Core Viewpoint - The stock of Shenzhen Technology Co., Ltd. (深科技) has shown positive performance with a year-to-date increase of 6.84% and a recent rise of 2.02% on September 11, 2023, indicating strong market interest and potential growth in the electronic manufacturing sector [1][2]. Financial Performance - For the first half of 2025, Shenzhen Technology reported a revenue of 7.74 billion yuan, reflecting a year-on-year growth of 9.71%, while the net profit attributable to shareholders was 452 million yuan, up 25.39% compared to the previous year [2]. - Cumulatively, since its A-share listing, the company has distributed a total of 3.96 billion yuan in dividends, with 702 million yuan distributed over the last three years [3]. Shareholder Information - As of August 30, 2025, the number of shareholders for Shenzhen Technology reached 173,500, an increase of 0.27% from the previous period, with an average of 9,032 circulating shares per shareholder, which is a decrease of 0.27% [2]. - The top ten circulating shareholders include significant institutional investors, with the Southern CSI 500 ETF holding 16.17 million shares, an increase of 4.12 million shares from the previous period [3]. Business Overview - Shenzhen Technology, established on July 4, 1985, and listed on February 2, 1994, operates in the electronic manufacturing sector, focusing on high-end manufacturing (50.52% of revenue), storage semiconductors (27.13%), and intelligent metering terminals (21.70%) [1]. - The company is categorized under the electronic industry, specifically in consumer electronics and components, and is involved in various concept sectors including blockchain, drones, and advanced packaging [1].

Company Overview - Shanghai Xinyang Semiconductor Materials Co., Ltd. focuses on R&D, production, sales, and service of key process materials and supporting equipment for integrated circuit manufacturing and advanced packaging [1] - The company operates five core business technologies: electronic plating, electronic cleaning, electronic lithography, electronic grinding, and electronic etching [1] Financial Performance - In the first half of 2025, the semiconductor industry achieved revenue of CNY 7.09 billion, a year-on-year increase of 53.12% [1] - The company’s total revenue for the first half of 2025 reached CNY 8.97 billion [5] - The projected revenue for the semiconductor sector for the full year 2025 is not less than CNY 13.00 billion, with total revenue expected to exceed CNY 17.00 billion [5] Production Capacity - Current production capacity at the Songjiang headquarters is 19,000 tons/year [1] - The Hefei Xinyang Phase I capacity expansion is planned to reach 43,500 tons/year, including various chemical solutions for chip manufacturing [1][2] - A new project at the Songjiang headquarters is designed for a capacity of 50,000 tons/year, with specific allocations for ultra-pure cleaning and plating solutions [1] Product Development - The company has developed a complete range of photoresist products, including I-line, KrF, ArF dry, and ArF immersion types, with some achieving mass production [3] - The grinding liquid products have completed client testing and are now in mass production, targeting the domestic market to overcome key technology barriers [4] Profitability and Market Challenges - The gross margin for the semiconductor business declined year-on-year due to increased production costs from depreciation and the ramp-up phase of the Hefei project [4] - The coatings segment faced a revenue decline of 5.29% year-on-year, attributed to slow recovery in the construction market and falling product prices [4] Strategic Goals - The company aims to strengthen market development and explore various business models for its coatings segment [5] - Continuous innovation and optimization of product sales structure are key to achieving growth in the semiconductor materials sector [5] Industry Position - The company has established itself as a critical player in the domestic photoresist supply chain, with significant market share in various integrated circuit production lines [5]

Core Viewpoint - The interposer has transitioned from a supporting role to a focal point in the semiconductor industry, with major companies like Resonac and NVIDIA leading initiatives to develop advanced interposer technologies [1][28]. Group 1: Definition and Importance of Interposer - Interposer serves as a critical layer between chips and packaging substrates, enabling high-density interconnections and efficient integration of various chiplets into a system-in-package (SiP) [3][5]. - The interposer is essential for achieving higher bandwidth, lower latency, and increased computational density in advanced packaging [3][5]. Group 2: Types of Interposers - Two main types of interposers are currently in production: Silicon Interposer (inorganic) and Organic Interposer (Redistribution Layer) [5][6]. - Silicon Interposer has been established since the late 2000s, with TSMC pioneering its use in high-performance computing [6]. - Organic Interposer is gaining traction due to its lower production costs and flexibility, despite challenges in wiring precision and reliability [6][23]. Group 3: JOINT3 Alliance - The JOINT3 alliance, led by Resonac, consists of 27 global companies aiming to develop next-generation semiconductor packaging, focusing on panel-level organic interposers [8][11]. - The alliance plans to establish a dedicated center in Japan for advanced organic interposer development, targeting a significant increase in production efficiency and cost reduction [11][12]. - The shift to organic interposers is driven by the limitations of silicon interposers, particularly in terms of geometric losses and production costs [11][12]. Group 4: SiC Interposer as a New Direction - NVIDIA is exploring the use of Silicon Carbide (SiC) interposers for its next-generation GPUs, indicating a potential shift in materials used for interposers [17][19]. - SiC offers superior thermal conductivity and electrical insulation, making it suitable for high-performance AI and HPC applications, although manufacturing challenges remain [19][25]. Group 5: Competitive Landscape of Interposer Materials - The competition among silicon, organic, and SiC interposers is characterized by their respective advantages and disadvantages, influencing performance, cost, and scalability [20][22][23]. - Silicon interposers are currently dominant but face challenges as chip sizes increase, while organic interposers are expected to gain market share due to cost advantages [22][26]. - SiC interposers, if successfully developed, could become the standard for cutting-edge AI and HPC packaging in the long term [26]. Group 6: Future Trends - In the short term, silicon interposers will remain the market leader, while organic interposers are anticipated to see widespread adoption in the mid-term due to their cost and scalability benefits [26]. - Long-term projections suggest that SiC interposers may emerge as the preferred choice for advanced packaging once manufacturing hurdles are overcome [26].

Group 1 - Nvidia plans to replace silicon with silicon carbide (SiC) in the intermediate substrate material of its next-generation Rubin processors to enhance performance, with SiC expected to be integrated by 2027 [1] - TSMC is also planning to use 12-inch single crystal silicon carbide for heat dissipation substrates, replacing traditional materials like alumina and sapphire [1] - Silicon carbide has a thermal conductivity of 500 W/mK, significantly higher than silicon's thermal conductivity of approximately 150 W/mK, indicating its potential in high-heat environments [1] Group 2 - As Nvidia's GPU chips increase in power, integrating multiple chips into a silicon interlayer will raise thermal performance requirements, making SiC interlayers a promising solution to reduce heat sink size and optimize overall packaging [1] - The application potential of silicon carbide in high-end computing chips is not fully realized, suggesting future growth opportunities in advanced packaging and other segments [1] - Silicon carbide is expected to improve heat dissipation efficiency when used in heat dissipation substrates, as current ceramic materials have lower thermal conductivity than single crystal silicon carbide [1] Group 3 - Companies like 瑞纳智能, 错威特, and 宇环数控 are actively advancing silicon carbide technology and products, indicating a growing interest in this material within the semiconductor industry [3][4][5] - The market for silicon carbide devices is expanding, with various companies like 得润电子 and 甘化科工 achieving significant milestones in production and development of SiC components [4][5][6] - The overall trend in the semiconductor industry is shifting towards third-generation semiconductor materials, particularly silicon carbide, which is being adopted for various applications including automotive and power electronics [4][5][6]

Core Insights - The strategic value of semiconductor equipment is highlighted, with electronic terminal products accounting for a significant portion of global output, driven by the explosion of industries like big data and AI, which rely on chip manufacturing supported by semiconductor equipment [2] - CMP (Chemical Mechanical Polishing) is identified as one of the five key technologies in integrated circuit manufacturing, essential for flattening wafer surfaces to facilitate subsequent processes like lithography [2] - Current challenges in CMP include achieving nanoscale wafer flattening, cleaning nanoscale contaminants, maintaining precision in rapid polishing, and ensuring efficient operation of the entire system [2] - The global flatness requirement for 12-inch wafers has increased to less than 5nm, with strict limits on the number of fine contaminants above 28nm [2] Opportunities - The demand for CMP in advanced packaging is expected to rise significantly, driven by the rapid development of technologies like TSV and 3D packaging [3] - The transition from multi-wafer polishing to single-wafer polishing in third-generation semiconductors is leading to a sustained increase in demand for CMP equipment [3] - Huahai Qingshi, a leading domestic semiconductor equipment supplier, has evolved from a CMP equipment provider to a platform enterprise covering various equipment and services, including thinning, cutting, wet processing, ion implantation, and edge polishing [3] - The company emphasizes that industry demand and technological iteration will continue to drive progress in the sector, with a commitment to innovation based on years of technical accumulation [3]

Core Insights - The semiconductor packaging and testing technology has become a crucial element in overcoming the dual challenges of "physical limits" and "industrial chain disruptions" in the context of the global semiconductor industry's rapid transformation and geopolitical tensions [1] Group 1: Industry Trends - The advanced packaging sector is seen as a core pathway to continue Moore's Law, with technologies such as 2.5D/3D, Chiplet, and Fan-Out accelerating the integration of design and manufacturing [1] - The geopolitical landscape is reshaping supply chains, necessitating a dual approach of self-sufficiency and globalization for China's packaging industry [1] Group 2: Regional Developments - Jiangsu province, holding nearly half of the national packaging capacity, has become a significant hub for the semiconductor packaging industry, with the Yangtze River Delta region accounting for over 81% of the national total [2] - By 2024, Jiangsu's packaging revenue is projected to exceed 170 billion yuan, with key enterprises achieving breakthroughs in system-level packaging and 2.5D packaging technologies [2] Group 3: Market Dynamics - The domestic integrated circuit industry has seen a continuous increase in prosperity, with sales reaching 1,045.8 billion yuan, a year-on-year growth of 18% [3] - The advanced packaging market is growing at a rate that outpaces traditional packaging, driven by the demand for high-density, diversified, and miniaturized packaging solutions [3]

Group 1 - SEMICON Taiwan 2025 will focus on AI, CoWoS advanced packaging, and testing mass production progress from September 10-12 [1] - The semiconductor industry is facing bottlenecks in process miniaturization, with heterogeneous integration and advanced packaging emerging as breakthrough directions [1] - Demand for AI, high-performance computing (HPC), and HBM is increasing, making advanced packaging technologies like 3D IC and panel-level fan-out packaging core to semiconductor innovation [1] Group 2 - TSMC's CoWoS, InFO, and SoIC advanced packaging technologies are applicable for AI and HPC chips, with CoWoS already in mass production [1] - NVIDIA and AMD have strong ongoing demand for CoWoS, while Apple requires TSMC's InFO technology for high-end processors [1] - TSMC is expanding its CoWoS and InFO advanced packaging lines in the U.S. due to strong demand and U.S. government support for domestic semiconductor manufacturing [1] Group 3 - TSMC announced a $100 billion investment in advanced semiconductor manufacturing in the U.S., totaling $165 billion, which includes two advanced packaging facilities [2] - TSMC aims to balance the supply-demand gap for CoWoS advanced packaging, with expected monthly capacity exceeding 90,000 to 95,000 pieces by the end of 2026 [2] - Non-TSMC CoWoS capacity is projected to reach 12,000 pieces monthly by the end of next year, with nearly 60% of overall annual capacity still supplied to NVIDIA [2]

Investment Rating - The industry investment rating is "Positive (Maintain)" [4] Core Viewpoints - Silicon carbide (SiC) materials are expected to be applied in advanced packaging, opening up growth opportunities. The material's excellent thermal conductivity makes it suitable for applications in intermediary layers and heat dissipation substrates, benefiting related manufacturers [2][19] - The demand for AI GPU performance is continuously increasing, leading to higher thermal management requirements in chip packaging. SiC's thermal conductivity can significantly enhance heat dissipation efficiency in these applications [7][14] Summary by Sections Industry Overview - The report focuses on the electronic industry, particularly the application of silicon carbide materials in advanced packaging, which is anticipated to drive industry growth [1][4] Investment Recommendations and Targets - Key investment targets include Tianyue Advanced, a leader in the silicon carbide substrate industry, and Sanan Optoelectronics, a major power device manufacturer with a focus on silicon carbide substrates [2][19] - Tianyue Advanced is projected to achieve a revenue of 1.77 billion yuan in 2024, representing a 41% year-on-year growth, with a net profit of 180 million yuan, indicating a turnaround from losses [20][23] - Sanan Optoelectronics is expected to see a revenue of 8.99 billion yuan in the first half of 2025, a 17% increase year-on-year, with a gross margin of 15.2% [27][31] Key Developments - NVIDIA plans to use silicon carbide substrates in the advanced packaging of its next-generation GPU chips, indicating a significant application potential for SiC materials in high-performance computing [7][8] - TSMC is also planning to apply 12-inch single crystal silicon carbide in heat dissipation substrates, replacing traditional materials [7][17] - The thermal conductivity of silicon carbide can reach 500 W/mK, compared to silicon's 150 W/mK, making it a superior choice for high thermal management applications [14][18]

Core Insights - The revenue of the top five Wafer Fab Equipment (WFE) manufacturers is projected to grow by 20% year-on-year in Q2 2025, driven by strong demand for advanced processes, HBM, and advanced packaging, alongside investments from domestic Chinese customers in mature nodes [1][3] - Despite the overall growth, DRAM and NAND memory equipment sales lagged due to weak demand in consumer-driven markets, resulting in a 13% quarter-on-quarter decline in memory revenue [1] - The top WFE manufacturers, including ASML, Lam Research, and KLA, reported significant revenue growth of 35%, 29%, and 26% respectively, aided by double-digit growth in systems and services [1][3] Revenue Growth and Market Trends - In the first half of 2025, net revenue increased by 21% year-on-year, with system revenue up by 22% and service revenue up by 20, driven by customer upgrades and automation [3] - The WFE market is expected to see a 10% year-on-year revenue increase in 2025, with the top five manufacturers outpacing the overall market due to key technological shifts in foundry/logical, DRAM, and NAND sectors [3][4] - The introduction of various tools in etching, deposition, lithography, and process control will support customer roadmaps in foundry/logical, memory, and NAND sectors, contributing to revenue growth in the latter half of 2025 [3][4] Diversification and Strategic Focus - WFE manufacturers are focusing on global business diversification to mitigate the impact of trade regulations and tariffs, ensuring facilities are close to customers and supply chains [5][6] - The growth of the semiconductor ecosystem in India is becoming strategically important, with over $10 billion announced for wafer fabs and OSAT, supported by government subsidies [6][10] - The shift towards advanced packaging is seen as a new growth engine for the semiconductor industry, with advanced packaging becoming a strategic driver for performance and cost optimization [8][10] Future Outlook - The ramp-up of OSAT and foundry tool deployments in India is expected to lead to a surge in tool shipments, benefiting equipment suppliers from high-value capital expenditures and long-term service contracts [9][10] - The long-term growth potential in India is highlighted, with the country positioned to offset long-term revenue declines from China, as multiple fabs and OSAT facilities are established [11]

Core Insights - The strategic value of semiconductor equipment is highlighted, with electronic terminal products accounting for a significant portion of global output, driven by the explosion of industries like big data and AI, which rely on chip manufacturing supported by semiconductor equipment [4][5] - CMP (Chemical Mechanical Polishing) is identified as one of the five key technologies in integrated circuit manufacturing, essential for flattening wafer surfaces to facilitate subsequent processes like photolithography [4][5] - Current challenges in CMP include achieving nanoscale wafer flattening, cleaning nanoscale contaminants, maintaining rapid polishing precision, and ensuring efficient and stable operation of the entire machine [4][5] - The demand for CMP equipment is expected to rise significantly due to advancements in packaging technologies such as TSV and 3D packaging, as well as the shift from multi-wafer to single-wafer polishing in third-generation semiconductors [5][6] - Huahai Qingshi, originating from Tsinghua University's State Key Laboratory of Tribology, has evolved from a CMP equipment supplier to a comprehensive platform covering various semiconductor equipment and services, establishing itself as a leading domestic supplier [5][6] - The continuous drive for progress in the industry is fueled by demand and technological iteration, with Huahai Qingshi committed to leveraging its technological expertise to support breakthroughs in China's semiconductor industry [6]