Core Viewpoint - Qualcomm is making significant strides in the PC market with its Snapdragon X series processors, supported by major OEMs like Dell, HP, and Lenovo, and has secured over 85 design orders, expecting to exceed 100 by next year [1][2]. Group 1: Qualcomm's PC Market Strategy - Qualcomm's acquisition of Nuvia aims to enhance CPU performance and power efficiency in personal computers [1]. - The introduction of the Dell Pro Max Plus laptop featuring Qualcomm's AI 100 PC inference card marks a notable advancement, being the first workstation with an enterprise-level independent NPU [1][2]. Group 2: Technical Specifications and Innovations - The Dell Pro Max Plus utilizes two Cloud AI 100 processors, providing a total of 32 AI cores and 64 GB of LPDDR4x memory, capable of performing over 450 8-bit integer operations per second within a thermal range of 75 watts [2]. - This setup allows for rapid and secure device inference for large AI models, including those with up to 109 billion parameters, indicating a shift towards alternatives to traditional power-hungry GPUs [2]. Group 3: Competitive Landscape - The PC market has evolved significantly over the past decade, with increased competition from AMD, Nvidia, Qualcomm, and Apple, moving away from Intel's dominance [3]. - Dell's leadership emphasizes the benefits of competition in the semiconductor market, aiming to provide customers with the best components available [3].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自半导体新闻综合 ，谢谢 。 据报道，台积电已发出抗议信，称其亚利桑那州晶圆厂的运营可能因美国关税政策而受到干扰。据 报道，他们表示，如果关税生效，台积电的制程成本将不可避免地上升，美国客户的需求将放缓， 这将影响正在推进的耗资超过100万亿韩元的亚利桑那工厂的建设进度。据透露，戴尔、HPE等美 国服务器公司也表达了与台积电一致的立场。 据台媒23日报道，台积电亚利桑那州公司向美方传达了公司在关税问题上的立场。据《经济日 报》报道，台积电致函称，"关税可能会提高最终用户产品的价格，减少对那些产品及其所含半导 体部件的需求，并使亚利桑那州晶圆厂的建设和运营计划变得不确定"，"我们敦促美国政府不要对 美国以外生产的半导体征收关税或其他限制"。 台积电2020年至今宣布的对美投资额为1650亿美元。台积电最初决定投资650亿美元在美国亚利桑 那州建设三家工厂，在美国关税政策公布后，台积电宣布计划在美国额外投资1000亿美元建设生 产设施。 台积电似乎在努力提高盈利能力，其亚利桑那州工厂过去四年累计亏损 394.52 亿新台币且关税负 担不断增加之际，做出了这一强 ...

Core Insights - The global silicon carbide (SiC) wafer market is projected to grow from 143.6 billion yen in 2024 to 619.5 billion yen by 2035, representing an increase of approximately 4.3 times [1] - In 2024, the demand for SiC power semiconductors is expected to slow down, but sales volume is anticipated to increase by 81.9% year-on-year, primarily driven by Chinese wafer manufacturers [1] - The 6-inch wafer currently dominates the market, accounting for over 90% of sales, while the demand for 4-inch wafers is declining [2] Group 1 - The SiC power semiconductor market is expected to see a sales volume and revenue growth of about 20% year-on-year in 2025, despite a decline in prices due to the influx of cheaper products [1] - The diamond wafer market is projected to take off starting in 2026, with the market size expected to reach 4.6 billion yen by 2035 [3] - The commercialization of 2-inch diamond wafers is anticipated to accelerate the development of the diamond power semiconductor market [3] Group 2 - The aluminum nitride (AlN) wafer samples have begun shipping, and the application range is expanding, with full-scale production expected in the future [3] - The germanium wafer is planned to be developed as a 6-inch epitaxial wafer, with sales expected to begin around 2030 [3] - The silicon wafer market is expected to stabilize from 2025 onwards after a contraction in 2024, with the 6-inch wafer's practicality driving growth in GaN and gallium oxide wafer markets [3]

如果您希望可以时常见面，欢迎标星收藏哦~ UTAC成立于1997年，总部位于新加坡，提供半导体芯片的封装与测试服务，其应用涵盖消费电 子、计算设备、安全设备及医疗领域。 除新加坡外，该公司还在泰国、中国和印尼设有生产基地，并拥有覆盖美国、欧洲和亚洲的全球销 售网络。其客户主要包括"无晶圆厂"公司（即将芯片制造外包的公司）、集成器件制造商和晶圆代 工厂。 UTAC未披露其财务表现，但消息人士称，其年度息税折旧摊销前利润（EBITDA）估计约为3亿 美元。 参考链接 由于信息尚属机密，两位消息人士均拒绝具名。富士康对此拒绝置评，UTAC、Wise Road和杰富 瑞尚未立即回应置评请求。 近年来，全球芯片制造业受到国家安全和技术竞争的影响，尤其是在中美之间。传统上，半导体依 赖高度全球化的制造供应链，但美国已采取措施限制中国大陆获取先进芯片和高端制造工具， 消息人士表示，由于UTAC在中国大陆的业务，该公司预计将吸引非美国的财务型和战略型竞购 者。 富士康是苹果公司的主要供应商，也是全球最大的电子产品代工制造商。根据其官网，近年来富士 康已将业务拓展至半导体制造，作为其长期增长战略的一部分。 来源：内容 编译自路 ...

美国对高科技出口的限制已导致英伟达在中国市场份额下滑，公司不得不撤出原有芯片并推出符合 美国政策的性能下降版本。 与此同时，微软和谷歌母公司Alphabet等云计算巨头也已暗示将削减AI支出。尽管黄仁勋在过去 一个月宣布了在海湾地区数千亿美元规模的合作项目，但分析师表示此类大单将越来越罕见。 "每个国家都能像沙特那样宣布建设一个100亿美元、甚至500亿美元的数据中心吗？当然不可 能。"Seaport Research分析师Jay Goldberg说，"他们正在耗尽显而易见的交易机会。" 当路透社询问英伟达将如何应对AI支出放缓时，黄仁勋回应道："AI基础设施正在全球范围内建 设……这也是我到处旅行的原因之一……AI基础设施将成为社会的一部分。" 新增长路径 在Computex上，黄仁勋展示了英伟达一条不依赖于主权数据中心大单的新增长路径：通过新技 术，进一步扩大其在AI市场的掌控力。 如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容编译自路透 ，谢谢 。 英伟达CEO黄仁勋周五离开台北，结束了一周在中国台湾科技业界的"膜拜"之旅，并传递出这位 美国AI芯片之王在如何保持其领先地位方面一个微妙但关键的信息 ...

如果您希望可以时常见面，欢迎标星收藏哦~ SK海力士计划在年内获得客户认证，并从明年第一季度开始批量出货。该产品将提供两种容量类 型——512 GB和1TB。 SK海力士总裁兼首席开发官安铉表示，SK海力士计划在年内完成面向消费者和数据中心的321层 4D NAND 固 态 硬 盘 的 开 发 。 " 我 们 正 致 力 于 构 建 具 有 AI 技 术 优 势 的 产 品 组 合 ， 以 巩 固 我 们 在 NAND领域作为全栈AI内存供应商的地位。" 来源：内容来自 sk hynix ，谢谢 。 SK海力士22日宣布，已开发出采用全球最高层数321层、1Tb三位元储存单元（TLC）4D NAND 快闪记忆体的UFS 4.1解决方案产品，应用于行动装置领域。 NAND Flash 产品根据每个单元中存储的比特（bit）信息数量，分为单层、多层、三层、四层和 五层。存储的信息数量越多，意味着在相同空间内可以存储的数据越多。 此次开发正值市场对 NAND 解决方案产品高性能、低功耗的需求日益增长，以确保设备端 AI 的 稳定运行。该公司预计，针对 AI 工作负载优化的 UFS 4.1 产品将有助于巩固其在旗舰智 ...

Jim Keller：RISC-V一定会胜出 如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自 chinatimes ，谢谢 。 半导体已是全球最受重视的科技产业，台积电更是其中焦点，各国也争相邀请台积电设厂。最新消 息传出，台积电婉拒在印度、新加坡和卡达建厂的邀请，因台湾是最完美的生产据点，海外建厂是 逼不得已的决定。 根据《DIGITIMES》21日报导指出，供应链消息人士称，想要与台积电合作的国家相当多，但台 积电已经婉拒印度、新加坡、卡达的设厂邀约，因为台湾是最完美的生产据点，海外建厂是逼不得 已的决定，在美国、日本和德国的工厂都是在大国「巨大压力」下建立，以及考量美日德在设备、 材料与IC设计等半导体产业链中拥有领先实力。 该篇报导也提到，据供应链业者透露，中东多国可说是诚意满满，「钱不是问题」，但对台积电来 说，除了国安与复杂政治问题外，面临的主要障碍是，中东在半导体领域部署几乎是零。 参考链接 https://www.chinatimes.com/realtimenews/20250522001291-260410?ctrack=pc_money_headl_p04&chdtv 点这里加 ...

Core Insights - Nvidia has announced the establishment of a consortium for 800V high-voltage direct current (DC) power distribution, which is a crucial step for supporting 1MW power processing racks starting in 2027 [1] - Upgrading to 800V can enhance end-to-end power efficiency by up to 5% and reduce maintenance costs by as much as 70% due to fewer power failures and lower labor costs [1] - The consortium includes major chip suppliers such as Infineon, MPS, Navitas, Rohm, STMicroelectronics, and Texas Instruments, as well as power module suppliers like Delta and Flex Power [1] Group 1: Technical Advantages - The use of industrial-grade rectifiers to convert 13.8 kV AC grid power directly to 800V DC minimizes energy loss typically incurred during multiple AC-DC and DC-DC conversion steps [2] - The 800V busbar allows for 85% more power transmission on the same size conductors, reducing copper demand by 45% due to lower current requirements and resistance losses [4] - The elimination of rack-level AC-DC conversion components frees up valuable space for more computing resources, enabling higher density configurations and improved cooling efficiency [5] Group 2: Industry Collaboration and Innovation - The consortium aims to accelerate the application of high-voltage DC architecture, which has faced challenges in technology and deployment in the past [5] - Infineon has developed a 12kW reference design using GaN and SiC devices with a baseline efficiency of approximately 98%, paving the way for new standards in power architecture for AI data centers [5] - Nexperia showcased an AI data center power system with an 8.5kW power supply, achieving 98% efficiency and a peak efficiency of 99.3% through its patented IntelliWeave technology [6] Group 3: Challenges and Considerations - Transitioning to an 800V high-voltage DC power system presents new challenges in safety, standards, and personnel training [7] - Nvidia and its partners are actively researching the capital and operational expenditures, as well as safety impacts of traditional transformer-based and solid-state transformer (SST) solutions [7] - The transition must include more isolation measures, with the need for circuit breakers that combine mechanical relays and semiconductor components for rapid response [7]

Core Insights - RISC-V has emerged as a significant open-source instruction set architecture (ISA) that has gained traction in both academic and commercial sectors, driven by its flexibility and openness [2][4][10] - The transition from a research project to a widely adopted standard has been marked by the establishment of the RISC-V Foundation, which aims to promote neutrality and prevent fragmentation [12][13] - The architecture has been embraced globally, with countries like Brazil and India recognizing its potential for national computing infrastructure [19][20] Group 1: Development and Adoption - The initial discussions among the RISC-V team led to the acceptance of the risks associated with developing a new RISC architecture, which has since proven to be highly rewarding [2][4] - RISC-V's open nature has attracted significant interest from the industry, with many companies participating in its development and adoption [7][9] - The architecture's flexibility has been highlighted as a major advantage over proprietary ISAs, allowing for quicker implementation and reduced costs for startups [8][9] Group 2: Academic Integration - RISC-V has gradually been integrated into academic curricula, with institutions worldwide adopting it for teaching and research purposes [10][11] - The transition to RISC-V in educational settings has been facilitated by the development of comprehensive course materials and resources [10][11] - Collaborative projects, such as the PULP initiative, have further advanced the use of RISC-V in academic research [11][12] Group 3: Commercialization and Ecosystem Growth - The establishment of SiFive marked a significant step in the commercialization of RISC-V, providing customized chip solutions for various applications [14][15] - The demand for verified IP cores has led to a shift in the business model of many companies, with RISC-V driving innovation in the IP market [15][16] - Major companies, including NVIDIA and Western Digital, have publicly committed to using RISC-V, indicating its growing acceptance in the semiconductor industry [9][16] Group 4: Global Impact and Future Prospects - RISC-V's influence has expanded beyond traditional markets, with applications in sectors such as automotive, aerospace, and high-performance computing (HPC) [31][32][34] - The architecture is positioned to play a crucial role in the development of software-defined vehicles and advanced computing systems [31][32] - The ongoing evolution of RISC-V is expected to lead to a robust software ecosystem, which is essential for its widespread adoption across various industries [24][25][26]

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自 techinasia ，谢谢 。 法 国 总 统 埃 马 纽 埃 尔 · 马 克 龙 对 台 湾 鸿 海 精 密 工 业 股 份 有 限 公 司 计 划 在 法 国 投 资 约 2.5 亿 欧 元 （2.78 亿美元）成立合资企业表示感谢。 此次投资将重点关注半导体和航天工业。 富士康与法国公司泰雷兹和雷迪埃签署了两份谅解备忘录，以创建法国首个外包半导体组装和测试 （OSAT）工厂。 这将采用扇出型晶圆级封装 (FOWLP) 技术，专注于汽车、空间科学、6G 移动技术和国防。 富士康还将与泰雷兹公司合作生产用于近地轨道电信的卫星。 此次投资是台湾在法国的第二大项目，仅次于辉能科技股份有限公司于 2023 年宣布的投资 52 亿 欧元（45.9 亿美元）的固态电池工厂。 参考链接 https://www.techinasia.com/news/french-president-thanks-foxconn-for-semiconductor-investment 点这里加关注，锁定更多原创内容 *免责声明：文章内容系作者个人观点，半导体芯闻转载仅为了传达 ...