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【太平洋科技-每日观点&资讯】(2025-04-25)
远峰电子· 2025-04-24 12:50
①主板领涨,西陇科学(+10.00%)/武汉凡谷(+5.10%)/盛路通信(+4.87%)/立昂微(+4.75%)/大晟 文化(+4.46%)/ ②创业板领涨,海联讯(+9.36%)/新晨科技(+8.35%)/飞天诚信(+7.33%)/③科创板领涨,莱尔科 技(+6.07%)/世华科技(+5.56%)/新点软件(+3.31%)/ 国内新闻 ①全球半导体观察,台积电在全球技术论坛北美场次中/揭示其下一世代先进 逻辑制程技术A14的状况/台积电表示/A14制程技术体现了台积电在其领先 业界的N2制程上的重大进展/此技术旨在通过提供更快的运算和更好的能源 效率来推动人工智能(AI)转型/其亦有望透过增进装置端AI功能(on- board AI capabilities)来强化智慧型手机功能/使其更加智慧/A14制程技 术计划于2028年开始生产/截至目前开发进展顺利/良率表现优于预期进度/ ②爱集微,和辉光电正式向香港联交所递交主板上市申请/中金公司担任独家 保荐人/该公司此前已于2021年5月登陆上交所科创板/截至2025年4月23日 A股市值约292亿元/此次赴港IPO旨在拓展国际融资渠道/优化资本结构/为 技 ...
台积电CoWoS技术再升级,达到9.5倍光罩尺寸
半导体芯闻· 2025-04-24 10:39
台积电此次发表新的逻辑制程、特殊制程、先进封装和3D芯片堆叠技术,为广泛的高效能运算 (HPC)、智能型手机、汽车和物联网(IoT) 技术平台做出贡献,驱动产品创新。 台积电继续推进CoWoS 技术,以满足AI 对更多逻辑和高频宽存储(HBM) 永无止境的需求。台积 电计划在2027年量产9.5倍光罩尺寸的CoWoS,从而能够以台积电先进逻辑技术将12 个或更多的 HBM 堆叠整合到一个封装中。 台积电继2024年发表革命性系统级晶圆(TSMC-SoW) 技术,今年再次推出以CoWoS 技术为基础 的SoW-X,以打造一个拥有当前CoWoS 解决方案40 倍运算能力的晶圆尺寸系统,SoW-X 计划于 2027 年量产。 如果您希望可以时常见面,欢迎标星收藏哦~ 来源:内容来自 钜亨网 ,谢谢。 台积电今(24) 日举办2025 年北美技术论坛,会中除了推出A14制程技术,也还发表众多新技术, 其 中 包 括 继 续 推 进 CoWoS 技 术 , 计 划 在 2027 年 量 产 9.5 倍 光 罩 尺 寸 的 CoWoS , 相 较 现 阶 段 CoWoS-L 的3.3 倍以及去年推出的8 倍,技术进一步大 ...
新鲜早科技丨余承东称“尚界”首款车预计销量“大爆”;苹果、Meta被罚超58亿元;爱奇艺入局直播带货
Group 1: Technology Developments - OpenAI has launched a new image model, gpt-image-1, which is now available via API and has been adopted by major creative platforms like Adobe and Figma. The model features higher precision, diverse visual styles, and advanced image editing capabilities [2] - Tencent has released version 2.5 of its mixed reality 3D generation model, significantly enhancing modeling precision and increasing effective polygon count by over ten times [4] - Intel has announced a new generation of AI-enhanced software-defined vehicle system-on-chip (SDV SoC) at the Shanghai Auto Show, claiming up to a 10x performance improvement over the previous generation [8] Group 2: Corporate Actions and Financials - Apple and Meta have been fined a total of €700 million (approximately ¥58 billion) by the EU for violating the Digital Markets Act [2] - Neuralink, led by Elon Musk, is planning to raise $500 million with a pre-money valuation of $8.5 billion [10] - Jingfeng Mingyuan intends to acquire 100% of Sichuan Yichong Technology for ¥3.283 billion as part of a major asset restructuring [11] Group 3: Automotive Industry Updates - Huawei's first car under the "Shangjie" brand, developed in collaboration with SAIC, is expected to achieve significant sales upon its launch in Q3 2023 [3] - NIO's chairman Li Bin highlighted the importance of three core technologies—intelligent driving chips, universal operating systems, and smart chassis—in enhancing the experience and safety of smart vehicles [5] - GAC Aion and Didi Autonomous Driving have introduced the world's first mass-produced L4 autonomous vehicle, set for mass production by the end of the year [6] Group 4: Market Trends and Consumer Behavior - iQIYI is entering the live-streaming e-commerce space, leveraging its IP content and celebrity resources to tap into its membership base as a potential e-commerce user group [3] - Alibaba's international site has topped the U.S. App Store shopping charts, indicating a significant rise in its download rankings [4] - The establishment of the Greater Bay Area (Dongguan) Artificial Intelligence Alliance aims to enhance AI capabilities and attract over 300 AI-focused enterprises by 2027 [7]
1.4nm正式亮相,台积电更新路线图
半导体行业观察· 2025-04-24 00:55
如果您希望可以时常见面,欢迎标星收藏哦~ 今天,台积电在美国举办了tsmc symposium 2025,会上他们发布了一系列新技术,并对路线 图做了更新。值得一提的是,公司第二代GAA工艺14A也首次曝光。 台积电表示,A14代表了台积电业界领先的N2工艺的重大进步,旨在通过提供更快的计算速度和 更高的能效来推动人工智能(AI)转型。此外,它还有望通过提升智能手机的内置AI功能,使其 更加智能。根据台积电的规划,A14计划于2028年投产,目前开发进展顺利,良率已提前实现。 台积电指出,与即将于今年晚些时候量产的 N2 工艺相比,A14 将在相同功耗下实现高达 15% 的 速度提升,或在相同速度下降低高达 30% 的功耗,同时逻辑密度将提升 20% 以上。台积电凭借 其在纳米片晶体管设计与技术协同优化方面的经验,正在将其 TSMC NanoFlex 标准单元架构升 级为 NanoFlex Pro,从而实现更高的性能、能效和设计灵活性。 台积电董事长兼首席执行官魏哲家博士表示:"我们的客户始终着眼于未来,而台积电的技术领导 力和卓越的制造能力为他们提供了可靠的创新路线图。台积电的尖端逻辑技术(例如 A14)是 ...
TSM vs. GFS: Which Semiconductor Stock is Poised to Lead in 2025?
ZACKS· 2025-04-23 20:00
Taiwan Semiconductor Manufacturing Company (TSM) and GlobalFoundries (GFS) are two of the most prominent players in the global semiconductor foundry space, but they offer very different propositions. TSM leads in cutting-edge chip manufacturing with a dominant market share, while GFS targets differentiated processes and specialty technologies.With 2025 shaping up as a pivotal year for the semiconductor industry, which foundry stock offers a more compelling investment option today? Let’s find out.The Case fo ...
4月24日电,台积电更先进的A14芯片技术将于2028年开始投产。
news flash· 2025-04-23 18:42
Group 1 - TSMC's advanced A14 chip technology is set to begin production in 2028 [1]
QDII基金最新动向!减持美股,港股仓位创新高
券商中国· 2025-04-23 12:54
中美贸易博弈之际,美国出现"股汇债"三杀,美股更是剧烈波动。多只QDII主动管理基金最新披露的 一季报显示,美股的持仓比例下降,转而增配港股,南下资金对港股的定价权持续创新高。 比如QDII基金南方香港成长,一季度末美股的持仓市值从1.8亿元下降到2846万元,持仓比例从10.46% 减少至1.31%,而港股的持仓比例从77.7%提高到90.17%;摩根亚太优势一季度也将美股的持仓比例从 3.47%降到了0.74%,港股占比从25.77%提高到30.06%。 目前规模较大的QDII混合型基金,即张坤管理的易方达亚洲精选,一季报显示其增持了台积电。账面上, 基金总体的美股持仓比例并没有减少,实则从去年三季度就逐步减持了台积电的美股,局部增持的美股也 是中概股富途控股。 QDII基金减持美股、增配港股 多只QDII基金最新披露的一季报显示,美股的持仓比例下降,同时转而增配港股。原因除了美股一季度波 动剧烈导致的市值缩水之外,基金主动下调美股仓位的也不在少数。 比如南方香港成长,一季度末美股的持仓市值从1.8亿元下降到2846万元,持仓比例从10.46%减少至 1.31%,而港股的持仓比例从77.7%提高到90.1 ...
This May Be the Best Artificial Intelligence (AI) Semiconductor Stock to Buy Right Now
The Motley Fool· 2025-04-23 12:51
Shares of Taiwan Semiconductor Manufacturing (TSM 2.40%), popularly known as TSMC, have been under pressure in 2025. Investors have concerns surrounding the health of artificial intelligence (AI) infrastructure spending earlier this year followed by the recent tariff-related turmoil, which sparked a stock market sell-off. Still, the company's latest results show that these factors haven't derailed the company's impressive growth trajectory.TSMC released its first-quarter results on April 17. The company's r ...
美国搞芯片关税,毫无益处?
半导体芯闻· 2025-04-23 10:02
如果您希望可以时常见面,欢迎标星收藏哦~ 来源:内容 来自网络 。 美国总统唐纳德·特朗普近日宣称,政府将"审视半导体和整个电子供应链"。考虑到他多次承诺要 对进口芯片征收关税,我们可以预见一些措施即将出台。但问题是,这些措施会是什么类型?目的 又是什么? 根据贸易数据,美国每年进口约300亿美元的芯片,主要来自东南亚。但征收关税是否会促使企业 以本土制造的芯片取代进口芯片?答案是否定的。美国几乎不具备早在20世纪60年代起就外包到 亚洲的那类劳动密集型封装和组装能力。 因此,如果美国真的对半导体征收关税,企业可能反而会为了抵消成本上升而将更多制造环节转移 到海外。原本是进口芯片并在本土组装到电器或汽车上的供应商,可能会选择将整个制造流程搬到 海外。虽然这些成品最终仍需缴纳关税,但至少制造成本更低。 实际上,大多数芯片已经是作为其他设备的一部分进入美国的。为了捕捉这类贸易,美国政府正在 考虑一项更为激进的措施:对半导体征收所谓的"组件关税"。这意味着要计算设备中所含外国芯片 的价值,并据此征税。 这种做法符合现代供应链的多国化特点。例如,一部iPhone可能是在中国大陆组装的,但大多数 关键组件却来自其他地区 ...
Upgrading TSMC On Management Confidence Despite Tariff Uncertainty
Seeking Alpha· 2025-04-23 03:24
Group 1 - Bram de Haas has 15 years of investing experience and over 5 years managing a Euro hedge fund [1] - He is a former professional poker player, applying risk management skills to identify lucrative investments [1]