杭州士兰微电子股份有限公司 关于为士兰集科提供担保的进展公告 本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述或者重大 遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： ● 被担保人名称：厦门士兰集科微电子有限公司（以下简称"士兰集科"）。 士兰集科为杭州士兰微电子股份有限公司（以下简称"公司"或"本公司"）之 关联人。 ● 本次担保金额及已实际为其提供的担保余额：公司于 2025 年 5 月 19 日 为士兰集科签署了合计担保金额为 3.56811 亿元的担保合同。 截至本公告披露日，公司为士兰集科实际提供的担保余额为 5.12 亿元，担 保余额在公司相关股东大会批准的担保额度范围内。 证券代码：600460 证券简称：士兰微 编号：临 2025-023 ● 本次担保无反担保。 ● 本公司不存在逾期对外担保。 一、担保情况概述 （一）担保进展情况 公司于2025年5月19日与国家开发银行厦门市分行签署了2份《保证合同》， 就参股公司士兰集科融资事宜按 27.447%的持股比例提供连带责任保证担保，具 体如下： | 担保合同 名称 | 保证人 | 被担保人 | 债权人 ...

Investment Rating - The investment rating for the company is "Buy" and is maintained [2] Core Views - The company has significantly increased its market share, rising from 2.6% in 2023 to 3.3% in 2024, moving from the tenth to the sixth position globally in the power semiconductor market [6] - Despite a decline in the overall power semiconductor market size from $35.7 billion in 2023 to $32.3 billion in 2024, the company achieved a revenue of 11.22 billion yuan in 2024, representing a year-on-year growth of over 20% [6] - The company’s core products, including IGBT, SiC MOSFET, and IPM modules, saw substantial growth, with automotive-grade power devices revenue increasing by over 100% year-on-year [6] - The company is continuously launching new products across its silicon-based chip production lines, which are operating at full capacity, and has received bulk orders from several domestic smartphone manufacturers for its six-axis inertial sensors [7] Financial Projections - Revenue projections for the company are as follows: 13.31 billion yuan in 2025, 15.83 billion yuan in 2026, and 18.88 billion yuan in 2027, with corresponding net profits of 650 million yuan, 984 million yuan, and 1.31 billion yuan respectively [8] - The company is expected to maintain a growth rate of approximately 18.6% to 19.3% in revenue from 2025 to 2027 [10] - The earnings per share (EPS) are projected to increase from 0.39 yuan in 2025 to 0.79 yuan in 2027 [10]

Investment Rating - The investment rating for the company is "Buy" and it is maintained [2] Core Insights - The company's market share has significantly increased, rising from 2.6% in 2023 to 3.3% in 2024, moving up from the tenth to the sixth position globally [6] - The company achieved a revenue of 11.22 billion yuan in 2024, representing a year-on-year growth of over 20%, with over 75% of revenue coming from high-barrier markets such as large home appliances, automotive, new energy, industrial, communications, and computing [6] - The company reported a net profit attributable to shareholders of 220 million yuan in 2024, marking a turnaround from losses [6] - The company has launched several new products across its silicon-based chip production lines, which are fully operational, targeting sectors like automotive, large home appliances, and high-end consumer electronics [7] - Revenue projections for the company are 13.31 billion yuan, 15.83 billion yuan, and 18.88 billion yuan for 2025, 2026, and 2027 respectively, with net profits expected to be 650 million yuan, 984 million yuan, and 1.31 billion yuan for the same years [8] Financial Summary - The company’s total market capitalization is 40.8 billion yuan, with a total share capital of 1.664 billion shares [4] - The company’s earnings per share (EPS) is projected to increase from 0.13 yuan in 2024 to 0.79 yuan in 2027 [10] - The company’s EBITDA is expected to grow from 1.52 billion yuan in 2024 to 4.23 billion yuan in 2027 [10] - The company’s asset-liability ratio is currently at 44.3% and is projected to decrease to 38.6% by 2027 [12]

Core Viewpoint - The conference will gather key players in the silicon carbide (SiC) industry, providing a platform for exploring development opportunities and technological advancements in the sector [1]. Conference Details - The conference is scheduled for May 15, from 09:00 to 17:30, at the Shanghai Jin Jiang InterContinental Hotel [2]. - Attendees are encouraged to arrive before 09:00 for timely registration [2]. Transportation Information - From Shanghai Pudong International Airport to the hotel is approximately 37 kilometers, taking about 45 minutes by taxi or 50 minutes via public transport [3]. - From Shanghai Hongqiao International Airport to the hotel is about 20 kilometers, with a taxi ride taking around 35 minutes or 50 minutes using public transport [3]. Conference Agenda - The conference will feature two thematic forums and an all-day exhibition, focusing on the SiC industry [5]. - The launch of the "2025 Silicon Carbide Substrate and Epitaxy Industry Research White Paper" and "2025 Silicon Carbide Devices and Modules Industry Research White Paper" will take place during the event [5]. - The afternoon session will include a seminar on SiC technology applications in electric transportation [5]. Exhibition Highlights - A dedicated exhibition area will showcase new products and technologies from various companies, enhancing networking and collaboration opportunities [7]. - Companies such as Mitsubishi Electric, Guojijinan, and others will present their latest innovations [8]. Sponsorship and Participation - Companies like Hesheng New Materials and Jihua Hengyi are sponsoring the event by providing promotional materials and product information [9].

从上证G60战略新兴产业成份指数持仓样本的行业来看，工业占比36.53%、信息技术占比30.24%、原材 料占比14.25%、通信服务占比9.67%、医药卫生占比9.31%。 资料显示，指数样本每半年调整一次，样本调整实施时间分别为每年6月和12月的第二个星期五的下一 交易日。权重因子随样本定期调整而调整，调整时间与指数样本定期调整实施时间相同。在下一个定期 调整日前，权重因子一般固定不变。特殊情况下将对指数进行临时调整。当样本退市时，将其从指数样 本中剔除。样本公司发生收购、合并、分拆等情形的处理，参照计算与维护细则处理。 金融界5月12日消息，上证指数高开高走，上证G60战略新兴产业成份指数 (G60成指，950049)上涨 1.23%，报935.77点，成交额157.24亿元。 数据统计显示，上证G60战略新兴产业成份指数近一个月上涨7.95%，近三个月下跌4.89%，年至今上涨 0.49%。 据了解，上证G60战略新兴产业成份指数在长三角G60九城市的沪市上市公司中，选取不超过50家规模 最大的战略新兴产业上市公司证券作为指数样本，反映相关地区的战略新兴产业上市公司证券的整体表 现。该指数以2016年 ...

Core Viewpoint - The upcoming "Electric Transportation & Digital Energy SiC Technology Application and Supply Chain Upgrade Conference" in Shanghai aims to address key challenges and opportunities in the SiC industry, focusing on 8-inch SiC technology and automotive-grade SiC chip manufacturing [2][12]. Group 1: Conference Highlights - The conference will feature nearly 20 leading SiC companies, including Mitsubishi Electric, STMicroelectronics, and Wolfspeed, presenting the latest industry insights and innovative solutions [13]. - A focus on collaborative efforts in the 8-inch supply chain to overcome challenges in material mass production will be highlighted by companies like Tianke Heda and Dazhu Semiconductor [15]. - A roundtable forum will include discussions on the current state and challenges of SiC applications in the new energy market, as well as global development trends for the SiC industry by key players [18]. Group 2: Digital Energy SiC Technology Application Seminar - The morning session will feature presentations from STMicroelectronics, Wolfspeed, and Hong Kong University, discussing advancements in SiC technology and its applications in digital energy [23]. - STMicroelectronics will present its strategies for the Chinese market and advancements in 8-inch SiC wafer technology [23]. - Wolfspeed will showcase how its fourth-generation SiC MOSFET technology is transforming industrial automation and aerospace drive systems [23]. Group 3: Electric Transportation SiC Technology Application Seminar - The afternoon session will include in-depth technical analyses from companies like Mitsubishi Electric and Sanan Semiconductor, focusing on cost reduction and efficiency improvements in electric transportation applications [24]. - Mitsubishi Electric will present its solutions for SiC power semiconductors in high-voltage fast charging and electric drive systems [24]. - Sanan Semiconductor will discuss the latest advancements in packaging technology for SiC power devices [24]. Group 4: SiC Industry Chain Exhibition - The conference will feature a dedicated exhibition area showcasing the latest technologies from various industry players, promoting industry exchange and resource integration [26]. - Companies like Hantian Tiancheng and Zhongdian Guojinan will present their latest SiC products and solutions [27]. Group 5: Launch of SiC White Papers - The conference will also mark the launch of two white papers focusing on the progress and trends in the SiC substrate and epitaxy industry, as well as the applications of SiC in electric transportation and digital energy [28]. - The research initiative aims to create a comprehensive industry consensus covering the entire substrate-device-system chain [28].

Core Insights - The global semiconductor industry is expected to recover in 2024 after a downturn in 2023, driven by national policies aimed at boosting domestic demand, consumption, and technological innovation [1][2] - The market for power semiconductors is projected to decrease from $35.7 billion in 2023 to $32.3 billion in 2024, yet domestic companies like Silan Microelectronics and BYD have significantly increased their market shares [2][3] Group 1: Market Performance - Silan Microelectronics' revenue in the power semiconductor sector is estimated to reach $1.066 billion in 2024, up from $928 million in 2023, with market share rising from 2.6% to 3.3%, making it the sixth largest globally [2][3] - BYD has entered the top ten in global power semiconductor market share with 3.1%, benefiting from a significant increase in its automotive sales, which exceeded 4.27 million units in 2024, a 41.1% year-on-year increase [2][3] Group 2: Industry Trends - Only Silan Microelectronics and BYD saw an increase in market share among the top ten power semiconductor companies in 2024, while leading competitors like Infineon and ON Semiconductor experienced declines [3] - The automotive semiconductor market remains dominated by foreign companies, with the top five holding 48.2% of the market share in 2024, indicating a highly concentrated market [5][6] Group 3: Future Projections - The global automotive semiconductor market is expected to grow nearly 29% over the next three years, reaching a size of $68.4 billion in 2024, with China's automotive semiconductor market projected to reach 120 billion yuan in 2024 and exceed 300 billion yuan by 2030 [6][7] - The demand for automotive chips is driven by the increasing penetration of electric vehicles and advanced driver-assistance systems, with a compound annual growth rate exceeding 25% anticipated for China's market [6][7] Group 4: Company Strategies - Silan Microelectronics is focusing on expanding its automotive semiconductor capabilities, with significant investments in new production lines and projects aimed at enhancing its market position [9][10] - The company has achieved substantial growth in its automotive semiconductor revenue, with a 60% increase in sales from IGBT and SiC products, indicating a strong commitment to innovation and market expansion [8][11]

Core Viewpoint - The legal opinion letter confirms that the procedures for convening and holding the 2025 first extraordinary general meeting of shareholders of Hangzhou Silan Microelectronics Co., Ltd. comply with relevant laws and regulations, ensuring the legitimacy and effectiveness of the meeting and its voting results [1][9]. Group 1: Meeting Procedures - The board of directors published the notice for the extraordinary general meeting on April 24, 2025, detailing the meeting's time, location, and voting methods [4]. - The meeting was held on May 9, 2025, at 2 PM, presided over by the chairman, Chen Xiangdong [4]. - Voting was conducted both on-site and online, with specific timeframes for online voting provided in the notice [4][6]. Group 2: Attendance and Qualifications - Eligible attendees included all shareholders registered with the China Securities Depository and Clearing Corporation Limited as of May 6, 2025, along with company directors, supervisors, and senior management [5]. - A total of 9 shareholders and their proxies attended the meeting in person, representing 550,107,357 shares, or 33.06% of the total voting shares [5]. - Online voting involved 4,174 shareholders, representing 118,044,543 shares, or 7.09% of the total voting shares, leading to a combined attendance of 4,183 shareholders representing 668,151,900 shares, or 40.15% of the total voting shares [6]. Group 3: Voting Procedures and Results - The meeting utilized a combination of on-site and online voting for the proposed resolutions, with results being counted and announced immediately after voting concluded [7]. - The voting results showed that 662,855,393 shares (99.2073%) voted in favor of the resolutions, while 4,087,113 shares (0.6117%) opposed, and 1,209,394 shares (0.1810%) abstained [8]. - For small and medium investors, 112,748,136 shares (95.5131%) voted in favor, with 4,087,113 shares (3.4623%) against, and 1,209,394 shares (1.0246%) abstaining [8]. Group 4: Conclusion - The legal opinion concludes that the convening and holding procedures of the shareholders' meeting, as well as the qualifications of attendees and the voting process, are in compliance with the Company Law, Shareholders' Meeting Rules, and the company's articles of association [9].

本公司董事会及全体董事保证本公告内容不存在任何虚假记载、误导性陈述 或者重大遗漏，并对其内容的真实性、准确性和完整性承担法律责任。 重要内容提示： 本次会议是否有否决议案：无 一、会议召开和出席情况 (一) 股东大会召开的时间：2025 年 5 月 9 日 证券代码：600460 证券简称：士兰微 公告编号：临 2025-022 杭州士兰微电子股份有限公司 2025年第一次临时股东大会决议公告 (二) 股东大会召开的地点：浙江省杭州市西湖区黄姑山路 4 号公司三楼大 会议室 (三) 出席会议的普通股股东和恢复表决权的优先股股东及其持有股份情况： | 1、出席会议的股东和代理人人数 | 4,183 | | --- | --- | | 2、出席会议的股东所持有表决权的股份总数（股） | 668,151,900 | | 3、出席会议的股东所持有表决权股份数占公司有表决权 | 40.1516 | | 股份总数的比例（%） | | (四)表决方式是否符合《公司法》及《公司章程》的规定，大会主持情况等 本次股东大会采用现场投票与网络投票相结合的方式对本次股东大会通知 中列明的事项进行了投票表决。现场出席本次股东大会现场会 ...

国浩律师（杭州）事务所 关 于 杭州士兰微电子股份有限公司 2025 年第一次临时股东大会 法律意见书 地址：杭州市上城区老复兴路白塔公园 B 区 2 号、15 号国浩律师楼 邮编：310008 Grandall Building, No.2＆No.15, Block B, Baita Park, Old Fuxing Road, Hangzhou, Zhejiang 310008, China 电话/Tel: (+86)(571) 8577 5888 传真/Fax: (+86)(571) 8577 5643 电子邮箱/Mail：grandallhz@grandall.com.cn 网址/Website：http://www.grandall.com.cn 二〇二五年五月 国浩律师（杭州）事务所 法律意见书 国浩律师（杭州）事务所 关 于 杭州士兰微电子股份有限公司 2025 年第一次临时股东大会 法律意见书 致：杭州士兰微电子股份有限公司 国浩律师（杭州）事务所（以下简称"本所"）接受杭州士兰微电子股份有 限公司（以下简称"公司"）委托，指派律师出席公司 2025 年第一次临时股东 大会（以下简称"本次股东 ...