如果您希望可以时常见面，欢迎标星收藏哦~ 来源：本文编译自tomshardware 。 美国芯片巨头英特尔已与日本科技和投资巨头软银携手，合作开发一种堆叠式DRAM，以替代高 带宽存储器（HBM）。据《日经亚洲》报道，这两家行业巨头联合成立了一家名为 Saimemory 的 公司，致力于基于英特尔的技术与东京大学等日本高校的专利，共同打造原型芯片。该公司计划于 2027年完成原型开发并评估量产可行性，目标是在 2030年前实现商业化。 在1980年代，日本企业曾占据全球约70%的存储芯片市场份额，是当时的行业霸主。然而，随着 韩国和台湾地区厂商的崛起，日本多数存储芯片企业逐渐退出了市场。 不 过 ， Saimemory 并 非 第 一 家 探 索 3D 堆 叠 式 DRAM 的 企 业 。 三 星 早 在 去 年 就 宣 布 了 开 发 3D DRAM和堆叠式DRAM的计划；而NEO Semiconductor也正在推进其名为3D X-DRAM的产品研 发。不过，这些项目的重点在于提升单芯片容量，目标是实现每个内存模块高达512GB的容量。 相比之下，Saimemory的核心目标是降低功耗——这是当前数据中心 ...

Core Viewpoint - Nvidia is entering the gaming laptop market by collaborating with MediaTek to develop an Accelerated Processing Unit (APU) that integrates CPU and GPU functionalities, expected to launch between Q4 2023 and early 2026, potentially transforming the industry ecosystem [1][2]. Group 1 - Nvidia's APU will allow laptops to operate at 65W while delivering performance equivalent to a 120W RTX 4070 gaming laptop, significantly reducing energy consumption [2]. - The integration of CPU and GPU in a single APU is anticipated to enhance cooling efficiency and reduce the overall weight of gaming laptops, marking a significant breakthrough in the industry [2]. - Nvidia is reportedly working with Dell's gaming brand Alienware on this APU, with plans for a product launch in the specified timeframe [1][2]. Group 2 - The collaboration between Nvidia and Dell was previously hinted at by both CEOs, indicating a commitment to launching AI PCs equipped with Nvidia technology by 2025 [1]. - The APU development is seen as a strategic move for Nvidia to leverage its leadership in AI chips and GPUs to reshape the gaming laptop market [1]. - The anticipated product is expected to benefit related manufacturers such as Wistron, Inventec, and Compal, enhancing their business prospects [1].

Core Viewpoint - The Netherlands must accelerate investments in the semiconductor industry to maintain its competitive edge amid increasing international competition and geopolitical tensions [1][2]. Group 1: Strategic Importance of Semiconductors - Semiconductors are essential for modern technologies, including electric vehicles, medical devices, artificial intelligence, and defense systems [2]. - The Netherlands plays a critical role in the semiconductor supply chain but is becoming overly dependent on other countries for key value chain components [2]. Group 2: Beethoven Plan - The "Beethoven Plan" involves a joint investment of €2.51 billion from the government, regional authorities, and industry to enhance the semiconductor business environment [2]. - The plan focuses on the Brainport region, which includes key players like ASML and aims to create 62,000 new housing units and improve infrastructure by 2030 [2]. - A talent development initiative aims to train 38,000 skilled professionals by 2030, with an investment of €450 million and ongoing annual funding of €80 million [2]. Group 3: European Semiconductor Coalition - The urgency for action extends beyond the Netherlands, as the European Semiconductor Coalition was formed with eight other EU member states to enhance Europe's position in the global semiconductor value chain [3]. - The coalition aims to increase local chip production, as Europe currently holds only about 10% of the global semiconductor sales market [3]. Group 4: International Cooperation and Security - The Netherlands is fostering collaborations with countries like South Korea, Japan, Taiwan, and the USA in areas such as innovation and talent exchange [5]. - Stricter export controls on advanced chip manufacturing equipment have been implemented to prevent misuse for military purposes [5]. Group 5: National Innovation Capability - A broad coalition of 64 semiconductor companies in the Netherlands has proposed the "ChipNL" innovation plan, focusing on chip design, advanced packaging, and production equipment [6]. - The plan seeks government co-funding to enhance the country's semiconductor capabilities and is closely aligned with national defense objectives [6]. Group 6: Semiconductor Industry Blueprint - The Netherlands will establish the "Semicon Board Netherlands" in early 2025 to create a development blueprint for the semiconductor industry aimed at 2035 [7]. - The Minister emphasizes the need for immediate action to maintain the country's creativity, strategic autonomy, and economic resilience [7].

如果您希望可以时常见面，欢迎标星收藏哦~ 上篇文章《 沙漠上崛起的芯片新贵 》探寻中东，见识了阿联酋的芯片布局；本次我们将视角转向 南亚，聚焦印度半导体产业的发展故事。 近年来，在全球半导体产业逆全球化浪潮与地缘政治博弈交织的当下，印度正以令人瞩目的速度崛 起为国际芯片巨头战略布局的核心坐标。 从瑞萨电子宣布在印启动3nm先进制程研发，到德州仪器将最小MCU设计团队落子班加罗尔，再 到富士康携手HCL斥资建设半导体封装基地...，一场横跨芯片设计、制造、封装全产业链的"印度 热"正在上演。 印度半导体，热闹起来了 瑞萨3nm设计中心聚焦车规级与高性能计算芯片研发，计划2027年下半年量产。项目获印度政府 大力支持，超270所学术机构获EDA软件及学习套件，用于工程师培养。瑞萨计划2025年底将在印 员工增至1000人，并通过"半导体计划"与"生产挂钩激励计划（PLI）"，联动250多家学术机构和 初创企业。制造环节，瑞萨联合印度CG Power、泰国星微电子，在古吉拉特邦投资760亿卢比 （约9.2亿美元）建设外包封测厂，专注国防、太空芯片封装，与塔塔集团28nm晶圆厂协同，构 建"设计-制造-封装"全产业链 ...

该修订于4月30日公布，是泰勒市历时一个月、旨在减少与芯片工厂相关的规划审查和检查开支的 一部分。原先可达2500万美元的返还激励现已被削减至最多900万美元，且这一金额还取决于三星 是否在2026年底前达到设备安装门槛。 泰勒市将这一门槛称为"确保三星在明年底前开始引入设备、启动芯片制造的保证"。 如果您希望可以时常见面，欢迎标星收藏哦~ 来源：本文编译自韩国中央日报 。 由于三星电子耗资370亿美元的半导体制造项目建设进度滞后，加上全球芯片供应过剩削弱了早期 的乐观预期，德克萨斯州泰勒市在最新修订中削减了对该项目的财政激励。 这一变化也反映出特朗普再次就任总统后，美国政策基调发生了转变。特朗普政府推动削减对外国 芯片制造商的补贴，这也是其更广泛保护主义议程的一部分。 在芯片行业之外，特朗普政府也正向三星和苹果施压，要求它们将生产转移至美国，否则将面临从 6月底起实施的25%关税。这对目前一半以上智能手机产自越南的三星来说构成重大挑战。 在修订条款中，泰勒市还要求三星在2026年前完成总建筑面积为600万平方英尺的厂房建设，并在 2028年前再新增100万平方英尺，合计达到700万平方英尺。这一此前未曾列明 ...

Core Viewpoint - The "5th China Integrated Circuit Design Innovation Conference and IC Application Ecological Exhibition" (ICDIA) aims to promote breakthroughs in chip technology, showcase China's IC innovation achievements, and foster a self-controlled industrial ecosystem for large-scale applications in AI, new energy vehicles, IoT, and digital economy [1] Group 1: Event Overview - The conference will be held from July 11-12, 2025, at the Suzhou Jinji Lake International Conference Center [1] - The theme is "Independent Innovation • Application Landing • Ecological Co-construction," focusing on AI computing power, photonic integrated circuits, heterogeneous computing, RISC-V ecosystem, 5G/6G semiconductors, AIoT, and smart vehicles [1] - The event will feature a "1+1+4+1" model, including one summit forum, one AI developer conference, four sub-forums, and one IC application ecological exhibition [1] Group 2: Agenda Highlights - The agenda includes a welcome dinner and the 2025 China Strong Chip IC Awards on July 11, followed by various thematic sessions on advanced design, automotive chips, AIoT, and industry-academia cooperation on July 12 [2] - The summit forum will focus on cutting-edge technology breakthroughs, advanced design tools, application scenarios, and industrialization [3] Group 3: AI Developer Conference - The AI Developer Conference will invite influential experts to discuss AI high-performance chips, AI models, and applications, covering deep learning, big data processing, and innovative trends in AI [6][8] - Topics will include AI-driven chip design, emerging computing paradigms, high-end EDA tools, and low-power, high-reliability designs [6] Group 4: Exhibition Areas - The exhibition will showcase China's IC innovation achievements, AI technologies, and intelligent ecological application scenarios across four main areas: advanced design, design innovation alliance, applications and intelligent ecology, and AI and robotics [9][11][12][13][14] - The advanced design area will feature EDA tools, RISC-V ecosystem, and various types of chips including 5G/6G communication chips and AI acceleration chips [11] - The AI and robotics area will include humanoid robots, industrial robots, and AI interaction experiences [14] Group 5: Strong Chip Evaluation - The "Strong Chip Evaluation" aims to identify and promote leading Chinese chip products, providing references for system integrators and end-users, thereby fostering a self-sustaining industrial ecosystem [17]

Core Viewpoint - Amazon Web Services (AWS) is expanding its global data center network and improving access to Nvidia AI chips to maintain its competitive edge in the rapidly growing cloud infrastructure market [1][2]. Group 1: Expansion and Market Position - AWS has opened new data centers in Mexico and is constructing facilities in Chile, New Zealand, Saudi Arabia, and Taiwan to enhance its geographical reach [1][3]. - Despite holding a 29% market share, AWS's year-on-year growth rate of 17% lags behind Microsoft Azure's 21% and Google Cloud's 28% [1][2]. Group 2: AI Demand and Infrastructure Challenges - The demand for AI services is driving significant revenue growth, with AWS focusing on increasing the supply of Nvidia GB200 chips due to strong demand [1][2]. - Goldman Sachs projects that AI will increase global data center power demand by 165% by 2030, with AI workloads expected to account for 27% of total data center power consumption [2][3]. Group 3: Infrastructure Adaptation - The high power density of AI workloads is necessitating changes in data center design, with more companies adopting liquid cooling technologies to manage heat from densely packed AI processors [3]. - AWS is transitioning from leasing existing facilities to building dedicated data centers with specialized substations to meet the unique requirements of AI computing [3]. Group 4: Regulatory and Localized Needs - AWS's expansion strategy addresses growing data sovereignty requirements and aims to reduce latency for emerging market customers by diversifying its infrastructure across various regions [3]. - This approach aligns with AWS's established practice of organizing infrastructure into regions with multiple availability zones, ensuring redundancy and compliance with local regulations [3].

Core Viewpoint - The article discusses the advancements in semiconductor technology, particularly focusing on the challenges and innovations related to Through-Silicon Vias (TSV) in 3D chip stacking, emphasizing the importance of managing thermal and mechanical stresses to enhance chip performance [1][2][7]. Group 1: TSV Technology and Challenges - TSVs are ultra-thin copper wires, typically 5 micrometers in diameter, used for vertical connections between stacked silicon chips, enabling high-speed communication and increased bandwidth [1]. - One of the main challenges of advanced 3D packaging is heat dissipation, as densely packed materials generate more heat than traditional 2D chips, leading to potential deformation and reliability issues [1][2]. - Simply reducing the size of TSVs and increasing their quantity does not necessarily improve chip speed due to the physical interactions and thermal issues that arise as the wires shrink [1]. Group 2: Research Findings - Research conducted by Purdue University focused on the thermal-mechanical performance of TSVs, with prototypes created featuring TSV diameters of 4 micrometers, 2 micrometers, and 1 micrometer [2][6]. - The study revealed that as TSV size decreases, the microstructure of copper changes significantly, affecting its elastic response and potentially increasing strength [2][7]. - The research indicates a non-monotonic relationship between equivalent stress and TSV diameter, suggesting that smaller TSVs may exhibit higher elasticity compared to larger counterparts due to reduced average grain size in copper [7]. Group 3: Future Implications - Understanding the thermal-mechanical response of TSVs is crucial for the development of high-density 3D integrated circuits in future logic and memory computing architectures [7]. - The findings aim to assist chip manufacturers in improving their designs and materials, ultimately leading to faster and more reliable semiconductor devices [6][7].

来源：内容来自Source：工商时报 。 如果您希望可以时常见面，欢迎标星收藏哦~ 全球封测产业（OSAT）面临技术升级和产业重组双重挑战，从营收来看，日月光（3711）控股、 Amkor去年维持领先，值得关注的是，长电科技和天水华天等中国大陆封测厂去年营收皆呈双位数 成长，对既有市场构成强大挑战，压力持续到今年。 法人看好，半导体制造链正迎来新一轮扩张趋势，AI驱动先进制程与先进封装需求，同时传统应 用市场逐步复苏，也为产业带来多元化发展机会。 因应陆系封测业者快速崛起，日月光投控、京元电、力成、矽格等，积极强化制程技术量能，包括 异质整合、晶圆级封装、晶圆堆叠、先进测试设备导入，以及AI与边缘运算对高频率、高密度封 装的迫切需求，都成为台湾业者主攻范畴。 业界指出，封装测试技术优劣影响晶片效能与成本。日月光半导体日前推出具备硅通孔（TSV）的 扇出型基板上晶片桥接技术，推动AI技术发展。 京元电规划在台湾以外地区建立生产基地，分散供应链据点，将审慎评估半导体上下游和同业策略 合作机会，以及转投资全球半导体产业，延伸公司触角。 力成持续开发先进封装技术如2.5D及3D IC封装，公司说明，FOPLP技术自2 ...

Genesis 的设计注重结构可靠性，保持最小的占用空间，使其能够适应密集的服务器，并支持长达 1000 毫米的电缆长度，且不会影响信号完整性。为此，它采用 29 AWG 低损耗微波同轴电缆，以 实现最佳的高频性能、信号完整性和可靠性。 Molex 的 Genesis 路线图包括计划于 2025 年 5 月推出的 x8 连接器、计划于 2025 年 7 月推出的 x16 型号以及未来推出的 x20 版本。Genesis 设计支持最多 74 个引脚的 x8 配置，而更大的 x16 和 x20 版本计划分别容纳 124 个和 148 个引脚。Molex 计划提供多种方向选项以适应不同的系统 布局，包括直角、斜角出口和垂直出口设计。连接器的宽度随通道数而变化，x8 为 28 毫米，x16 为 47 毫米，x20 为 57 毫米。连接器的高度为 8.7 毫米，深度为 13.2 毫米，以满足密集系统设 计的需求。 如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自Source：标题tomshardware 。 支持 128 GT/s 传输速率的 PCIe 7.0 互连系统尚需数年时间才能问世。然而，像 Molex ...