Core Viewpoint - AT&S has officially launched its new factory in Kulim Hi-Tech Park, Malaysia, achieving full production capacity, which marks a significant milestone for the company and symbolizes Malaysia's strategic leap in the global semiconductor supply chain [1][2]. Group 1: Factory Launch and Production Capacity - The new factory in Kulim was completed in a record time of two years and is expected to have the fastest production ramp-up in the world for similar projects, achieving mass production readiness within just one year [2][4]. - The factory is part of AT&S's response to Malaysia's national semiconductor strategy, focusing on new customers, technologies, and R&D projects to support economic growth [2][3]. Group 2: Investment and Infrastructure - AT&S has invested approximately 5 billion MYR (1 billion EUR) in the Kulim facility, which includes a total building area of about 255,000 square meters and is equipped with around 500 high-tech devices [3][5]. - The company has collaborated closely with local institutions, including the Collaborative Research in Engineering, Science & Technology (CREST) and the Ministry of Investment, Trade and Industry (MITI) in Malaysia [3][5]. Group 3: Strategic Operations and Market Demand - The new factory will benefit from a tightly integrated operational model involving plants in Chongqing, Malaysia, and Leoben, Austria, enhancing knowledge sharing and R&D capabilities to meet the growing demand for CPUs, GPUs, AI, VR, and AR technologies [2][3]. - As global data volumes increase exponentially, the demand for data storage, transmission, and analysis is expected to remain strong, positioning AT&S as a preferred technology partner [2][3]. Group 4: Workforce Development and Certifications - Over 6 million MYR has been invested in R&D, with more than 5,000 students participating in AT&S's employer branding initiatives [3]. - The Kulim facility has achieved necessary product certifications, factory certifications, and ISO system certifications, further solidifying its operational credibility [4][5].

如果您希望可以时常见面，欢迎标星收藏哦~ 在汽车"智能化、电动化"浪潮席卷全球的当下，车规级芯片正成为智能座舱、辅助驾驶、整车控制 等关键系统的神经中枢。 然而长期以来，这一核心领域始终被海外厂商垄断，国产供应链一度面临"有整车，无芯片"的困 局，特别是在地缘政治加剧的背景下，国内整车厂和Tier1厂商对高可靠、高一致性、高性能的国 产车规芯片需求愈来愈大。 对于车规级产品的研发而言，并不只是把消费级产品拿来"加厚加固"这么简单。紫光国芯为此设计 了内嵌ECC纠错电路，大幅降低了应用中的失效概率；在量产测试中留下足够的Guardband裕度， 保证批次间的一致性和稳定性；严格挑选车规BOM材料，通过对车规产品进行严格的可靠性认证 和品质管控，确保每一颗芯片都经得起高温、严寒、震动等苛刻环境的考验。 坚守，赢得客户认可 "紫光国芯没有盲目追逐风口，而是扎根于客户需求。"产品负责人说道。其自主研发的数款中小容 量车规DRAM产品被广泛应用于ADAS感知系统（如激光雷达和前视觉一体机）、智能座舱（如数 字仪表、DMS、HUD）、中央网关及域控单元（VDC）等，在多家主流车企的车型中实现量产， 出货超千万颗。 而正是 ...

Core Insights - Intel's Arrow Lake architecture features a chiplet design, showcasing a complex layout of compute, I/O, SoC, and GPU tiles, with filler dies for structural support [1][3] - The compute tile utilizes TSMC's advanced N3B process, while the I/O and SoC tiles are manufactured using the older N6 process, indicating a significant reliance on competitor technology [3] - Arrow Lake introduces a new cache structure, allowing E-core clusters to access shared L3 cache, enhancing performance capabilities [5] Architecture Details - The compute tile measures 117.241 mm², while the I/O and SoC tiles are 24.475 mm² and 86.648 mm² respectively, all mounted on a base tile made with Intel's 22nm FinFET process [3] - Each P-core is equipped with 3MB of L3 cache, totaling 36MB, and E-core clusters have shared L2 cache, improving inter-core communication [5] - The arrangement of E-cores between P-cores aims to reduce thermal hotspots, with a total of 8 P-cores and 16 E-cores organized strategically [5] Performance Considerations - Despite the innovative chiplet architecture, initial performance has not met expectations, lagging behind AMD's Ryzen 9000 series and even Intel's previous generation processors [6] - Intel is addressing interconnect latency issues through firmware updates, indicating ongoing optimization efforts [6] - The shift to a chiplet architecture is expected to provide future opportunities for architectural enhancements, improving yield and reducing production costs [6]

Core Viewpoint - The gaming console market is experiencing a significant shift, with prices increasing rather than decreasing, which contradicts historical trends where prices typically drop over time [2][9]. Price Trends - The last major price drop for gaming consoles occurred in 2016 with the PS4 Slim, which saw a price reduction from $349 to $299 [2]. - Recent price increases include the OLED version of the Nintendo Switch, which rose by $50, and the PS5's digital version, which also increased by $50 in 2023 [2]. - Xbox Series S and X saw price hikes of $80 to $100 without any hardware improvements [2]. Factors Influencing Price Increases - Multiple factors contribute to the rising prices, including inflation, supply shortages during the pandemic, unpredictable trade policies, and a shift away from the traditional model of selling hardware at a loss [2]. - A core technical reason for the price increases is the slowdown of Moore's Law, which has historically driven down costs through advancements in chip manufacturing [2][3]. Moore's Law and Its Implications - Moore's Law, proposed by Gordon Moore, suggests that the number of transistors on a chip doubles approximately every two years, but this trend is slowing down [3]. - The slowdown in chip manufacturing advancements has led to increased costs and reduced benefits from die shrink technologies, which previously allowed for smaller, more efficient chips [3][4]. Impact on Gaming Consoles - The benefits of die shrink in gaming consoles have diminished, leading to less significant improvements in size, power consumption, and heat generation [5][6]. - Historical examples, such as the PlayStation 2 and Xbox 360, illustrate how die shrink technology previously allowed for lower prices and improved performance, but this trend is no longer evident in the latest console generations [6][7]. Future Outlook - The gaming console market may not revert to historical pricing trends, and future price reductions are uncertain, depending on global trade agreements and advancements in manufacturing processes [8]. - The expectation is that the current trend of rising prices and stagnant technological improvements will continue, leading to a shift in consumer purchasing behavior [9].

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：本文编译自digitimes ，谢谢 。 SK海力士与其长期供应商韩美半导体之间围绕热压键合机（TC Bonder，简称TCB）设备的冲突 愈演愈烈，这可能会重塑高带宽存储器（HBM）的供应链。随着SK海力士在紧张局势加剧之际寻 找替代供应商，作为一家新晋厂商的韩华半导体将受益。 " TC键合机供应紧张加剧 SK海力士和韩美半导体在开发HBM生产关键的TCB设备方面合作了八年，如今双方关系却日益紧 张。据韩国媒体Greened报道，韩美半导体最近撤回了SK海力士利川园区的所有客户服务（CS） 工程师，并提议提高TCB设备的价格。SK海力士认为这些举动将严重扰乱其业务，因此评估了韩 华半导体的特殊订单产能，这预示着其可能将不再与韩美合作。 在人工智能需求的推动下，SK海力士在HBM市场占据主导地位，此次纠纷的解决将影响其生产战 略和竞争格局。目前，韩华半导体占据优势地位，但其规模化和与韩美半导体质量匹敌的能力将决 定其长期成功。 参参考考链链接接 据业内人士透露，SK海力士的供应链管理团队正在评估韩美半导体退出TCB供应链可能带来的影 响，以及韩华半导体填补这一缺 ...

该 27 国集团正在咨询行业利益相关者，包括位于布鲁塞尔的 SEMI 欧洲分支机构，以规划 2028 年至 2034 年期间的长期支出，并计划于 7 月公布预算。 SEMI 在 路 透 社 看 到 的 信 函 中 表 示 ， 欧 盟 委 员 会 将 需 要 在 整 个 半 导 体 供 应 链 中 拨 款 200 亿 欧 元 （226.4亿美元），这将引发公共和私人实体总计超过2600亿欧元的投资。 3月下旬，欧洲审计院表示，按照目前的速度，欧盟到2030年芯片产量达到全球20%的目标无法实 现。 欧盟最高审计机构在报告中表示，欧盟委员会迄今仅为430亿欧元的《欧洲芯片法案》投入了45亿 欧元，而约80%的公共资金来自成员国。 SEMI表示，单独的欧盟预算将有助于创造整个地区公平的竞争环境，因为目前每个成员国都首先 投资于自己的民族产业。 如果您希望可以时常见面，欢迎标星收藏哦~ 来源：本文编译自路透社 ，谢谢 。 国际半导体产业协会 (SEMI) 周二在对欧盟即将出台的投资预算进行磋商的官方回应中表示，欧盟 应该将其芯片支出增加四倍，并为此分配单独的预算。 欧洲立法者和行业团体正在推动"芯片法案2.0"，力求 ...

如果您希望可以时常见面，欢迎标星收藏哦~ 来源：内容来自工商时报 ，谢谢 。 继美国亚利桑那州长郝恺悌（Katie Hobbs）3月中率代表团来中国台湾招商后，不到两个月，亚 利桑那州招商官方代表团再次本周访台，宴请台积电及相关供应商，积极争取供应链扩大赴美；据 悉，中国台湾业者将提出四大诉求洽谈，包括争取州政府建厂代租、保税进口、人才培训及生活机 能等，双方渐渐掌握左右供应链赴美关键进行对接。 台积电3月初宣布美国总投资金额加码至1,650亿美元，扩大亚利桑那州厂规模，包括先进制程、 先进封装、研发中心全都到齐，唯独台积电供应链生态系尚未跟进，亚利桑那州政府连番主动与台 系业者面对面沟通，争取一同赴美机会。 半导体厂商指出，早在2024年初，包括美国亚利桑那州及美国在台协会（AIT）均多次探询，台积 供应链厂商为何迟迟没有一同前往美国设厂的原因，当时美国政府就已透露美方有意建构更完整半 导体供应链的规划。 供应链透露，5月初亚利桑那州政府招商团，除州长之外，主要官员都将再次来台，台系半导体供 应链业者将针对州政府建厂代租、保税进口、人才培训及生活机能等四大项目和州政府招商团进行 洽谈。 https://ww ...

Core Viewpoint - AMD has reportedly abandoned its 4nm orders with Samsung Foundry, likely shifting to TSMC due to Samsung's underperformance in the semiconductor industry [1][2]. Group 1: AMD's Shift in Partnerships - AMD has decided to forgo its 4nm orders with Samsung and is expected to turn to TSMC for production in the U.S. [1] - The specific reasons for this shift have not been disclosed, but it is likely linked to Samsung's poor performance and TSMC's attractive offerings [1]. - AMD's dual-sourcing strategy involved extensive collaboration with Samsung on the SF4X process, covering EPYC server CPUs, Ryzen APUs, and Radeon GPUs [1]. Group 2: Samsung's Market Position - Samsung's foundry business is struggling to gain industry recognition despite its diverse product range and substantial capacity [1]. - The exit of a major partner like AMD is a negative signal for Samsung, which needs to enhance its reputation in the chip industry [1]. - However, there are indications that companies like NVIDIA are interested in Samsung's 2nm process, suggesting potential future opportunities [2]. Group 3: TSMC's Advancements - TSMC's Arizona facility is currently mass-producing 4nm processes, and AMD is likely to enter this field following its agreement with TSMC [2]. - AMD has ordered high-end 2nm "Venice" server CPUs and is producing the Ryzen 9000 series consumer CPUs, indicating a significant shift in its collaboration with TSMC [2]. - AMD is one of the first companies to gain exclusive rights to the 2nm process, highlighting a transformative change in its partnerships [2].

Core Viewpoint - Tata Electronics is negotiating with NXP Semiconductors to become a foundry supplier, reflecting a trend towards local semiconductor manufacturing in response to geopolitical uncertainties and supply chain shifts [1][2]. Group 1: Tata Electronics and NXP Semiconductors - Tata Group is constructing a wafer fab in Gujarat and a packaging facility in Assam, with operations expected to begin in March 2024 and chip manufacturing in 2026 [1]. - The Gujarat wafer fab will primarily produce power management ICs, display drivers, and microcontrollers (MCUs) [1]. - Tata Electronics' potential deal with NXP may mirror its existing collaboration with Analog Devices, which aims to explore semiconductor manufacturing opportunities in India [1]. Group 2: Market Trends and Geopolitical Context - The trend of local manufacturing is growing among wafer fab companies, driven by the need to cater to different regional markets [1]. - Tata Group is well-positioned to benefit from the outflow of equipment manufacturing, enhancing its competitive advantage in the semiconductor sector [1]. - Geopolitical uncertainties, including tariffs imposed by the U.S. on global imports, are influencing the semiconductor landscape, with companies like Tesla potentially becoming customers of Tata's chips [2].

然而，长期以来被视为三星核心引擎的半导体业务的业绩表现令人担忧。负责芯片业务的设备解决 方案 (DS) 部门营收为 25.1 万亿韩元（约合 175 亿美元），营业利润为 1.1 万亿韩元（约合 7.69 亿美元）。虽然三星没有提供分部门的详细数据，但分析师估计，仅内存部门就创造了约 3 万亿 韩元（约合 22 亿美元）的利润，仅为 SK 海力士的一半。 三星难以向主要客户 Nvidia 供应第五代高带宽内存 (HBM) 芯片，再加上其代工和系统大规模集 成 (LSI) 业务总计亏损约 2 万亿韩元（13 亿美元），拖累了整体盈利能力。 与此同时，SK海力士在快速增长的人工智能芯片组件领域扩大了领先地位。凭借全球HBM市场超 过50%的份额，SK海力士连续第二个季度的表现优于三星整个半导体部门。雪上加霜的是，三星 在第一季度将其数十年来在动态随机存取存储器（DRAM）领域的领先地位拱手让给了SK海力 士。市场追踪机构Counterpoint Research报告称，SK海力士占据了全球DRAM市场36%的份额， 领先于三星的34%和美国美光的25%。 相比之下，尽管市场环境充满挑战，三星智能手机部门仍取得了稳 ...