正文 在半导体产业攀登工艺巅峰的征程中，光刻胶作为集成电路图形化工艺的核心媒介，其地位堪比精密绘制蓝图的"画笔"。它不仅决定了电路图案能否被高 保真地转印至硅片，其材料本身的每一次革新—— 从早期的DNQ-酚醛树脂体系，到随KrF、ArF光刻技术而生的化学放大光刻胶，直至面向EUV时代的金 属簇光刻胶 ——都直接推动了摩尔定律的延续。 然而，这项精密且关键的产业，长期以来被少数国际巨头在 材料设计、核心树脂及复杂工艺 诀窍上所构建的壁垒所主导。 国产化之路，因而远非简单的产品替代，而是一场贯穿 基础化学、精密工程与供应链安全的系统性攻坚，涉及从分子设计、配方研发、稳定量产到客户 验证 的全链条能力重塑。 报告将系统性地梳理 半导体光刻胶的技术脉络与产业现状 。报告内容主要涵盖四大方面： 首先 ，回顾光刻胶随光刻技术代演进的 发展历程 ，揭示设备、材料与工艺协同发展的规律； 其次 ，深入剖析成熟制程中主流光刻胶（如248nm、193nm化学放大胶及I线胶）的 工作原理与配方核心 ； 再次 ，明确界定评估光刻胶性能的 关键技术指标 ，解读其背后的设计考量； 点击 最 下方 "在看"和" "并分享，"关注"材料汇 ...

Core Viewpoint - Specialty nylon, as a high-performance polyamide material system beyond general nylon (PA6, PA66), is a key direction for the new materials industry towards high-end, functional, and green development. It overcomes the limitations of conventional nylon in heat resistance, water absorption, and transparency through molecular structure design and synthesis process innovation, leading to various subcategories widely used in advanced manufacturing fields such as automotive electrification, electronics, new energy equipment, and aerospace [1][2]. Group 1: Overview of Specialty Nylon - Specialty nylon refers to polyamide materials excluding general nylons (PA6 and PA66), including long-chain polyamides, high-temperature polyamides, transparent polyamides, and bio-based polyamides (PA56), with long-chain nylon and high-temperature nylon dominating the market [5][6]. - The global specialty nylon market is currently dominated by international giants such as Arkema, Evonik, and DuPont, with significant technological barriers in key monomers, polymerization processes, and high-end grades [1][10]. Group 2: Market Supply and Demand - The global production capacity of specialty nylon is approximately 600,000 tons per year, with major producers including Arkema, DuPont, DSM, and others. DSM uniquely masters the industrialization of hexamethylenediamine, producing PA4T, while other companies primarily focus on PA6T products [10][11]. - In China, domestic production of long-chain polyamides has gained a significant market share, with several companies planning to expand production capacity, expected to reach 150,000 tons in the next five years [14][13]. Group 3: Long-Chain Polyamides - Long-chain nylon typically refers to nylon materials with more than ten methylene groups in the molecular chain, offering high toughness and low water absorption, with applications in automotive, electronics, and military sectors [16][20]. - The global production capacity of long-chain polyamides is around 270,000 tons per year, with a projected market sales revenue of $2.846 billion in 2024, expected to reach $3.64 billion by 2031, reflecting a CAGR of 3.6% [21][23]. Group 4: High-Temperature Polyamides - High-temperature polyamides can operate at temperatures up to 150°C, with a global production capacity of approximately 335,000 tons per year. They are widely used in electronics, automotive, and mechanical manufacturing [26][32]. - The production of high-temperature nylon involves complex synthesis processes, with the two-step method of high-temperature high-pressure solution polymerization followed by solid-phase post-polymerization being the mainstream industrial process [28][31].

Core Viewpoint - The article emphasizes the critical role of heat dissipation technology in high-power and high-density electronic devices, highlighting the emergence of diamond-copper composite materials as a key solution to overcome traditional thermal management limitations [1][3]. Group 1: Heat Dissipation Technology's Core Position - Heat dissipation systems have evolved from being performance optimization items to core constraints on product performance, driven by exponential increases in heat flow density [4][11]. - Traditional thermal management solutions, such as heat pipes, face significant limitations as heat flow density exceeds 300W/cm², necessitating breakthroughs in high-performance composite materials [4][11]. Group 2: Performance Parameters and Economic Implications - The performance of heat pipes is often overstated, with real-world applications revealing a significant gap between theoretical and practical performance, presenting opportunities for new materials [7]. - The economic implications of heat dissipation are stark, with data indicating that a 10°C increase in temperature can lead to a 50% decrease in reliability, and that 40% of energy consumption in AI centers is dedicated to heat dissipation [13]. Group 3: Diamond-Copper Composite Materials - Diamond-copper composite materials are characterized by their exceptional thermal conductivity and adaptability, achieved through microstructural design that combines the high thermal conductivity of diamond with the workability of copper [18][22]. - The thermal conductivity of diamond can reach 2200 W/m·K, significantly surpassing that of copper, and the composite can achieve thermal conductivities exceeding 1000 W/m·K [22]. Group 4: Market Size and Growth Trends - The global market for diamond-copper composites is projected to grow from approximately $1.4 billion in 2024 to over $3.85 billion by 2031, with a compound annual growth rate (CAGR) of 12.4% [37]. - The Chinese market is expected to expand from 12.8 billion yuan in 2024 to 50 billion yuan by 2031, driven by domestic substitution and the expansion of application scenarios [37][38]. Group 5: Competitive Landscape - The competitive landscape is characterized by international giants dominating high-end markets while domestic companies accelerate local substitution, with Japan's Sumitomo Electric holding a significant market share [45]. - Chinese manufacturers are making strides in the diamond-copper sector, achieving thermal conductivities of 600-800 W/(m·K) and reducing costs by 30%-40% compared to imports [45]. Group 6: Future Development Trends - Future advancements in the diamond-copper sector will likely stem from technological breakthroughs and the expansion of application scenarios, with a focus on high-performance and extreme environment stability [53]. - The industry is expected to mature through the standardization of processes and the localization of equipment, which are essential for large-scale commercialization [53].

Core Market Growth Drivers - The global military metal new materials market is experiencing strong growth, driven by rising defense budgets and the urgent demand for advanced weaponry and aerospace systems, with a current market size of $15 billion and an expected CAGR of 6% from 2025 to 2033 [1] - The demand for lightweight, high-strength materials in aircraft and missile manufacturing is a key engine for market growth, with innovative alloys and composite materials like titanium alloys, beryllium, and carbon fiber composites becoming core selections for military production [3] Technological Advancements - Breakthroughs in materials science are facilitating the development of a new generation of military materials, providing technical support for market expansion, particularly in applications such as aircraft engines, aerospace fasteners, inertial navigation systems, and thermal protection materials [4] Market Challenges - The market faces challenges including high production costs of advanced military materials and a fragile supply chain, exacerbated by geopolitical uncertainties affecting raw material supply and product delivery [6] - Strict regulatory environments governing the application and production of military materials can delay market expansion due to complex approval processes for special materials [6] Competitive Landscape - The competition in the military metal new materials market is concentrated among a few leading manufacturers, with significant market shares held by companies like VSMPO-AVISMA, ATI, and Carpenter Technology in titanium alloys, and Toray, Mitsubishi Rayon, and Tenax in carbon fiber composites [8] - The beryllium market is dominated by a few specialized companies, with a total market share of approximately 70% [8] Innovation Focus Areas - Key innovation directions include developing advanced alloys with enhanced fatigue resistance and high-temperature capabilities, integrating nanotechnology with advanced processing techniques to create lighter and stronger composite materials, and improving surface treatment processes to enhance corrosion and wear resistance [9] End-User Demand and Industry Consolidation - The market demand is highly concentrated among major military powers such as the US, Russia, China, and European countries, which collectively account for over 80% of market demand [12] - The industry has seen significant merger and acquisition activity, with a total scale of about $2 billion over the past five years, primarily aimed at capacity integration and securing raw material supply [12] Regional Market Dynamics - The US is the dominant player in the global military metal new materials market, supported by high defense R&D investments, advanced manufacturing infrastructure, and a robust domestic supply chain [15] - The Asia-Pacific region, particularly China, is rapidly emerging, driven by the expansion of domestic defense capabilities and advanced material production, although the US maintains a significant lead in technology and market share [15] Industry Development Trends - The military new materials market is undergoing significant growth, driven by ongoing demand for advanced military aircraft, missiles, and spacecraft, with a focus on lighter, stronger, and more heat-resistant materials [17] - Advanced manufacturing technologies like additive manufacturing (3D printing) are enhancing the production of complex, customized parts, while the rise of UAVs is increasing the demand for lightweight, high-strength materials [19]

Core Viewpoint - The semiconductor and integrated circuit industry in Guangdong Province is projected to reach a total output value of 360 billion yuan in 2024, with significant contributions from design, manufacturing, packaging, and materials sectors [3]. Guangdong Semiconductor and Integrated Circuit Industry Overview - The total output value of Guangdong's semiconductor and integrated circuit industry is expected to reach 360 billion yuan in 2024, with the design sector contributing 210.9 billion yuan, manufacturing 9.2 billion yuan, packaging and testing 79.5 billion yuan, and equipment and materials 60.8 billion yuan [3]. - The overall revenue growth rate for the integrated circuit industry in Guangdong is projected at 23.92% [4]. Shenzhen Semiconductor Industry Insights - Shenzhen's integrated circuit industry accounts for 79% of Guangdong's total output, with an expected revenue of 283.96 billion yuan in 2024, reflecting a growth of 32.9% from 2023 [8]. - Shenzhen hosts 727 integrated circuit companies, including 456 design firms, 8 manufacturing companies, 82 packaging and testing firms, 133 equipment and parts companies, and 48 materials companies [8]. Revenue and Growth Trends in Shenzhen's Industry Chain - The revenue for Shenzhen's integrated circuit industry is projected to grow from 1,608.93 billion yuan in 2022 to 2,839.6 billion yuan in 2024, with a compound annual growth rate of 32.9% [9]. - The design sector is expected to grow significantly, with revenues increasing from 1,101.90 billion yuan in 2022 to 1,914.1 billion yuan in 2024, marking a growth rate of 33.2% [9]. Key Projects in Shenzhen's Semiconductor Sector - Major semiconductor projects in Shenzhen include the construction of a 12-inch integrated circuit production line by SMIC with a total investment of 2.35 billion USD, and a 12-inch production line project by Runpeng Semiconductor with an investment of 22 billion yuan [14][13]. Domestic Wafer Foundry Growth Trends - By 2030, mainland China is expected to surpass Taiwan in wafer foundry capacity, achieving a 30% global market share, driven by the establishment of 4-5 new wafer fabs annually [14]. Comparison of Domestic IDM Companies - The top 12 domestic IDM companies include notable players such as Weitai Technology, Times Electric, and Huazhong Microelectronics, with varying revenue projections for 2024 [22]. Global Semiconductor Equipment Market - The global semiconductor equipment market is projected to exceed 110 billion USD in 2024, with a year-on-year growth of approximately 10% [24]. Domestic Semiconductor Material Companies - Leading domestic semiconductor material companies include Shanghai XinYang, Jiangsu Yake Technology, and Shenzhen Rongda, focusing on products like photoresists and electronic chemicals [35]. Advanced Packaging Industry Landscape - The top five domestic advanced packaging companies include Changdian Technology and Huatian Technology, with significant revenue contributions and a comprehensive strength index for 2024 [40][42].

点击 最 下方 关注《材料汇》 ， 点击"❤"和" "并分享 添加 小编微信 ，寻 志同道合 的你 正文 引言 我们正站在一场由深度学习和大规模计算驱动的智能革命浪潮之巅。AI模型的参数规模已突破万亿，其对算力的饥渴远超 半导体行业传统的发展节奏。当芯片制程逐步逼近物理极限，单纯依靠工艺微缩已难以为继， 突破的方向，正从设计转向 底层——材料科学成为解锁下一代算力的关键钥匙 。 从硅基到二维材料、三五族化合物，从电子到光子乃至量子，每一次材料体系的革新，都可能重构芯片的性能边界与能效 天花板。与此同时，全球半导体产业链格局深刻调整，供应链安全成为核心关切。在这一历史性交汇点上，中国本土的材 料创新与产业化进程，不仅关乎单一技术节点的突破，更承载着 构建自主可控算力底座、重塑全球AI硬件竞争格局 的战 略使命。 本文将系统梳理支撑 AI创新的关键新材料体 系，呈现从设计、制造、封装到新兴计算范式的全景技术图谱，并聚焦国内 相关企业与科研机构的产业化进展。这既是一份认识AI算力底层驱动力的技术指南，也是一张观测中国硬科技突围路径的 产业地图。 一、核心计算与逻辑芯片材料 （一）先进沟道材料 沟道材料是 半导体晶体 ...

Core Insights - The article discusses the upcoming 2026 Innovation Conference on Metal Organic Framework Materials (MOFs) scheduled for January 10, 2026, in Ningbo, Zhejiang, highlighting the significance of MOFs in addressing resource issues and climate challenges, especially after the Nobel Prize recognition in 2025 [3][4]. Conference Information - The conference will feature a total of 200 participants and is organized by Flink Qiming Supply Chain, with support from the National Key Laboratory of Marine Key Materials and Ningbo Qiming Supply Chain Information Technology Co., Ltd [7]. - The agenda includes registration on January 9, 2026, and various forum reports on January 10, covering advanced synthesis, carbon neutrality applications, and interdisciplinary applications of MOFs [6][8]. Conference Topics - **Topic 1: Advanced Synthesis and Characterization of MOFs** [9] - **Topic 2: MOFs Design and Applications for Carbon Neutrality** [10] - **Topic 3: Interdisciplinary Fusion and Cutting-edge Applications of MOFs** [11] Call for Posters - The conference encourages experts and scholars to submit posters for technical exchange, with specific dimensions suggested for the posters [13]. Registration Fees - The registration fee varies based on the timing of registration, with early bird rates available until December 10, 2025. Regular fees apply thereafter, with discounts for groups and students [15].

Core Viewpoint - The article discusses the rapid growth and investment opportunities in the advanced packaging materials sector, highlighting the potential for domestic companies to replace foreign imports in critical areas of technology [7][8]. Market Overview - The global market for advanced packaging materials is projected to reach $2.032 billion by 2028, with the Chinese market expected to grow to 9.67 billion yuan by 2025 [8]. - Specific materials such as PSPI and Al-X photoresist are highlighted, with PSPI's market size in China estimated at 7.12 billion yuan in 2023 [8]. Investment Opportunities - The article identifies 14 key advanced packaging materials that are critical for the semiconductor industry, emphasizing the potential for domestic companies to capture market share from established foreign players [7][8]. - Companies like 鼎龙股份, 国风新材, and 三月科 are mentioned as potential leaders in the domestic market for advanced packaging materials [8]. Growth Projections - The market for conductive adhesives is expected to reach 3 billion yuan by 2026, while the chip bonding materials market is projected to grow from approximately $4.85 billion in 2023 to $6.84 billion by 2029 [8]. - The epoxy encapsulation materials market is anticipated to grow to $9.9 billion by 2027, indicating strong demand in the sector [8]. Competitive Landscape - The article outlines the competitive landscape, noting that foreign companies like Fujifilm, Toray, and Dow are currently dominant in various segments, but domestic firms are rapidly advancing [8]. - The need for innovation and investment in R&D is emphasized for domestic companies to compete effectively against established international players [8].

Core Viewpoint - The rapid development of the new energy vehicle (NEV) industry demands higher standards for lightweight materials, safety, and range performance, with polymer materials emerging as a key technology due to their low density, high strength, corrosion resistance, and design flexibility [2][3]. Group 1: Current Application Status of Polymer Materials in NEVs - Engineering plastics (e.g., PA6, PC/ABS) are widely used in battery housings and charging station components [2]. - Elastomer materials (e.g., silicone rubber) are applied in sealing and damping systems [2]. - Lightweight composite materials (e.g., carbon fiber reinforced plastics) are gradually covering body structure components [2]. - Polymer materials account for approximately 15% of the total weight of vehicles, surpassing the total weight of other non-metal materials [13]. Group 2: Development Trends of Polymer Materials - Future trends focus on three main areas: developing high-temperature and flame-retardant battery-specific polymer materials to enhance safety; promoting the green transformation of bio-based or recyclable materials in response to carbon neutrality goals; and integrating materials, structures, and processes to further reduce costs and optimize performance [2][3]. - The integration of material science and intelligent manufacturing technology is expected to enable more efficient and environmentally friendly lifecycle applications of polymer materials in NEVs [3]. Group 3: Specific Material Developments - Battery materials are evolving with specific requirements such as thermal conductivity and mechanical strength, with a focus on domestic production to reduce reliance on imports [14][20]. - Electric control materials are being developed to meet high voltage requirements, with a focus on improving mechanical properties and reducing costs [20][25]. - The demand for lightweight and thin-walled materials is increasing, with potential weight reductions of 10-40% through innovative design and material use [30][36]. Group 4: Environmental Considerations - The development of green rubber materials is aligned with carbon neutrality strategies, focusing on enhancing performance while reducing costs [47]. - The application of recycled materials in automotive interior components is being explored to overcome challenges related to odor and thermal aging [51]. Group 5: Future Material Innovations - The future of NEV materials includes the development of intelligent films and flexible electronic materials that enhance user experience and integrate advanced functionalities [38][44]. - The shift towards high-performance, lightweight composite materials is anticipated to meet the increasing demands for energy density and cost-effectiveness in battery systems [31].

Core Viewpoint - The successful commercial operation of the C919 large passenger aircraft marks a significant milestone for China's aviation industry, showcasing the collaborative efforts of over 200 domestic companies and numerous educational institutions in the development of this aircraft, which has achieved over 50% localization in its key materials [1][4]. Group 1: Domestic Supplier Distribution - The C919 aircraft employs a "main manufacturer-supplier" production model similar to that of Boeing and Airbus, with the overall design completed by COMAC and various components designed and produced in collaboration with other enterprises [1]. - A total of over 200 companies from 22 provinces in China are involved in the development of the C919, with Shanghai serving as the assembly center and a complete industrial chain layout radiating to regions such as the Yangtze River Delta, Southwest, and Northeast [3]. Group 2: Key Material Supply - The material supply chain for the C919 consists of three key material systems: titanium alloy, aluminum-lithium alloy, and composite materials, with domestic suppliers achieving significant technological breakthroughs [4]. - Titanium alloy, supplied by BaoTi Group, constitutes 9.3% of the C919's structure, with over 130 tons of various specifications produced [4]. - Southwest Aluminum Group provides over 600 aluminum alloy components, utilizing third-generation aluminum-lithium alloy, which improves yield strength by 40% and reduces component density by 3% [4]. - Composite materials account for 11.5% of the C919, with applications in critical structural components [4]. Group 3: Role of Private Enterprises - Private enterprises play a crucial role in the C919 supply chain, with Xizi United Holdings being the only private company among the primary structural suppliers [6]. - Zhejiang Xizi Shibori Aviation Industry Co., Ltd. is responsible for the complex design and manufacturing of the aircraft doors, while Zhejiang Huaron Aviation Equipment Co., Ltd. provides essential tooling for composite materials [7]. - Zhejiang Meidun Protection Technology Co., Ltd. supplies engine insulation materials that significantly reduce high temperatures, showcasing the diversity and innovation within the supply chain [7]. Group 4: Material Innovation Breakthroughs - The C919 has achieved several major breakthroughs in material applications, including the use of third-generation aluminum-lithium alloy for the front fuselage, which required extensive testing and new manufacturing facilities [8]. - Advanced third-generation carbon fiber composite materials are utilized in critical structural areas, marking a first in domestic civil aircraft development [8]. - Chongqing Zaiseng Technology Co., Ltd. has developed "aircraft cotton," a unique product designed for weight reduction and space-saving, filling a domestic gap in the market [8]. Group 5: Supply Chain Security and Challenges - Despite significant achievements, the C919 supply chain faces challenges, particularly in international airworthiness certification, which is essential for global market access [9]. - Key material technologies still require breakthroughs, especially in specialized materials and onboard systems [10]. - As the C919 enters mass production, there is a pressing need to enhance production capacity to meet delivery requirements, with plans for significant capacity increases by 2025 [10].