如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容编译自chosun 。 据《朝日新闻》28日上午报道，日本政府在与美国进行关税谈判时，为解决贸易不平衡问题，向 美国提议购买价值数十亿美元的美国企业生产的半导体产品，预计半导体进口金额可能高达1万亿 日元（约合9500亿韩元）。 据悉，日本政府提出此项提案的目的是确保英伟达（NVIDIA）的产品供应。英伟达在人工智能 （AI）开发所需的数据中心所需的半导体市场占据主导地位。日本政府计划向运营数据中心的国 内IT企业提供补贴，以支持其购买美国半导体。 然而，去年美国对日贸易逆差为685亿美元（约94万亿韩元），而日本提出的半导体采购金额仅为 逆差的10%左右，因此有分析认为谈判效果可能微乎其微。 目前，日本已向美国提出了扩大农产品进口、改善扩大汽车进口法规、以及在造船领域开展合作等 措施。但美国坚持认为，只有针对各国差别适用的关税才能进行谈判。 据美国联邦公报21日(当地时间)报道，截至7日，美国商务部就根据《贸易扩展法》第232条款针 对进口半导体、半导体制造设备以及使用半导体的衍生产品进行的调查，共收到206份意见书。 韩国政府强调，韩国主要向美国出口存储 ...

Core Viewpoint - Soitec, a French semiconductor materials supplier, has withdrawn its financial forecasts for the new fiscal year and mid-term due to a continuous decline in demand for automotive and industrial chips, citing reduced visibility and market uncertainty [1][2]. Group 1: Financial Performance - Soitec anticipates a 20% year-on-year decline in revenue for the first quarter, with last year's revenue being €121 million (approximately $137.1 million) [1]. - The company previously projected a sales decline of about 7% to 9% for the year, with an EBITDA margin expected to be between 32% and 34% [2]. - In the third quarter, Soitec reported sales of €226 million, reflecting a 10% year-on-year decrease [3]. Group 2: Management Changes - Soitec announced the immediate resignation of CFO Lea Alzingre, with Albin Jacquemont taking over the position [1]. - Jacquemont is credited with leading significant financial transformations and creating substantial value through operational performance improvements and cash flow optimization [1]. Group 3: Market Conditions - The company noted that the automotive and consumer electronics sectors have seen deteriorating market conditions, leading some customers to halt delivery requests [2]. - Despite the challenges, Soitec expects a strong sequential growth in the fourth quarter, driven by a recovery in RF-SOI sales and strong demand for its photonic SOI products [2].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 appleinsider 。 高通公司资助的一项新研究声称，搭载骁龙调制解调器的安卓手机性能优于iPhone 16e C1 调制解调器，而且从设计上来说，高通公司占据优势。高通公司委托撰写的一份新报告发 现，搭载该公司最新调制解调器的安卓手机在 5G 速度测试中的表现优于苹果的 iPhone 16e。然而，这份报告也包含一些重要的背景信息，例如价格、测试条件以及这些数据在日 常使用中的表现。 虽然测试方法看似合理，但高通的巨额赞助却引发担忧。测试的两款安卓手机均为高端机型，售价 分别为 799 美元和 619 美元。这些手机都配备了高通最新的调制解调器，这使得结果对赞助商有 利。相比之下，iPhone 16e 是苹果售价 599 美元的中端机型，也是其首款配备完全定制调制解调 器的设备，该调制解调器尚未面向高端设备推出。这使得直接的价格比较变得不那么有意义。 苹果的 iPhone 16 Pro 机型仍依赖高通调制解调器，并提供先进的天线调谐、改进的热设计和 mmWave 5G 支持，但未包含在该研究中 通过排除这些型号，比较将苹果的入门级调制解调器 ...

在智能手机十几年的发展历程中，苹果当之无愧地扮演着一个"全球导师"的角色。 荣耀 X70i 、 vivo X200 Ultra 一颗小按键背后的黑科技 从使用者的反馈看来，这个新增的按键似乎有点被高估了，终端用户也并不能轻易窥见这个按键带 来的革命性变化。但按照苹果的说法，能在方寸空间实现这个设计，并提供如此酷炫的UI交互， 他们克服了三大挑战，分别是高集成度、防误触和可靠性。 iPhone16 相机控制按钮 如上图所示，第一眼看到苹果这个新增的"相机控制"按键，有种梦回iPhone 5S首次引进Touch ID 的感觉——在设计上，固态按键外圈用了金属，中间是蓝宝石。具体到原理上，Touch ID通过中 间的蓝宝石水晶和电容触摸传感器，拍下指纹的高分辨率图像并对其进行智能分析，以便从任何角 度都能精确读取指纹。 这个"相机控制"按键，其实与"指纹识别"的原理和技术有点异曲同工。不同之处在于，前者在使用 者按下不同键程时会触发不同的功能（可以简单理解为轻按和重按实现不同的功能），而且如开头 的视频所示，使用者在这个按键上滑动，也会取得相应的控制效果。 如上图所示，苹果在介绍iPhone 16的时候，花了不少时 ...

Core Viewpoint - Major US semiconductor companies, including Micron, Qualcomm, and Texas Instruments, are seeking relief from anticipated semiconductor import tariffs through comments submitted to the US Department of Commerce, highlighting the complexity of the semiconductor supply chain and the potential negative impact of poorly designed tariffs on US interests [1][2][3]. Group 1: Micron Technology's Position - Micron emphasizes its role as the only large-scale memory component manufacturer in the US and plans to invest $140 billion over the next 20 years to support US national and economic security [5][9]. - The company argues that tariffs on semiconductor manufacturing equipment (SME) could disadvantage US manufacturers by increasing costs and harming competitiveness [17][19]. - Micron's investment is expected to create 80,000 jobs and contribute $1.4 trillion to the US economy over 20 years, while also addressing national security risks associated with memory chip production concentrated in Asia [12][14]. Group 2: Qualcomm's Position - Qualcomm highlights its leadership in semiconductor design and its critical role in 5G and 6G technology, advocating for reduced regulatory burdens to facilitate expansion and investment in the US [28][30]. - The company stresses the importance of maintaining a strong domestic supply chain to support its operations and the broader semiconductor industry, while also emphasizing the need for government policies that stimulate domestic demand for semiconductors [29][39]. - Qualcomm warns that tariffs could jeopardize its global market access and the US's position as a technology leader, urging careful consideration of the implications of any tariff actions [38][40]. Group 3: Industry Implications - The semiconductor industry is characterized by a complex, interdependent global supply chain, where even minor disruptions can lead to significant competitive disadvantages for US companies [39]. - The industry is facing challenges related to high manufacturing costs in the US compared to Asia, necessitating supportive government policies to enhance competitiveness and attract investment [13][24]. - The need for a coordinated trade policy that supports US semiconductor manufacturing growth is critical, as tariffs could inadvertently harm domestic manufacturers and hinder the goal of increasing US semiconductor production [16][22].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容 编译自 eejournal 。 近年来，CXL正在成为大家的焦点。 事实上，在开发 CXL 标准、基于该标准生产早期计算机硬件（内存模块和内存服务器）以及从该 硬件获取一些性能数据方面确实取得了长足的进步。从性能数据中，现在可以确定哪些应用程序最 适合使用基于 CXL 的内存子系统，哪些不适合。 内存专家Jim Handy在一个分享中概述了 CXL 的现状。他首先指出，就像七个盲人摸象一样， CXL 凭借其在各个修订版本中新增的功能，拥有了丰富的功能。CXL 可用于： 根据应用程序的不同，其中一些功能将比其他功能更重要，正如 Handy 通过来自可能使用 CXL 内存的不同系统 OEM 的回应所说明的那样： Handy 还 指 出 ， CXL 是 一 个 相 对 较 新 的 标 准 。 CXL 联 盟 于 2019 年 发 布 了 CXL 1.0 和 CXL 1.1。CXL 2.0 于 2020 年底发布，它增加了 CXL 交换的概念，以支持数据中心机架内的多个主 机 xPU。CXL 3.0、3.1 和 3.2 增加了多项功能，包括多个交换机层，以支持跨机 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自经济日报 。 半导体业界流传日本化工巨头旭化成（Asahi KASEI）对客户发出的通知，提到因该公司产能无法 跟上市场需求，将对部分客户断供先进封装关键耗材感光型聚醯亚胺（PSPI），业界忧心恐导致 AI断链危机一触即发。 业界指出，目前没有任何材料能全面替代PSPI在所有先进封装制程中的性能，考量先进封装是AI 芯片生产关键技术，若缺少PSPI导致先进封装产能供给受限，不仅牵动台积电（2330）、日月光 投控、群创等业者先进封装业务接单，进而冲击全球AI产业发展。业界分析，旭化成是全球PSPI 数一数二关键供应商，以封装材料来说，旭化成和HD（杜邦与日立合资公司）居前两大，一旦供 货不足，牵动整个半导体生态。 根据业界人士转述，此次旭化成拟对部分客户断供其PIMEL系列感光材料供应，即PSPI相关产 品，主因AI高速发展，使得算力需求快速增长，对先进封装需求暴增，同步带动PSPI需求劲扬， 该公司产能无法及时跟上市场需求。 业界人士说，旭化成的PSPI材料，在半导体封装领域具有关键应用价值，并广获半导体指标厂采 用，主要用于元件表面保护层、凸块钝化层 ...

Core Viewpoint - TSMC partners with startup Avicena to produce MicroLED-based interconnect products, aiming to replace electrical connections with optical ones to meet the increasing communication demands between GPUs in AI data centers [1][4]. Group 1: Technology Overview - The collaboration focuses on using optical connections to address unprecedented demands for data volume, bandwidth, latency, and speed in AI clusters due to large language models [1]. - Avicena's LightBundle platform utilizes hundreds of blue MicroLEDs connected through imaging-type optical fibers to transmit data, avoiding the complexities associated with lasers [1][4]. - The technology allows for a simple optical fiber link that can transmit data at 10 Gb/s over distances exceeding 10 meters, achieving net transmission rates of up to 3 Tb/s [4]. Group 2: Industry Context - The optical interconnect technology is positioned as a solution to the challenges faced by laser-based optical interconnects, which struggle with reliability, manufacturing, and cost issues [3][4]. - Avicena's approach leverages existing technologies in LEDs, cameras, and displays, which are already mature industries, allowing for quicker adjustments in production methods [6][7]. - TSMC's involvement in producing optical detector arrays for Avicena highlights the potential for lower costs and higher efficiency compared to traditional laser-based systems [7]. Group 3: Competitive Advantage - Avicena claims that their technology can achieve energy consumption as low as sub-picojoules per bit, outperforming other optical methods that find it difficult to reach 5 picojoules per bit [7]. - The simplicity of the LightBundle design, requiring only minor modifications to existing camera and display technologies, positions it favorably against more complex silicon photonics solutions [6][7].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容编译自tradingview 。 安森美半导体ON 的股价今年迄今已下跌 34.5%，表现逊于 Zacks 半导体 - 模拟和混合行业 5.9% 的跌幅和 Zacks 计算机与技术行业的 3.7% 的跌幅。 安森美半导体股价下跌可归因于电源解决方案事业部 (PSG)、模拟和混合信号事业部 (AMG) 以及 智 能 传 感 事 业 部 (ISG) 的 增 长 疲 软 。 在 刚 刚 结 束 的 2025 年 第 一 季 度 ， PSG 收 入 （ 占 总 收 入 的 44.6%）同比下降26.2%。AMG收入（占总收入的39.2%）同比下降18.7%，而ISG收入（占总收 入的16.2%）同比下降19.7%。 地缘政治紧张局势和电动汽车普及率放缓导致汽车行业需求疲软，对安森美半导体的增长产生了负 面 影 响 。 2025 年 第 一 季 度 ， 汽 车 （ 占 收 入 的 52.7% ） 收 入 同 比 下 降 25.1% ， 工 业 （ 占 收 入 的 27.7%）终端市场（包括军工、航空航天和医疗）收入同比下降16%。 然而，人工智能数据中心已成为安森美半 ...

Core Viewpoint - Xiaomi's new flagship SoC, the玄戒O1, is not a custom chip from Arm, but rather a product of Xiaomi's own four-year development, utilizing Arm's CPU and GPU IP standards while maintaining independent design and implementation [1][2]. Group 1: Xiaomi's Development of玄戒O1 - The玄戒O1 is a 3nm flagship SoC developed entirely by Xiaomi's玄戒 team, with no use of Arm's complete solutions [1]. - The CPU of玄戒O1 features a maximum frequency of 3.9GHz, significantly exceeding industry standards, achieved through numerous innovations and optimizations [1]. - The team redesigned over 480 standard cell libraries for the CPU, representing nearly one-third of the 3nm standard cell library [1]. Group 2: Collaboration with Arm - Arm acknowledges that Xiaomi has become a global technology leader over the past 15 years, with a diverse product portfolio including smartphones and IoT devices [2]. - The partnership between Xiaomi and Arm has focused on optimizing SoC performance, efficiency, and workload management [2]. - The upcoming XRING O1 chip, built on Arm's latest architecture, will debut in the Xiaomi 15S Pro smartphone and Xiaomi Pad 7 Ultra tablet, promising enhanced battery life and performance [3]. Group 3: Future Prospects - The launch of XRING O1 marks a significant milestone in Xiaomi's technological innovation journey [3]. - Both companies aim to push the boundaries of performance, efficiency, and scalability across smartphones, IoT, and automotive sectors [3].