strategic Developments - Chipone announced plans to acquire a 97.0070% stake in Chip Lai Technology to enhance its industry footprint [1][6]. - The acquisition is expected to strengthen Chipone's capabilities in AI ASIC design and improve its market competitiveness in key business areas [7][8]. - The company raised 1.807 billion yuan through a private placement to fund projects related to AIGC and smart mobility, as well as new IP development [1][8]. Group 3: Market Sentiment - The market has reacted positively to Chipone's announcements, with a significant increase in institutional holdings, reaching a record high of 142 million shares held by 632 funds [4][5]. - The stock price has seen substantial growth, increasing 6.51 times since September 18, 2024, and 2.5 times since the beginning of 2025 [4][5]. - Analysts expect that as the company's strategic initiatives progress and orders convert into revenue, its financial performance will improve significantly [9].

Core Insights - The semiconductor packaging and testing technology has become a crucial element in overcoming the dual challenges of "physical limits" and "industrial chain disruptions" in the context of the global semiconductor industry's rapid transformation and geopolitical tensions [1] Group 1: Industry Trends - The advanced packaging sector is seen as a core pathway to continue Moore's Law, with technologies such as 2.5D/3D, Chiplet, and Fan-Out accelerating the integration of design and manufacturing [1] - The geopolitical landscape is reshaping supply chains, necessitating a dual approach of self-sufficiency and globalization for China's packaging industry [1] Group 2: Regional Developments - Jiangsu province, holding nearly half of the national packaging capacity, has become a significant hub for the semiconductor packaging industry, with the Yangtze River Delta region accounting for over 81% of the national total [2] - By 2024, Jiangsu's packaging revenue is projected to exceed 170 billion yuan, with key enterprises achieving breakthroughs in system-level packaging and 2.5D packaging technologies [2] Group 3: Market Dynamics - The domestic integrated circuit industry has seen a continuous increase in prosperity, with sales reaching 1,045.8 billion yuan, a year-on-year growth of 18% [3] - The advanced packaging market is growing at a rate that outpaces traditional packaging, driven by the demand for high-density, diversified, and miniaturized packaging solutions [3]