仿真确保了该芯片得到各种编译器、库和工具的支持，从 C/C++、GO 和 Rust 等传统编程语言到 TensorFlow 和 PyTorch 等 AI 框架。 如果您希望可以时常见面，欢迎标星收藏哦~ 来 源： 内容 编译自 eenewseurope 。 法国芯片设计公司 SiPearl 终于推出了其期待已久的 Rhea1 超级计算机芯片，准备在 2026 年初 进行硅片采样。 设计方案提交给台湾台积电的时间表明，该公司有信心这款拥有80个ARM Neoverse V1核心和 610亿个晶体管的芯片无需重新设计。它需要为安装在德国旗舰级Jupiter百亿亿次超级计算机做好 准备。 该芯片最初计划采用台积电的 N6 6nm 工艺，于 2024 年推出样品，后来推迟到 2025 年，现在是 2026 年。它在封装中 使用了三星的四层高带宽内存 (HBM) 。 SiPearl 还从一位重要的台湾投资者处获得了 3200 万欧元的额外投资，使其 A 轮融资总额达到 1.3 亿欧元。这笔资金将用于为未来几周的 B 轮融资做准备，以及下一代处理器 Rhea2 的研发。 Rhea2 预计将采用性能更高的 Neoverse ...

Core Viewpoint - Samsung's wafer foundry division is facing challenges with its 5/3 nm process and is now focusing on ramping up its 2 nm technology, aiming for a yield of 70% by the end of the year to attract major clients [1][2]. Group 1: Current Challenges - Samsung's wafer foundry is experiencing quarterly losses amounting to tens of trillions of Korean won, compounded by low utilization rates and difficulties in securing large customer orders [1]. - The company has decided to concentrate resources on 2 nm technology, temporarily shelving investments in the more risky 1 nm process due to the high demand for AI semiconductors [1]. Group 2: Strategic Moves - Samsung is actively investing in building partnerships with U.S. clients and is working to regain customer trust after failing to meet performance and yield commitments for its 5/3 nm process [1]. - The company has appointed Margaret Han, a former executive from NXP Semiconductors, to lead its U.S. foundry operations, leveraging her experience to secure orders from potential clients [2]. Group 3: Market Position and Performance - The 2 nm process is expected to offer a 12% performance improvement and a 25% reduction in power consumption compared to the 3 nm process, although current yield rates for 2 nm are estimated to be below 30% [2]. - Despite the challenges, Samsung is in discussions with multiple potential clients regarding the 2 nm production status, indicating a proactive approach to securing orders [2].

Group 1 - The ICDIA 2025 event will take place on July 11-12 at the Suzhou Jinji Lake International Conference Center, featuring the second third meeting of the China Integrated Circuit Design Alliance Council to summarize and discuss the main work of the alliance and exchange industry development issues [1] - The event will include various forums such as the IC design forum, AI developer forum, and automotive chip forum, highlighting the diverse topics covered [1] - A white paper on the application fields of automotive safety chips will be released during the conference, indicating a focus on automotive technology advancements [1]

Core Viewpoint - The article highlights the rapid growth and potential of Shanghai Guangyu Xincheng Technology Co., Ltd. in the edge AI chip market, emphasizing its innovative technology and strong market recognition within a short period since its establishment [1][4]. Group 1: Company Development - Guangyu Xincheng was founded with a small team and a strong belief in the edge AI market, focusing on speed and resource integration as key factors for success [2]. - The founder, Dr. Zhou Qiang, emphasizes the importance of speed and resource consolidation in the startup journey, aiming for precise scheduling and collaboration with leading industry players [2][3]. - The company has attracted nearly a hundred R&D talents from top global tech firms, forming a strong team that drives its rapid development [3]. Group 2: Market Recognition - Within less than six months of its establishment, Guangyu Xincheng completed multiple rounds of financing, indicating high market confidence in its technology and team capabilities [4]. - The company has garnered a diverse array of investors, including top financial institutions and significant state-owned enterprises, enhancing its resource integration capabilities [5]. - Guangyu Xincheng has established commercial partnerships with several leading smart device manufacturers, marking a successful transition from laboratory research to commercial application [5][6]. Group 3: Market Potential - The edge AI market is described as a vast "ocean of stars," with significant growth potential across various applications, including AI smartphones and AIPCs [7][8]. - The article suggests that the integration of AI into everyday devices will lead to a second hardware revolution, with numerous applications in robotics, smart cockpits, and AI education terminals [8]. - Guangyu Xincheng aims to provide high-performance, low-power edge AI solutions to enhance the intelligence and user interaction of devices, ultimately benefiting millions of users [8]. Group 4: Future Vision - Guangyu Xincheng represents a vivid example of China's hard technology innovation wave, leveraging top talent, disruptive technology, and strategic resources to achieve rapid breakthroughs in key sectors [9]. - The company is positioned as a potential leader in the edge AI revolution, inviting talented individuals to join its mission in shaping the future of edge AI technology [9].

Core Viewpoint - Renesas has completed the acquisition of Transphorm, a global supplier of GaN power semiconductors, and is focusing on integrating GaN technology into its product offerings to enhance energy efficiency and reduce environmental impact [1][2]. Group 1: GaN Technology and Applications - Renesas is positioning its GaN products for high-power applications, challenging the notion that GaN is limited to medium and low-power uses. The company offers GaN products ranging from tens of watts to high-power applications of 6KW to 12KW, particularly for electric vehicle applications [2][3]. - The company emphasizes the advantages of D-Mode GaN over E-Mode GaN, particularly in high-power applications, due to its ability to maintain consistent resistance and efficiency [5][6]. Group 2: Product Development and Features - Renesas has introduced its fourth-generation GaN products based on the SuperGaN platform, which includes three new high-voltage 650V GaN FETs. These products are designed for compatibility with standard gate drivers, simplifying design and reducing barriers for adoption [9][10]. - The new GaN devices feature improved switching performance, a 14% reduction in on-resistance (RDS(on)), and a 20% enhancement in the figure of merit (FOM), making them suitable for high-efficiency applications [10][11]. Group 3: Market Position and Future Outlook - Renesas has delivered over 20 million GaN devices, with a total operational time exceeding 300 billion hours, showcasing its strong market presence and reliability in high-power and low-power applications [12]. - The company plans to expand its product line to include 1200V devices in the future, further strengthening its position in the GaN market [12].

Core Viewpoint - Samsung Electronics' second-quarter financial results have raised concerns among investors regarding its position in high-performance memory and advanced chip manufacturing, particularly in the context of competition with SK Hynix and Micron, which have shown robust performance despite a weak overall memory market [1][2]. Financial Performance - Samsung reported Q2 revenue of 74 trillion KRW (approximately 531 billion USD) and an operating profit of 4.6 trillion KRW (around 33 billion USD), reflecting a year-on-year decline of 0.1% and 55.9%, respectively, falling short of market expectations [1][2]. HBM Challenges - Analysts attribute the disappointing earnings primarily to Samsung's insufficient execution in HBM production, with delays in certification for its 12-layer HBM3E by major buyer Nvidia leading to increased inventory and storage costs [2][4]. - The expected shipment volume for HBM remains low, estimated between 500 to 600 gigabits, significantly below targets [2]. NAND Flash Business - Despite significant production cuts, Samsung's NAND flash business failed to achieve profitability in Q2, with losses projected to exceed 300 billion KRW (approximately 216 million USD) due to reliance on the commoditized NAND sector amid weak demand [4]. Foundry and LSI Losses - The foundry and LSI sectors are experiencing deepening losses, with total losses estimated at 23 trillion KRW (around 16.5 billion USD), and individual foundry losses exceeding 21 trillion KRW [5]. - Samsung struggles to attract advanced node customers for 3nm and 5nm processes, with its yield rates significantly lagging behind TSMC [5]. DRAM Market Pressures - Samsung's DRAM business, its largest revenue source, is expected to face pricing pressures, with potential declines in Q4 due to diminishing demand for DDR4 and shrinking premium space for DDR5 [7]. - The company is pinning hopes on the launch of its sixth-generation 10nm DRAM and next-generation HBM products, although this transition carries substantial execution risks [7]. Competitive Landscape - Industry experts indicate that Samsung's poor performance in HBM and foundry sectors may be difficult to reverse, with significant delays in Nvidia certification highlighting its lag behind competitors SK Hynix and Micron [8].

如果您希望可以时常见面，欢迎标星收藏哦~ 来 源： 内 容 编译自 embedded 。 想象一下，一家能够实时思考、学习、调整和优化工艺流程的半导体代工厂。这家工厂不仅能检测 每一片晶圆，还能预测每一个缺陷，同时采取纠正措施，并为客户提供改进设计的见解。 这听起来像是科幻小说，但这正是下一代半导体制造的样子，进而创造出一种为人工智能时代而精 心调整的新型代工厂。 单晶圆加工是下一代代工厂愿景的关键。然而，在传统的直线型代工厂中运行单晶圆效率不高。必 须设计一种新型代工厂。这种代工厂能够更流畅地移动晶圆，并从每颗晶圆中学习，然后利用人工 智能模型预测错误并进行修正。为了从每颗晶圆中获取数据，未来的先进代工厂需要重新思考晶圆 在工厂内的移动方式，并调整布局，以便在同一工厂内同时管理多个客户项目和封装项目。 未来的铸造厂需要创新集成来实现制造优化。 半导体制造：前端处理 芯片制造的晶圆或前端工艺始于氧化层，然后使用光刻技术（包括抗蚀剂涂覆、曝光和显影）绘制 图案；蚀刻零件；添加离子；创建金属层和绝缘层；以及平滑表面。这些步骤重复多次，以构建复 杂的电路层。在前端处理（图 1）中，在同一晶圆上重复这些步骤，以构建构 ...

Core Viewpoint - Yitang Semiconductor Technology Co., Ltd. (屹唐股份) officially listed on the STAR Market on July 8, 2025, marking a significant milestone for the company and the semiconductor industry in China [1][3]. Group 1: Company Overview - Yitang is a leading semiconductor equipment manufacturer based in China with global operations, focusing on integrated circuit manufacturing equipment [3]. - The company has established itself as a key supplier in the global market, ranking second in the global market share for dry etching and rapid thermal processing equipment as of 2023 [3][4]. Group 2: Market Position and Performance - Yitang's market share for dry etching equipment increased from 12.87% in 2018 to 34.60% in 2023, while its share in rapid thermal processing equipment stands at 13.05%, making it the only Chinese company in the top tier [4]. - The company has built a strong customer base, including the top ten global chip manufacturers, and maintains long-term relationships with its clients, with many partnerships exceeding ten years [4][5]. Group 3: Financial Performance - Yitang's revenue for 2022, 2023, and 2024 was 4.763 billion yuan, 3.931 billion yuan, and 4.633 billion yuan, respectively, with net profits of 383 million yuan, 309 million yuan, and 541 million yuan [5]. - The company expects a revenue of 2.3 billion to 2.5 billion yuan in the first half of 2025, reflecting a year-on-year growth of 10.06% to 19.63% [5]. Group 4: Research and Development - Yitang has significantly increased its R&D investment from 530 million yuan in 2022 to 717 million yuan in 2024, maintaining a high R&D expense ratio of 11% to 15.5% [5][6]. - The company holds 445 patents globally, establishing a strong technological barrier and ensuring its core products meet international standards [6]. Group 5: Strategic Direction - Yitang's strategy emphasizes a "localization" approach, with domestic market revenue increasing from 45.42% in 2023 to 66.67% in 2024, reflecting its competitive advantage in the domestic market [8]. - The company aims to enhance its core competitiveness through improved R&D systems and talent incentives, positioning itself as a leading global integrated circuit equipment manufacturer [8].

Core Viewpoint - Wolfspeed, Inc. has appointed Gregor van Issum as CFO, effective September 1, which has positively impacted the stock price amid ongoing financial challenges and restructuring efforts [1][2]. Group 1: Company Leadership Changes - Gregor van Issum brings over 20 years of experience in the technology sector, having previously held significant roles at ams-OSRAM and NXP Semiconductors [1]. - David Emerson was appointed COO in May to help improve gross margins and turn the company profitable [1]. Group 2: Financial Performance and Restructuring - Wolfspeed's stock has plummeted by 65.32% year-to-date, contrasting with a 5.92% increase in the S&P 500 [2]. - The company faced severe financial strain due to fluctuating U.S. trade policies and declining demand, leading to concerns about its ability to continue operations [2]. - In June, Wolfspeed announced plans to file for U.S. bankruptcy protection to alleviate its overall debt burden, with a restructuring process expected to be completed by Q3 2025 [2]. - Post-restructuring, Wolfspeed anticipates a 70% reduction in debt (approximately $4.6 billion) and a 60% decrease in annual cash interest expenses [2]. Group 3: Market Outlook and Stock Performance - Investors are optimistic that Van Issum's leadership will facilitate successful restructuring and effective cash management, capitalizing on strong demand for silicon carbide in electric vehicles and AI data centers [2]. - Following the announcement, Wolfspeed's stock surged by 95.76% to $2.31, marking the highest closing price since May 20, with a remarkable increase of 479.24% in July alone [2].

如果您希望可以时常见面，欢迎标星收藏哦~ 来 源： 内容 编译自 calcalistech 。 英特尔以色列公司最新一轮裁员给员工带来了一个严峻的选择：要么接受根据服务年限计算的巨额 遣散费，要么挑战这一决定，承担离职时收入远低于原定数额的风险。 第二组受影响的人员是远程操作中心 (ROC) 的技术人员，据 ROC 员工向 Calcalist 透露。这些操 作人员远程控制、监控和管理生产流程。ROC 技术人员无需亲临生产线，也不穿洁净服，而是在 控制室全天候工作，操作连接到晶圆厂所有工具和工位的计算机系统。他们使用这些工具运行机 器、审批流程、跟踪统计数据并实时检测故障。这一角色需要同时管理数百个复杂的生产流程，最 大限度地减少停机时间，并快速响应问题。工作采用轮班制，全天候 24/7 进行。 作为公司全面削减成本措施的一部分，英特尔将向预计将受到影响的数百名以色列员工提供丰厚的 薪酬待遇。 根据目前的计划，在英特尔工作五年的员工如果接受该方案，将获得相当于四个月工资的赔偿。在 英特尔工作十年以上的员工将获得相当于十个月工资的赔偿。服务超过三十年的资深员工将获得相 当于十九个月工资的赔偿。 但这项遣散计划附带 ...