Industry Background - The solid-state battery industry is driven by the urgent demand for high-performance batteries in electric vehicles and consumer electronics, with solid-state batteries offering advantages such as higher safety, significantly improved energy density, and fast charging potential [2][3] - Traditional liquid lithium batteries face three main challenges: limited energy density affecting range, safety issues due to flammable liquid electrolytes, and insufficient fast charging performance [8][10][14] Negative Electrode Material Systems - The negative electrode materials in solid-state batteries currently rely on graphite and silicon-carbon, with silicon-based anodes being a significant development direction due to their theoretical capacity being much higher than that of graphite [19][35] - Lithium metal anodes, while facing challenges such as volume expansion and dendrite growth, have the potential to achieve a qualitative leap in energy density, with commercial applications becoming increasingly viable [19][45] Lithium Metal Anode Preparation Methods - The most mature method for lithium metal preparation is the extrusion/rolling method, which involves extracting lithium from ore or brine, followed by electrolysis and rolling to achieve the desired thickness [53][54] - New techniques such as electrochemical deposition and liquid phase methods are being explored to overcome thickness limitations and improve uniformity in lithium metal anodes [57][59] Market Size and Growth Potential - The global lithium-ion battery shipment is projected to reach 1545.1 GWh in 2024, with the power battery segment accounting for 1051.2 GWh, indicating a rapid growth trajectory in the market [22] - The development of low-altitude economy and humanoid robots is expected to significantly boost the demand for solid-state batteries, as traditional liquid batteries cannot meet the energy density and safety requirements [24][28] Solid-State Battery Advantages - Solid-state batteries can achieve energy densities exceeding 500 Wh/kg, far surpassing the liquid battery limit of 300 Wh/kg, thus enhancing the range of electric vehicles and reducing charging frequency [19][21] - The solid-state electrolyte eliminates the risks associated with liquid electrolytes, such as leakage and combustion, thereby significantly improving battery safety [19][21] Industry Trends and Future Directions - The transition from semi-solid to all-solid-state batteries is underway, with semi-solid batteries serving as a bridge technology while full solid-state batteries are being developed to address existing technical challenges [30][34] - The industry is focusing on overcoming technical bottlenecks and high costs associated with solid-state batteries, including low ionic conductivity and poor solid-solid contact interface performance [32][34]

Group 1 - The rapid development of AI chips is driving new demand for testing and packaging equipment, particularly for high-performance testing machines and advanced packaging technologies [2][4][38] - The semiconductor testing equipment market is expected to exceed $13.8 billion by 2025, with SoC and storage testing machines accounting for approximately $4.8 billion and $2.4 billion, respectively [3][50] - The complexity of SoC and advanced storage chips is increasing, leading to a significant rise in demand for high-performance testing machines [35][33] Group 2 - The demand for SoC testing machines is increasing due to the high integration and stability requirements of AI HPC chips, which significantly raise testing volume and time [3][50] - The storage testing machines are facing increased complexity due to HBM testing, which includes wafer-level testing and KGSD testing, replacing conventional packaging-level testing [3][44] - The core barriers in testing machines are the testing boards and chips, with a significant market share held by companies like Advantest and Teradyne, which dominate approximately 90% of the global semiconductor testing machine market [3][50] Group 3 - Advanced packaging technologies, such as HBM and CoWoS, are becoming mainstream, driving the demand for advanced packaging equipment [38][36] - The main difference between advanced and traditional packaging lies in the connection methods between chips and external electronics, with advanced packaging requiring more sophisticated equipment [4][38] - The investment suggestion highlights the potential opportunities in domestic testing and packaging equipment driven by AI chip advancements [4][5] Group 4 - The AI chip market in China is projected to reach approximately 140.6 billion yuan by 2024, with a compound annual growth rate (CAGR) of 36% from 2019 to 2024 [12][10] - The smart computing scale in China is expected to reach 640.7 EFLOPS by 2024, indicating a significant increase in demand for AI chips [12][10] - The end-side AI applications are rapidly expanding, leading to increased demand for SoC chips, which are expected to grow significantly in the market [27][25] Group 5 - The global SoC chip market is anticipated to reach $274.1 billion by 2030, driven by the increasing integration and performance requirements of AI applications [27][26] - SoC chips are essential for various applications, including mobile devices, smart home systems, and industrial control systems, highlighting their versatility [27][24] - The core of SoC chips lies in the IP cores, which are critical for achieving high integration, performance, and low power consumption [30][29] Group 6 - The majority of the AI chip market is still dominated by foreign giants, with domestic companies like Huawei, Haiguang, and Cambricon making strides to break the monopoly [32][31] - The performance of domestic AI chips is improving, with Huawei's Ascend series and Haiguang's DCU chips showing competitive capabilities against leading foreign products [32][31] - The ongoing trend of domestic substitution in the AI chip market is expected to accelerate as local companies enhance their technological capabilities [32][31]

Core Viewpoint - The article emphasizes the transformative impact of artificial intelligence (AI) on the global semiconductor industry, particularly focusing on the critical role of advanced chips and wafer foundries in this evolution. It highlights the challenges and opportunities faced by Chinese foundries in the context of geopolitical tensions and the shift from globalization to regionalization [2][5]. Group 1: Industry Overview - The wafer foundry industry is defined by the division of labor among Fabless, Foundry, and OSAT, which is essential for analyzing the current state of China's semiconductor industry. China has strong players in Fabless and Foundry but faces significant challenges in EDA/IP and advanced equipment [5]. - The trend towards domestic production is driven by geopolitical pressures rather than purely market forces, revealing high barriers to entry in the industry, including capital, technology, and ecosystem accumulation [5][31]. - The semiconductor market is experiencing structural changes, with AI and automotive electronics being the primary drivers of capacity growth. However, there is a risk of overcapacity in mature processes [5][12]. Group 2: Market Dynamics - The article notes that the demand for chips is increasing, particularly in AI, HPC, and automotive electronics, which require higher performance and efficiency. This has led to significant R&D investments in advanced process technologies [32][44]. - The global semiconductor market is projected to exceed $1 trillion by 2030, with a compound annual growth rate (CAGR) of 9% from 2025 to 2030, driven by the surge in demand for servers, data centers, and storage [44][50]. Group 3: Chinese Foundries - Chinese foundries are forming a tiered layout, with companies like SMIC, Hua Hong Semiconductor, and others establishing competitive advantages in various niche markets, avoiding homogenization [6][19]. - SMIC is recognized as a leader in China's integrated circuit manufacturing, achieving significant revenue growth and technological advancements in logic and specialty processes [54][53]. - Hua Hong Semiconductor is noted for its comprehensive specialty process platform, focusing on embedded non-volatile memory and power devices, and has shown strong revenue growth [56][57]. - Jinghe Integrated Circuit has become a leader in the liquid crystal panel driver chip foundry sector, achieving significant market share and revenue growth [59]. Group 4: Competitive Landscape - TSMC's competitive advantages include technological leadership, R&D investment, and deep integration with major clients like Apple and NVIDIA, which are crucial for maintaining its market position [6][12]. - The article discusses the shift from IDM to Foundry as a revolutionary change in the industry, with geopolitical factors influencing global supply chain restructuring [14][50]. - The article highlights the importance of specialized processes and system-level foundry services as a trend in the industry, with TSMC's advanced packaging technologies serving as a significant competitive edge [29][12]. Group 5: Future Outlook - The future of the wafer foundry industry is characterized by a focus on mature processes and specialty technologies, with Chinese foundries positioned to capitalize on domestic demand and policy support [31][37]. - The article warns of potential overcapacity risks, particularly in consumer electronics, while emphasizing the importance of maintaining high utilization rates and strong customer relationships to mitigate financial pressures [26][50].

Core Viewpoint - The article emphasizes the silent revolution in materials science that supports the advancements in 5G technology, highlighting the critical role of high-frequency and high-speed materials in meeting the demands of modern communication systems [2]. Group 1: High-Frequency and High-Speed Materials - PTFE (Polytetrafluoroethylene) is recognized for its excellent performance in high-frequency applications, featuring a dielectric constant (Dk) of 1.9-2.1 and a low dielectric loss factor (Df) of approximately 0.0002-0.002, making it suitable for various electronic and chemical applications [6][7]. - PPO/PPE (Polyphenylene Oxide/Polyphenylene Ether) offers balanced performance with a dielectric constant of 2.6-2.8 and a loss factor of about 0.0042-0.008, widely used in automotive and medical applications [8]. - PCH (Polycyclic Hydrocarbon Resin) is a newer material with a dielectric constant of less than 2.6 and a loss factor below 0.001, gaining traction in base station antennas and power amplifier modules [9]. - LCP (Liquid Crystal Polymer) is favored for flexible circuits, with a dielectric constant of approximately 2.9 and a loss factor of 0.002-0.004, ideal for 5G mobile phone antenna modules [10][11]. - XCPS (Cross-linked Polystyrene) is a new low-dielectric material with a stable dielectric constant of 2.5 and an extremely low loss factor of 0.0005, applicable in various high-tech fields [12][13]. - Ceramic-filled composite materials allow for performance customization by adjusting the type and ratio of ceramic fillers, excelling in high-temperature and high-power applications [18]. Group 2: Market Size and Growth - The global high-frequency and high-speed materials market was valued at approximately 15 billion yuan in 2022, projected to grow to 25 billion yuan by 2025, with a compound annual growth rate (CAGR) exceeding 18% [21]. - The Chinese market is expected to grow faster than the global average, potentially capturing over 40% of the global market by 2025 [21]. Group 3: Application Scenarios - High-frequency materials are essential across the 5G industry chain, including base station equipment, RF modules, terminal devices, automotive electronics, and satellite communications [24][25]. - PTFE currently holds the largest market share at around 35%, while LCP is anticipated to grow the fastest with a CAGR exceeding 25% [26]. Group 4: Technological Development Trends - The development of high-frequency materials is moving towards diversification, composite materials, and localization, with various materials finding their niche in specific applications [27][28][29]. Group 5: Challenges and Opportunities - The industry faces challenges such as balancing performance and cost, ensuring stable mass production, and matching materials with processes, while also presenting opportunities from the demand for material upgrades in millimeter-wave applications and the rise of satellite internet [30].

Investment - The article discusses various investment opportunities in new materials, semiconductors, and renewable energy sectors, highlighting the potential for growth and innovation in these industries [1][3][4]. Semiconductor - It emphasizes the importance of semiconductor materials such as photolithography, electronic special gases, and silicon wafers, which are critical for advanced packaging and manufacturing processes [1][3]. - The report also covers the advancements in third and fourth generation semiconductors, including silicon carbide and gallium nitride technologies, which are expected to drive future growth [1][3]. New Energy - The article outlines the investment landscape in new energy, focusing on lithium batteries, solid-state batteries, and hydrogen energy, which are pivotal for the transition to sustainable energy solutions [1][3]. - It highlights the significance of materials like silicon-based anodes and composite current collectors in enhancing battery performance [1][3]. Photovoltaics - The report details the photovoltaic sector, including materials such as solar glass, encapsulants, and back sheets, which are essential for solar panel efficiency [1][3]. - It also mentions the role of quartz sand and perovskite materials in the development of next-generation solar technologies [1][3]. New Display Technologies - The article discusses new display technologies, including OLED, MiniLED, and MicroLED, and the materials required for their production, such as optical films and adhesives [3][4]. Fibers and Composites - It covers advancements in fiber materials like carbon fiber and aramid fiber, which are crucial for lightweight and high-strength applications in various industries [3][4]. Notable Companies - The report lists key players in the materials sector, including ASML, TSMC, BYD, and Tesla, emphasizing their roles in driving innovation and market growth [4][3].

Core Viewpoint - The article emphasizes the growing importance of thermal management solutions in the electronics industry, driven by advancements in high-end smartphones, AI computing demands, and the increasing power density of electric vehicle control systems. The thermal materials industry is rapidly evolving, showcasing a vibrant ecosystem of domestic companies and innovative technologies [2]. Group 1: Listed Companies - Feirongda (300602) is a leading expert in electromagnetic shielding and thermal management solutions, providing a complete product chain including thermal conductive materials, graphite films, and liquid cooling plates. The company serves major clients like Huawei and BYD in the communication and new energy sectors [3][5]. - Siquan New Materials (301489) focuses on thermal management materials, offering a comprehensive range of products such as graphite heat dissipation films and modules. The company has notable clients including Xiaomi and Google [18][20]. - Suzhou Tianmai (301626) is recognized for its comprehensive thermal management solutions, with products like thermal interface materials and heat pipes, serving major clients in the telecommunications and new energy vehicle sectors [22][23]. - Zhongshi Technology (300684) specializes in high-performance synthetic graphite thermal solutions, becoming a core supplier for top global consumer electronics brands like Apple. The company reported a revenue of 1.566 billion in 2024, with a 24.51% year-on-year increase [26][28]. - Lingyi Zhi Zao (002600) provides intelligent manufacturing services, with thermal management business revenue reaching 4.107 billion in 2024, reflecting a 9.20% increase from the previous year [30][34]. - AAC Technologies (02018) reported a significant growth of 40.1% in its thermal business, achieving a revenue of 326 million in 2024, and holds over 50% market share in the domestic flagship smartphone thermal market [35]. - Shuo Beid (300322) offers thermal products and reported a revenue of 1.86 billion in 2024, with a 12.37% increase from the previous year [36]. Group 2: Financial Performance - Feirongda's 2024 revenue reached 5.03 billion, with a net profit of 173 million, reflecting a 15.76% year-on-year growth [17]. - Siquan New Materials achieved a revenue of 656 million in 2024, marking a 51.10% increase compared to the previous year [21]. - Suzhou Tianmai reported a revenue of 943 million in 2024, with a slight increase of 1.62% year-on-year [25]. - Zhongshi Technology's revenue for 2024 was 1.566 billion, showing a 24.51% increase from 2023 [29]. - Lingyi Zhi Zao's total revenue for 2024 was 442 billion, with a 29.56% increase from the previous year [34]. - AAC Technologies' thermal business revenue reached 326 million in 2024, reflecting a 40.1% growth [35]. - Shuo Beid's revenue for 2024 was 1.857 billion, with a 12.37% increase from the previous year [36].

Core Viewpoint - PEEK exhibits excellent performance, with downstream development and application expansion driving demand [1] Group 1: PEEK Market Overview - PEEK is a lightweight material with outstanding mechanical, physical, thermal, corrosion resistance, electrical properties, and biocompatibility, ranking at the top of the specialty engineering plastics pyramid [1] - After over 40 years of development, PEEK has been widely used in automotive, electronics, industrial manufacturing, aerospace, and medical fields [1] - The global PEEK consumption is expected to reach approximately 10,203 tons in 2024, with a year-on-year growth of 13.8%, and the market size is projected to reach $1.226 billion by 2027 [1][70] - The domestic PEEK market is growing rapidly, with a demand increase from 1,100 tons in 2018 to 3,904 tons in 2024, reflecting a CAGR of 23.5% [1][80] Group 2: Competitive Landscape - The PEEK production technology is complex, leading to a competitive landscape characterized by one leader and several strong players, with Victrex being the global leader, followed by Solvay and Evonik [2][7] - Domestic companies such as Zhongyan Co., Pengfulong, and Junhua Co. are gradually rising, achieving technological breakthroughs and improving product quality and market recognition [2][7] Group 3: Key Raw Materials - DFBP is a critical raw material for PEEK synthesis, accounting for about 50% of PEEK production costs, with approximately 0.8 tons of DFBP required for every ton of PEEK produced [3] - In 2023, global DFBP consumption was 6,646.97 tons, with a consumption value of 974 million yuan [3] Group 4: Investment Recommendations - Suggested companies for upstream raw materials include Xinhang New Materials, Zhongxin Fluorine Materials, and Xingfu New Materials [4] - Companies involved in PEEK production include Zhongyan Co., Water Co., and Jinfat Technology [4] - PEEK processing and application companies include Huitong Co., Tongyi Co., and Kent Co. [4] Group 5: Industry Challenges and Opportunities - The PEEK industry faces challenges such as high production costs, long verification cycles, and the need for technological innovation to overcome processing difficulties [50][55][60] - The industry is exploring various avenues for breakthroughs, including technological innovation, cost reduction through vertical integration, and collaborative development with downstream partners [60][62] Group 6: Policy Support - National policies have been established to enhance the self-sufficiency rate of engineering plastics, with a clear focus on PEEK as a strategic new material [64][65] - The strong policy push is a key external factor enabling domestic PEEK companies to rise rapidly and challenge international giants [65]

Core Viewpoint - The decision by Apple to switch from titanium alloy to aluminum alloy for the iPhone 17 Pro highlights a significant shift in the consumer electronics industry, emphasizing the importance of heat dissipation performance in high-end device design [3][4]. Group 1: Analysis of iPhone 17 Pro's Material Change - The core contradiction of "abandoning titanium for aluminum" lies in the trade-off between heat dissipation performance and high-end feel [5]. - Titanium alloy, while known for its strength-to-weight ratio and premium feel, has a thermal conductivity that is only 1/30th that of aluminum alloy, which has become a bottleneck for device performance as chip power increases [7]. - The new iPhone 17 Pro, utilizing 6061 aerospace aluminum and a 0.3mm ultra-thin laser-welded VC heat spreader, maintains a body temperature of 41.3°C after 30 minutes of 4K video recording, a reduction of 7.4°C compared to the previous titanium model [8][9]. - In high-performance gaming scenarios, frame rate fluctuations decreased from 15 frames to just 2 frames, significantly enhancing user experience [9]. - The aluminum and VC heat spreader combination improves heat conduction efficiency by 20 times compared to the titanium model, indicating that heat dissipation performance is now a critical metric for flagship devices [9]. Group 2: Heat Dissipation Performance Comparison - A comparative analysis of heat dissipation performance between iPhone 17 Pro and iPhone 16 Pro shows significant improvements across various metrics: - 4K recording temperature: 41.3°C (iPhone 17 Pro) vs. 48.7°C (iPhone 16 Pro), a difference of -15.2% [10]. - Frame rate fluctuation during gaming: 2 frames (iPhone 17 Pro) vs. 15 frames (iPhone 16 Pro), a difference of -86.7% [10]. - Continuous performance under full load: 40 minutes without throttling (iPhone 17 Pro) vs. 22 minutes with a 30% throttle (iPhone 16 Pro), an improvement of +81.8% [10]. - Maximum charging temperature: 38.5°C (iPhone 17 Pro) vs. 44.2°C (iPhone 16 Pro), a difference of -12.9% [10]. Group 3: Overview of the Heat Dissipation Materials Market - The global thermal interface materials (TIM) market is expected to grow at a compound annual growth rate (CAGR) of over 10%, potentially reaching approximately $7.5 billion by 2036 [15]. - The VC heat spreader is rapidly penetrating the high-end consumer electronics market, with its penetration rate in high-end smartphones projected to increase from 35% in 2023 to 62% by 2025 [17]. - The cost of thermal modules in smartphones has risen from 3.5% of the bill of materials (BOM) in 2020 to an expected 5.8% by 2025, indicating that heat dissipation systems are becoming a significant component of smartphone production costs [17]. Group 4: Evolution of Heat Dissipation Materials - The development of heat dissipation materials can be categorized into three main stages: passive heat dissipation, active heat dissipation, and smart heat dissipation [25]. - Traditional heat dissipation materials include metals like aluminum and copper, which are widely used due to their excellent thermal conductivity [26]. - Emerging materials such as graphite and phase change materials (PCM) are gaining traction due to their high thermal conductivity and efficiency in heat management applications [29][30]. - Advanced technologies like microchannel cooling and immersion cooling are being explored for high-power applications, showcasing the ongoing evolution in heat management solutions [31][32].

Core Viewpoint - The article discusses the current state and future prospects of the semiconductor materials industry, highlighting the importance of domestic substitution and the potential investment opportunities within this sector [5][38]. Group 1: Semiconductor Materials - The article emphasizes the critical role of semiconductor materials in the industry, particularly focusing on CMP polishing liquids and advanced packaging materials, which are seen as key areas for investment [5][7]. - It mentions the ongoing "invisible war" for 7N purity in semiconductor sputtering targets, indicating a significant market shift and potential for domestic players to capture market share [5]. - The article outlines the challenges and opportunities in the semiconductor materials market, particularly in the context of technological barriers and market rewards [5][38]. Group 2: Domestic Substitution - The article highlights the rapid growth of domestic substitution in semiconductor materials, with 14 advanced packaging materials identified as critical areas for investment [7][38]. - It discusses the progress made in domestic production capabilities, which is expected to reduce reliance on foreign suppliers and enhance the competitiveness of local companies [5][7]. - The potential for a billion-dollar market in domestic semiconductor materials is underscored, with specific companies positioned to benefit from this trend [5][38]. Group 3: Investment Logic - The article provides insights into the investment logic surrounding semiconductor materials, suggesting that the market is ripe for investment due to the increasing demand for advanced technologies [5][38]. - It mentions various reports and analyses available for investors looking to understand the semiconductor materials landscape better, indicating a wealth of information for informed decision-making [5][38]. - The article encourages investors to consider the long-term growth potential of the semiconductor materials sector, particularly in light of ongoing technological advancements and market shifts [5][38].

Core Viewpoint - The article discusses the development and potential impact of 30 cutting-edge materials, emphasizing their strategic importance for future technological advancements in various industries [3]. Group 1: Overview of Cutting-edge Materials - Cutting-edge materials include boron graphene, transition metal sulfides, 4D printing materials, and biomimetic plastics, which are crucial for China's strategic development [3]. - The article lists 30 of the most promising advanced materials and their potential effects on future life [3]. Group 2: Individual Material Summaries - **Holographic Film**: A revolutionary projection film that allows 360° viewing and interaction, offering high clarity and durability, with significant future research potential [6][8]. - **Metallic Hydrogen**: A high-density, high-energy material with potential applications in superconductivity and space travel, capable of revolutionizing energy storage and propulsion systems [11][15]. - **Supersolid**: A state of matter that combines properties of solids and superfluids, with potential applications in superconducting magnets and energy transmission [18][20]. - **Wood Sponge**: A chemically treated material that can absorb oil up to 46 times its weight, offering a green solution for cleaning oil spills [23][24]. - **Time Crystals**: A new state of matter with periodic structures in both space and time, promising advancements in quantum computing and material science [27][31]. - **Quantum Stealth Material**: A camouflage fabric that bends light to achieve invisibility, with applications in military technology [37][39]. - **Never-dry Material**: A polymer-water composite that remains conductive and could be used in artificial skin and flexible robotics [40][43]. - **Transition Metal Dichalcogenides (TMDC)**: A semiconductor material with potential in optoelectronics, offering low-cost and stable thin layers [44][53]. - **Cold Boiling Material**: A material that exhibits solid, liquid, and gas states at varying temperatures, with applications in aerospace and electronics [56][57]. - **Magnetic Fluid Material**: A stable colloidal liquid with magnetic properties, applicable in various fields including aerospace and medical devices [60][62]. - **Rock-solid Coating Material**: A cost-effective coating for industrial tools that enhances durability and efficiency [65][67]. - **Nano-point Perovskite**: A material with excellent properties for light absorption and storage, crucial for solar energy applications [70][72]. - **Micro Metal**: A lightweight yet strong material that can significantly reduce the weight of aerospace vehicles [75][76]. - **Tinene**: A new two-dimensional material with superior conductivity, promising applications in electronics [78][79]. - **Molecular Superglue**: A high-strength adhesive with potential uses in medical diagnostics and material bonding [81][82]. - **Metamaterials**: Engineered materials with unique properties, promising advancements in various scientific fields [85][86]. - **Quantum Metal**: A unique material that exhibits both metallic and insulating properties under different conditions, with significant implications for superconductivity [88][89]. - **Boron Graphene**: A two-dimensional material with exceptional electronic properties, showing promise in energy and electronics sectors [91][92]. - **Programmable Cement**: A high-performance cement with enhanced properties, aimed at sustainable construction practices [94][95]. - **Ultra-thin Platinum**: A cost-effective method for producing thin platinum layers for fuel cells, reducing material costs [97][98]. - **Platinum Alloys**: Versatile materials with applications in various industries, including high-temperature environments [101][103]. - **Self-healing Materials**: Materials that can autonomously repair damage, extending their lifespan and reducing maintenance costs [106][107]. - **Sun-blocking Glass Coating**: A smart coating that adjusts transparency based on temperature, with applications in construction [109][110]. - **Biomimetic Plastics**: Materials that mimic biological properties, offering high strength and flexibility for infrastructure development [112][114]. - **Photon Crystals**: Optical materials that manipulate light flow, with applications in advanced optics and photonics [115][120]. - **Ablation-resistant Ceramics**: High-temperature materials suitable for aerospace applications, providing durability and resistance to extreme conditions [122][125]. - **Cooling Wall Materials**: A material that can absorb and evaporate water to provide cooling, potentially replacing traditional air conditioning [127][128]. - **Infinitely Recyclable Plastics**: Plastics designed for sustainable use, addressing environmental concerns while maintaining economic value [129][131]. - **4D Printing Materials**: Smart materials that can change shape based on environmental stimuli, with potential applications in fashion and healthcare [132][138].