Core Viewpoint - LG Electronics is entering the semiconductor equipment market by developing hybrid bonding machines for high bandwidth memory (HBM), aligning with the company's focus on artificial intelligence (AI) and B2B business expansion [1][2]. Group 1: Development and Market Strategy - LG Electronics' Production Engineering Research Institute (PRI) has begun developing hybrid bonding machines, crucial for next-generation HBM manufacturing, with a goal to achieve mass production by 2028 [1][2]. - The company aims to compete with established players like Samsung Electronics, Hanwha Semiconductor, and Hynix in the HBM manufacturing equipment market [1][3]. - The successful development of hybrid bonding machines could significantly increase sales and establish LG Electronics as a leader in the semiconductor equipment market [2]. Group 2: Technology and Innovation - Hybrid bonding machines are seen as a revolutionary technology that allows for chip stacking without the need for bumps, offering advantages such as thinner combined chips and lower heat generation, which are critical for multi-layer DRAM in HBM [2]. - This technology is currently applied in NAND flash and system semiconductors but has not yet been commercialized for HBM [2]. Group 3: Competitive Landscape - Leading companies in the semiconductor hybrid bonding machine sector include BE Semiconductor Industries NV and Applied Materials, but LG Electronics has opportunities due to the strong interest from SK Hynix and Samsung in domestic equipment production [3]. - Samsung plans to start using hybrid bonding machines for its sixth-generation HBM (HBM4) this year, while SK Hynix may apply the technology to its seventh-generation product (HBM4E) [3].

如果您希望可以时常见面，欢迎标星收藏哦~ 来 源： 内容来自经济日报 。 推荐阅读 10万亿，投向半导体 芯片巨头，市值大跌 黄仁勋：HBM是个技术奇迹 Jim Keller：RISC-V一定会胜出 外媒报导，英特尔Nova Lake-S CPU已投片台积2纳米，Nova Lake-S 处理器预计将于2026年第3 季正式上市。 外媒Guru3D报导，公司已正式投片了至少一款采用台积电（2330）先进2纳米技术的运算芯片， 这使得在同时采用英特尔的Intel 18A制程，和台积电的N2节点制程的情况下，Nova Lake-S系列 获得生产灵活性。 Guru3D 报导指出，上述情况将可能避免因英特尔自身制造的限制，进而造成的延迟或短缺情况发 生。 依据外电，Nova Lake-S处理器将采用复杂的架构，整合了总共52个核心，包括16个高效能核心、 32个以效率为重点的核心和4个针对极低功耗最佳化的额外核心。除了其广泛的核心布局外，该处 理器还整合先进的记忆体控制器，支援高达8,800 MT/s的速度。 图形功能将由Xe3「Celestial」 处理，而Xe4「Druid」将管理媒体解码和显示任务，强调分配给不同 ...

Core Viewpoint - The Indian information and communication technology (ICT) export reached over $115.1 billion in the first half of the year, marking the second-highest level in history, driven by the demand for artificial intelligence (AI) data centers and record semiconductor exports [1]. Group 1: Export Performance - The ICT export from South Korea in the first half of the year amounted to $115.16 billion, representing a year-on-year increase of 5.8% [1]. - In June, the export value was $22.03 billion, showing a growth of 4.7% compared to the previous year [1]. - The semiconductor export reached $73.31 billion in the first half, with an increase of 11.4%, setting a new record for the first half of the year [1]. Group 2: Product-Specific Trends - The export of computers and peripheral devices grew by 10.8%, reaching $6.64 billion, driven by the expansion of AI servers and the demand for solid-state drives (SSD) in data centers [2]. - Conversely, the display and mobile phone sectors experienced declines, with display exports falling to $1.29 billion, a decrease of 33.7% [3]. - Mobile phone exports also decreased to $0.79 billion, down 6.2% year-on-year, influenced by reduced exports of semiconductors and sensor modules [3]. Group 3: Regional Export Dynamics - Exports to the United States, Taiwan, and Japan increased, while exports to China (including Hong Kong) and the European Union decreased [4]. - Exports to the U.S. reached $14.42 billion, up 14.5%, with a continuous growth streak for 20 months [4]. - Exports to Taiwan and Japan grew to $3.61 billion and $0.4 billion, with increases of 54.6% and 20.6%, respectively [4]. - Exports to China amounted to $7.89 billion, down 9.4%, despite a 16.9% increase in computer and peripheral device exports [4]. - Exports to the EU and India were $0.93 billion and $0.42 billion, reflecting declines of 5.3% and 6.3% respectively [5].

Core Viewpoint - JS Foundry, a semiconductor foundry company in Japan, filed for bankruptcy with total liabilities of approximately 16.1 billion yen, highlighting challenges in the domestic semiconductor industry [1][2]. Group 1: Company Overview - JS Foundry was established in 2022 as Japan's first independent foundry, aiming to strengthen the domestic supply chain for analog and power semiconductors and support R&D in these areas [1]. - The company acquired the Niigata factory from ON Semiconductor Niigata and began semiconductor foundry production [2]. Group 2: Financial Performance - For the fiscal year ending December 2023, JS Foundry reported sales of approximately 3.14 billion yen but incurred a net loss of 1.372 billion yen [2]. - In October 2024, the company initiated business cooperation in the SiC wafer sector after a failed capital collaboration with an overseas company [2].

Group 1 - TSMC plans to invest $100 billion in advanced semiconductor manufacturing in the U.S. by March 2025, including three new fabs, two advanced packaging facilities, and a major R&D center [1] - TSMC is accelerating the construction of its third fab at Fab 21 in Phoenix, Arizona, with plans to build two dedicated buildings nearby for advanced packaging services [1] - The first advanced packaging facility, AP1, is set to begin construction in 2028, while the second facility, AP2, has no specific start date yet [2] Group 2 - The two advanced packaging facilities will focus on CoPoS and SoIC packaging technologies, with CoPoS utilizing a 310×310 mm rectangular panel to improve area utilization and capacity [2] - SoIC technology involves stacking memory chips beneath the processing core, validated in AMD's Ryzen X3D processor, with testing production for CoPoS planned to start in 2026 [2] - AP1 is expected to be operational by the end of 2029 or early 2030, aligning with TSMC's delivery timelines [2]

根据先前报导，美国政府准备制定一套新的出口管制规则，加强对向马来西亚与泰国出口NVIDIA 先进AI GPU的限制，防止这些芯片在现行禁令下被转出口至中国。在初步草案中，美国商务部计 划要求企业在向马、泰两国出口AI GPU 前，必须取得美国政府的出口许可。 与此同时，川普也于近期宣布对于许多国家的关税税制，其中课征马来西亚25% 关税，反而比 「解放日」的24% 还多。 如果您希望可以时常见面，欢迎标星收藏哦~ 来 源： 内容来自technews。 马来西亚将对高效能美国人工智能（AI）芯片的出口与转运实施许可制度，显示政府有意防堵敏 感芯片被转售至中国等地区。 据彭博社报导，马来西亚投资、贸易与工业部周一（14 日）发布声明指出，若个人/企业知情或有 合理理由怀疑相关货品可能被滥用，或将用于受限活动，须在出口、转运或过境前至少30 天通知 主管机关，并申请许可。该政策即日起生效。 该部表示，此举是为了补上现行法规的漏洞，同时马来西亚政府也在检讨是否将原产于美国的高效 能AI芯片纳入《战略贸易法》下的战略物项清单。 Jim Keller：RISC-V一定会胜出 对此，马来西亚投资、贸易及工业部对此发布声明指 ...

Core Viewpoint - The acquisition of Ansys by Synopsys has been approved with restrictive conditions due to potential anti-competitive effects in various software markets, including optical software, photonic software, and certain EDA software markets [1][39]. Group 1: Case Background - Acquirer: Synopsys, established in 1986 in the USA, listed on NASDAQ, primarily engaged in EDA software and design IP business [2]. - Target: Ansys, founded in 1970 in the USA, also listed on NASDAQ, focuses on developing and selling simulation and analysis software [2]. - The agreement for acquisition was signed on January 15, 2024, with Synopsys acquiring all outstanding shares of Ansys [2]. Group 2: Relevant Markets - The relevant markets identified include optical software, photonic software, certain EDA software, and design IP markets, with horizontal overlaps between Synopsys and Ansys in these areas [4][5][6][15]. - Optical software and photonic software are defined as separate markets due to their distinct applications and technological complexities [5][6]. - The EDA software market is highly specialized, with various functions that do not allow for easy substitution among different software tools [7][8][9]. Group 3: Competition Analysis - The merger is expected to significantly increase market concentration in the optical software market, with combined market shares of 65-70% and a substantial increase in the HHI index [19]. - Similar concerns exist for the photonic software market, where the combined market share is also 65-70%, indicating a potential reduction in competition [20]. - The RTL power analysis software market shows a combined share of 70-75%, with a significant increase in market concentration post-merger [22]. - The transaction is likely to enhance Synopsys's market power in several EDA software markets, potentially limiting competition and innovation [37]. Group 4: Restrictive Conditions - The approval of the acquisition comes with several conditions, including the divestiture of optical solutions and power analysis software businesses to mitigate anti-competitive effects [39][40]. - Synopsys is required to maintain existing customer contracts and ensure fair access to its products without discrimination [40]. - The company must also uphold interoperability agreements with third-party EDA vendors to promote competition and innovation in the market [41].

Core Viewpoint - The demand for custom AI semiconductors is rapidly increasing, leading to a shift in the customer base for high bandwidth memory (HBM) from traditional GPU manufacturers like Nvidia and AMD to tech giants such as Amazon, Google, and Meta, who are designing their own ASICs [1][2]. Group 1: Market Dynamics - The shift in demand is prompting memory chip manufacturers like Samsung, SK Hynix, and Micron to adjust their supply strategies and increase production capacity for HBM targeted at ASIC developers [1]. - Micron has identified ASIC platform companies alongside Nvidia and AMD as its four major HBM customers, indicating the growing influence of this sector [1]. - Analysts predict that by 2026, global shipments of AI ASICs will surpass those of Nvidia's AI chips, with the global ASIC AI market expected to reach $30 billion this year, growing at over 30% annually [1]. Group 2: HBM Supply and Technology - The demand for HBM is increasing as it is crucial for handling high-speed data in AI workloads, with SK Hynix supplying significant volumes to Amazon, Google, and Broadcom [2]. - Samsung is delivering its fifth-generation HBM3E to Broadcom and other ASIC customers, while the upcoming sixth-generation HBM4 technology is expected to bring further changes, allowing for customized logic chips [2]. - Samsung and SK Hynix are accelerating investments in HBM4 production to meet the rising demand, with Micron also providing samples of 12-layer HBM4 chips for quality verification [2]. Group 3: Future Agreements - HBM orders typically require a year of advance booking, and it is anticipated that the three major suppliers will finalize sample agreements with ASIC customers by the end of the year [3].

Core Insights - Nvidia is redefining the characteristics and functionalities of future power electronic devices, particularly for AI data centers, by designing a new powertrain architecture [1][4] - The shift towards 800V high voltage direct current (HVDC) data center infrastructure is being supported by various semiconductor suppliers and power system component manufacturers [1][5] Group 1: Nvidia's Influence on Power Electronics - Nvidia's push for AI data centers is creating momentum for Gallium Nitride (GaN) technology, similar to the impact of Silicon Carbide (SiC) during Tesla's rise [2] - Nvidia is collaborating with multiple partners, including Infineon, MPS, Navitas, and others, to transition to 800V HVDC systems [1][4] Group 2: Technical Requirements and Innovations - The new 800V HVDC architecture will necessitate a range of new power devices and semiconductors to meet the demands of AI data centers [5] - Infineon is developing converters to demonstrate the advantages of 800V to lower voltages, focusing on power density and efficiency [6][8] Group 3: Competitive Landscape - Other companies, such as Navitas Semiconductor, are also capitalizing on Nvidia's drive for AI data centers by leveraging their expertise in GaN technology [13] - The competition is intensifying as companies like Infineon and Navitas seek to provide solutions for Nvidia's evolving power infrastructure needs [13][14] Group 4: Market Predictions - Yole Group predicts that GaN will experience faster growth than SiC in the AI data center market, with GaN devices having higher voltage potential [16] - The shift in Nvidia's power infrastructure strategy may render existing open computing projects obsolete, leading to a fragmented market [15]

Core Viewpoint - The GaN market is experiencing significant changes, with TSMC announcing its exit from GaN foundry services within two years, while other companies like Powerchip and Infineon are ramping up their GaN production capabilities. This shift indicates a competitive landscape where GaN is poised for growth, particularly in high-efficiency applications like electric vehicles and fast charging [1][4][15]. Group 1: TSMC's Exit and Market Dynamics - TSMC will gradually phase out its GaN semiconductor foundry business due to profit margin pressures from Chinese competitors, halting the development of 200mm wafer production [1][2]. - Navitas Semiconductor plans to transition its production from TSMC to Powerchip, with expectations to produce GaN products rated from 100V to 650V by mid-2026 [2]. - The exit of TSMC opens opportunities for other players like Powerchip and Infineon to fill the production gap and capture market share [1][4]. Group 2: Competitor Strategies - Infineon is advancing its 12-inch GaN production, with plans to release customer samples by Q4 2025, leveraging its IDM model for scalable production [4]. - Renesas Electronics has shifted focus from SiC to GaN, suspending its SiC projects due to market saturation and is preparing to enhance its GaN capabilities following its acquisition of Transphorm [5][6]. - ROHM is committed to deepening its collaboration with TSMC to address market demands and explore future production frameworks [3]. Group 3: Market Growth and Challenges - The GaN semiconductor market is projected to grow significantly, with a compound annual growth rate (CAGR) of 98.5% from 2024 to 2028, potentially exceeding $6.8 billion by 2028 [15]. - The main drivers for GaN market growth include consumer electronics and electric vehicles, with expectations for GaN applications in fast chargers and adapters to grow at a CAGR of 71.1% [15]. - Transitioning GaN from peripheral applications to core power systems in electric vehicles presents challenges, including reliability and ecosystem maturity [16][17]. Group 4: Strategic Partnerships and Investments - STMicroelectronics has extended its lock-up period for its investment in Innoscience, signaling confidence in the latter's future and the broader GaN market [9][11]. - The partnership between ST and Innoscience aims to leverage each other's manufacturing capabilities to enhance GaN product development and production [12]. - Innoscience has emerged as a key player in the GaN market, achieving significant revenue growth and expanding its wafer production capacity [14].